JPH0138919Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a wiring board used when mass producing hybrid integrated circuits.

Conventional hybrid integrated circuits, especially hybrid integrated circuits for watches, are made by setting circular areas in a matrix on one large flat insulating substrate, printing and applying the necessary wiring patterns for each of these circular areas, and then individually connecting the circuits. Separate the circular areas by punching or the like. Workers install these individual separated circuit boards into an assembly machine while visually aligning them, and then fix circuit components such as integrated circuit elements, capacitors, and resistors to predetermined parts of the circuit board. A hybrid integrated circuit was obtained by forming predetermined circuit wiring by bonding, then encapsulating it with resin as necessary, and performing a characteristic test.

For this reason, processing by an operator is required during the manufacturing process, which has been a major obstacle to improving work efficiency. In particular, since wiring patterns are printed and coated on a flat insulating board and then separated by punching into individual circuit boards, the arrangement of the circuit boards becomes disjointed during this process, making it difficult for workers to install them in the assembly machine. They were taken out individually, identified front and back, and direction, and then rearranged them in a uniform manner. This alignment work requires a large number of man-hours and a long working time, and has been one of the obstacles to improving work efficiency. In order to improve work efficiency, punching from a flat insulating substrate after forming a hybrid integrated circuit, i.e. after sealing a predetermined part with resin or inspecting its characteristics, requires a large assembly machine and a high degree of precision. This resulted in not only an increase in costs but also a decrease in yield. In addition, the above-mentioned alignment of the circuit boards is also necessary during characteristic inspection which is usually performed using a device different from the assembly machine, and this has been an obstacle to further improving work efficiency.

The purpose of the present invention is to obtain a continuous structure of wiring boards that is suitable for automated manufacturing of hybrid integrated circuits and that can achieve high work efficiency.

The continuous structure according to the present invention includes a plurality of wiring boards each having an insulating board formed into a substantially final shape and a wiring metal layer formed on the surface of the board, and a pair of strip-shaped wiring boards. a pair of insulating support bands that are integrally continuous with a portion of each of the plurality of wiring boards; the plurality of wiring boards are connected to each other only via the pair of insulating support bands; A plurality of two types of holes, ie, positioning holes and feed mechanism holes, are each provided in the insulating support band, and each of the positioning holes is arranged in parallel between the pair of insulating support bands. It is characterized in that it is provided at a position away from the connecting portion between the wiring board and the insulating support band.

When the continuous structure according to the present invention is used, a plurality of wiring boards for hybrid integrated circuits have the same front and back sides and directions, and the loading operation into an assembly machine can be carried out extremely efficiently. In particular, it is possible to determine the front and back sides of a continuous structure in a short time, and since the shapes are continuous in one direction, alignment is extremely easy. Furthermore, a plurality of wiring boards can be aligned in one operation, and the large size makes it easy for operators to handle. Furthermore, it also enables consistent automatic production up to characteristic inspection. Not only will it improve yields and make it easier to manage semi-finished products, but it can also be expected to further improve work efficiency.

Although the feeding mechanism hole is easily damaged due to feeding trouble, etc., the positioning accuracy does not deteriorate because it is provided exclusively as a positioning hole separately from the feeding mechanism hole. The positioning hole is also used for positioning when cutting and separating each wiring board from the insulating support, but since the hole is provided at a position away from the connecting part between each wiring board and the insulating support, The protrusion of the cutting device that protrudes from the positioning hole during separation does not get in the way and does not reduce the finished dimensional accuracy after completion.

The present invention will now be described in more detail with reference to the drawings.

Figure 1 shows an embodiment of the present invention, in which two insulating support bands 1 and 1' made of glass-filled epoxy resin, polyimide, triaziline, a heat-resistant glass, etc., are arranged in parallel. ing. A plurality of wiring boards 4 are supported between these two parallel support bands 1, 1'. A square feeding mechanism hole 2 and a round positioning hole 3 are formed in the support band 1. The feed mechanism hole 2 connects the wiring board 4 and the support 1.
The positioning hole 3 is located at the connecting portion between the wiring boards 1 and has a projection 5 that projects toward the wiring board 1 between the wiring boards 1. That is, the positioning hole 3 is separated from the connecting portion. The feed mechanism hole 2 may not be formed in the support band 1, but may be formed as a square feed mechanism hole 6 in the protrusion 5' of the support band 1'. The shape of the wiring board 4 can be selected from various shapes depending on the purpose, but when assembling a hybrid integrated circuit for a watch, it is punched out into a circular shape as shown in the figure.

Such a continuous structure is formed by printing predetermined wiring on a single flat insulating substrate and then punching it out. This continuous structure is installed in an assembly machine so that the positioning hole 3 and the feed mechanism 2 are inserted into a protrusion provided on the machine. Next, circuit components such as integrated circuit elements, capacitors, and resistors are installed.
Wiring is formed by wire bonding of thin metal wires, the integrated circuit element is sealed by, for example, resin potting, and a characteristic test is performed. Thereafter, the wiring board 4 is separated from the support band by punching, and only good products are obtained as products.

In a series of work steps, the hybrid integrated circuit is separated into individual wiring boards after its characteristics have been tested. Until then, everything is processed as a continuous structure, so processes that require manual labor by workers, such as loading into assembly machines and characteristic testing equipment, can be carried out extremely efficiently. It is not necessary to perform this kind of work for each individual wiring board, and it is only necessary to perform it once for a series of continuous structures (more precisely, twice when loading it into an assembly machine and when loading it into a characteristic testing device). Moreover, it is extremely easy to judge whether the object is long and narrow, or whether it is front or back or direction. Furthermore, since the wiring boards do not come apart individually during the work, it is easier to manage the semi-finished products, and there is no damage caused by contact between the wiring boards. Furthermore, since such a continuous structure is made of an insulating substrate, it has the advantage that electrical characteristics can be tested without having to separate each part. Moreover, it is possible to further improve work efficiency through automatic production that includes all aspects including characteristic inspection.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention. 1, 1'... Support band, 2, 6... Hole for feed mechanism,
3...Positioning hole, 4...Wiring board, 5...Protrusion.

Claims (1)

[Scope of utility model registration request] a plurality of wiring substrates each having an insulating substrate formed in a substantially final shape and a wiring metal layer formed on a surface of the substrate; and a pair of insulating support bands formed in a band shape, a pair of insulating support bands integrally continuous with a portion of each of a plurality of wiring boards, the plurality of wiring boards being connected to each other only via the pair of insulating support bands; A plurality of two types of holes, ie, positioning holes and feed mechanism holes, are provided in parallel between the bands, and each positioning hole is provided between each wiring board and the insulating support band. A continuous structure for a hybrid integrated circuit, characterized in that the continuous structure is provided at a position away from a connecting portion with the.