JPH0136725Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention mainly relates to a heating head used for heat-sealing an upper tape to an inner tape for taping and packaging electronic parts.

(Prior art) Electronic components are taped and packaged, for example, as shown in FIG. A sealing tape 3 with the adhesive side facing down is heat-sealed to the upper surface of the tape 2.

For this heat fusion bonding, as shown in FIG. The sealing tape 3 is heated in a striped manner from the upper surface with the provided heat-sealing chip 8, and both tapes 2 and 3 are heat-sealed and bonded at both sides of the component storage hole 1. The heat-sealing chip 8 is heated by a heater 9 provided on its back, and the heater 9 is controlled via a temperature controller 11 based on the detection result of a temperature sensor 10 using a thermocouple attached to the chip 8. The temperature of the chip 8 is maintained within the set range by on/off control. In this case, the on/off control of the heater 9 is performed by setting a lower limit temperature t1 and an upper limit temperature t2 with a predetermined width above and below the set temperature T, as shown in FIG.
is set, the heater 9 is turned on after the detected temperature falls below the lower limit temperature t1 until it reaches the upper limit temperature t2, and after reaching the upper limit temperature t2, the lower limit temperature t1 is then turned on.
The heater 9 is turned off until the temperature drops below .

(Problem to be solved by the invention) However, in the case of the conventional example having such a configuration, the chip 8 is connected to a single high-output heater 9.
The time lag in heat transfer from the heater 9 to the chip 8 is large, and as a result, as shown by the broken line A in Figure 2, there is a large overshoot from within the set temperature range, resulting in relatively large temperature variations. It was easy.

The present invention was developed in view of the above circumstances, and an object of the present invention is to improve the chip heating form so that heating can be performed with less overshoot.

(Means for solving the problem) In order to achieve this purpose, the present invention
A small-output auxiliary heater is embedded in the heat-sealing chip that is heated by the main heater, which is constantly energized at a predetermined high output, and only this auxiliary heater is controlled on and off based on the detection results of the chip temperature sensor. It consists of

(Function) In this configuration, basic heating is continuously performed by the main heater, and when the chip temperature changes depending on usage conditions, this is supplemented by turning on and off the small output auxiliary heater. In this case, the heat transfer time lag from the auxiliary heater to the chip is extremely small, so there is little overshoot from the set range, and short-cycle on/off control is performed as shown by the solid line B in Figure 2, resulting in temperature changes. The width of is close to the setting range.

(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings. FIG. 1 shows a schematic configuration of a taping packaging apparatus using a heating head according to an embodiment of the present invention. Cavity tape 2 in which component storage holes 1 and feed holes 12 are molded at a constant pitch.
is wound around the taping drum 13, and after the electronic components 4 supplied by the work clamper 14 on this winding path are loaded into each component storage hole 1,
The adhesive surface of the sealing tape 3 is superimposed and guided between the heating head 6 and the pressing rollers 7, 7 so that it comes into contact with the upper surface of the cavity tape 2, and the upper surface of the component storage hole 1 is closed by heat-sealing and joining both tapes. It will be done.

The heating head 6 includes a heat-sealing chip 8 that slides into contact with the back surface of the sealing tape 3 at two locations corresponding to both sides of the component storage hole 1 of the cavity tape 2, and a main heater 16 that heats the chip from the back. An auxiliary heater 17 embedded in the heat-sealing chip 8 and a temperature sensor 10 consisting of a thermocouple for detecting the temperature of the heat-sealing chip 8 are provided.

The output of the main heater 16 is set by the power controller 18 to a temperature equilibrium state during operation, and the main heater 16 is constantly energized. Also. The auxiliary heater 17 is adjusted in advance to have an output smaller than that of the main heater 16 by the power controller 19, and the temperature sensor 1
It is connected to the controller 20 so as to be controlled to be turned on and off based on the detection result of 0.

The on/off control of the auxiliary heater 17 is performed based on the lower limit temperature t.
A configuration similar to the conventional one is employed, in which the current is turned on (on) after the temperature drops below 1, until the upper limit temperature t2 is reached, and after the upper limit temperature t2 is reached, the current is stopped (off) until the lower limit temperature t1 is reached.

(Effects) As described above, according to the present invention, the main heater basically heats the heat-sealing chip, and then the small-output buried auxiliary heater with extremely small heat transfer time lag is controlled on and off, so the set temperature The overshoot from the range is smaller than in the past, which controlled on/off of a single heater, making it possible to stabilize the chip temperature.

In particular, if the outputs of the main heater and the auxiliary heater are set by the power controller as shown in the embodiment, it is possible to cope with slight changes in conditions, which is advantageous in practice.

[Brief explanation of the drawing]

Fig. 1 is a schematic configuration diagram of a taping packaging device incorporating a heating head according to an embodiment of the present invention;
3 is an enlarged perspective view of a heating head portion, FIG. 4 is a side view of a conventional heating head, and FIG. 5 is a perspective view of taping parts. In the figure, numeral 8 is a heat fusion chip, 16 is a main heater, 17 is an auxiliary heater, and 18 and 19 are power controllers.

Claims (1)

[Scope of claims for utility model registration] (1) Main heater 16 that is constantly energized with a predetermined high output
A small output auxiliary heater 17 is embedded in the heat fusion chip 8 heated by the auxiliary heater 1.
The heating head has a configuration in which only the chip temperature sensor 7 is controlled on and off based on the detection result of the chip temperature sensor 10. (2) The heating head according to claim 1 of the utility model registration, wherein the outputs of the main heater 16 and the auxiliary heater 17 are set by power controllers 18 and 19, respectively.