JPH0136321Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a functional component for microwaves, and more specifically, to a functional component for microwaves in the GHz band.

Prior Art A conventional microwave functional component, for example, a GHz band microwave diode switch, is usually constructed as shown in FIG. In FIG. 1, the center conductor of the coaxial input section 10 is connected to a conductor strip 14 formed on the surface of an insulating substrate 12 whose entire back surface is covered with a ground conductor, and is connected to the conductor strip 14 via capacitors C and C. The branch conductor strips 16 and 18, which are coupled together, extend in a bent manner to the center conductors of the coaxial output sections 20 and 22, and are connected via a capacitor C. These branch conductor strips 16 and 18 are connected to switch control lines 24 and 26 via inductances L and L, respectively, and are further connected to the ground conductor on the back side of the insulating substrate by diodes D every λ/4. . The whole is housed in a metal case 28. The circuit diagram of the microwave diode switch shown in FIG. 1 is shown in FIG. 2.

As described above, the microwave diode switch becomes a distributed constant circuit having a microstripline structure. Therefore, the spacing between the branch portions and diodes must be set to λ/4, resulting in a large size and high price. This problem,
This is an unavoidable problem not limited to microwave diode switches, but common to microwave functional components in the form of distributed constant circuits with a microstripline structure.

On the other hand, as shown in FIG. 3, functional components used for frequencies lower than that include a plurality of circuit elements 32, 34, 36, etc. arranged on one side of a printed circuit board 30 with a circuit pattern printed on one side. It is configured as a lumped constant circuit. Since this is a lumped constant circuit, it can be made at low cost and miniaturized, but on the other hand, because it is a lumped constant circuit, high frequency
In particular, it could not be used for microwaves in the GHz band.

Therefore, the inventor of this invention solved the disadvantages of large size and high price of functional components for microwaves, which had to adopt a distributed constant circuit format of microstrip line structure, and made it possible to reduce the cost and size. Patent Application No. 139548 (1982) for microwave functional parts
30301).

In the invention of Japanese Patent Application No. 57-139548, the inventor of the present invention focused on the miniaturization and low cost characteristics of lumped constant circuits, and made it possible to apply lumped constant circuits to microwaves in the GHz band. A unique twist has been applied to this. In other words, the reason why lumped constant circuits cannot be used for microwaves in the GHz band is that when used for microwaves, impedance matching cannot be achieved at each part, and because the wavelength is short, the circuit cannot be used for wavelengths longer than a quarter wavelength. We believe that this is because the potential of each part of the ground conductor differs depending on the distance from the ground terminal of the input terminal section due to the wave propagation. Therefore, we covered the back side of the insulating substrate with a ground conductor, placed a signal conductor on the front side to form a microstripline shape, and also placed a ground conductor on the front side, between the ground conductor on the front side and the signal conductor. Connect the circuit elements, and then electrically connect the grounding conductor on the front side and the grounding conductor on the back side with a grounding conductor connecting conductor over a wide area at the edge of the insulating board, and then reduce the distance from the grounding terminal of the input terminal part. The ground conductor on the surface of the insulating board was made to have the same potential everywhere, regardless of the current. In this way, impedance matching can be achieved due to the microstrip shape even if the circuit elements are not arranged every λ/4 but in a concentrated manner. Since all the circuit elements in the circuit have the same ground potential, it is possible to prevent reflections from occurring due to non-uniformity in the ground potential of each circuit element.

However, when the ground conductor on the front surface and the ground conductor on the back surface are electrically connected in this way over a wide area at the edge of the insulated board using a ground conductor connecting conductor, the degree of freedom in designing the circuit on the board is limited to some extent. The result is This restriction becomes a big problem when the input terminals, output terminals, and control terminals are gathered on one edge of the board so that the microwave functional components can be placed on the printed board with the board vertical.
The degree of freedom in circuit design is greatly impaired. Further, even if the board is vertically connected to a printed board or the like, the width of the board becomes the height, and it is inevitable that the height will be considerable.

Purpose of the invention Therefore, the present invention solves the disadvantages of large size and high cost of functional components for microwaves, which have had to adopt a distributed constant circuit format of microstripline structure, and also solves the disadvantages of large and expensive components for microwaves, which have no choice but to adopt a distributed constant circuit format with a microstripline structure. To provide a microwave functional component that has sufficient performance without any trouble in use, is inexpensive, can be used with the board vertically, and can be miniaturized with a low height. It is something.

Structure of the invention That is, according to the invention, a first part is provided with a ground conductor so as to substantially cover the back surface thereof, and a plurality of signal conductors and a plurality of ground conductors are provided on the front surface; an insulating substrate that is placed such that its back surface is located on the back surface side of the portion, and has a second portion provided on its surface with a signal conductor connected to a part of the signal conductor of the first portion; the first portion of the insulating substrate;
a first signal terminal electrically connected to one of the signal conductors of the portion of the insulating substrate; and a first signal terminal located near the first signal terminal and electrically connected to a ground conductor of the first portion of the insulating substrate. an input terminal section provided on one edge of the first portion of the insulating substrate; a second signal terminal electrically connected to another one and the first portion of the insulating substrate provided separately from the first ground terminal and located near the second signal terminal; an output terminal portion provided on the one edge of the first portion of the insulating substrate and configured by a pair with a second ground terminal electrically connected to a ground conductor of the insulating substrate;
a plurality of circuit elements connecting signal conductors or between a signal conductor and a ground conductor on the surface side of the first portion of the insulating substrate;
at least one circuit element connecting signal conductors on the surface side of the portion; a circuit connected to a ground conductor among the plurality of circuit elements of the first portion of the insulating substrate; The elements are arranged so as to be concentrated near the one edge of the first portion of the insulating substrate, and are connected to the ground conductor in a concentrated manner to the extent that they do not intersect the signal conductor; Each of the ground terminals of the terminal section and the output terminal section connects the ground conductor on the back surface of the first portion of the insulating substrate and the ground conductor on the surface of the first portion to which the ground terminal is connected to the insulating substrate. the first of the substrates;
Y electrically connected at said one edge of the part of
A microwave functional component is provided that is configured with a type terminal.

In such microwave functional components, various elements such as resistors, capacitors, inductors, diodes, and transistors are appropriately used as circuit elements, and the number, position, and shape of signal conductors from input to output are controlled. By choosing the appropriate
The microwave functional components can be configured into various microwave unit components such as switches, distributors, attenuators, couplers, isolators, and circulators.

Embodiments Hereinafter, embodiments of the microwave functional component according to the present invention will be described with reference to the accompanying drawings.

4 is a perspective view of the front side of the switch device for 900Mz according to the present invention, FIG. 5 is a perspective view of the back side of the switch device of FIG. 4, and FIG.
7 and 7 are perspective views of the front and back sides of the switch device shown in FIG. 4 in an expanded state, and FIG. 8 is a circuit diagram thereof. The insulating substrate 40 has a first portion 40A and a second portion 40B, and as can be seen from FIG. All but one part is covered with a ground conductor 42. Then, on the surface of the first portion 40A of the substrate 40, as shown in FIGS. 4 and 6, a ground conductor 42A,
42B, 42C, signal conductor 44A, 44B, 44
C, 44D, 44E, 44F, 44G, and control conductors 46A, 46B are provided. Further, as shown, the input signal terminal 48A is connected to the signal conductor 44A, and the input ground terminal 48B is connected to a portion of the ground conductor 42B proximate to the signal conductor 44A, so that the input signal terminal 48A and the input ground terminal 48B are connected to a portion of the ground conductor 42B proximate to the signal conductor 44A, respectively. They are fixed to one long edge 58 of 40A and form a pair. In addition, the first output signal terminal 50A and the first output ground terminal 50B
are connected to the signal conductor 44G and a portion of the ground conductor 42A near the signal conductor 44G, respectively, and are arranged in pairs close to each other on the long edge 58,
Furthermore, the second output signal terminal 52A and the second output ground terminal 52B are connected to the signal conductor 44E and the ground conductor 42B.
The control terminal 54A is connected to the control conductor 46A, and the ground terminal 54B is connected to the control conductor 46A, and is arranged in pairs in close proximity to each other on the long edge 58. are connected to the ground conductor 42C and fixed to the same long edge 58. Additionally, ground terminals 68 and 70 are connected to and secured to the same long edge 58 as shown in ground conductors 42B and 42A.

The second portion 40B of one insulating substrate 40 has the same width W as the first portion 40A, and
Its height hB is approximately the same as or somewhat lower than the height hA of the first portion 40A. And the second
As shown in FIG. 7, the portion 40B has no conductor at all on its back surface, and has conductors 66A, which constitute inductors L ₁ , L ₂ , L ₃ and also serve as signal conductors, on its surface as shown in FIG. 66B and 66C are provided. Furthermore, these conductors 66A, 66B, 6
Each end of 6C is connected to the signal conductor 44F, control conductor 46B, and signal conductor 44B of the first portion 40A, respectively.
and 44C, and extend to signal conductors 44C and 44D.

The diodes D ₁ , D ₂ , D ₃ , the resistor R, the capacitors C ₁ , C ₂ , C ₃ , C ₄ , and C ₅ are connected together with the inductors L ₁ , L ₂ , and L ₃ as shown in FIG. In particular, towards the edge 58 of the first part 40A of the substrate 40, which constitutes a path and to which the connecting terminal is fixed,
The fourth
They are connected as shown in the figure and FIG.

As can be seen from the fact that the peak value of the signal and the zero voltage differ by a quarter wavelength, the ground potential of the ground conductor also differs depending on the location, and the ground potential of one element differs from the ground potential of other elements. As a result, reflection and impedance changes occur between these elements. Therefore, in order to prevent such reflections and impedance changes, the concentration of components is preferably concentrated within a range of 1/16 wavelength, most preferably within a range of 1/32 wavelength, from the edge to be concentrated. let Figures 4 and 5
In the illustrated example, all elements except inductors L ₁ , L ₂ , and L ₃ printed on the second portion 40B of the substrate are concentrated within 1 cm from the edge 58.

Furthermore, the ground conductor on the front surface of the first portion 40A of the substrate 40 is electrically connected to the ground conductor on the back surface,
Independent ground conductors on the surface are electrically connected to each other and maintained at approximately the same ground potential. That is, the connection between the ground conductor on the front surface and the ground conductor on the back surface is made through the ground conductors 42A, 42B, and 42C on the front surface.
and a pair of holding pieces 60 and 6 for narrowing the edge of the board as shown in FIG. 9 connected to the ground conductor 42 on the back side.
The grounding terminal 4 consists of a Y-type terminal 64 having 2
8B, 50B, and 52B. This ground conductor connection between the front and back surfaces may additionally be accomplished by small U-shaped fittings 56A, 56B connecting the front ground conductor 42B and the back ground conductor 42. The interconnection of the ground conductors on the front and back surfaces is achieved by using through-hole plating, etc., in which a through hole is formed from the conductor on the front surface and the through hole is plated with metal to electrically connect the conductors on the front and back sides. However, it is important to connect the front ground conductor and the back ground conductor near the ground terminal, and for this purpose, if you use a Y-type terminal, you can connect the front and back ground conductors. This is convenient because there is no need to provide separate means for interconnecting the two. In addition, terminal 6
Reference numeral 8 denotes a ground terminal, which is connected to the ground conductor of the printed board when the illustrated microwave switch device is mounted on the printed board. Further, the ground terminal 70 is provided to give directionality to the terminal row and to increase the substrate supporting force when the terminal row is connected to the connector. Therefore, in the illustrated embodiment, the U-shaped fittings 56A and 56B and the terminal 70 may be omitted.

The first portion 40A and the second portion 40B of the substrate 40 are separated at a dotted line 80 in FIG. 6, and are folded so that their back surfaces touch each other as shown in FIGS. 4 and 5. Overlapping and cut conductor 66
A, 66B, 66C are U-shaped metal fittings 72A, 72
By B, 72C, 72D, 72E, 72F,
They are connected to a signal conductor 44F, a control conductor 46B, signal conductors 44B and 44C, and signal conductors 44C and 44D, respectively.

As can be seen from FIG. 8, in the microswitch shown in FIGS. 4 and 5, when a voltage is applied to the control terminal 54A, diode D ₁ becomes conductive, and diodes D ₂ and D ₃ also become conductive, resulting in an output of 2. Since the signal line to the input terminal is grounded, the microwave supplied to the input terminal is output to output 1, and conversely, when the voltage applied to the control terminal 54 is removed, the diode
Since D ₁ becomes non-conductive and the signal line to output 2 is released from ground, the input microwave is output from output 2.

Next, the insertion loss of the microwave switch shown in FIGS. 4 and 5 is shown in the graph of FIG. 10. In the graph of Figure 10,
The solid lines are for the microwave switches shown in Figures 4 and 5, and the dotted lines constitute exactly the same circuit as shown in Figure 8, but with the signal and ground terminals placed close together and paired. without connecting the ground conductors on the front and back sides with a ground terminal, and without connecting the ground side of the circuit element so as to concentrate on the ground conductor on one side of the board, This figure shows the insertion loss of a conventional microwave switch in which a circuit is constructed by arranging components entirely on a single insulating substrate. As is clear from the comparison of both curves, at 900Mz, the insertion loss of the microwave switch in Figure 4 is
While the insertion loss is extremely low, below 1.0 dB, it far exceeds the 4.0 dB insertion loss of conventional microwave switches.

Note that in the embodiment described above, the inductor
Although L ₁ , L ₂ , and L ₃ are formed by printing conductors on the surface of the second portion 40B of the substrate, separate coils may be connected to them. Further, although the illustrated embodiment constitutes a changeover switch that divides the input into two outputs, for example, nothing is connected to output 2, that is, the second output signal terminal 52A and the second output ground terminal 52B are connected. By not providing this, it is also possible to construct an on/off switch that turns on and off between the input and output 1.

Effects of the Invention As is clear from the above, according to the present invention, a first part is provided with a ground conductor so as to substantially cover the back surface thereof, and further provided with a plurality of signal conductors and a ground conductor on the front surface; an insulator that is placed such that its back surface is located on the back surface side of the first section and has a signal conductor connected to a part of the signal conductor of the first section on its surface; a first signal conductor electrically connected to one of the signal conductors of the first portion of the insulating substrate; and a first signal conductor of the insulating substrate located near the first signal terminal; an input terminal portion provided on one edge of the first portion of the insulating substrate and configured as a pair with a first grounding terminal electrically connected to a grounding conductor of the portion of the insulating substrate; a second signal terminal electrically connected to another one of the signal conductors of the first portion of the ground terminal, and a second signal terminal provided separately from the first ground terminal and located near the second signal terminal; and a second ground terminal electrically connected to the ground conductor of the first portion of the insulating substrate, and provided on the one edge of the first portion of the insulating substrate. a plurality of circuit elements connecting signal conductors or between a signal conductor and a ground conductor on the surface side of the first portion of the insulating substrate; and the second portion of the insulating substrate; at least one circuit element connecting between the signal conductors on the side of the surface of the circuit;
circuit elements connected to a ground conductor among the plurality of circuit elements of the first portion of the insulating substrate are concentrated near the one edge of the first portion of the insulating substrate; and are centrally connected to the ground conductor within a range that does not intersect with the signal conductor; and each ground terminal of the input terminal section and the output terminal section is connected to the back surface of the first portion of the insulating substrate. and a grounding conductor on the surface of the first portion to which the ground terminal is connected are electrically connected by the one edge of the first portion of the insulating substrate. A microwave functional component is provided.

In this way, the insulating substrate is divided into a first part and a second part, stacked on top of each other, and the second part is not provided with a terminal.
A part of the circuit element that is not connected to the ground conductor is arranged in the first part, while in the first part, the signal terminal of the human output terminal and the ground terminal are arranged close to each other so as to form a pair. By placing all the ground conductors on the same edge and connecting the front and back ground conductors with the ground terminal, and arranging the circuit elements connected to the ground conductors so that they are concentrated near the same edge, the micro In addition to solving the disadvantages of large size and high cost of microwave functional components that had to adopt a distributed constant circuit format with a lipline structure,
It has sufficient performance without any problems in use, and is inexpensive.
Furthermore, it is possible to obtain a microwave functional component that can be used with the substrate vertically placed and whose height can be reduced to nearly half of the required height of the substrate.

Although the embodiment of the microwave switch has been described above, it is obvious that the microwave functional component according to the present invention can be realized not only as a component but also as a distributor, attenuator, coupler, isolator, circulator, etc. It will be obvious to business owners.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway perspective view of a conventional microwave diode switch device, Fig. 2 is its circuit diagram, Fig. 3 is a perspective view of a conventional printed board type functional component, and Fig. 4 is a diagram of a conventional microwave diode switch device. FIG. 5 is a perspective view of the front side of the microwave switch according to the invention, FIG. 5 is a perspective view of the back side of the switch device of FIG. 4, and FIGS. 6 and 7 are respectively the front side of the switch device of FIG. 8 is a circuit diagram of the switch device shown in FIG. 4, FIG. 9 is a perspective view of the Y-type terminal, and FIG. 10 is a perspective view of the microwave switch shown in FIG. 4. It is a graph showing loss. 10... Coaxial input section, 12... Insulating board, 14
... Conductor strip, 16, 18 ... Branch conductor strip, 20, 22 ... Coaxial output section, 24, 2
6... Control line, 28... Case, 30... Printed circuit board, 32, 34, 36... Circuit element, 4
0... Board, first part of 40A..., 40B...
Second part of the board, 42A, 42B, 42C...ground conductor, 44A to 44G...signal conductor, 46A,
46B...Control conductor, 48A...Input signal terminal,
50A, 52A...Output signal terminal, 48B, 50
B, 52B...ground terminal, 54A...control terminal,
56A, 56B, 56C... Connection conductor.

Claims (1)

[Scope of utility model registration request] a first portion provided with a ground conductor so as to substantially cover the back surface and further provided with a plurality of signal conductors and a ground conductor on the front surface; and a back surface located on the back surface side of the first portion. an insulating substrate comprising a part of the signal conductor of the first part and a second part having a connected signal conductor on the surface; a signal of the first part of the insulating substrate; a first signal terminal electrically connected to one of the conductors; and a first signal terminal located near the first signal terminal and electrically connected to a ground conductor of the first portion of the insulating substrate. an input terminal portion provided on one edge of the first portion of the insulating substrate; and another one of the signal conductors of the first portion of the insulating substrate; A second signal terminal electrically connected to the second signal terminal and the second ground terminal provided separately from the first ground terminal.
a second electrically connected to the ground conductor of the first portion of the insulating substrate and located near the signal terminal of the insulating substrate;
an output terminal portion configured by a pair with a ground terminal and provided on the one edge of the first portion of the insulating substrate; a signal conductor on the surface side of the first portion of the insulating substrate; a plurality of circuit elements that connect between signal conductors and a ground conductor; and at least one circuit element that connects signal conductors on the surface side of the second portion of the insulating substrate; circuit elements connected to a ground conductor among the plurality of circuit elements of the first portion of the insulating substrate are concentrated near the one edge of the first portion of the insulating substrate; and are centrally connected to the ground conductor within a range that does not intersect with the signal conductor; and each ground terminal of the input terminal section and the output terminal section is connected to the back surface of the first portion of the insulating substrate. and a grounding conductor on the surface of the first portion to which the grounding terminal is connected are electrically connected by the one edge of the first portion of the insulating substrate. Functional components for microwaves.