JPH0133649Y2 - - Google Patents
Info
- Publication number
- JPH0133649Y2 JPH0133649Y2 JP1983152448U JP15244883U JPH0133649Y2 JP H0133649 Y2 JPH0133649 Y2 JP H0133649Y2 JP 1983152448 U JP1983152448 U JP 1983152448U JP 15244883 U JP15244883 U JP 15244883U JP H0133649 Y2 JPH0133649 Y2 JP H0133649Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- processing container
- recovery
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 92
- 238000011084 recovery Methods 0.000 claims description 33
- 238000005406 washing Methods 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000004065 wastewater treatment Methods 0.000 description 5
- 239000002351 wastewater Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Description
【考案の詳細な説明】
〔技術分野〕
本考案はめつき処理を行なう際に使用するめつ
き処理容器に付着しためつき液を効率良く回収で
きるようにしためつき液回収装置に関するもので
ある。[Detailed Description of the Invention] [Technical Field] The present invention relates to a tamping liquid recovery device that can efficiently recover the tamping liquid adhering to a plating processing container used in plating processing.
第１図は従来のめつき液回収装置の概略構成を
示す図である。同図において、１はめつき槽であ
り、めつき液２を入れてある。めつき槽１から引
き上げられためつき処理容器たるバレル３は、一
旦回収槽４に浸けられてめつき液２を回収された
後、水洗槽５にて水洗され、次の工程に移る。回
収槽４にて回収されためつき液２は、めつき液帰
還装置たるポンプ６により断続的にめつき槽１に
フイードバツクされる。しかるにかかる従来例に
あつては、回収槽４が一槽だけであるので、完全
にめつき液２の回収を行なうことができず、次工
程の水洗槽５に持ち込まざるを得ない。そして水
洗槽５ではめつき液２の回収機能がなく、水洗槽
５に持ち込まれためつき液２は全部排出され、排
水処理部（図示せず）へと流れることになる。排
水処理部では、排水中に含まれるめつき液を中和
処理するために、中和剤を補給し、完全に無害に
なるまで処理を行なうようになつている。したが
つて従来例にあつては、めつき液２を大量に損失
し、さらには排水中のめつき液２を処理する排水
処理用の薬剤（中和剤）の費用もかなり必要であ
るという問題があつた。
FIG. 1 is a diagram showing a schematic configuration of a conventional plating liquid recovery device. In the figure, numeral 1 is a plating tank in which plating liquid 2 is placed. The barrel 3, which is a plating processing container, which has been lifted out of the plating tank 1, is once immersed in a recovery tank 4 to recover the plating solution 2, and then washed with water in a washing tank 5, and then moves to the next step. The plating liquid 2 recovered in the recovery tank 4 is intermittently fed back to the plating tank 1 by a pump 6 which is a plating liquid return device. However, in the conventional example, since there is only one recovery tank 4, the plating solution 2 cannot be completely recovered and must be carried into the washing tank 5 for the next step. The washing tank 5 does not have a recovery function for the plating liquid 2, and the plating liquid 2 brought into the washing tank 5 is completely discharged and flows to a wastewater treatment section (not shown). In the wastewater treatment section, a neutralizing agent is supplied to neutralize the plating solution contained in the wastewater, and the process is continued until it becomes completely harmless. Therefore, in the conventional example, a large amount of plating solution 2 is lost, and furthermore, a considerable amount of cost is required for wastewater treatment chemicals (neutralizing agents) to treat the plating solution 2 in the wastewater. There was a problem.
本考案は上述のような点に鑑みて為されたもの
であり、めつき液の回収効率が高く、排水処理用
の薬剤や水洗用の水量が少なくて済むようにした
めつき液回収装置を提供することを目的とするも
のである。
The present invention has been developed in view of the above-mentioned points, and provides a plating liquid recovery device that has high plating liquid recovery efficiency and requires less chemicals for wastewater treatment and less water for washing. The purpose is to
以下、本考案の構成を図示実施例について説明
する。第２図は本考案の一実施例の概略構成図で
ある。同図において、１はめつき槽であり、めつ
き液２を入れてある。めつき槽１から引き上げら
れためつき処理容器たるバレル３は、３槽の回収
槽４1，４2，４3に順に浸けられて、めつき液２
を回収される。３槽の回収槽４1，４2，４3は、
それぞれめつき液２の濃度が異なつており、第１
の回収槽４1の濃度が最も高く、第２の回収槽４2
の濃度が次に高く、第３の回収槽４3の濃度は最
も低くなつている。しかも第１乃至第３の回収槽
４1〜４3には段差を設けてあつて、濃度の低い回
収槽４3から濃度の高い回収槽４1に向かつて順次
自然段差でめつき液２が流れ落ちるようになつて
おり、めつき液２の逆流は生じないように構成さ
れている。回収されためつき液２をめつき槽１に
フイードバツクするときには、最も濃度の高い回
収槽４1からフイードバツクさせるものである。
従来例ではめつき液２のフイードバツクは回収槽
４からめつき槽１に対して断続的に行なつていた
ものであるが、本実施例にあつては定量ポンプ６
１を用いて、めつき槽１からの蒸発分Ｓに対応す
る分の液量を連続してフイードバツクするように
している。回収槽４3の液量が不足してきたとき
には、水洗槽５内の水洗用の水を定量ポンプ６2
によつて回収槽４3に補給するものである。回収
槽４3から引き上げたバレル３は水洗槽５にて水
洗され、次の工程に移る。従来例では水洗槽５の
水質が良くても悪くても水を流し放しにしていた
ものであるが、本実施例にあつては水洗槽５にお
ける水洗用水に含まれるめつき液２の濃度を導電
率計によつて測定し、水洗用水に含まれるめつき
液２の濃度が下がつたときには、電磁弁によつて
給水バルブ８を閉じて、水洗槽５の水質を常に一
定に保つようにして無駄な水を使わないようにし
ているものである。
Hereinafter, the configuration of the present invention will be described with reference to illustrated embodiments. FIG. 2 is a schematic diagram of an embodiment of the present invention. In the figure, numeral 1 is a plating tank in which plating liquid 2 is placed. The barrel 3, which is a plating processing container, is lifted out of the plating tank 1 and is immersed in three recovery tanks 4 1 , 4 2 , and 4 3 in order, and is filled with plating solution 2.
will be collected. The three recovery tanks 4 1 , 4 2 , 4 3 are
The concentration of plating liquid 2 is different for each, and the first
The concentration in recovery tank 4 1 is highest, and the concentration in recovery tank 4 2 is the highest.
The concentration in the third recovery tank 43 is the next highest, and the concentration in the third recovery tank 43 is the lowest. Moreover, the first to third collection tanks 4 1 to 4 3 are provided with steps, so that the plating liquid 2 is gradually drained from the collection tank 4 3 with a low concentration to the collection tank 4 1 with a high concentration due to the natural step. The plating liquid 2 is designed to flow down, and is configured to prevent backflow of the plating liquid 2. When the recovered plating liquid 2 is fed back to the plating tank 1, it is fed back from the recovery tank 41 where the concentration is highest.
In the conventional example, the feedback of the plating liquid 2 was carried out intermittently from the collection tank 4 to the plating tank 1, but in this embodiment, the feed back of the plating liquid 2 was carried out intermittently through the metering pump 6.
1 is used to continuously feed back the amount of liquid corresponding to the evaporated amount S from the plating tank 1. When the amount of liquid in the recovery tank 43 becomes insufficient, the water for washing in the washing tank 5 is pumped into the metering pump 62.
This is used to replenish the recovery tank 43 . The barrel 3 pulled up from the recovery tank 43 is washed with water in the washing tank 5, and then moved to the next process. In the conventional example, the water was left to flow regardless of whether the water quality in the washing tank 5 was good or bad, but in this embodiment, the concentration of the plating solution 2 contained in the washing water in the washing tank 5 was changed. When the concentration of the plating solution 2 contained in the washing water decreases as measured by a conductivity meter, the water supply valve 8 is closed using a solenoid valve to maintain the water quality in the washing tank 5 at a constant level. This is to avoid wasting water.
第３図は第２図実施例システムにおける回収効
率の定量的な解析を行なうために示した説明図で
ある。同図において、Ｓ〔／Ｈ〕はめつき槽１
の１時間当たりの蒸発量をリツトル単位で示すも
のである。またθ〔／Ｈ〕はバレル３の引き上
げに伴うめつき槽１からのめつき液２の汲み出し
量、Ｗ〔／Ｈ〕は回収槽４1からめつき槽１への
回収液量、Ｘ〔／Ｈ〕は水洗槽５から回収槽４3
への給水量、Ｙ〔／Ｈ〕は水洗槽５からの排出
量、Ｚ〔／Ｈ〕は給水バルブ８からの総給水量
を、それぞれ１時間当たりのリツトル量で示した
ものである。ここでＸ＝Ｗ＝Ｓであり、またＺ＝
Ｘ＋Ｙである。次にCo〔ｇ／〕は、めつき槽１
におけるめつき液２の濃度であり、C1〜C4〔ｇ／
〕はそれぞれ回収槽４1〜４3および水洗槽５に
おけるめつき液２の濃度であり、各濃度は１リツ
トル当たりのグラム数によつて表わされる。水洗
槽５における濃度C4と、めつき槽１における濃
度C0との間には、次の関係式が成り立つもので
ある。 FIG. 3 is an explanatory diagram shown for quantitative analysis of recovery efficiency in the embodiment system of FIG. 2. In the same figure, S [/H] fitting tank 1
It shows the amount of evaporation per hour in liters. In addition, θ[/H] is the amount of plating liquid 2 pumped out from plating tank 1 as the barrel 3 is lifted, W[/H] is the amount of liquid recovered from recovery tank 41 to plating tank 1, and X[/ H] is from washing tank 5 to recovery tank 4 3
, Y[/H] is the amount of water discharged from the washing tank 5, and Z[/H] is the total amount of water supplied from the water supply valve 8, each expressed in liters per hour. Here, X=W=S and Z=
It is X+Y. Next, Co [g/] is in plating tank 1.
is the concentration of plating solution 2 in C 1 to C 4 [g/
] are the concentrations of the plating solution 2 in the recovery tanks 4 1 to 4 3 and the washing tank 5, respectively, and each concentration is expressed in grams per liter. The following relational expression holds between the concentration C 4 in the washing tank 5 and the concentration C 0 in the plating tank 1.
C0／C4＝１＋Ｚ／θ＋Ｚ／θ2Ｘ＋Ｚ／θ3X2＋Ｚ／θ
4X3
かかる関係式を基礎にして、第１図従来例と本
考案の第２図実施例とを比較してみたところ、め
つき液２の回収効率は従来例の38％から92.5％に
改善され、また水洗用水の使用量は１時間当たり
従来例では15m3であつたものが、１時間当たり10
m3に低減されたものである。 C 0 /C 4 =1+Z/θ+Z/θ 2 X+Z/θ 3 X 2 +Z/θ
4 X 3 Based on this relational expression, we compared the conventional example shown in Figure 1 and the embodiment of the present invention shown in Figure 2, and found that the recovery efficiency of plating solution 2 increased from 38% in the conventional example to 92.5%. The amount of water used for washing has been reduced from 15 m3 per hour to 10 m3 per hour.
m3 .
本考案は叙上のように構成されており、めつき
処理容器を浸けてめつき処理容器に付着しためつ
き液を回収する回収槽を複数個設けて、各回収槽
は、めつき処理容器を浸ける順番が遅い回収槽か
ら、該順番が早い回収槽に向かつて順次自然落差
で回収しためつき液が流れるように列設したもの
であるから、めつき処理容器を最初に浸けた回収
槽において完全にめつき液が回収できなくても、
第２の回収槽、第３の回収槽によつて順次残つた
めつき液を回収されるものであり、したがつて水
洗槽にめつき処理容器を浸けたときにおける水洗
槽の水質の悪化が少なく、少ない水量で水洗を行
なうことができ、また排水中に含まれるめつき液
の量は従来例の場合よりも少なくなるので、排水
処理用の中和剤等の薬剤の使用量を少なくするこ
とができ、また複数個の回収槽によつて回収され
ためつき液は、順次濃度の低い回収槽から濃度の
高い回収槽へと自然落差で流れて行き、最終的に
はめつき槽の中に戻るので、めつき液の回収効率
は著しく向上するという効果がある。
The present invention is constructed as described above, and includes a plurality of collection tanks for collecting the plating solution that has adhered to the plating processing container by dipping the plating processing container into the plating processing container. The plating containers are arranged in a row so that the collected plating solution flows sequentially from the collection tank in which the plating processing container is immersed later to the collection tank in which the plating processing container is immersed first. Even if the plating solution cannot be completely recovered,
The remaining plating solution is sequentially collected in the second recovery tank and the third recovery tank, so that the water quality in the washing tank will not deteriorate when the plating processing container is immersed in the washing tank. It is possible to perform washing with less water, and the amount of plating solution contained in the wastewater is less than in the conventional case, so the amount of chemicals such as neutralizers used for wastewater treatment is reduced. In addition, the plating solution collected in multiple collection tanks flows sequentially from the collection tank with a low concentration to the collection tank with a high concentration, and finally flows into the plating tank. This has the effect of significantly improving the recovery efficiency of the plating solution.
しかも、回収槽で回収しためつき液は自然落差
でめつき槽側の回収槽へと流れていき、めつき液
を流すにあたつてポンプなどの動力を必要とする
ことがないという効果がある。また、めつき槽か
らの蒸発量に相当する量の水を水洗槽から順番が
最も遅い回収槽に補給する定量ポンプを備えたの
で、めつき槽の自然減少量を水洗槽の水を補給す
ることによつて補つてめつき槽及び回収槽の総量
を常に一定に保持することができると共に、水洗
槽から排水されるめつき液の総量を少なくするこ
とができるという効果があり、さらに、導電率計
によつて測定した水洗槽のめつき液濃度に応じて
水洗槽に給水する給水バルブを備えたので、めつ
き液濃度に応じた量の給水で水洗槽の水質を常に
一定に保つことができ、過剰の給水をして無駄な
水を使わなくて済むという効果がある。 Moreover, the plating liquid collected in the collection tank flows to the collection tank on the plating tank side by natural head, and there is no need for power such as a pump to flow the plating liquid. be. In addition, we are equipped with a metering pump that replenishes an amount of water equivalent to the amount of evaporation from the plating tank from the washing tank to the collection tank that is the latest in order, so that the naturally decreasing amount of water in the plating tank can be replenished with water from the washing tank. As a result, the total amount of plating solution in the plating tank and recovery tank can be kept constant at all times, and the total amount of plating solution drained from the washing tank can be reduced. Equipped with a water supply valve that supplies water to the washing tank according to the plating solution concentration in the washing tank measured by a rate meter, so the water quality in the washing tank can always be kept constant by supplying water in an amount according to the plating solution concentration. This has the effect of eliminating the need to waste water by supplying excess water.
第１図は従来例の概略構成図、第２図は本考案
の一実施例の概略構成図、第３図は同上の動作説
明図である。
１はめつき槽、２はめつき液、３はバレル、４
１〜４3は回収槽、５は水洗槽、６1，６2は定量ポ
ンプである。
FIG. 1 is a schematic configuration diagram of a conventional example, FIG. 2 is a schematic configuration diagram of an embodiment of the present invention, and FIG. 3 is an explanatory diagram of the same operation. 1 is a plating tank, 2 is a plating liquid, 3 is a barrel, 4
1 to 4 3 are recovery tanks, 5 is a washing tank, and 6 1 and 6 2 are metering pumps.
Claims (1)
めつき槽内のめつき液に浸けられるめつき処理容
器と、めつき槽から引き上げためつき処理容器を
浸けてめつき処理容器に付着しためつき液を回収
する回収槽と、回収しためつき液を回収槽からめ
つき槽に戻すめつき液帰還装置と、回収槽から引
き上げためつき処理容器を浸けて水洗する水洗槽
とを有して成るめつき液回収装置において、めつ
き処理容器を浸ける回収槽を複数個設けて、各回
収槽は、めつき処理容器を浸ける順番が遅い回収
槽から、該順番が早い回収槽に向かつて順次自然
落差で回収しためつき液が流れるように列設し、
めつき槽からの蒸発量に相当する量の水を水洗槽
から順番が最も遅い回収槽に補給する定量ポンプ
を備えると共に、導電率計によつて測定した水洗
槽のめつき液濃度に応じて水洗槽に給水する給水
バルブを備えて成るめつき液回収装置。 A plating tank containing plating solution, a plating processing container that is immersed in the plating solution in the plating tank during plating work, and a plating processing container that is removed from the plating tank and immersed in the plating processing container. It has a collection tank for collecting the plating liquid, a plating liquid return device for returning the collected plating liquid from the collection tank to the plating tank, and a washing tank for immersing and washing the plating processing container taken up from the collection tank. In the plating liquid recovery device, a plurality of recovery tanks are provided in which the plating processing container is immersed, and each recovery tank is sequentially arranged from the recovery tank in which the plating processing container is immersed in the later order to the collection tank in which the order in which the plating processing container is immersed is earlier. Arranged in a row so that the collected liquid flows through natural head,
It is equipped with a metering pump that replenishes an amount of water equivalent to the amount of evaporation from the plating tank from the washing tank to the collection tank that is the latest in order, and also according to the concentration of plating solution in the washing tank as measured by a conductivity meter. A plating liquid recovery device that is equipped with a water supply valve that supplies water to a washing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15244883U JPS6060464U (en) | 1983-09-30 | 1983-09-30 | Plating liquid recovery device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15244883U JPS6060464U (en) | 1983-09-30 | 1983-09-30 | Plating liquid recovery device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6060464U JPS6060464U (en) | 1985-04-26 |
| JPH0133649Y2 true JPH0133649Y2 (en) | 1989-10-12 |
Family
ID=30337547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15244883U Granted JPS6060464U (en) | 1983-09-30 | 1983-09-30 | Plating liquid recovery device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6060464U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4217691Y1 (en) * | 1965-11-08 | 1967-10-13 | ||
| JPS4923134A (en) * | 1972-06-27 | 1974-03-01 | ||
| JPS5442717B2 (en) * | 1976-02-24 | 1979-12-15 | ||
| JPS569280A (en) * | 1979-06-29 | 1981-01-30 | Dijet Ind Co Ltd | Cubic boron nitride sintered body |
| JPS5758217U (en) * | 1980-09-22 | 1982-04-06 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442717U (en) * | 1977-09-01 | 1979-03-23 | ||
| JPS5932602Y2 (en) * | 1981-01-13 | 1984-09-12 | トヨタ自動車株式会社 | plating device |
-
1983
- 1983-09-30 JP JP15244883U patent/JPS6060464U/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4217691Y1 (en) * | 1965-11-08 | 1967-10-13 | ||
| JPS4923134A (en) * | 1972-06-27 | 1974-03-01 | ||
| JPS5442717B2 (en) * | 1976-02-24 | 1979-12-15 | ||
| JPS569280A (en) * | 1979-06-29 | 1981-01-30 | Dijet Ind Co Ltd | Cubic boron nitride sintered body |
| JPS5758217U (en) * | 1980-09-22 | 1982-04-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6060464U (en) | 1985-04-26 |
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