JPH01321697A - Assembling method for electronic device with printed board and structure thereof - Google Patents
Assembling method for electronic device with printed board and structure thereofInfo
- Publication number
- JPH01321697A JPH01321697A JP15343788A JP15343788A JPH01321697A JP H01321697 A JPH01321697 A JP H01321697A JP 15343788 A JP15343788 A JP 15343788A JP 15343788 A JP15343788 A JP 15343788A JP H01321697 A JPH01321697 A JP H01321697A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electronic device
- divided
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000010348 incorporation Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はロボットによる自動組立を可能にするプリント
基板を備える電子装置の組立方法とその構造に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for assembling an electronic device including a printed circuit board and its structure, which enables automatic assembly by a robot.
〔従来技術と発明が解決しようとする課題〕従来のプリ
ント基板を備える電子装置、例えばサーボコントローラ
は、第１図に示すようにきょう体１にヒートシンク２及
び複数のプリント基板３．４．５を複数の方向より組付
け、固定ネジ６で固定する構造となっている。[Prior Art and Problems to be Solved by the Invention] A conventional electronic device equipped with a printed circuit board, for example, a servo controller, has a heat sink 2 and a plurality of printed circuit boards 3, 4, 5 in a housing 1, as shown in FIG. It has a structure in which it can be assembled from multiple directions and fixed with fixing screws 6.
従って、組付けに際しては、きょう体１を反転する作業
を必要とし、ロボット等による自動組立が困難視されて
いた。Therefore, during assembly, it is necessary to invert the housing 1, making automatic assembly by a robot or the like difficult.
また、固定ネジの本数や種類が多く、部品点数及び組立
工数の消滅が問題となっていた。In addition, the number and types of fixing screws are large, and the number of parts and assembly man-hours are reduced.
そこで本発明は、ロボット等による自動組立てを容易に
する組立方法とその構造を提供することを目的としてい
る。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an assembly method and structure that facilitates automatic assembly by a robot or the like.
本発明は、上記の目的を達成するために、きょう体を適
数個に分割し、その分割きょう体間にプリント基板を挟
み込む組立方法としたものである。In order to achieve the above object, the present invention provides an assembly method in which a housing is divided into an appropriate number of pieces and a printed circuit board is sandwiched between the divided housings.
上記分割きょう体とプリント基板の固定方法としては貫
通する長い固定ネジで緊締する方法が自動組立にはふさ
れしい。As a method of fixing the divided housing and the printed circuit board, a method of tightening them with a long penetrating fixing screw is suitable for automatic assembly.
本発明実施の場合、分割きょう体の形状は枠状とするこ
とが好ましい。In the case of implementing the present invention, it is preferable that the divided housing has a frame shape.
また、分割きょう体とプリント基板の位置決めと、固定
孔の芯出しを同時に可能とする構造としては、
ｉ）隣接分割きょう体の一方にプリント基板を貫通する
突起を設は他方のプリント基板に前記突起と係合する凹
部又は透孔を設けるとよい。In addition, a structure that enables simultaneous positioning of the divided housing and printed circuit board and centering of the fixing hole is as follows: i) one of the adjacent divided housings is provided with a protrusion that penetrates the printed circuit board, and the other printed circuit board is provided with a protrusion that penetrates the printed circuit board; It is preferable to provide a recess or a through hole that engages with the protrusion.
ｉｉ）また、隣接分割きょう体のそれぞれにプリント基
板に設けた同一の透孔に嵌合する突起を設けるとよい。ii) Furthermore, it is preferable that each of the adjacent divided housings be provided with a protrusion that fits into the same through hole provided in the printed circuit board.
ｉｉｉ ）また上記突起は固定孔の部分に設けるとよい
。iii) Also, the above-mentioned protrusion is preferably provided in the fixing hole.
上記の方法によると、分割きょう体とプリント′基板を
必要な数だけ積み重ねれば目的の電子装置が得られ、し
かもロボット等による自動組立が行なえる。According to the above method, a desired electronic device can be obtained by stacking the required number of divided housings and printed circuit boards, and furthermore, automatic assembly by a robot or the like can be performed.
また、長いネジによる貫通緊締方法によると、ロボット
等による自動締め付けが行なえる。Further, according to the through-tightening method using long screws, automatic tightening can be performed by a robot or the like.
また、上記の位置決め及び芯出し構造を採ることにより
、組立及び締付は中の分割きょう体とプリント基板のず
れを防止し、不良品の発生及び自動組立運転停止などの
トラブル発生が防止される。In addition, by adopting the above positioning and centering structure, the assembly and tightening prevents misalignment between the divided housing and the printed circuit board, which prevents troubles such as defective products and automatic assembly operation stoppages. .
〔実施例）
本発明の具体的実施例について図面に基づき説明すると
次の通りである。[Example] Specific examples of the present invention will be described below based on the drawings.
第２図は本発明の実施例の分割斜視図で、ヒートシンク
１２の上部に、枠状の分割きょう体１１ａ。FIG. 2 is a divided perspective view of an embodiment of the present invention, in which a frame-shaped divided housing 11a is provided above the heat sink 12.
１１ｂ、ｌｌｃと、プリント基板１３．１４．１５をそ
れぞれ交互に積み重ね、最後に固定ネジ１６を各プリン
ト基板と、分割きょう体とに設けられた固定孔に通し、
ヒートシンク１２に設けられたタップ孔に締めつけるこ
とにより構成する電子装置である。11b, llc, and printed circuit boards 13, 14, and 15 are stacked alternately, and finally, the fixing screws 16 are passed through the fixing holes provided in each printed circuit board and the divided housing.
This is an electronic device configured by tightening a tap hole provided in a heat sink 12.
第３図は、ヒートシンク１２と分割きょう体１１ａ。FIG. 3 shows the heat sink 12 and the divided housing 11a.
１１ｂとプリント基板１３の位置決め構造を示すもので
、ヒートシンク１２に設けられた、深ザグリ（凹部１２
１）を有したタップ孔１２２と、分割きょう体１１ａの
下部に設けられた突起１１１により、また分割きょう体
１１ａの上面に設けた凹部１１２とそれと嵌合し、プリ
ント基板１３の固定孔１３ａを貫通する突起１１３によ
って、相互の位置決めと、固定孔とタップ孔との芯出し
が同時にできる構造となっている。11b and the printed circuit board 13, and shows the positioning structure of the heat sink 12.
1) and the protrusion 111 provided on the lower part of the divided housing 11a, and also fit into the recess 112 provided on the upper surface of the divided housing 11a, so that the fixing hole 13a of the printed circuit board 13 is fixed. The penetrating protrusion 113 allows mutual positioning and centering of the fixing hole and the tapped hole at the same time.
第４図は異なる位置決め構造を示すもので、この場合は
プリント基板１３の固定孔１３ａと嵌合する突起１１５
．１１６を対向する分割きょう体１１ａ、Ｉｌｂに設け
たものである。FIG. 4 shows a different positioning structure, in which a protrusion 115 that fits into the fixing hole 13a of the printed circuit board 13 is shown.
．． 116 are provided on the opposing divided housings 11a and Ilb.
第４図及び第５図に示した位置決め構造は、何れも突起
及び凹部を固定孔の部分に設けたが、他の位置でもよい
ことは勿論である。In both of the positioning structures shown in FIGS. 4 and 5, the protrusion and the recess are provided in the fixing hole, but it goes without saying that they may be provided in other positions.
以上説明したように、本発明によれば、一方向からの組
み付けが行え、人手による作業工数の低減は、もとより
、ロボット等による自動組立てが容易に実現することが
できる。As described above, according to the present invention, assembly can be performed from one direction, and not only the number of manual work steps can be reduced, but also automatic assembly by a robot or the like can be easily realized.
また、機種の違いによるプリント基板の枚数の変動の対
応にも、分割きょう体と、プリント基板との禎み重ねの
段数を増減することにより、容易に可能となる。Further, it is possible to easily deal with variations in the number of printed circuit boards due to differences in models by increasing or decreasing the number of stacked layers of divided housings and printed circuit boards.
さらに、分割きょう体とプリント基板を長い固定ネジに
より同時に固定することにより、固定ネジの本数や種類
を大巾に減少できる効果がある。Furthermore, by simultaneously fixing the divided housing and the printed circuit board using long fixing screws, there is an effect that the number and types of fixing screws can be greatly reduced.
第１図は従来の電子装置の組立て構造図、第２図は、本
発明による組立て構造図、第３図は位置決め構造の拡大
断面図、第４図は異なる位置決め構造の拡大断面図であ
る。
１・・・きょう体
２・・・ヒートシンク
３〜５・・・プリント基板
６・・・固定ネジ
７・・・スタッド
１１ａ〜ｌｌｃ・・・分割きょう体
１２・・・ヒートシンク
１３〜１５・・・プリント基板
１６・・・固定ネジ
特許出願人 株式会社安川電機製作・竹：′・宣）同
代理人 服 部 修 →胃
・ど、−０−１−
第 ３ 図
第 ４ 図
４５２図
第 １ 図
本 会FIG. 1 is an assembled structural diagram of a conventional electronic device, FIG. 2 is an assembled structural diagram according to the present invention, FIG. 3 is an enlarged sectional view of a positioning structure, and FIG. 4 is an enlarged sectional view of a different positioning structure. 1... Housing 2... Heat sinks 3-5... Printed circuit board 6... Fixing screws 7... Studs 11a-llc... Divided housing body 12... Heat sinks 13-15... Printed circuit board 16...Fixing screw Patent applicant: Yaskawa Electric Manufacturing Co., Ltd., Bamboo:', Sen) Same
Agent Osamu Hattori → Stomach・Do, -0-1- Figure 3 Figure 4 Figure 452 Figure 1 Figure 1
Claims (7)
にプリント基板を挟み込み一体とする組立方法を採った
ことを特徴とするプリント基板を備える電子装置の組立
方法。(1) A method for assembling an electronic device equipped with a printed circuit board, characterized in that the housing is divided into an appropriate number of parts, and the printed circuit board is sandwiched between the divided housings to integrate them.
ネジで一体とする請求項１記載の電子装置の組立方法。(2) The method for assembling an electronic device according to claim 1, wherein the divided housing and the printed circuit board are integrated with a long fixing screw passing through them.
重ねそれらを貫通する長い固定ネジで一体としたことを
特徴とするプリント基板を備える電子装置の構造。(3) A structure of an electronic device equipped with a printed circuit board, characterized in that an appropriate number of divided housings and printed circuit boards are stacked alternately and integrated with long fixing screws that pass through them.
ト基板を備える電子装置の構造。(4) A structure of an electronic device comprising a printed circuit board according to claim 3, wherein the divided housing is frame-shaped.
の一方にプリント基板を貫通する突起を設け、他方のプ
リント基板に前記突起と係合する凹部又は透孔を設けて
成るプリント基板を備える電子装置の構造。(5) According to claim 3 or 4, there is provided a printed circuit board, further comprising a protrusion penetrating the printed circuit board on one of the adjacent divided enclosures, and a recess or a through hole that engages with the protrusion on the other printed circuit board. The structure of the electronic device.
のそれぞれにプリント基板に設けた同一の透孔に嵌合す
る突起を設けて成るプリント基板を備える電子装置の構
造。(6) The structure of an electronic device according to claim 3 or 4, further comprising a printed circuit board in which each of the adjacent divided housings is provided with a protrusion that fits into the same through hole provided in the printed circuit board.
求項５又は６記載のプリント基板を備える電子装置の構
造。(7) The structure of an electronic device comprising a printed circuit board according to claim 5 or 6, wherein the protrusion is provided in the fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15343788A JPH01321697A (en) | 1988-06-23 | 1988-06-23 | Assembling method for electronic device with printed board and structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15343788A JPH01321697A (en) | 1988-06-23 | 1988-06-23 | Assembling method for electronic device with printed board and structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01321697A true JPH01321697A (en) | 1989-12-27 |
Family
ID=15562505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15343788A Pending JPH01321697A (en) | 1988-06-23 | 1988-06-23 | Assembling method for electronic device with printed board and structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01321697A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463687U (en) * | 1990-10-09 | 1992-05-29 | ||
| US5373104A (en) * | 1993-07-12 | 1994-12-13 | Delco Electronics Corporation | Control module with integral fastening/locking assembly |
| JPH11103177A (en) * | 1997-09-25 | 1999-04-13 | Matsushita Electric Ind Co Ltd | Electronic apparatus case and its assembling method |
| JP2012502460A (en) * | 2008-09-04 | 2012-01-26 | エスケー イノベーション カンパニー リミテッド | Multilayer printed circuit board fixing structure |
| WO2023037856A1 (en) * | 2021-09-10 | 2023-03-16 | 株式会社デンソー | Electronic device |
-
1988
- 1988-06-23 JP JP15343788A patent/JPH01321697A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463687U (en) * | 1990-10-09 | 1992-05-29 | ||
| US5373104A (en) * | 1993-07-12 | 1994-12-13 | Delco Electronics Corporation | Control module with integral fastening/locking assembly |
| JPH11103177A (en) * | 1997-09-25 | 1999-04-13 | Matsushita Electric Ind Co Ltd | Electronic apparatus case and its assembling method |
| JP2012502460A (en) * | 2008-09-04 | 2012-01-26 | エスケー イノベーション カンパニー リミテッド | Multilayer printed circuit board fixing structure |
| WO2023037856A1 (en) * | 2021-09-10 | 2023-03-16 | 株式会社デンソー | Electronic device |
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