JPH01321086A - Laser beam cutting method - Google Patents

Laser beam cutting method

Info

Publication number
JPH01321086A
JPH01321086A JP63153073A JP15307388A JPH01321086A JP H01321086 A JPH01321086 A JP H01321086A JP 63153073 A JP63153073 A JP 63153073A JP 15307388 A JP15307388 A JP 15307388A JP H01321086 A JPH01321086 A JP H01321086A
Authority
JP
Japan
Prior art keywords
gas
cutting
laser beam
laser
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63153073A
Other languages
Japanese (ja)
Inventor
Tsugio Futaki
二木 次夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63153073A priority Critical patent/JPH01321086A/en
Publication of JPH01321086A publication Critical patent/JPH01321086A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve and stabilize laser beam cutting quality by mixing different kind of gas in O gas and changing the rate of O purity according to a cutting shape of a material to be cut to perform laser beam cutting thereon. CONSTITUTION:A gas bomb 9 of N gas, etc., of the different kind is connected to an assisting gas supplying device 8 of a laser beam machine 3 together with an O gas bomb 7. The assisting gas having a large quantity of N gas mixed in the O gas is supplied to a fine cutting 11 part and a sharp edge 10 part of the material 5 to be cut by the gas supplying device 8 and laser beam cutting is performed. By this method, since the O purity is adjusted low at the parts with the complicated cutting shapes, the oxidation reaction is suppressed. Accordingly, melting-down due to thermal saturation at the fine cutting parts 10 and 11 is reduced and the cutting quality is improved and stabilized.

Description

【発明の詳細な説明】 [産業上の利用分野] この発明は、レーザビームを用いて板金部品等の被加工
物を切断加工する際に用いて好適のレーザ切断加工方法
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser cutting method suitable for use when cutting a workpiece such as a sheet metal part using a laser beam.

[従来の技術] 第4図は従来のレーザ切断加工手段を実施する際に用い
られる一般的なレーザ加工装置を示す概略構成図であり
、図において、1はレーザビーム2を発振するレーザ発
振器、3はレーザ加工機、4はレーザ加工機3に装着さ
れた加工ヘッド、5は被加工物、6は被加工物5を支持
する加工テーブル、7はアシストガスとして用いられる
酸素ガスを収納する酸素ガスボンベ、8は酸素ガスを酸
素ガスボンベ7から加工ヘッド4へ供給するアシストガ
ス供給装置である。
[Prior Art] FIG. 4 is a schematic configuration diagram showing a general laser processing apparatus used when performing conventional laser cutting processing means. In the figure, 1 indicates a laser oscillator that oscillates a laser beam 2; 3 is a laser processing machine, 4 is a processing head attached to the laser processing machine 3, 5 is a workpiece, 6 is a processing table that supports the workpiece 5, and 7 is an oxygen tank that stores oxygen gas used as an assist gas. A gas cylinder 8 is an assist gas supply device that supplies oxygen gas from the oxygen gas cylinder 7 to the processing head 4.

次に、第4図に示したレーザ加工装置を用いて行なわれ
る従来のレーザ切断加工手段について説明する。レーザ
発振器1によって発振されたレーザビーム2は、レーザ
加工機3へ導かれ、加工ヘッド4にて小さなスポット径
に集束され、加工テーブル6に支持された被加工物5へ
照射されて、被加工物5の切断加工が行なわれる。この
とき、切断加工用のアシストガスとして酸素ガスがアシ
ストガス供給装置8により加工ヘッド4へ供給される。
Next, conventional laser cutting processing means performed using the laser processing apparatus shown in FIG. 4 will be explained. A laser beam 2 oscillated by a laser oscillator 1 is guided to a laser processing machine 3, focused into a small spot diameter by a processing head 4, and irradiated onto a workpiece 5 supported on a processing table 6 to form a laser beam 2 to be processed. The object 5 is cut. At this time, oxygen gas is supplied to the processing head 4 by the assist gas supply device 8 as an assist gas for cutting.

[発明が解決しようとする課題] 従来のレーザ切断加工は以上のように行なわれ、切断加
工を施す被加工物5が全屈部品である場合、アシストガ
スに酸素ガスを使用しているので、鋭角切断(シャープ
エツジ)部や微細切断部などのように切断加工速度が遅
くなる部分では、加工部に吹き付けられる酸素ガスによ
る酸化反応が過大になりやすく、鋭角切断部や微細切断
部などが熱影響を受け、切断品質が不安定で精度の低下
を招くという課題があった。このため、被加工物5の形
状に応じてレーザ出力、出力形態が制約されることにな
り、パルス出力を発生させることのできる装置をそなえ
た高価なレーザ発振器を使用する必要があった。
[Problems to be Solved by the Invention] Conventional laser cutting is performed as described above, and when the workpiece 5 to be cut is a fully bent part, oxygen gas is used as the assist gas. In areas where the cutting speed is slow, such as sharp edges and fine cuts, the oxidation reaction caused by the oxygen gas blown onto the processed area tends to be excessive, causing the sharp edges and fine cuts to heat up. As a result, cutting quality was unstable and accuracy was reduced. For this reason, the laser output and output form are restricted depending on the shape of the workpiece 5, and it is necessary to use an expensive laser oscillator equipped with a device capable of generating pulsed output.

例えば、第5図は従来のレーザ切断加工手段によるレー
ザ切断加工例を示す説明図であり、また第6図(a)、
(b)はシャープエツジ角度θと溶損長りとの関係の一
例を示す特性図である。第5゜6図に示すように、被加
工物5の微細切断部11や鋭角切断時のシャープエツジ
部10は、形状効果により熱飽和状態になり、アシスト
ガスである酸素ガス7との酸化反応が著しくなって、そ
の反応熱により、溶損部(斜線部分)12が生じて良好
な切断加工を行なえなかった。このために、被加工物5
のシャープエツジ部1oや微細切断部11では、溶損を
生じないように出力および出力形態などの加工条件を再
設定する必要があるなどの課題があった。
For example, FIG. 5 is an explanatory diagram showing an example of laser cutting processing using a conventional laser cutting processing means, and FIG. 6(a),
(b) is a characteristic diagram showing an example of the relationship between the sharp edge angle θ and the melting loss length. As shown in FIG. 5.6, the fine cut portion 11 of the workpiece 5 and the sharp edge portion 10 during acute angle cutting become thermally saturated due to the shape effect, and undergo an oxidation reaction with oxygen gas 7, which is an assist gas. The reaction heat caused a melted part (shaded part) 12 to occur, making it impossible to perform a good cutting process. For this purpose, the workpiece 5
In the sharp edge part 1o and the fine cutting part 11, there were problems such as the need to reset processing conditions such as output and output form so as not to cause melt damage.

この発明は上記のような課題を解消するためになされた
もので、複雑な形状の板金部品の鋭角切断部などにおい
ても切断加工品質が安定し、しかも加工条件設定のため
の所要時間を短縮できるレーザ切断加工方法を得ること
を目的とする。
This invention was made to solve the above-mentioned problems, and it is possible to stabilize the cutting quality even when cutting sharply-angled parts of sheet metal parts with complex shapes, and shorten the time required to set the processing conditions. The purpose is to obtain a laser cutting processing method.

[課題を解決するための手段] この発明に係るレーザ切断加工方法は、被加工物の切断
形状に応じて、アシストガスである酸素ガスに他の種類
のガスを混入して酸素純度の割合を変化させるものであ
る。
[Means for Solving the Problems] The laser cutting method according to the present invention mixes other types of gas into oxygen gas, which is an assist gas, to adjust the oxygen purity ratio according to the cutting shape of the workpiece. It is something that changes.

[作   用] この発明におけるレーザ切断加工方法では、アシストガ
スである酸素ガスの酸素純度を調整することによって酸
化反応が抑制されるので、複雑な形状の板金部品(被加
工物)の微細切断部や鋭角切断部などにおいても、熱飽
和による溶損が少なくなる。
[Function] In the laser cutting method of the present invention, the oxidation reaction is suppressed by adjusting the oxygen purity of the oxygen gas that is the assist gas. This also reduces melting loss due to thermal saturation, even when cutting at sharp angles.

[発明の実施例] 以下、この発明の一実施例を図について説明する。第1
図はこの発明の一実施例によるレーザ切断加工方法を実
施するために用いられるレーザ加工装置を示す概略構成
図で、図中、第4図に示す装置と同一の部分には同一の
符号を付し、その説明は省略する。
[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1st
The figure is a schematic configuration diagram showing a laser processing device used to implement a laser cutting method according to an embodiment of the present invention. In the figure, the same parts as those in the device shown in FIG. However, the explanation thereof will be omitted.

第1図において、9は窒素ガスを収納する窒素ガスボン
ベで、この窒素ガスボンベ9内の窒素ガスは、アシスト
ガス供給装置8により適当量取り出されて、酸素ガスボ
ンベ7からの酸素ガスに混入されるようになっている。
In FIG. 1, reference numeral 9 denotes a nitrogen gas cylinder that stores nitrogen gas, and an appropriate amount of nitrogen gas in the nitrogen gas cylinder 9 is taken out by an assist gas supply device 8 and mixed with the oxygen gas from the oxygen gas cylinder 7. It has become.

次に、このようなレーザ加工装置を用いて行なわれるレ
ーザ切断加工方法について説明する。従来の場合と同様
に、レーザ発振器1によって発振されたレーザビーム2
は、レーザ加工機3へ導かれ、加工ヘッド4にて小さな
スポット径に集束され、加工テーブル6に支持された被
加工物5へ照射されて、被加工物5の切断加工が行なわ
れる。
Next, a laser cutting method performed using such a laser processing apparatus will be described. As in the conventional case, a laser beam 2 oscillated by a laser oscillator 1
is guided to a laser processing machine 3, focused into a small spot diameter by a processing head 4, and irradiated onto a workpiece 5 supported on a processing table 6, thereby cutting the workpiece 5.

このとき、本実施例の方法では、アシストガス供給袋[
8により、被加工物5の切断形状に応じて、切断加工用
のアシストガスとしての酸素ガスに窒素ガスを適当量混
入し、酸素純度を調整してからガスが加工ヘッド4へ供
給される。
At this time, in the method of this embodiment, the assist gas supply bag [
8, an appropriate amount of nitrogen gas is mixed into oxygen gas as an assist gas for cutting according to the cutting shape of the workpiece 5, and the oxygen purity is adjusted before the gas is supplied to the processing head 4.

例えば、第2図に示すような形状の切断加工をA−にの
順序で行なう場合、切断形状の複雑な部分つまりシャー
プエツジ部10や微細切断部11であるD−F、G〜I
、J−にでは、第3図に示すように、アシストガス供給
装置8により酸素ガスへの窒素ガスの混入量を多くして
、酸素純度の割合を減少変化させてから、その混合ガス
をアシストガスとして加工ヘッド4へ供給し被加工物5
の加工部へ吹き付ける。
For example, when cutting a shape as shown in FIG.
, J-, as shown in FIG. 3, the amount of nitrogen gas mixed into the oxygen gas is increased by the assist gas supply device 8 to decrease the oxygen purity ratio, and then the mixed gas is supplied to the assist gas. The gas is supplied to the processing head 4 and the workpiece 5 is
Spray onto the processing area.

このようにして、切断形状の複雑な部分では、アシスト
ガスである酸素ガスの酸素純度を低く調整することによ
り、酸化反応が抑制されるので、複雑な形状の板金部品
(被加工物)の微細切断部や第5図において示した熱飽
和による溶損が少なくなり、高品質で高精度のレーザ切
断加工が行なえ、しかも加工条件設定の所要時間を短縮
できるとともに、安定した切断加工が実現される。また
、出力形態の制約がなくなり、パルス出力発生装置を必
要としない安価なレーザ発振器を使用できる利点もある
In this way, in areas with complicated cutting shapes, the oxidation reaction is suppressed by adjusting the oxygen purity of oxygen gas, which is the assist gas, to a low level. Melting loss due to thermal saturation shown in the cutting section and Figure 5 is reduced, allowing high-quality and highly accurate laser cutting, reducing the time required to set processing conditions, and achieving stable cutting. . There is also the advantage that there are no restrictions on the output form and that an inexpensive laser oscillator that does not require a pulse output generator can be used.

なお、上記実施例では、アシストガスである酸素ガスに
混入するガスを窒素ガスとした場合について説明したが
、これ以外に、アルゴン、ヘリウム等の不活性ガスや、
水素等の活性ガスや、空気などを用いてもよく、いずれ
の場合も上記実施例と同様の効果を奏する。
In addition, in the above embodiment, a case was explained in which nitrogen gas was used as the gas mixed into the oxygen gas which is the assist gas, but in addition to this, inert gas such as argon, helium, etc.
An active gas such as hydrogen, air, etc. may be used, and in either case, the same effects as in the above embodiments can be achieved.

[発明の効果] 以上のように、この発明によれば、レーザ切断加工時に
、切断形状に応じてアシストガスとして用いられる酸素
ガスに他の種類のガスを混入し、激素純度を調整するよ
うにしたので、複雑な形状の板金部品の切断加工などに
際しても切断加工品質が向上・安定するとともに、加工
条件設定の所要時間を短縮できる効果がある。
[Effects of the Invention] As described above, according to the present invention, other types of gases are mixed into the oxygen gas used as an assist gas depending on the cutting shape during laser cutting processing to adjust the purity of the radical element. Therefore, even when cutting sheet metal parts with complicated shapes, the cutting quality is improved and stabilized, and the time required for setting processing conditions can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例によるレーザ切断加工方法
を実施するために用いられるレーザ加工装置を示す概略
構成図、第2図は上記装置による切断加工例を説明する
ための被加工物の平面図、第3図は第2図の被加工物の
切断形状に対応した酸素純度の調整例を示すグラフ、第
4図は従来のレーザ切断加工手段を実施する際に用いら
れる一般的なレーザ加工装置を示す概略構成図、第5図
は上記従来装置による切断加工例を説明するための被加
工物の平面図、第6図(、)はシャープエツジ角度と溶
損長とを説明するための図、第6図(b)シャープエツ
ジ角度と溶損長との関係を示す特性図である。 図において、1−レーザ発振器、2−レーザビーム、3
−レーザ加工機、5・−被加工物、7−・酸素ガスボン
ベ、8−アシストガス供給装置、9−窒素ガスボンベ。 なお1図中、同一の符号は同一、又は相当部分を示して
いる。 第1図 1−−−−レーア°溌I辰器 9−一一一窒素πスボンベ 第2図 ++ 第3図 (刀Ωエイ立冒) 第4図 1−−−−レープ溌1灰器 第5図 第6図 (G)         (b) エラ+泊度θ(釦
FIG. 1 is a schematic configuration diagram showing a laser processing device used to carry out a laser cutting method according to an embodiment of the present invention, and FIG. 2 is a diagram showing a workpiece for explaining an example of cutting processing by the above device. A plan view, FIG. 3 is a graph showing an example of oxygen purity adjustment corresponding to the cutting shape of the workpiece shown in FIG. 2, and FIG. 4 is a graph showing a typical laser used when performing conventional laser cutting processing A schematic configuration diagram showing a processing device, FIG. 5 is a plan view of a workpiece for explaining an example of cutting processing using the above-mentioned conventional device, and FIG. 6 (,) is for explaining the sharp edge angle and erosion length. FIG. 6(b) is a characteristic diagram showing the relationship between the sharp edge angle and the erosion length. In the figure, 1 - laser oscillator, 2 - laser beam, 3
-Laser processing machine, 5.-Workpiece, 7.-Oxygen gas cylinder, 8-Assist gas supply device, 9-Nitrogen gas cylinder. In addition, in FIG. 1, the same reference numerals indicate the same or corresponding parts. Fig. 1 1----- Lehr ° 溌 I Tatsuki 9-111 Nitrogen π bomb Fig. 2 ++ Fig. 3 (Katana Ω Ei Riseki) Fig. 4 1 ---- Leb 溌 1 ash container No. Figure 5 Figure 6 (G) (b) Erra + Night degree θ (button

Claims (1)

【特許請求の範囲】[Claims] 酸素ガスをアシストガスとして被加工物の加工部へ吹き
付けながらレーザビームを上記加工部へ照射し酸化反応
を利用して上記加工部の切断加工を行なうレーザ切断加
工方法において、上記被加工物の切断形状に応じて、上
記酸素ガスに他の種類のガスを混入して酸素純度の割合
を変化させることを特徴とするレーザ切断加工方法。
In a laser cutting method, in which a laser beam is irradiated to the machined part of the workpiece while oxygen gas is used as an assist gas to cut the machined part, the workpiece is cut using an oxidation reaction. A laser cutting method characterized by changing the oxygen purity ratio by mixing other types of gas into the oxygen gas according to the shape.
JP63153073A 1988-06-20 1988-06-20 Laser beam cutting method Pending JPH01321086A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63153073A JPH01321086A (en) 1988-06-20 1988-06-20 Laser beam cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63153073A JPH01321086A (en) 1988-06-20 1988-06-20 Laser beam cutting method

Publications (1)

Publication Number Publication Date
JPH01321086A true JPH01321086A (en) 1989-12-27

Family

ID=15554389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63153073A Pending JPH01321086A (en) 1988-06-20 1988-06-20 Laser beam cutting method

Country Status (1)

Country Link
JP (1) JPH01321086A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760368A (en) * 1994-07-08 1998-06-02 Fanuc, Ltd. Laser beam method using an inactive gas as the assist gas
EP2018926A1 (en) * 2007-07-26 2009-01-28 Linde Aktiengesellschaft Process for thermal cutting with change of gas composition during the cutting process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760368A (en) * 1994-07-08 1998-06-02 Fanuc, Ltd. Laser beam method using an inactive gas as the assist gas
EP2018926A1 (en) * 2007-07-26 2009-01-28 Linde Aktiengesellschaft Process for thermal cutting with change of gas composition during the cutting process

Similar Documents

Publication Publication Date Title
EP0527229A1 (en) Laser and laser welding method
KR970010888B1 (en) Laser machining apparatus
EP1018395A2 (en) Laser machining apparatus
US20020134768A1 (en) Laser machining apparatus
JPS61123493A (en) Laser working device
JPS608916B2 (en) Welding method using laser and MIG
JPH0321271B2 (en)
US6274841B1 (en) Controlled plasma arc cutting
JPH06155063A (en) Laser beam cutting method
JP2579800B2 (en) Laser cutting method
JPH01321086A (en) Laser beam cutting method
JPH067973A (en) Laser beam machine
JPH10323781A (en) Laser processing method
JPS63171289A (en) Laser beam cut processing method
JPH0233996Y2 (en)
JP3838817B2 (en) Corner cutting method and apparatus using plasma processing machine
JPH079175A (en) Piercing method for laser beam machine
JP2006341259A (en) Laser piercing method, and machining apparatus
JPS6462291A (en) Welding method for al alloy
JPH02295688A (en) Laser beam machining method for film coating material and laser beam machining head used for the method
JPH11291040A (en) Shielding gas for fillet welding of lap joint of steel sheet and method for fillet welding of lap joint using the same gas
JPH0788669A (en) Laser beam machine
JP2913018B2 (en) Metal surface treatment method
JP2001001150A (en) Cutting method of hole with plasma arc processing machine
JP3031562B2 (en) Plasma piercing method and apparatus