JPH01321082A - Laser beam marking device - Google Patents

Laser beam marking device

Info

Publication number
JPH01321082A
JPH01321082A JP63152942A JP15294288A JPH01321082A JP H01321082 A JPH01321082 A JP H01321082A JP 63152942 A JP63152942 A JP 63152942A JP 15294288 A JP15294288 A JP 15294288A JP H01321082 A JPH01321082 A JP H01321082A
Authority
JP
Japan
Prior art keywords
moving
mask
imaging
image formation
changed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63152942A
Other languages
Japanese (ja)
Inventor
Takahiro Okubo
大久保 高博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Development and Engineering Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Device Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Device Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP63152942A priority Critical patent/JPH01321082A/en
Publication of JPH01321082A publication Critical patent/JPH01321082A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve workability of a laser beam marking by moving the position of an image formation lens of the title laser beam making device and changing an image formation ratio without moving a mask and the focusing position. CONSTITUTION:A beam shaping optical system, the mask 1 and an image formation optical system 5 are arranged successively at prescribed intervals on a laser beam optical axis. At this time, the image formation optical system 5 is constituted by combining two concave and convex lenses 5a and 5b and as necessary, the composite focal length is changed from f' to f'' by moving the lenses 5a and 5b. By this method, the composite focal length f' s changed only by moving the positions of the lenses 5a and 5b and the size D of an image at a fixed image formation point 3 is changed freely and the image formation ratio is changed. Since the operation of the device is simplified only by moving the lenses, the workability of marking is improved.

Description

【発明の詳細な説明】 [発明の目的コ (産業上の利用分野) この発明は、レーザマーキング装置に係り、特にその結
像レンズ系の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention (Industrial Field of Application)] The present invention relates to a laser marking device, and particularly to an improvement in its imaging lens system.

(従来の技術) 従来、レーザマーキング装置は第3図に示すように構成
され、レーザ発振器(図示せず)から出射されたレーザ
光は、ビーム整形光学系(図示せず)を通り、その光束
は適当な断面形状を持つように整形される。この整形さ
れたレーザ光4はマスク1に照射される。この、マスク
1は、例えばレーザ光4を透過する部分と遮蔽する部分
とでマーキングしたいパターンを形成したものである。
(Prior Art) Conventionally, a laser marking device is configured as shown in FIG. is shaped to have an appropriate cross-sectional shape. This shaped laser beam 4 is irradiated onto the mask 1. This mask 1 has, for example, a pattern to be marked formed with a portion that transmits the laser beam 4 and a portion that blocks the laser beam 4.

マスク1を通過したレーザ光は1つ又は複数の組みレン
ズによる結像レンズ2を通って結像点(被加工物)3に
照射される。
The laser light that has passed through the mask 1 is irradiated onto an imaging point (workpiece) 3 through an imaging lens 2 made up of one or more assembled lenses.

この時、マスク1に形成されたパターンが、結像レンズ
2によって結像点3に結像されているため、被加工物上
にマスク1のパターンがマーキングされる。
At this time, since the pattern formed on the mask 1 is focused on the imaging point 3 by the imaging lens 2, the pattern of the mask 1 is marked on the workpiece.

ところで、マーキングする大きさを変える場合、一定の
結像比であるならば、マスク1の交換を行ない、又、結
像比を変えてマーキングする大きさを変化させる場合で
あるなら、第3図のa(マスクと結像レンズ間距離)、
b(結像レンズと結像位置間距離)及び結像レンズ2の
焦点距離fの下記の関係式(2)に従って被加工物にマ
ーキングを行ない大きさを定め、マスク1でのパターン
の大きさから結像倍率が決まる。よって、関係式(1)
、(2)を用いて、aとbの値を算出し、被加工物に対
しての距離を設定していく。
By the way, when changing the marking size, if the imaging ratio is constant, the mask 1 is replaced, and if the imaging ratio is changed to change the marking size, then the mask 1 is replaced as shown in Fig. 3. a (distance between mask and imaging lens),
Mark the workpiece according to the following relational expression (2) of b (distance between the imaging lens and the imaging position) and the focal length f of the imaging lens 2, determine the size, and determine the size of the pattern on the mask 1. The imaging magnification is determined from Therefore, relational expression (1)
, (2), the values of a and b are calculated, and the distance to the workpiece is set.

a / b−結像倍率      ・・・(1)1 /
 f −1/ a + 1 / b    −= (2
)但し、f:結像レンズ焦点距離 (発明が解決しようとする課題) 上記従来のレーザマーキング装置では、安価である代わ
りに、同一マスクパターンの被加工物へのマークサイズ
を変化させようとした場合に、被加工物の焦点位置を一
定に保ち、尚且つマスク1と結像レンズ2の2箇所を移
動し、固定しなければならず、作業が繁雑になっていた
a/b-imaging magnification...(1)1/
f −1/a + 1/b −= (2
) However, f: focal length of the imaging lens (problem to be solved by the invention) In the conventional laser marking device described above, although it is inexpensive, it attempts to change the mark size on the workpiece with the same mask pattern. In this case, the focal position of the workpiece must be kept constant, and the mask 1 and the imaging lens 2 must be moved and fixed at two locations, making the work complicated.

この発明は、マスクパターンの結像位置を変えることな
く、そのマスクパターンの結像比、即ち、被加工物上で
のマーキングされるパターンの大きさを変えることが出
来、作業性を著しく向上したレーザマーキング装置を提
供することを目的とする。
This invention can change the imaging ratio of the mask pattern, that is, the size of the pattern to be marked on the workpiece, without changing the imaging position of the mask pattern, and has significantly improved workability. The purpose of the present invention is to provide a laser marking device.

[発明の構成] (課題を解決するための手段) この発明は、レーザ発振器から出射されたレーザ光を、
少なくともレンズ、マスク及び結像レンズを通して被加
工物に照射することにより、この被加工物上に上記マス
クのパターンをマーキングするレーザマーキング装置に
おいて、上記結像レンズのみを移動させることにより結
像比を変えることを特徴とするレーザマーキング装置で
ある。
[Structure of the Invention] (Means for Solving the Problems) This invention provides a method for converting laser light emitted from a laser oscillator into
In a laser marking device that marks the pattern of the mask on the workpiece by irradiating the workpiece through at least a lens, a mask, and an imaging lens, the imaging ratio can be adjusted by moving only the imaging lens. This is a laser marking device that is characterized by the ability to

(作用) この発明によれば、結像光学系における凹凸の組合せに
よるレンズを移動させることにより、被加工物表面への
マーキングパターンの大きさをマスク交換並びにマスク
移動をすることなく変化させることが出来、被加工物表
面での焦点が変わることもない。
(Function) According to the present invention, by moving the lens based on the combination of concave and convex portions in the imaging optical system, it is possible to change the size of the marking pattern on the surface of the workpiece without changing or moving the mask. The focus on the surface of the workpiece does not change.

(実施例) 以下、図面を参照して、この発明の一実施例を詳細に説
明する。
(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

この発明によるレーザマーキング装置は、第1図に示す
ように構成され、従来例(第3図)と同一箇所には同一
符号を付すことにする。
The laser marking device according to the present invention is constructed as shown in FIG. 1, and the same parts as in the conventional example (FIG. 3) are given the same reference numerals.

即ち、レーザ発振器(図示せず)から出射されるレーザ
光の光軸上には、ビーム整形光学系(図示せず)とマス
ク及び結像光学系5が所定間隔をおいて順次配設されて
いる。
That is, on the optical axis of laser light emitted from a laser oscillator (not shown), a beam shaping optical system (not shown), a mask, and an imaging optical system 5 are sequentially arranged at predetermined intervals. There is.

この場合、結像光学系5は凹凸2枚の結像レンズ5 a
 s 5 bの組合せにより構成され、第2図に示すよ
うに、必要に応じこの結像レンズ5 a s5bを移動
させることにより、合成焦点距離をf′からf′まで変
化させることで、結像倍率a / bを変化させている
In this case, the imaging optical system 5 has two concave and convex imaging lenses 5 a
As shown in FIG. 2, the combined focal length can be changed from f' to f' by moving the imaging lenses 5a and 5b as necessary. The magnification a/b is changed.

第1図に示したレンズ間距離Cの場合、合−成焦点距離
f′は凹状の結像レンズ5aの焦点距離fIs凸状の結
像レンズ5bの焦点距離f 2としたときに、以下の式
より求まる。
In the case of the inter-lens distance C shown in FIG. 1, the combined focal length f' is the following, where the focal length fI of the concave imaging lens 5a and the focal length f2 of the convex imaging lens 5b are Determined from the formula.

1 / f ’ = 1 / f 1+ 1 / f 
2  C/f1 ・f2    ・・・(3) 第2図においても、レンズ間距離C′となった時、式(
3)にC′を代入することで、合成焦点圧i!fi f
 ’が算出される。算出された合成焦点距離f′により
結像点3での像の大きさがD及びD′と変化していき、
そのときの結像点3が動くことなくマスク1から結像点
3までの距離a’+bが一定のまま異なった結像比を得
ることが出来る。
1/f'=1/f1+1/f
2 C/f1 ・f2 ... (3) Also in Fig. 2, when the distance between the lenses becomes C', the formula (
By substituting C' into 3), the composite focal pressure i! fi f
' is calculated. The size of the image at the imaging point 3 changes to D and D' according to the calculated composite focal length f',
Different imaging ratios can be obtained while the distance a'+b from the mask 1 to the imaging point 3 remains constant without moving the imaging point 3 at that time.

[発明の効果] 以上説明したように、この発明によれば、結像光学系を
複数の結像レンズにより構成しているので、結像光学系
のレンズ間距離を変更することで焦点距離を変更するこ
とが出来る。この結果、マスク及び焦点位置を移動させ
ることなく、複数の結像レンズを移動させることで、結
像点つまり被加工物上のマスクのパターンの大きさを得
ることが出来る。
[Effects of the Invention] As explained above, according to the present invention, since the imaging optical system is composed of a plurality of imaging lenses, the focal length can be changed by changing the distance between the lenses of the imaging optical system. Can be changed. As a result, by moving the plurality of imaging lenses without moving the mask and the focal point position, it is possible to obtain the imaging point, that is, the size of the mask pattern on the workpiece.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例に係るレーザマーキング装
置を示す概略構成図、第2図はこの発明のレーザマーキ
ング装置において結像比を変化させた場合を示す概略構
成図、第3図は従来のレーザマーキング装置を示す概略
構成図である。 1・・・マスク、3・・・結像点(被加工物)、5・・
・結像光学系、5a、5b・・・結像レンズ。 出願人代理人 弁理士 鈴江武彦 第3図
FIG. 1 is a schematic configuration diagram showing a laser marking device according to an embodiment of the present invention, FIG. 2 is a schematic configuration diagram showing a case where the imaging ratio is changed in the laser marking device of the present invention, and FIG. FIG. 1 is a schematic configuration diagram showing a conventional laser marking device. 1... Mask, 3... Imaging point (workpiece), 5...
- Imaging optical system, 5a, 5b...imaging lens. Applicant's agent Patent attorney Takehiko Suzue Figure 3

Claims (1)

【特許請求の範囲】 レーザ発振器から出射されたレーザ光を、少なくともレ
ンズ、マスク及び結像レンズを通して被加工物に照射す
ることにより、この被加工物上に上記マスクのパターン
をマーキングするレーザマーキング装置において、 上記結像レンズのみを移動させることにより結像比を変
えることを特徴とするレーザマーキング装置。
[Claims] A laser marking device that marks a pattern of the mask on a workpiece by irradiating the workpiece with laser light emitted from a laser oscillator through at least a lens, a mask, and an imaging lens. A laser marking device characterized in that the imaging ratio is changed by moving only the imaging lens.
JP63152942A 1988-06-21 1988-06-21 Laser beam marking device Pending JPH01321082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63152942A JPH01321082A (en) 1988-06-21 1988-06-21 Laser beam marking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63152942A JPH01321082A (en) 1988-06-21 1988-06-21 Laser beam marking device

Publications (1)

Publication Number Publication Date
JPH01321082A true JPH01321082A (en) 1989-12-27

Family

ID=15551524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63152942A Pending JPH01321082A (en) 1988-06-21 1988-06-21 Laser beam marking device

Country Status (1)

Country Link
JP (1) JPH01321082A (en)

Similar Documents

Publication Publication Date Title
JP3531199B2 (en) Optical transmission equipment
JPS5794482A (en) Pattern forming device by laser
KR950033695A (en) Optical integrator and projection exposure apparatus using the same
US4526443A (en) Telecentric illumination system
KR950024024A (en) Projection exposure apparatus and device manufacturing method using the same
JPS556354A (en) Refractive index distribution type lens
JPS5820015B2 (en) Focused laser beam optical device
JPS62266513A (en) Projecting exposure optical system
JPH0436794B2 (en)
JPH01321082A (en) Laser beam marking device
JPH0290119A (en) Condensing optical device for laser drawing machine
JPH0556992A (en) Ophthalmo-optical apparatus
JP2001009580A (en) Laser light condensing device
JPH1062710A (en) Illumination optical system
EP0236521B1 (en) Reflection type optical device
JPS63273806A (en) Objective for laser beam machining
JPH0439647B2 (en)
JPS63108318A (en) Laser working device
JP3526165B2 (en) Optical processing machine and method of manufacturing orifice plate using the same
JPS62212091A (en) Laser beam machine
JP2685019B2 (en) Laser processing equipment
JPS5515131A (en) Scanning optical system
JPS52111736A (en) Scanning optical system with information beam take-out element
JPS547927A (en) Photographic lens of excellent focusing operation
JPH0336377U (en)