JPH01319106A - Magnetic head - Google Patents
Magnetic headInfo
- Publication number
- JPH01319106A JPH01319106A JP15026988A JP15026988A JPH01319106A JP H01319106 A JPH01319106 A JP H01319106A JP 15026988 A JP15026988 A JP 15026988A JP 15026988 A JP15026988 A JP 15026988A JP H01319106 A JPH01319106 A JP H01319106A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- terminals
- bonding
- lead terminal
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 26
- 239000004020 conductor Substances 0.000 description 12
- 239000010409 thin film Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 244000144730 Amygdalus persica Species 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 235000006040 Prunus persica var persica Nutrition 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁気へ―ドに係シ、特に、磁気ヘッドの端子と
可撓性プリント基板との接続に関するゆ〔従来の技術〕
近年の磁気記憶装置の大容量化、且つ、小型化の傾向に
伴って、磁気へ―ドは高記録密度化を達成する為、狭ト
ラーり幅を実現させると共に、高密度実装を可能にする
必要がある。従って、狭トラタク化に対応し、磁気ヘッ
ドの端子幅も必然的に小さくなって来ている。その為、
磁気ヘッドの端子のみならず、外部引出しの役目をする
可撓性プリント基板の端子においても、端子幅精度及び
ピーチ精度の高精度化並びに接続精度の向上が要求され
ている。へ―ドの端子については、薄膜プロセス技術の
導入等に伴って、数μｍのオーダーの・精度に抑えられ
ることは一般的に知られている。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a magnetic head, and in particular, to a connection between a terminal of a magnetic head and a flexible printed circuit board. [Prior Art] Recent magnetic fields With the trend towards larger capacity and smaller size of storage devices, magnetic heads need to realize narrower error widths and enable high-density packaging in order to achieve higher recording densities. . Therefore, in response to the trend toward narrower tracks, the terminal width of magnetic heads is also becoming smaller. For that reason,
Not only the terminals of magnetic heads but also the terminals of flexible printed circuit boards that serve as external leads are required to have higher terminal width accuracy and pitch accuracy, and improved connection accuracy. It is generally known that with the introduction of thin film process technology, the accuracy of head terminals can be reduced to an order of several μm.
従って、可撓性プリント基板のリード端子の幅精度並び
にビ噌チ精度をいかに向上させられるか、さらに、接続
精度をいかに上げられるかが課題として残される。Therefore, it remains a problem how to improve the width accuracy and fit accuracy of the lead terminals of the flexible printed circuit board, and how to improve the connection accuracy.
以下、従来の公知例について説明する。第４図の薄膜磁
気ヘード１が示す様に基板２′上の素子４′。Conventional known examples will be described below. As shown in the thin film magnetic head 1 of FIG. 4, an element 4' on a substrate 2'.
面には外部接続用の導体膜端子Ｓが形成されており、可
撓性プリント基板５の一端に露出している多数のリード
端子６とＡｎ又はＡＡ材等から成るワイヤ１０により接
続されている。尚、この接続に際しては、ワイヤボンデ
ィング技術等により、両端子を接続する方法が採用され
ている。Ａｕ線又はＭ線１０の両端で且つ、多数の端子
間の接続のため、多点箇所のボンディング作業が必要に
なっている。A conductor film terminal S for external connection is formed on the surface, and is connected to a large number of lead terminals 6 exposed at one end of the flexible printed circuit board 5 by wires 10 made of An or AA material or the like. . Note that for this connection, a method is adopted in which both terminals are connected by wire bonding technology or the like. Bonding work is required at multiple points at both ends of the Au wire or M wire 10 and for connections between a large number of terminals.
さらに、他の公知例の一つに特公報昭５９−１７２１０
６号公報に記載されている点について説明する。これを
示したのが第５図の他の従来例である多チャンネル薄膜
磁気ヘード１である。非磁性基板２゛の上にＦａ −Ｎ
ｉ合金又はＮｉ −Ｃｒ合金から成る磁気抵抗素子４が
形成され、その上には、可撓性プリント基板５との接続
用に導体膜端子Ｓが形成されておシ、一部透明体７から
成る可撓性ブ１リント基板５の８ｎ −Ｐｂ合金８゛と
付着したリード端子６との位置合わせを行い、ガラス板
１１を通し６、レーザ光を照射し、ｐｂ−ｓｂ合金属８
′を溶融し、可撓性プリント基板５のリード端子６と磁
気ヘッド１の導体膜端子３との多点箇所を半田リフロー
法によシ、−括接続することを可能にしている・〔発明
が解決しようとする課題〕
上記従来技術の一つである可撓性プリント基板５のリー
ド端子６と磁気ヘードの端子３間をＭ線またはＡμ線１
０を介して、両端で接続する構造では１、接続点が増え
ることと、位置合わせ作業が個々に必要になシ、作業性
が悪く、工数も増加する問題がある口
また、もう一つの特公昭５９−１７２１０６号の場合に
は、レーザ光を用いてリード端子の半田を溶融させるこ
とから、接続部が高温、即ち３００℃近くの温度にさら
されることになυ、磁気ヘードの接・続対応の端子のみ
ならず、下部膚も上記温度以上の耐熱性が要求されるこ
とから、磁気へ９ドの構造が規制される問題がある。さ
らに、可撓性プリント基板５のリード端子６に付着して
いる５ｎ−Ｐｂ合金層８′のばらつきと可撓性プリント
基板５のリード端子６の背面の透明フィルムの熱変形と
により、高密度実装時の隣接間ピーチ精度並びに糸状ピ
ーチ精度が維持出来なくなり、隣接端子間での接触等の
問題が起きる恐れがある。また、接合後の環境変化、特
に熱変化に伴なう背面フィルムの熱収縮等によシ、接合
部にストレスが作用し、接合部の信頼性を低下させる場
合も考えられる◎本発明の目的は、可撓性プリント基板
のリード一端子と磁気へ―ドの端子間の接続において、
磁気ヘッド構造体に影響を及ぼすことなく、両者の接続
を高精度に維持することと、接続信頼性を向上させる接
続構造を与えることにある。Furthermore, one of the other known examples is Japanese Patent Publication No. 59-17210
The points described in Publication No. 6 will be explained. This is illustrated in a multi-channel thin film magnetic head 1, which is another conventional example, shown in FIG. Fa-N on the non-magnetic substrate 2
A magnetoresistive element 4 made of i-alloy or Ni-Cr alloy is formed, and a conductive film terminal S is formed thereon for connection to a flexible printed circuit board 5. After aligning the 8n-Pb alloy 8 of the flexible printed board 5 with the attached lead terminals 6, a laser beam is irradiated through the glass plate 11, and the pb-sb alloy 8 is
', it is possible to connect the lead terminals 6 of the flexible printed circuit board 5 and the conductor film terminals 3 of the magnetic head 1 at multiple points by the solder reflow method. [Problems to be Solved] According to one of the above conventional techniques, an M wire or an Aμ wire 1 is connected between the lead terminal 6 of the flexible printed circuit board 5 and the terminal 3 of the magnetic head.
In the structure in which the connection is made at both ends via 0, the number of connection points increases and alignment work is required for each individual, resulting in poor workability and increased man-hours. In the case of Publication No. 59-172106, since the solder of the lead terminal is melted using a laser beam, the connection part is not exposed to high temperature, that is, close to 300℃, and it is difficult to connect and connect the magnetic head. Since not only the corresponding terminals but also the lower skin are required to have heat resistance above the above-mentioned temperature, there is a problem in that the structure of the magnetic field is restricted. Furthermore, due to variations in the 5n-Pb alloy layer 8' attached to the lead terminals 6 of the flexible printed circuit board 5 and thermal deformation of the transparent film on the back surface of the lead terminals 6 of the flexible printed circuit board 5, high density The peach accuracy between adjacent terminals and the filiform peach accuracy during mounting cannot be maintained, and problems such as contact between adjacent terminals may occur. Furthermore, due to environmental changes after bonding, especially thermal contraction of the back film due to thermal changes, stress may be applied to the bonded portion, reducing the reliability of the bonded portion.◎Objective of the present invention In the connection between the lead terminal of the flexible printed circuit board and the terminal of the magnetic head,
The object of the present invention is to maintain the connection between the two with high precision without affecting the magnetic head structure, and to provide a connection structure that improves connection reliability.
上記目的は、磁気ヘードの端子部と可撓性プリント基板
のリード端子の接合に関し、温度上昇の少ないボンディ
ング法で両端子を接続させることと同時に、両者の接合
部の広がυ部分を吸収できる様、に可撓性プリント基板
のリード端子幅より、接続領域に該当する部分の端子幅
を狭くすることによシ、達成される。The above purpose is to connect the terminals of the magnetic head and the lead terminals of the flexible printed circuit board using a bonding method that reduces temperature rise, and at the same time absorbs the expansion υ of the joint between the two. This can be achieved by making the terminal width of the portion corresponding to the connection area narrower than the lead terminal width of the flexible printed circuit board.
磁気ヘッドの多数の端子と可撓性プリント基板のリード
端子との接続に関し、可撓性プリント基。A flexible printed circuit board for connecting multiple terminals of a magnetic head to lead terminals of a flexible printed circuit board.
板のリード端子部の背面にはフィルムを付着させないこ
とで、両端子のボンディング条件がばらつき難くシ、安
定した接続が得られる。一方、通常、ワイヤボンディン
グ技術では、接合するリード端子は負荷荷重により変形
し、初期のリード端子幅。By not attaching a film to the back surface of the lead terminal portion of the plate, the bonding conditions of both terminals are less likely to vary, and a stable connection can be obtained. On the other hand, normally with wire bonding technology, the lead terminals to be bonded are deformed due to the load, and the initial lead terminal width decreases.
よりも広がり、接合されることになる。この為上記可撓
性プリント基板のリード端子接合部が大きく変形した場
合には、可撓性プリント基板のリード端子のビーチ精度
を含め、磁気ヘッドの隣接パターンとの間隔が狭ばまり
、シ曹−トする危険が□生じる。そこで、上記可撓性プ
リント基板のリード端子幅を単純に狭くすれば良いと考
えられるが゛、露出しているリード端子自体の強度が低
下するので、接続部以外の露出部分で断線等が起こる恐
れがある。従って、リード端子自体の強度を変えず１・
、接合に寄与する端子部分のみを接合時の広がり量を考
慮して、その分を狭くすることにより、接続部が広がら
ず、隣接端子間の接触を防止することが可能となる。It will spread out and be joined. For this reason, if the lead terminal joint portion of the flexible printed circuit board is significantly deformed, the distance between the magnetic head and the adjacent pattern will become narrower, including the beach accuracy of the lead terminal of the flexible printed circuit board, and the - There is a risk of being hit. Therefore, it may be possible to simply narrow the width of the lead terminals of the flexible printed circuit board, but this would reduce the strength of the exposed lead terminals themselves, resulting in disconnections at exposed parts other than the connection parts. There is a fear. Therefore, without changing the strength of the lead terminal itself, 1.
By narrowing only the terminal portion that contributes to bonding, taking into account the amount of spread during bonding, the connection portion does not spread, making it possible to prevent contact between adjacent terminals.
以下、本発明の一実施例を第１図、第２図により説明す
る。第１図は本発明の斜視図を表わしたものであシ、薄
膜磁気ヘリド１の可撓性プリント基板５との接合構造を
示したものである。第１図の接合部をＩ−Ｉ断面した構
造を示したのが第２図である。第２図はフェライト等の
磁性基板２の上に多数の素子４を形成し、接続対応部の
導体膜端子３にはＡｕ膜等が形成されている。この様に
形成された素子ブｒ：１嗜りは、一般に、熱の発生をき
らうので、導体膜端子５と外部中継用の端子との接続時
には、低温度の接合が必要となる。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the present invention, showing the bonding structure of the thin film magnetic helide 1 and the flexible printed circuit board 5. As shown in FIG. FIG. 2 shows the structure of the joint shown in FIG. 1 taken along the line I-I. In FIG. 2, a large number of elements 4 are formed on a magnetic substrate 2 made of ferrite or the like, and an Au film or the like is formed on the conductive film terminal 3 of the connection corresponding part. Since the element BR:1 formed in this manner generally avoids generating heat, low-temperature bonding is required when connecting the conductive film terminal 5 and an external relay terminal.
上記、薄膜磁気ヘリド１に対して、出力等の堰シ出し口
となる導体膜端子３と接続すべき、可撓性プリント基板
５の構造は、第５図に示す通りである。即ち、上記接続
に対応する部分を一部力雫卜シタベースフィルム（ポリ
イミド又はポリエステル）９とカバーフィルム（ポリイ
ミド又はポリエステル）７の間で、露出した銅箔の上に
メ―キ等によシＡｕ１ｉＳ８を付着させた多数のリード
端子６を介在させ、接着固定している・又、上記露出し
たリード端子６の中央部で且つ、ワイヤボンディングさ
れる領域については、その前後の端子幅ＷＯよりも狭く
、その端子幅をＷｌとす′ると、Ｗ１≦Ｗｅ −Ｑ、（
龜：ボンディング広がり量）の関係が成シ立つ様に、接
続対応リード端子６′の端子幅Ｗ１を設定すれば良い。The structure of the flexible printed circuit board 5 to be connected to the conductor film terminal 3 which serves as the weir outlet for output, etc. to the thin film magnetic helide 1 is shown in FIG. That is, the part corresponding to the above-mentioned connection is partially exposed by force, and is applied with a paint or the like on the exposed copper foil between the base film (polyimide or polyester) 9 and the cover film (polyimide or polyester) 7. A large number of lead terminals 6 to which Au1iS8 is adhered are interposed and fixed by adhesive. Also, the central part of the exposed lead terminal 6 and the area where wire bonding is to be performed is wider than the terminal width WO before and after it. If the width of the terminal is Wl, then W1≦We −Q, (
It is sufficient to set the terminal width W1 of the lead terminal 6' for connection so that the following relationship holds true: (amount of bonding spread).
凹の作製は工嗜チング加工にょυ容易に可能である。（
例えば、Ｗｏ ＝ ０．１５ ｍ で、６＝０．０５ｍ
の時、Ｗｚ＝ｏ、ｔ、）従って、ボンディングの広がシ
が有ってもリード端子幅Ｗａよシ突き出さないことにな
る。この為、リード端子＄１ｌＷｏを大きく与えられ、
素線強度を強く出来る。The concavity can be easily made by mechanical chiming. (
For example, Wo = 0.15 m and 6 = 0.05 m
(When Wz=o, t,) Therefore, even if the bonding spreads, it will not protrude beyond the lead terminal width Wa. For this reason, a large amount of lead terminal $1lWo is given,
The strength of the wire can be increased.
以上の様な構成の薄膜磁気ヘッド１の導体膜端子３と前
記可撓性プリント基板５とを温度上昇の少ない超音波ワ
イヤボンディング法で接続した構造を示したのが第１図
である。接続部の断面を示したのが第２図であり、可撓
性プリント基板５のリード端子６に付着しているＡｕ層
（メーキ等）８と導体膜端子５のＡｕ膜とが、Ａｕ間同
志の接合という条件で、低温度の超音波ワイヤボンディ
ングに適した構造を与えている。両端子の位置合せに当
っては、可撓性プリント基板５の任意のリード端子６を
磁気へヴド１の当該導体膜端子３の中心に合わせること
で、±０．０１程度の精度で位置決め出来る。さらに、
磁気ヘッドの出力の取υ出し口（再生トラ９り）に対応
している導体膜端子５に対して位置決めされた可撓性プ
リント基板５の多数Φリード端子６は、該可撓性プリン
ト基板５のリード端子６の上部から直接ボンディング用
ツール（ＷＣ等）で、ある一定の荷重を加え、超音波振
動を与えることで、導体膜端子との一合が可能となる。FIG. 1 shows a structure in which the conductor film terminal 3 of the thin film magnetic head 1 having the above structure and the flexible printed circuit board 5 are connected by an ultrasonic wire bonding method that causes a small temperature rise. FIG. 2 shows a cross section of the connection part, and the Au layer (coating, etc.) 8 attached to the lead terminal 6 of the flexible printed circuit board 5 and the Au film of the conductor film terminal 5 are connected to each other. It provides a structure suitable for low-temperature ultrasonic wire bonding, provided that the bonding is like-for-like. When aligning both terminals, by aligning any lead terminal 6 of the flexible printed circuit board 5 with the center of the conductive film terminal 3 of the magnetic head 1, the positioning can be performed with an accuracy of about ±0.01. I can do it. moreover,
The multiple Φ lead terminals 6 of the flexible printed circuit board 5, which are positioned with respect to the conductor film terminals 5 corresponding to the output outlet (reproduction track 9) of the magnetic head, are connected to the flexible printed circuit board 5. By directly applying a certain load to the top of the lead terminal 6 of No. 5 using a bonding tool (such as a WC) and applying ultrasonic vibration, it is possible to connect the lead terminal 6 with the conductor film terminal.
この接合の過程としては、超音波振動で導体膜端子３の
Ａｕ膜とリード端子６のＡｍ層８間の面が平滑化され、
凝着が起こり始め、お互いの摩擦係数が大きくなシ、負
荷荷重と共にリード端子が変形（塑性流動）を起こすこ
とによシ、凝着面積が増大し、Ａｕ同志の接合が行われ
る。In this bonding process, the surface between the Au film of the conductor film terminal 3 and the Am layer 8 of the lead terminal 6 is smoothed by ultrasonic vibration.
Adhesion begins to occur, and as the friction coefficient between them increases and the lead terminals undergo deformation (plastic flow) with the load, the adhesion area increases and Au joins together.
本実施例によれば、先ず第一に、薄膜磁気ヘリドの導体
膜を初めとして、構造体に熱による障害を発生させるこ
となく、導体膜端子３と可撓性プリント基板５のリード
端子６の接続が可能になる。According to this embodiment, first of all, the conductor film terminals 3 and the lead terminals 6 of the flexible printed circuit board 5 can be connected without causing heat damage to the structure including the conductor film of the thin film magnetic helide. Connection becomes possible.
第二に、再生トラークに対応する導体膜端子３と可撓性
プリント基板５のリード端子６と直接超音波ボンディン
グが可能なので、信頼性の高い接続となる。第三には、
可撓性プリント基板５のリード端子６の接続対応リード
端子６をボンディング時の広がり分を考慮して狭くしで
あるので、リード端子の強度を低下させることなく、隣
接端子間の距離を保持出来、接触等を防止できる。第四
には、可撓性プリント基板のリード端子幅より接続部の
幅を規定の広が９分だけ狭くすることで、接続後のリー
ド端子の広がシが規定内（リード端子より広がらない）
に入っているかどうかという、一つのボンディング品質
管理も容易に出来る様になる。Second, direct ultrasonic bonding is possible between the conductor film terminal 3 corresponding to the regeneration track and the lead terminal 6 of the flexible printed circuit board 5, resulting in a highly reliable connection. Thirdly,
The lead terminals 6 that correspond to the connection of the lead terminals 6 of the flexible printed circuit board 5 are narrowed in consideration of the spread during bonding, so the distance between adjacent terminals can be maintained without reducing the strength of the lead terminals. , contact, etc. can be prevented. Fourthly, by making the width of the connection part narrower than the lead terminal width of the flexible printed circuit board by 9 minutes of the specified spread, the spread of the lead terminal after connection is within the specified range (not wider than the lead terminal). )
Bonding quality control, such as whether or not the bonding quality is within the specified range, can be easily performed.
又、本発明の他の実施例としては第６図に示す様に、ボ
ンディング後の接続部の広が９形状と対応する様に可撓
性プリント基板５のリード端子６の接続対応部６′ヲ逆
几形状で狭くしておくことで、も、前記実施例と同様な
効果が得られる。Further, as another embodiment of the present invention, as shown in FIG. 6, the connection corresponding portion 6' of the lead terminal 6 of the flexible printed circuit board 5 is formed so as to correspond to the expanded shape 9 of the connection portion after bonding. By making it narrow with an inverted box shape, the same effect as in the embodiment described above can be obtained.
本発明によれば、接続後の可撓性フィルムのリード端子
幅が周囲のリード端子幅よシも広がらないので、隣接の
導体膜端子との接触等の防止に効果がある。また、ボン
ディング時の端子幅の広がシを考慮することなく、リー
ド端子の幅を広く出来るので、リード端子自体の強度が
向上し、取扱い他の外力等に伴う断線等の防止が可能と
なる＠さらに、ボンディング作業の品質管理という面で
°、リード端子幅を基準としてボンデ４ング後の端子幅
の広がυのチエ９りが容品に出来る効果がある。According to the present invention, the width of the lead terminal of the flexible film after connection does not become wider than the width of the surrounding lead terminals, which is effective in preventing contact with adjacent conductive film terminals. In addition, since the width of the lead terminal can be made wider without considering the width of the terminal during bonding, the strength of the lead terminal itself is improved, making it possible to prevent wire breakage caused by handling or other external forces. Furthermore, in terms of quality control of the bonding work, there is an effect that the width of the terminal after bonding can be increased by υ based on the lead terminal width.
第１図は本発明の一実施例の斜視図、第２図は第１図の
Ｉ−Ｉ線断面図、第３図は本発明を構成する可撓性プリ
ント基板の斜視図、第４＠及び第５図は従来の薄膜磁気
ヘタドの主要部を示す断面図、第６図は本発明を構成す
る他の可撓性プリント基板の斜視図である・
１・・・薄膜磁気ヘッド、
２・・・基板、
ダ・・・非磁性基板、
６・・・導体膜端子、
４・・・素子、
５・・・可撓性プリント基板、
６・・・リード端子、。
６′・・・接続対応リード端子、
７・・・カバーフィルム、
９・・・ベースフィルム。
代胛へｆＰ理士 小 川 Ｍ！Ｉ５
躬 １０
躬 ２０
躬４０
１θ
第５囚
躬乙虐FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line II in FIG. 1, FIG. 3 is a perspective view of a flexible printed circuit board constituting the present invention, and FIG. 5 is a sectional view showing the main parts of a conventional thin film magnetic head, and FIG. 6 is a perspective view of another flexible printed circuit board constituting the present invention. 1. Thin film magnetic head; 2. ...Substrate, D...Nonmagnetic substrate, 6...Conductor film terminal, 4...Element, 5...Flexible printed circuit board, 6...Lead terminal. 6'... Lead terminal for connection, 7... Cover film, 9... Base film. To my successor, fP Physician M. Ogawa! I5 10 20 40 1θ 5th prisoner
Claims (1)
と接続され、可撓性フィルムから露出したリード端子の
該接続部を前記リード端子幅より狭くした可撓性プリン
ト基板とを備え、前記磁気ヘッドの端子と前記可撓性プ
リント基板の該リード端子とを接合したことを特徴とす
る磁気ヘッド。1. A flexible printed circuit board that is connected to a large number of terminals included in the magnetic head and has a connection portion of the lead terminal exposed from the flexible film that is narrower than the width of the lead terminal; A magnetic head characterized in that a terminal of the magnetic head and the lead terminal of the flexible printed circuit board are bonded to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15026988A JPH01319106A (en) | 1988-06-20 | 1988-06-20 | Magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15026988A JPH01319106A (en) | 1988-06-20 | 1988-06-20 | Magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01319106A true JPH01319106A (en) | 1989-12-25 |
Family
ID=15493252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15026988A Pending JPH01319106A (en) | 1988-06-20 | 1988-06-20 | Magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319106A (en) |
-
1988
- 1988-06-20 JP JP15026988A patent/JPH01319106A/en active Pending
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