JPH0131702B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in an automatic press device for cutting IC lead frames, which cuts ICs from a lead frame in which multiple ICs are formed in parallel.

As shown in FIG. 1, ICs are usually arranged in seven series on a lead frame 11 to form an IC lead frame 1. The automatic press device for cutting IC lead frames is used to cut the IC lead frame 1 in which multiple ICs 10 are arranged in parallel to the lead frame 11, and to separate the ICs 10 from the lead frame 11. be.

By the way, the cutting of an IC lead frame by an automatic press device for cutting an IC lead frame is not performed in one process, but first, each of the many leads 10a of each IC 10 arranged in parallel on the IC lead frame 1 is cut. A cut is made to drop the resin 12... integrally formed at a position adjacent to the base end portion from the IC lead frame 1, and then the tie bar 13 exposed by cutting the resin 12... is cut. , then each lead 10
The process is divided into several steps so that the process of cutting a... from the lead frame 11 is performed.

The length l of the mold consisting of an upper mold and a lower mold for performing each of these cuttings in the feeding direction (transfer direction) of the IC lead frame 1 is, for example, two pieces (two ICs). , is set to be much shorter than the length L of the IC lead frames 1 in the supply direction (longitudinal direction), and are arranged in parallel at a predetermined interval in the supply direction, and by a transfer device disposed within these intervals. , while the IC lead frame 1 is sequentially transferred in the supply direction, the above-mentioned cutting processes are sequentially performed using these molds.

For this reason, in the conventional automatic press equipment for cutting IC lead frames, the molds for dropping the resin 12, the molds for cutting the tie bars 13, and the molds for cutting the leads 10a are used to supply the IC lead frame 1. In order to make the entire mold larger by arranging them long in the direction,
There is a problem in that the mechanism for synchronizing the operation of each mold and synchronizing the operation of each transfer means becomes complicated.

To solve this problem, a mold for dropping the resin 12 from the IC lead frame 1, a mold for cutting the tie bars 13, and a mold for cutting the leads 10a are arranged in succession in the supply direction of the IC lead frame 1. The most effective method is to configure the continuous mold as an integral mold, but in this way, the length of the continuous mold in the supply direction of the IC lead frame 1 is the same as that of the IC lead frame 1. Another problem arises in that the IC lead frame 1 becomes approximately the same as the length L, making it impossible to transport the IC lead frame 1 when it enters the mold.

It is an object of the present invention to solve this problem and to make it possible to transfer an IC lead frame while assembling each mold in a continuous state into a single mold.

The present invention has been made based on the knowledge obtained through various studies and experiments for this purpose.

That is, in the past, IC lead frame 1
is transferred to the side frame 11a of the lead frame 11,
Through-holes 14 are formed in a series with a predetermined pitch, and a feed claw into which a pin fits into the through-holes 14 is inserted into the IC lead frame by repeatedly engaging and removing it. Since this was done by reciprocating the IC lead frame 1 in the feeding direction, the feed claws could only be placed at the front and rear of the mold, making it impossible to transfer the IC lead frame 1 inside the mold. However, the side frame 11a of the lead frame 11 of the IC lead frame 1 has a width of several millimeters.
The side edges of the side frame 11a of the lead frame 11 can be clamped from the sides of the mold, and the side edges of the side frame 11a of the lead frame 11 are grasped with clamps from above and below and moved in the supply direction. We realized that it was possible to transfer the IC lead frame 1 even within the mold by doing this, and when we conducted an experiment using such a device, we found that the side edges of the side frame 11a of the IC lead frame 1 could be moved. This is due to the fact that the IC lead frame 1 can be reliably transferred with a slight grip of the clamp.

For this reason, in the present invention, a lower die mount fixed to the machine body and an upper die mount provided on the machine body to move up and down relative to the lower die mount are provided with a lower die mount for cutting the IC lead frame. In an automatic press device for cutting an IC lead frame 1 in which a mold and an upper die are assembled, a part of the mold consisting of the lower mold and the upper die is inserted into the mold on the side in the direction in which the IC lead frame is transferred. This invention proposes a means characterized in that it is equipped with a clamp that grips the side edge of the side frame of the IC lead frame located in the mold with its tip and transfers it forward in the transfer direction.

Next, an example of implementation will be described in detail with reference to the drawings.

In Fig. 3, a is the body of the automatic press device A for cutting IC lead frames, 2 is a lower die mount fixedly mounted on the machine body a, and 3 is a lower die mount that is vertically opposed to the lower die mount 2. An upper mold mount mounted on the machine body a so as to be arranged above the lower mold mount 2 and move up and down with respect to the lower mold mount 2; 20 is a lower mold assembled on the upper surface of the lower mold mount 2; Reference numeral 30 indicates an upper die assembled to the lower surface of the upper die mount 3, and 4... indicates a plurality of posts installed on the body a so as to support the upper die mount 3 and move it up and down. In FIG. 4, b is the upper mold 3 assembled to the upper mold mount 3 and the lower mold mount 2.
A loader 5 loads the IC lead frame 1 into a supply path that feeds the IC lead frame 1 into a mold consisting of a mold 0 and a lower die 20;
d is a transfer device that feeds the lead frame 11, which is the leftover material after the IC 10 has been cut by the mold, toward the leftover material discharge port c; An IC transport chute for carrying out the IC 10 cut by the mold, e indicates a clamp according to the present invention.

The upper mold mount 3 has a through hole provided at its peripheral edge, which is inserted into the upper end of the post 4 installed on the fuselage a, and then inserted into the locking flange 4a provided on the post 4. By supporting the spacer 4b and fixing it with the tightening screw 4c, the post 4...
It is integrally assembled and supported at the upper end of the (Fig. 5).

In addition, posts 4 for raising and lowering the above-mentioned upper mold mount 3 are fitted into the lower mold mount 2 at three locations: at both front and rear ends on one side and at the front and rear intermediate portions on the other side. A through hole has been opened to allow this to occur (Figure 9). and,
The posts 4 supporting the upper mold mount 3 fit into the through holes of the lower mold mount 2 so as to be slidable up and down, and have lower end portions that protrude downward from the lower mold mount 2. However, as shown in Fig. 6, it is connected to a lifting platform 40 disposed in the inner cavity of the aircraft body a, and the lifting platform 40 is raised and lowered by the operation of the lifting operation mechanism w, so that it moves up and down synchronously. This movement acts to move the upper mold mounting base 3 up and down. The lifting mechanism w
As shown in FIG. 6, the assembly seat 41a,
The bearing support members 41, 41 that are assembled and supported on the fuselage a by the bearing support parts 41b,
41b are aligned and installed in parallel in two rows, and the shaft 42 is supported on the bearing support portions 41b, 41b of the bearing support members 41, 41 via bearings, and the shaft 42 A crank part 42a is formed in the middle part of the shaft 42, and the upper end part of a reciprocating rod 43 whose base end is fitted into the crank part 42a is connected to the above-mentioned lifting platform 40 via a connecting shaft 44. By transmitting one end to the output shaft of the motor M via the conduction pulleys 45, 45 and the conduction belt 46, the shaft 42 rotates due to the operation of the motor M, and the reciprocating rod 43 reciprocates up and down. , move the lifting platform 40 up and down, 3
The book post 4... is configured to move up and down, but the crank portion 42a of the shaft 42 described above
The reciprocating rod 43 connected thereto may be changed to a cam foil so that the lifting platform 40 can be moved up and down by the rotation of the cam foil. 47 is a buffer spring provided between the above-mentioned bearing support member 41 and the lifting platform 40, and 48... is a guide cylinder of the post 4... fixedly provided on the side of the body a.

The upper mold 3 is assembled to the lower surface of the upper mold mounting base 3.
As shown in FIG. 7, a fitting groove 3a having a dovetail cross section is formed on the lower surface side of the upper mold mounting base 3 along the supply direction of the IC lead frame 1.
On the lower surface side of the base 31, the upper surface side is provided with a fitting portion that is formed so as to penetrate in the front-rear direction (vertical direction in FIG. 4) and that can be inserted into and removed from the fitting groove 3a. , as shown in FIGS. 8 and 10, a punch 30 drops the resin 12 from the IC lead frame 1.
Punch 3 for cutting a, 30a and tie bar 13
0b, 30b and the punches 30c, 30c for cutting the lead 10a are combined in pairs and integrally connected in parallel in the above-mentioned transfer direction, and furthermore, flat punches are provided on both sides of each of the parallel punches. It is constructed by assembling plate-shaped rail parts 30d and 30d together (Fig. 11), and thereby,
It is formed into a cassette shape integral with a base 31 which can be freely inserted into and removed from the upper mold mount 3.

In addition, the lower mold 2 to be assembled on the upper surface side of the lower mold mounting base 2
0, a fitting groove 2a having a channel-shaped cross section is formed on the upper surface side of the lower mold mount 2 so as to pass through the lower mold mount 2 back and forth (FIG. 7), and in the fitting groove 2a, A longitudinally long base 21 having a fitting part that can be inserted into and removed from the fitting groove 2a is fitted, and the above-mentioned upper die mounting 3 is assembled on the upper surface side of the base 21. Each punch 30a, 30a, 30b, 30b,
30c, 30c, dies 20a, 20a for cutting the resin 12, dies 20b, 20b for cutting the tie bar 13, and dies 20c, 20c for cutting the lead frame 10a were combined in pairs and arranged in parallel in the supply direction. The parallel dies 20a..., 20b..., 20c are mounted on both ends of the base 21 in the front-rear direction (supply direction) and on both left and right sides (FIG. 12).
A guide rail 22 formed to surround the periphery of the die is attached to the base 21 and each of the parallel dies so as to move up and down a certain distance, and is urged by a spring 23 to push upward. As a result, these constitute a cartridge-shaped lower mold 20 that is integrally connected to a base 21 that can be freely inserted into and removed from the lower mold mounting base 2. Concave portions 24, 24 which are lowered further are formed in portions facing one side of the dies 22a, 22b, 22c, etc. (FIGS. 8 and 9).

The transfer device 5 horizontally supports a camshaft 51 provided with a cam foil 50 at a side position of the above-mentioned lower die mount 2 on the upper surface of the machine body a, and this camshaft 51 is attached to the above-mentioned upper die mount 2. As shown in FIG. 11, the transmission is transmitted through the shaft 42 of the lifting mechanism w of No. 3, the bevel gear 52, the transmission shaft 53, and the transmission gears 54, 54, and as shown in FIG. An arm 55 that reciprocates (left and right in FIG. 13) is connected, and the rotating end of the arm 55 is connected to a bearing support part 56 provided on the upper surface of the aircraft body a,
56 is connected to a rod 57 that is supported so as to slide back and forth, and the rod 57 has a through hole 14 provided in the side frame 11a of the IC lead frame 1 on the lower surface of the tip.
The engagement arm 59... provided with the engagement pin 58... that fits into... is attached, and the tip of the engagement arm 59 provided with the engagement pin 58 is assembled to the lower die mounting base 2. When the upper mold mount 3 descends, the guide rail 22 of the lower mold 20 assembled to the lower mold mount 2 is exposed to the spring. 23, the IC lead frame 1 moves downward together with the guide rail 22, thereby opening the through hole 1 of the IC lead frame 1.
4... is disengaged from the engagement pin 58 of the engagement arm 59, and in this state, the rod 57 moves to the return side by the operation of the cam wheel 50, and then the upper die mounting base 3
As the guide rail 22 of the lower die 20 moves to the old position due to the rise of the spring 23, the IC lead frame 1 on the guide rail 22 rises together with the guide rail 22 of the lower mold 20, which is attached to the side frame 11a. A certain through hole 14... is the engagement pin 5 of the engagement arm 59.
8... Then, in this state, the rod 57 moves to the feeding side to send out the IC lead frame 1, and the upper mold 30 descends together with the upper mold mounting base 3 to that state. As a result, the process of disengaging the engagement pins 58 and the through holes 14 is repeated, and the IC lead frame 1 is removed.
It acts to feed the.

The regulation arm 60, which is connected to the rod 57 at its proximal end, is moved by the movement of the rod 57, causing the engagement arm 59 to close.
When feeding the IC lead frame 1,
A ruler ring 61 pivotally supported at the tip of the regulating arm 60 contacts the lower surface of the ruler plate 62 and moves together with the rod 57 to regulate the rotational movement of the rod 57.
It acts to maintain the posture of the engagement arm 59 in a constant state.

The clamp e includes each of the punches 30a,
Upper mold 30 with 30b and 30c assembled in parallel
and the lower die 20 assembled with the dies 20a, 20b, 20c arranged in parallel. As shown, a pair of brackets 70, 70 are arranged in the front and rear (left and right in FIG. 13) and fixed to the upper surface of the aircraft body a, and each of the brackets 70, 70 is provided with a guide rod 7 in the vertical direction.
A vertical movement block 71 that moves up and down by 1a is provided (FIGS. 16 and 17), and these vertical movement blocks 7
1 and 71, two guide shafts 72, 72 are installed vertically in parallel (FIG. 14), and sliding members 73, 73 are attached to the guide shafts 72.
0 and the lower die 20 punches 30a, 30b, 30
c and each of the dies 20a, 20b, 20c are slidably supported at intervals shorter than the parallel length, and on the side wall of each of the sliding members 73, 73 on the opposing surface side,
Fixed clamp arms 74 formed long in the direction perpendicular to the guide shafts 72 and 72 are fixed to each other, and a movable clamp arm 75 facing the upper surface side of the fixed clamp arms 74 is attached to the fulcrum shaft 75.
The distal ends of the clamp arms 74 and 75 are attached to the lower mold 2 by pivoting them so that they can rotate up and down around the center a.
The movable clamp arm 75 is inserted into the recess 24 provided in the guide rail 22 of 0 (FIG. 7), and its tip is exposed to the side position of the parallel dies 20a, 20b, 20c of the lower die 20. The proximal end of the transfer device 75 is connected by a connecting arm 76, and the connecting arm 76 is fixed to the rod 57 that reciprocates in the left and right directions of the aforementioned transfer device 5, as shown in FIG. The rod 57 is connected in the front-rear direction via a roller 78 provided on the connecting block 77 and a vertical guide portion 79 fixed to the connecting arm 76.
It moves integrally with the rod 57, but it is linked vertically to move freely with respect to the rod 57, and furthermore, the connecting arm 7
6 is separately provided with a roller 80, and a vertically movable rod 81 that is parallel to the guide shaft 72 and long in the front and rear abuts against the upper surface side of the roller 80, and both front and rear ends of the vertically movable rod 81 are Front and rear brackets 70, 70
Each of the L-shaped rods 82 is supported so as to rotate up and down about a fulcrum shaft 82a, and each of the L-shaped rods 82 has a horizontal portion 82b on the upper surface thereof, and a vertically movable block 72. The lower ends of the integrally assembled pins 83 are brought into contact (Figs. 17 and 15).
), as a result of the downward movement of the vertical movement block 71, the L-shaped rod 82 is centered at the fulcrum shaft 82a at the 15th position.
In the figure, each of the vertical movement blocks 71, 71 is connected to rotate clockwise and move downward, and each of the vertically moving blocks 71, 71 is provided with a connecting pin 84 that projects toward the lower mold 20. is connected to an engaging portion 85 integrally installed on a guide rail 22 provided on the lower mold 20 so as to be immovable up and down a certain distance with respect to the base 21. In addition, 86 is a spring provided between a pin 87 provided on the sliding member 73 and a pin 88 provided on the movable clamp arm 75, and biases the movable clamp arm 75 toward the closing side, and 89 is a spring provided on the movable clamp arm 75. This is an adjustment screw that adjusts the opening degree of the open side.

This clamp e operates as follows.

When the upper mold mount 3 is in the raised position, the guide rail 22 of the lower mold 20 assembled on the lower mold mount 2 is in the raised position with respect to the base 21 of the lower mold 20. The vertically movable block 71, which is connected to the engaging portion 85 provided on the guide rail 22 via the connecting pin 84, is in a raised position, and the base end side of the movable clamp arm 75, which is connected to this vertically movable block 71, is Since the vertically movable rod 81 that is pressed down is in the raised position, the distal end of the movable clamp arm 75 descends and collides with the distal end of the fixed clamp arm 74, and is in the closed state as shown in FIG. 19A. , as shown in FIG. 7, is in a state where the side edge of the side frame 11a of the IC lead frame 1 inside the mold is gripped.

Next, the direction of transport of the rod 57 while the upper mold 30 assembled on the upper mold mount 3 is upwardly separated from the lower mold 20 assembled on the lower mold mount 2 (to the left in FIG. 13). The rod 57 moves in the direction of transport while remaining in the closed state, and is gripped.
The IC lead frame 1 is sent forward in the transport direction and becomes the state shown in FIG. 19B.

Next, when the upper mold mount 3 descends and the upper mold 30 collides with the lower mold 20, the guide rail 22 provided on the lower mold 20 resists the bias of the spring 23 and moves the base of the lower mold 20. The L-shaped rod 82 rotates downward as the vertical movement block 71, which is lowered relative to the base 21 and is connected to the engaging portion 85 provided on the guide rail 22 via the connecting pin 84, moves downward. The vertically movable rod 81 provided thereon moves downwardly, and the movable clamp arm 7
15 by pressing down the roller 80 provided on the connecting arm 76 connected to the proximal end of the movable clamp arm 75 and rotating the movable clamp arm 75 clockwise in FIG. upwardly away from the tip of the clamp arm 74, and
The clamp is released as shown in FIG. 9C.

Next, while the upper mold 30 is in pressure contact with the lower mold 20, the rod 57 moves in the return direction (to the right in FIG. 13), and moves in the return direction together with the rod 57 while remaining in the open state. It returns to the state shown in the figure and becomes the state D in FIG. 19.

Next, the operation of the upper mold mount 3 shifts to the upward stroke,
When the pressure of the lower mold 20 is released by the upper mold 30,
The guide rail 22 of the lower mold 20 rises due to the bias of the spring 23, and as a result, the vertically movable block 71 rises, and the pressing force of the vertically movable rod 81 that was pushing down the base end side of the movable clamp arm 75 is relieved. When released, the movable clamp arm 75 enters the closed state, returning to the state shown in FIG. 19A.

Then, repeat this process to create the upper mold 30 and lower mold 2.
It acts to grip the side edge of the side frame 11a of the IC lead frame 1 contained in the mold made of 0 and send it out in the transfer direction.

As explained above, the automatic press device for cutting IC lead frames according to the present invention has a lower mold 20
The tip of the mold consisting of the upper mold 30 and the upper mold 30, which protrudes into the mold, on the side of the side frame 11a of the IC lead frame 1 located in the mold, in the direction in which the IC lead frame 1 is transferred. Since it is equipped with a clamp e that grips the edge and transfers the mold in the transfer direction, by increasing the length of the mold in the transfer direction, the supplied IC lead frame can enter the mold and move the front and rear of the mold. Even if the transfer device installed in the die cannot push or pull out the IC lead frame 1, the clamp e can grasp the side edge of the side frame 11a of the IC lead frame 1 located in the mold and transfer it. Therefore, from the IC lead frame 1, the mold for cutting the resin 12, the diver 1
Each of the molds, including the mold for cutting the lead 10a and the mold for cutting the lead 10a, may be formed by setting their length in the transfer direction to a desired length,
Furthermore, even if these molds are connected in series to form a long mold, the cutting operation can be carried out without any support.

[Brief explanation of drawings]

Fig. 1 is a plan view of the IC lead frame, Fig. 2 is a plan view showing each cutting process of the above, Fig. 3 is a front view of an automatic press device for cutting the IC lead frame in which the present invention can be carried out, and Fig. 4 is a plan view of the IC lead frame. A plan view of the same device as above, FIG. 5 is a partially broken front view of the supporting part of the upper die mount of the above device, and FIG. 6 is a partially broken front view of the lifting mechanism of the upper die mount of the above device. , Fig. 7 is a longitudinal sectional front view of the mold section of the above device, Fig. 8 is a longitudinal sectional side view of the mold section of the above device, and Fig. 9 is a state in which the same device is assembled to the lower mold mounting base of the lower mold. FIG. 10 is a plan view of the lower mold of the same device, FIG. 11 is a bottom view of the upper mold of the same device assembled to the upper mold mounting base, and FIG.
Fig. 2 is a bottom view of the upper mold of the above device, Fig. 13 is a plan view of the clamp section of the above device, Fig. 14 is a partially broken side view of the clamp section of the above device, and Fig. 15 is a clamp of the above device. FIG. 16 is a partially cutaway front view of the same clamp portion, FIG. 17 is a partially broken side view of the same clamp portion, and FIG. 18 is a partially broken front view of the same clamp portion. FIG. 19 is a perspective view of the portion shown in FIG. Explanation of drawing symbols, A...Automatic press device, a...
...Airframe, b...Loader, c...Exhaust port, d...
IC transport chute, e...clamp, 1...IC lead frame, 10...IC, 10a...lead,
11...Lead frame, 11a...Side frame, 12
...Resin, 13...Tie bar, 14...Through hole,
2...Lower mold mounting base, 20...Lower mold, 20a, 20
b, 20c...Die, 21, 31...Base, 22
... Guide rail, 23 ... Spring, 24 ... Recess, 3 ... Upper mold mounting base, 30 ... Upper mold, 30a,
30b, 30c...Punch, 30d...Rail portion, 2a, 3a...Fitting groove, 2b, 3b...Stopper, 2c, 3c...Insertion port, 2d, 3d...
Set hole, 4...post, 4a...engaging flange, 4
b...Spacer, 4c...Tightening screw, 40...
Lifting platform, 41...bearing support member, 41a...assembly seat, 41b...bearing support part, 42...shaft,
42a...Crank part, 43...Reciprocating rod, 44
. . . Connection shaft, 45 .
...Discharge port side, 50...Cam wheel, 51...Cam shaft, 52...Bevel gear, 53...Transmission shaft, 54
...Transmission gear, 55... Arm, 55a... Fulcrum shaft, 56... Bearing support part, 57... Rod, 58
...Engagement pin, 59...Engagement arm, 60...Regulation arm, 61...Ruler ring, 62...Ruler plate, 7
0...Bracket, 71...Block, 71a...
... Guide rod, 72 ... Guide shaft, 73 ... Sliding member, 74 ... Fixed clamp arm, 75 ... Movable clamp arm, 75a ... Fulcrum shaft, 76 ... Connection arm, 77 ... Connection block, 87 ...Koro, 79...Guide section, 80...Koro, 81...
Vertical movement rod, 82... L-shaped rod, 82a... fulcrum shaft,
82b...Horizontal part, 83...Pin, 84...Linking pin, 85...Engaging part, 86...Spring, 87,8
8...pin, 89...adjustment screw, M...motor, w...lifting mechanism.

Claims (1)

[Claims] 1. An IC lead for assembling a lower die and an upper die for cutting an IC lead frame on a lower die mount fixed to the machine body and an upper die mount provided on the machine body to move up and down relative to the lower die mount. In the automatic press device for cutting the frame 1, the IC located in the mold is inserted into the mold by the tip of the mold consisting of the lower mold and the upper mold, which protrudes into the mold on the side in the transport direction of the IC lead frame. An automatic press device for cutting an IC lead frame, characterized by being equipped with a clamp that grips the side edge of the side frame of the lead frame and transfers it forward in the transfer direction.