JPH01316152A - Machining device - Google Patents

Machining device

Info

Publication number
JPH01316152A
JPH01316152A JP14776988A JP14776988A JPH01316152A JP H01316152 A JPH01316152 A JP H01316152A JP 14776988 A JP14776988 A JP 14776988A JP 14776988 A JP14776988 A JP 14776988A JP H01316152 A JPH01316152 A JP H01316152A
Authority
JP
Japan
Prior art keywords
machining
processing
diagram
control
micro processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14776988A
Other languages
Japanese (ja)
Inventor
Katsuhiko Tomita
冨田 勝彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Seiki KK
Original Assignee
Seiko Seiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Seiki KK filed Critical Seiko Seiki KK
Priority to JP14776988A priority Critical patent/JPH01316152A/en
Publication of JPH01316152A publication Critical patent/JPH01316152A/en
Pending legal-status Critical Current

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  • Numerical Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

PURPOSE:To make it possible to visually and readily know of the quantity of the deflection of tool axis seeing the diagram of the display means for realizing ideal machining condition by providing a display means for displaying the machining condition of a machining means or control quantity by a control means for the machining means. CONSTITUTION:Control quantity through a micro processor (control means) 4 is input or modified by a key board 7. The micro processor 4 controls the machining conditions of a work piece based on the machining way of the work piece having been measured by a inprocess measuring device 2. The CRT device 5 connected to the micro processor 4 displays the machining conditions of a grinding machine (machining means) 1 or control quantity by means of the micro processor 4 in a diagram. As a result, an operator can know of the deflection quantity of a tool axis readily and visually seeing the diagram on the CRT device 5 and can determine the data of the feed per revolution, feed rate and so on properly. This makes it possible to create ideal machining condition.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、たとえば研削盤のような加工装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a processing device such as a grinder.

〔発明の概要〕[Summary of the invention]

本発明は、たとえば研削盤の砥石の軸の撓み量を図表的
に表示する表示手段により視覚的に表示して、その撓み
量を容易に把握できることにより加工条件の設定、変更
の操伶性を向上さぜな加工装置を提供しようとするもの
である。
The present invention visually displays the amount of deflection of the shaft of the grinding wheel of a grinding machine using a display means that graphically displays the amount of deflection, for example, so that the amount of deflection can be easily grasped, thereby making it easier to set and change machining conditions. The aim is to provide an improved processing device.

〔従来の技術〕[Conventional technology]

従来の加工装置、たとえば研削盤においては、何度か試
験的に研削を繰り返すことにより、粗研。
Conventional processing equipment, such as a grinder, performs rough grinding by repeating trial grinding several times.

精研、スパークアウト等の各研削頭載における送りは、
送り速度、研削時間などを設定し、それらの設定値に基
づいてNC制御装置等により加工を制御していた。
The feed rate for each type of grinding head, such as fine grinding and spark out, is as follows:
The feed rate, grinding time, etc. were set, and the machining was controlled by an NC control device or the like based on these set values.

あるいは他の方法として、ワークの定寸寸法を何段階か
予め定めておき、インプロセス等の測定方法により加工
中のワークの寸法を測定して、上記定寸寸法になった都
崩測定装置から信号を入力して■研から精研、あるいは
精研からスパークアウト等の各研削モードに変換するよ
うにして加工を制御していた。
Alternatively, as another method, the fixed dimensions of the workpiece are determined in advance in several stages, and the dimensions of the workpiece being processed are measured using an in-process measurement method, etc., and when the fixed dimensions have been reached, Machining was controlled by inputting signals and converting into various grinding modes, such as from grinding to fine grinding, or from fine grinding to spark out.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、研削盤における加工状態は、研削砥石の軸の
撓み址が一定、あるいは漸次、連続的に変化していくの
か望ましい。
By the way, it is desirable that the machining state of the grinding machine is such that the deflection of the shaft of the grinding wheel is constant or changes gradually or continuously.

しかしながら、上記従来の研削盤にあっては、研削砥石
の軸の撓み量を知ることが容易ではないため、送り量や
送り速度などの各データを適切に定めることが難しく、
理想的な加工状態を実現しにくいという問題点があった
However, in the conventional grinding machine mentioned above, it is not easy to know the amount of deflection of the shaft of the grinding wheel, so it is difficult to appropriately determine each data such as feed amount and feed rate.
There was a problem in that it was difficult to achieve ideal processing conditions.

〔課題を解決するための手段〕[Means to solve the problem]

そこで、本発明による加工装置は上記問題点を解決する
ため、ワークを加工する加工手段と、この加工手段を制
御する制御手段と、前記加工手段の加工状態あるいは前
記制御手段による制御量を図表的に表示する表示手段と
、前記制御波を入力あるいは変更可能な入力手段とを備
えたことを特徴とするものである。
Therefore, in order to solve the above problems, the processing apparatus according to the present invention includes a processing means for processing a workpiece, a control means for controlling the processing means, and a processing state of the processing means or a control amount by the control means in a graphical manner. The present invention is characterized by comprising a display means for displaying the control wave, and an input means capable of inputting or changing the control wave.

〔作 用〕[For production]

このような加工装置によれば、操作者が表示手段の図表
などを見ながら視覚的に容易に工具の軸の撓み量を知る
ことができるため、工具の送り量や送り速度などの各デ
ータを適切に定めることができ、理想的な加工状態を実
現することができる。
According to such processing equipment, the operator can visually and easily know the amount of deflection of the tool shaft while looking at a diagram on the display means, so that various data such as the tool feed rate and feed rate can be displayed. It can be determined appropriately and ideal machining conditions can be achieved.

〔実施例〕〔Example〕

以下、本発明の実施例について図面に基づいて説明する
。第1〜3図は本発明による加工装置の一実施例を示す
図である。
Embodiments of the present invention will be described below based on the drawings. 1 to 3 are diagrams showing an embodiment of a processing apparatus according to the present invention.

第1図において、1はワークを研削加工する研削盤(加
工手段)であり、この研削盤1には研削加工されたワー
クの加工寸法を加工途中で測定できるインプロセス測定
装置2が設けられている。
In FIG. 1, 1 is a grinding machine (processing means) that grinds a workpiece, and this grinding machine 1 is equipped with an in-process measuring device 2 that can measure the machined dimensions of the ground workpiece during processing. There is.

また、研削盤1にはマイクロプロセッサ4(制御手段)
が設けられており、このマイクロプロセッサ4はインプ
ロセス測定装置12により測定されたワークの加工寸法
に基づいてワークの加工条件を制御することができる。
In addition, the grinding machine 1 includes a microprocessor 4 (control means).
The microprocessor 4 can control the machining conditions of the workpiece based on the machining dimensions of the workpiece measured by the in-process measuring device 12.

マイクロプロセッサ4にはCRT装置5(表示手段)が
接続されており、このCRT装置5は研削盤1の加工状
態あるいはマイクロプロセッサ4による制御量を図表的
に表示することができる。
A CRT device 5 (display means) is connected to the microprocessor 4, and the CRT device 5 can graphically display the machining status of the grinding machine 1 or the amount controlled by the microprocessor 4.

またマイクロプロセッサ4にはキーボード7(入力手段
)が接続されており、このキーボード7はマイクロプロ
セッサ4による制御量を入力あるいは変更することがで
きる。
Further, a keyboard 7 (input means) is connected to the microprocessor 4, and the keyboard 7 can input or change the amount controlled by the microprocessor 4.

次に、このような研削盤1の作用について説明する。研
削盤1は、粗研、精研等のような研削モードを変化させ
る時期(切換点)におけるワークの加工寸法や、その時
点における砥石の切り込み量、切り込み速度などの加工
条件を概ね定めておき、加工を開始する。この加工中に
おいて、研削盤1による加工状態をCR,T”装置5の
画面上にモニターする(写し出す)。
Next, the operation of such a grinding machine 1 will be explained. For the grinding machine 1, the processing conditions such as the processing dimensions of the workpiece at the time of changing the grinding mode (switching point) such as rough grinding, fine grinding, etc., the cutting amount of the grinding wheel, and the cutting speed at that point are roughly determined. , start processing. During this machining, the machining status by the grinder 1 is monitored (projected) on the screen of the CR,T" device 5.

そのときの画面が、たとえば第2図に示すように写し出
されたとする。すなわち、定寸変化線図aにおいて、上
記切換点におけるワークの加工寸法(定寸切換点1〜4
.定寸完了点)が映し出され、切り込み線図すにおいて
、予め、概ね定められたギャップ送り量120μm、粗
研1送り量60μm、ffl研2送り量20μm、11
研スパークアウト時間2,0秒、リトラクション量30
μm。
Assume that the screen at that time is displayed as shown in FIG. 2, for example. That is, in the sizing change diagram a, the machining dimensions of the workpiece at the above switching points (sizing switching points 1 to 4)
.. The sizing completion point) is displayed, and in the cut line, the gap feed amount is approximately 120 μm, rough grinding 1 feed amount is 60 μm, ffl grinding 2 feed amount is 20 μm, 11
Sharpening spark out time 2.0 seconds, retraction amount 30
μm.

精研1送り4110 μm 、精研2送り量5μm’、
′M!研スパークアウト時間1秒等が映し出される。
Seiken 1 feed 4110 μm, Seiken 2 feed amount 5 μm',
'M! The 1 second spark out time etc. will be displayed.

このように値が定められた加工条件の下において、かつ
ぎ線図C1すなわち砥石軸のかつぎ量(撓み量)を時間
とともに示す線図Cが、たとえば同図に示すように画面
に表示されたとする。同図におけるかつぎ線図Cは、中
高の山のような形状になっていて、時間に対して一定で
ないため、砥石軸のかつぎ量も一定してないことが一目
瞭然で分かることになる。
Suppose that under processing conditions with values determined in this way, a swivel diagram C1, that is, a line C that shows the swivel amount (deflection amount) of the grinding wheel shaft over time, is displayed on the screen as shown in the figure. . The cutting line C in the same figure has a shape like a medium-high mountain and is not constant over time, so it can be clearly seen that the cutting amount of the grindstone shaft is also not constant.

ところで前述のように、研削盤1における加工状態は砥
石軸のかつぎ量が一定であることが望ましいため、その
ように修正する必要があるが、その修正は操作者がその
画面を見ながら、キーボード7の各キーを押して操作す
ることにより、上記各値を、たとえば第3図に示ずよう
に、ギヤップ送り量X μm、■研1送り量x2μm、
■研2送り量X μm、■研スパークアウト時間t1秒
、リトラクション量x4μm、精研1送り量X μm、
精研2送りN x eμm、精研スパークアウト時間t
2秒等のように変更することにより、第3図に示すよう
にかつぎ線図Cを一定に修正することができる。リトラ
クションの前後でその一定値が異なっているが、そのこ
とは−向に差し支えなくむしろ必要なことである。
By the way, as mentioned above, it is desirable that the cutting amount of the grinding wheel shaft is constant in the machining state of the grinding machine 1, so it is necessary to make corrections in this way. By pressing and operating each key 7, the above values can be changed, for example, as shown in FIG.
■Grinding 2 feed amount
Seiken 2 feed N x eμm, Seiken spark-out time t
By changing the time to 2 seconds, etc., it is possible to correct the cross-section diagram C to a constant value as shown in FIG. The constant value is different before and after retraction, but this is not a problem in the negative direction, but is rather necessary.

このようにかつぎ線図Cを修正するように各値を適切に
変更した後、その値による加工条件で研削盤1はワーク
を理想的な加工状態で加工を行なうことができる。
After appropriately changing each value to correct the cross-section diagram C in this way, the grinding machine 1 can process the workpiece in an ideal processing condition under the processing conditions based on the values.

なお、上記実施例においては各値を目標値としてキーボ
ード7により入力する場合について説明したが、実際値
と目標値とをともに表示させて、たとえば砥石の切れ味
か低下した場合などにおいてそれらのずれを検出し、か
つぎ線図Cが一定にならなくなったら、それを再び一定
になるように目標値を入力し直して修正するような用い
方をすることもできる。
In the above embodiment, each value is input as a target value using the keyboard 7, but it is possible to display both the actual value and the target value to check the deviation between them, for example, when the sharpness of the grindstone decreases. It is also possible to detect this and, when the cross-section diagram C is no longer constant, correct it by inputting the target value again so that it becomes constant again.

また、上記実施例においては加工中に測定するインプロ
セス測定方式により測定する場合について説明したが、
加工後に測定するアフターゲージ測定方式により測定す
るようにしても、あるいは両方式を併用するようにして
もよい。
In addition, in the above embodiment, a case was explained in which measurement was performed using an in-process measurement method that measures during processing.
The measurement may be performed using an aftergauge measurement method that is measured after processing, or both methods may be used in combination.

さらに、上記実施例においては研削盤について説明した
が、研削盤に限定する必要はなく、他の加工装置に本発
明を用いてもよい。
Furthermore, although the above embodiments have been described with reference to a grinder, there is no need to limit the invention to a grinder, and the present invention may be applied to other processing devices.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明の加工装置によれば、操作者
か表示手段の図表などを見ながら視覚的に容易に工具の
軸の撓み麓を知ることができるため、工具の送り量や送
り速度などの各データを適切に定めることができ、理想
的な加工状態を実現することができる。
As explained above, according to the processing apparatus of the present invention, the operator can visually and easily know the base of deflection of the tool axis while looking at the diagram on the display means, so the feed amount and feed rate of the tool can be easily determined visually. It is possible to appropriately determine each data such as, and to realize an ideal machining state.

【図面の簡単な説明】[Brief explanation of the drawing]

第1〜3図は本発明による加工装置の一実施例を示す図
であり、第1図はその機能ブロック図、第2図はその表
示手段に表示される加工手段の加工状態をモニターして
示す各種線図、第3図はその加工状態を示すモニター線
図を見ながら理想的な加工条件に修正して入力した後の
各種線図である。 1・・・研削盤(加工手段) 2・・・インプロセス測定装置 4・・・マイクロプロセッサ(制御手段)5・・・CR
T装置(表示手段) 7・・・キーボード(入力手段) 特許出願人  セイコー精機株式会社
1 to 3 are diagrams showing one embodiment of the processing device according to the present invention, FIG. 1 is a functional block diagram thereof, and FIG. 2 is a diagram showing the processing state of the processing means displayed on the display means. The various diagrams shown in FIG. 3 are the various diagrams after correcting and inputting ideal machining conditions while looking at the monitor diagram showing the machining state. 1...Grinding machine (processing means) 2...In-process measuring device 4...Microprocessor (control means) 5...CR
T device (display means) 7...Keyboard (input means) Patent applicant Seiko Seiki Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] ワークを加工する加工手段と、この加工手段を制御する
制御手段と、前記加工手段の加工状態あるいは前記制御
手段による制御量を図表的に表示する表示手段と、前記
制御量を入力あるいは変更可能な入力手段とを備えたこ
とを特徴とする加工装置。
A processing means for processing a workpiece, a control means for controlling the processing means, a display means for graphically displaying a processing state of the processing means or a control amount by the control means, and a display means capable of inputting or changing the control amount. A processing device comprising an input means.
JP14776988A 1988-06-15 1988-06-15 Machining device Pending JPH01316152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14776988A JPH01316152A (en) 1988-06-15 1988-06-15 Machining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14776988A JPH01316152A (en) 1988-06-15 1988-06-15 Machining device

Publications (1)

Publication Number Publication Date
JPH01316152A true JPH01316152A (en) 1989-12-21

Family

ID=15437761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14776988A Pending JPH01316152A (en) 1988-06-15 1988-06-15 Machining device

Country Status (1)

Country Link
JP (1) JPH01316152A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506168A (en) * 1992-10-27 1996-04-09 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506168A (en) * 1992-10-27 1996-04-09 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor device
US5677229A (en) * 1992-10-27 1997-10-14 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor device isolation region

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