JPH01315927A - Shadow mask pattern printing plate and its manufacture - Google Patents

Abstract

PURPOSE:To reduce the generation of the pattern detect to the minimum and to decrease the vacuum contact time in the exposure process extensively by forming a specific thickness of light untransmissible layer to the parts responding to holes in the effective area of a light transmissible shadow mask. CONSTITUTION:A pattern negative plate 1 with a light untransmissible emulsion film 2 and a light transmissible emulsion film 3, and a glass dry plate 5 are arranged and contacted, and then, ultraviolet rays or green rays 6 are radiated. Then, after an untransmissible emulsion image 7 reverse to the negative plate 1 is formed, it is soaked in an emulsion etching solution. As a result, the untransmissible emulsion film 7 is solved and removed, and an emulsion film 8 being the light transmissible film is left. After that, the deposited blackened silver is rubbed off in a darkroom. Then, ultraviolet rays or green rays are radiated, and the second development is applied to produce the blackened silver to form an emulsion film 10. After that, a fixation, a water washing, and a drying are applied to obtain a pattern plate 11. In this case, the film thickness of the emulsion film 10 is made 3-5mum.

Description

DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention] (Field of Industrial Application) The present invention relates to a shadow mask pattern printing plate and a method for manufacturing the same.

(Prior art) Shadow masks for color cathode ray tubes generally have a large number of holes, and the piezoelectric beams corresponding to the red, green, and blue phosphor layers emitted from the electron gun pass through the holes in the mask, each corresponding to a corresponding one. It is a device that hits a phosphor that causes the phosphor to emit light.
It is also called a color selection electrode. The manufacturing of the shadow mask 4A is generally carried out using a photo-etching technique called photoetching.The outline of this manufacturing method is as follows.After degreasing and cleaning the shadow mask 4A, which is made of a continuous strip-shaped metal plate, A photoresist film with a constant thickness is formed.

Next, a pair of shadow mask pattern printing plates, which are opaque in the areas corresponding to the shadow mask openings and have different machining methods, are placed on the front and back sides of the mask system on which the photoresist film has been formed, and after completely adhering them. Exposure to ultraviolet light. Thereafter, the unexposed photoresist film corresponding to the openings of the shadow mask is dissolved and removed by hot water spray, and dried and baked to leave an etching-resistant photoresist film outside the openings. Next, spray etching solution on both sides to make shadow mask holes of the desired size, and then wash with water, remove the photoresist film, wash with water,
A shadow mask is manufactured by drying.

For pattern printing used in the exposure process, the plate is generally an emulsion type, and the original plate is produced using a pattern generator called a photo-plotter. The original plate becomes a master pattern by close contact reversal, and from this master pattern, multiple pattern printing (many single-digit plates are produced) used in the Nyadou mask manufacturing process. It has a nearly flat emulsion film that is opaque in parts corresponding to the holes and transparent in other parts. The ratio of opaque parts is 5 to 1
It is only 5%, and the probability of defects such as pin poles is also low. Also, if there is a pinhole in the opaque area, it will be etched, making it less likely to become a defect.

On the other hand, the master pattern is produced by closely inverting a pattern original produced by a photoplotter. The shape of the pattern is opaque except for the part corresponding to the shadow mask opening, and the proportion of this part is 85 to 9.
It will be 5%. As a result, it is inevitable that the rate of occurrence of pinhole defects will increase due to dust adhesion or emulsion film defects during the reversal process. The pinhole area is transparent and appears as a black dot in the pattern printing plate after reversal, and a hole is created in the subsequent etching process. Therefore, it is necessary to retouch the pinpole part of the master pattern using opaque ink, and retouching takes a lot of time. have In particular, recent high-definition mask patterns have fine pattern pitches and small dimensions, making it extremely difficult to retouch and also tend to cause uneven reversal of the retouched area, which is likely to ultimately degrade the quality of the shadow mask. is high.

The base material for the I-shaped pattern is generally float glass.
- The emulsion surface with the mask pattern used is almost flat. Therefore, for example,
When printing a shadow mask pattern onto a photoresist film formed in a shadow mask system using the exposure machine disclosed in 1.3298, the close contact between the shadow mask pattern and the photoresist film causes the pattern printing to occur around the periphery of the plate. In order to easily advance from the part to the center part, and to achieve complete vacuum adhesion to the center part, pattern printing (=I) is necessary because the plate itself does not have any air vent grooves.
Although it depends on the size of the pattern, a long time of 80 to 120 seconds is required.

In order to solve this problem, as shown in Japanese Patent Publication No. 53-28092, a method was proposed in which printing outside the effective surface of the mask pattern removes the emulsion on the pattern and creates a path for air release. ing. However, with this method, although pattern baking improves air venting at the periphery of the plate, pattern baking does not improve air venting at the center of the plate, and requires a long vacuum contact time, which increases the pattern area. is unavoidable. Also special public service 1972-232
Japanese Patent Application No. 73 proposes a shadow mask pattern in which an air flow passage is formed between gelatin walls surrounding a shadow mask pattern portion, and a method for manufacturing the same, with the aim of shortening the vacuum contact time. However, this method has the disadvantage that pattern defects are likely to occur due to the large number of steps. In addition, since the necessary opaque pattern area is surrounded by a transparent gelatin film, when the shadow mask pattern is printed on the photoresist film formed on the surface of the mask material, light scatters at the boundary, preventing printing. It has the disadvantage that pattern dimensions tend to change.

(Problems to be Solved by the Invention) As described above, with conventional printing plates and methods of manufacturing the same, pattern printing has a problem in that the process of creating the plate is complicated, and pattern printing causes pattern defects on the plate. Furthermore, during the exposure during the shadow mask manufacturing process, it takes a lot of time to vacuum-adhere the shadow mask material with photosensitive layers formed on both principal surfaces and the pattern printing plate, which improves production efficiency. There is a problem that cannot be solved.

The present invention has been made to solve the above problems,
Shadow mask pattern printing (-1 The purpose of this paper is to provide a printing plate and its manufacturing method.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a light transmitting plate with a thickness of 3μ■η to 50μ at a portion corresponding to the opening in the effective area of the shadow mask.
The pattern printing of the shadow mask is a printing plate, which is characterized in that an opaque layer of m is formed. Moreover, this printing can form a discontinuous light-transmitting layer with a thickness of 3 μm to 50 μm in the portion of the plate corresponding to the ineffective area of the shadow mask.

Furthermore, the present invention provides a method for manufacturing a printing plate used in an exposure process in which a shadow mask pattern is printed on photoresist films formed on both main surfaces of a shadow mask material. an exposure step in which a pattern original plate, which is opaque, is exposed in close contact with a light-transmitting plate having a pattern corresponding to the openings in the effective area of the shadow mask; and a development step in which a reverse pattern is formed in the emulsion layer. an etching step for etching away the exposed portion of the reverse pattern; a step for converting the emulsion layer remaining on the light-transmitting plate into a non-transparent layer; and fixing the non-transparent layer. This is a method for manufacturing a pattern printing plate of a shadow mask, characterized by comprising a fixing step.

Furthermore, if a discontinuous light-transmitting layer is also formed at the same time in the portion corresponding to the non-effective area of the shadow mask, the openings in the effective area of the shadow mask are an exposure step of closely exposing a pattern master in which a portion corresponding to the area corresponding to the non-effective area and a desired portion corresponding to the non-effective area are opaque; a developing step of forming an inverted pattern on the emulsion layer; and a developing step of forming an inverted pattern on the emulsion layer; an etching step of etching away the exposed portion; a step of making only the portion of the emulsion layer remaining on the light-transmitting plate corresponding to the opening in the effective area into an opaque layer; The pattern printing of the shadow mask, which includes the fixing step of fixing the emulsion layer, can be performed using a plate manufacturing method.

(Function) The present invention can form a shadow mask pattern printing plate which has an opaque emulsion layer only in the portions corresponding to the shadow mask openings, similar to the shadow mask pattern original plate, and is similar to the conventional shadow mask pattern original plate. Compared to conventional methods, the number of pattern defects is extremely low because the number of steps is small. In addition, since the sample is exposed except for the remaining emulsion layer, there are no pattern defects that occur in the emulsion area other than the opaque emulsion layer located in the conventional shadow mask opening, and the time spent on defect repair is reduced. In addition to being able to reduce the number of defects to r11, there is no deterioration in pattern quality caused by defect correction. Furthermore, during the exposure process, when the photoresist film formed on the shadow mask phase 2 and the pattern printing plate are brought into close contact with each other under vacuum, complete adhesion can be achieved instantly because the air flow passages or pattern printing are formed on the entire surface of the plate. Therefore, the time required for the exposure process IIh of Sha] and Umasuf can be shortened to 11].

(Example) Embodiments of the present invention will be described below with reference to the drawings.

(Example)) Using a plotting machine (e.g., Gaha Co., Ltd. No. 1 plotter),
A mask pattern drawn on a glass dry plate (for example, HRP manufactured by Kodak) is used as a pattern original. As shown in FIG. 2, this pattern original plate 2 has an opaque emulsion +1+22 only in the part to be etched with an etching solution using a dark mask system, and a translucent emulsion film 23 in other parts. It is something that exists.

As shown in FIG. 1(a), there is a pattern original plate 1 having an opaque emulsion film 2 and a light-transmitting emulsion film 3, and a glass plate having an unexposed emulsion film 4 having a film thickness of approximately 6 mm. A dry plate 5 (e.g. HRP or LPP manufactured by Kodak, PL manufactured by Konica) is placed in a dark room to remove the emulsion surface of each other.
After completing and adhering using a vacuum system, ultraviolet rays or green light 6 is irradiated.

Next, in the same way as in general photochemical processing, a developer solution (
After developing Mco for 3 to 4 minutes using (for example, Kodak Super RT developer) and forming an opaque emulsion film 7 opposite to that of the pattern original, as shown in FIG. 1(b),
A termination treatment is performed in a 3% glacial acetic acid solution. Thereafter, an oxidizing agent solution such as copper chloride or potassium dichromate and a resin decomposing agent solution such as ammonia or hydrogen peroxide are mixed, and a surfactant is added to the mixture to form an emulsion etching solution for 1 minute. - Soak for 3 minutes.

By performing this treatment, the opaque emulsion film 7 obtained in the first development is dissolved and removed, as shown in FIG. 1(C).
As shown in the figure, only the emulsion film 8, which is a light-transmitting layer, remains.

Thereafter, in a bright room, using lint-free paper, the blackened silver deposited during dissolution of the emulsion film is lightly rubbed off under running water.

Next, ultraviolet rays or green light is irradiated to form development nuclei in the silver halide in the translucent emulsion film 8, and a second development is performed in a developer in the same manner as the first development. )
As shown in FIG. 2, blackened silver is generated to form an emulsion film 10. Next, fix and wash with water.

After the drying process, the pattern of the desired shadow mask is printed on the plate] 1 to 1! do. The thickness of the emulsion film 10 of the shadow mask pattern 11 obtained here is 5 μm.
Met.

The thickness of the emulsion film at this time is 31tm to 50μm.
degree is suitable. This is due to the reasons shown below.

First, samples used on glass dry plates are generally made of float glass, and the surface is not completely flat but has local undulations. Furthermore, the photoresist films formed on both main surfaces of the shadow mask also have local thickness variations.

Therefore, when the thickness of the remaining emulsion film is set to 3 μm or less, the air flow passages formed are insufficient due to the effects of local waviness of the glass sample and fluctuations in the film thickness of the photosensitive film. It is not possible to obtain the effect of shortening the vacuum contact time. On the other hand, when the thickness of the remaining emulsion film is set to 50 μm or more, there is a problem in the double mask baking that foreign matter adheres to the plate and scratches the emulsion film when it is rubbed or pressed, easily causing pattern defects.

In this embodiment, etching is performed after the first development to dissolve and remove impermeable pores formed during development. The adhesion between the glass sample and the emulsion film is strong, and etching progresses from the surface of the emulsion film, so that the cross-sectional shape of the remaining emulsion film tends to be trapezoidal. This change in shape is greatly influenced not only by exposure and development conditions but also by etching conditions. When the cross section of this impermeable emulsion film is trapezoidal, the degree of blackening decreases because the edge of the emulsion film in contact with the glass substrate is thin17. The light shielding power when printing the old shadow mask pattern is reduced.

As a result, variations in pattern dimensions of the printed photoresist film tend to occur. As a result of the test, even if the desired cross section of the emulsion film is trapezoidal, it does not affect the mask quality as long as the difference between the top side and the bottom side is 5 to 30 squares. Of course, the allowable amount of this difference depends on the dimensions of the target pattern.

Here, as shown in FIG. 2, if the outer frame pattern 24 of the pattern portion in the effective area of the shadow mask is formed by a continuous line, air venting inside the shadow mask pattern is inhibited. , air vents may be formed by cutting off multiple locations so as not to affect the quality of the mask.

The number of defects generated in the pattern printing of the shadow mask produced according to the present invention was reduced to 173 to 1 in comparison with that produced by the conventional two-time contact reversal process. In addition, we implemented the obtained pattern printing plate in the actual exposure process and tested to see how far the vacuum adhesion time could be shortened without degrading the mask quality.As a result, we found that the adhesion time, which conventionally required 80 to 120 seconds, was reduced. The process time was 40 seconds or less regardless of the pattern area, resulting in a significant improvement in production efficiency. Furthermore, in the conventional pattern burnout, the occurrence of mask defects due to omission of defect correction areas on the plate and the occurrence of mask unevenness defects due to local poor adhesion of correction areas have been reduced to about half or less.

(Example 2) After the first development and stop treatment in Example 1, an oxidizing agent solution such as copper chloride or potassium dichromate and a resin decomposing agent such as ammonia or hydrogen peroxide are mixed, and a surfactant is added to the mixture. 2kg/c of emulsion etching solution with added agent
Spray at a pressure of J for 1 to 2 minutes, and spray while irradiating with ultraviolet rays or green light. In this process, the non-light-transmitting emulsion film 7 obtained in the first development is completely dissolved and removed, leaving only the light-transmitting emulsion film 8.

Next, after rinsing with running water in a bright room, a pattern after the second development of Example 1 can be applied to produce a printing pattern exhibiting the same effect as in Example 1.

(Example 3) Using a plotting machine (for example, a Gerber photoplotter),
A shadow mask pattern drawn on a glass dry plate (for example, HRP manufactured by Kodak) is used as a pattern original.

FIG. 5 shows a plan view of the pattern original plate 25, which shows that non-transparent emulsion films 2B and 27 are formed at locations corresponding to the shadow mask openings and at desired locations other than the shadow mask pattern sections, respectively. A transparent emulsion film 28 is formed at other locations.

As shown in FIG. 3(a), there is a pattern original plate 1 having opaque emulsion films 2 and 12 and a light-transmitting emulsion film 3, and a glass drying plate 5 having an unexposed emulsion film 4 (
For example, Kodak HRP or LPP, Konica P
L) and L) are placed in a dark room so that their emulsion surfaces face each other, and after they are completely brought into close contact using a vacuum system, they are irradiated with ultraviolet rays or green light 6. Next, a first development is performed for 3 to 4 minutes using a developer at 20° C. (for example, RT developer manufactured by Kodak) in the same manner as in general photochemical processing. As a result, as shown in FIG. 3(b), a light-opaque emulsion film 7 opposite to that of the pattern original is formed, and then a stop treatment is performed in a 3% glacial acetic acid solution. After that, mix an oxidizing agent solution such as copper chloride or potassium dichromate with a resin decomposing agent solution such as ammonia or hydrogen peroxide, and immerse it for 1 to 3 minutes in an emulsion etching solution in which a surfactant is added. Alternatively, spray the etching solution at a pressure of 1 to 3 kg/cJ for about 1 to 2 minutes. By carrying out this treatment, as shown in FIG. 3(C), the non-light-transmitting emulsion film 7 obtained in the first development is dissolved and removed, and the light-transmitting emulsion films 13 and 14 remain. After washing with water, the desired emulsion film 13 located outside the shadow mask pattern area is irradiated with ultraviolet rays or green light 9 while being hidden with a shielding plate 15 or a shielding film so that the desired emulsion film 13 located outside the shadow mask pattern area is not exposed to light.
Development nuclei are formed in the silver halide in the emulsion film 14 corresponding to the shadow mask openings, and a second development is performed in the same developer as the first development. In step 14, blackened silver is formed and becomes opaque, making the emulsion film] 3 remains transparent, and the rest of the glass sample is exposed to water.Next, it is stopped, washed with water,
After drying, as shown in FIG.
I, 3.

FIG. 6 shows a plan view of the pattern printing plate 31.
As described above, a light-opaque emulsion film 32 is provided at a location corresponding to the shadow mask opening, and a transparent emulsion film 33 is provided at a desired location other than the shadow mask opening.
At other locations, the glass sample surface 34 was exposed and the pattern of the shadow mask was printed (one copy 31).The thickness of the emulsion film 32 at this time was approximately 5 μIn.

The number of defects generated on the printing plate of the Nyadou mask produced according to the present invention was reduced to 173 to 1/4 compared to that produced by conventional two-time contact reversal. In addition, we implemented the obtained printing plate in the actual exposure process and conducted a test to see how far the vacuum contact time could be shortened without degrading mask quality. The adhesion time was reduced to less than 40 seconds regardless of the pattern area, resulting in a significant improvement in production efficiency.Furthermore, with conventional printing, mask defects occur due to missing areas to be corrected, and local adhesion of areas to be corrected occurs with conventional printing. The occurrence of mask unevenness defects due to defects has been reduced by about half.

(Example 4) Figures 4(a) and 4(1)) are similar to Figure 3(a) of Example 3.
2I) and in the same manner as in FIG. 3(b). Next, the pattern original plate inverted product is treated with the same emulsion etching solution as in Example 3, and then the entire surface is irradiated with ultraviolet rays or green light as shown in FIG. 4(C). As a result, development nuclei are formed in the silver halide in the remaining emulsion films 3 and 14. Next, the second development is carried out in the same developer as the first development by applying the developer to the desired emulsion film 13 located outside the shadow mask pattern area by applying the developer to the shielding plate or shielding film 15 so that the developer does not adhere to the desired emulsion film 13 located outside the shadow mask pattern area. As a result, after development, blackened silver is not formed in the emulsion film 13 that does not adhere to the developer solution (=1) and remains transparent. After that, it is fixed, washed with water, and dried. As shown in FIG. 4(d), the target shadow mask pattern is printed on the printing plate 41 by 1'3.

Desired emulsion film located outside the shadow mask pattern part mentioned in the example] 3 forms an air flow path so as not to impede the vacuum adhesion of the shadow mask pattern part, and its shape and arrangement were tested. It is not a fixed thing, but it can be changed as needed. In addition, if the outer frame pattern of the shadow mask pattern part is formed continuously, air venting inside the dark mask pattern will be obstructed, so several locations may be slightly scraped to the extent that the mask quality is not affected. It is sufficient to form a cut-out part.

(Example 5) A pattern drawn on a glass dry plate using a drawing machine is used as a pattern original.

Next, the pattern original plate and an unexposed glass dry plate are exposed in close contact with each other using a mercury lamp, and then developed, fixed, and dried to form a master pattern in a state opposite to that of the pattern original plate. On the other hand, a sheet (for example, Hanks A-125 manufactured by Fuji Photo Film, Ris I-N 3010 manufactured by DuPont, etc.) on which a dry film-like resist film having a thickness of 20 to 5011/71 is formed on a transparent glass plate is used. Use a heat roll to heat and press the transparent glass spray as shown in Figure 7!・A resist film 53 is transferred and formed on the second layer 51.

Next, as shown in FIG. 8, this unexposed resist film 53
A glass dry plate 55 having a master pattern 54 formed thereon and a master pattern 54 obtained by the previous contact inversion.
Then perform contact inversion exposure using a mercury lamp.

Next, as shown in FIG. 9, by developing with a weak alkaline solution such as soda carbonate, washing with water, and drying, a convex resist pattern 56 remains in the portion corresponding to the opening of the shadow mask. As shown in FIG.
2, and the pattern of the shadow mask can be printed on a plate.

The opaque layer 52 is colored dark blue or red and has the ability to block light.

Note that if the coloring is insufficient, only the opaque layer 52 may be recolored using a black or red pigment or dye.

Further, in this embodiment, a dry film was used instead of the emulsion layer, but this is effective when the film thickness of the pattern is increased.

(Example 6) A shadow mask pattern drawn on a glass dry plate with a drawing machine is used as a pattern original.

On the other hand, a dry film of 20 to 50
A sheet on which a resist film with a thickness of μm is formed (for example, Banks A, -125 manufactured by Fuji Photo Film, Liston 3010 manufactured by DuPont, etc.) is heated and pressed using a hot roll, and as shown in FIG. transparent glass plate 51
A resist film 53 is transferred and formed thereon.゛Next, as shown in FIG. 8, this unexposed resist film 53 is
The glass plate 1, 51 on which the pattern was formed and the glass dry plate 55 having the master pattern 54 obtained by the previous contact reversal are subjected to contact reversal exposure using a mercury lamp.

Next, as shown in FIG. 9, by developing and drying using an organic solvent such as trichloroethane, no resist film 53 remains in the portions corresponding to the openings of the shadow mask, and the other portions are forms a resist pattern 56 covered with the resist film 53. Next, an organic material 57 made of a black or red pigment or a water-soluble photosensitive resin (for example, polyvinyl alcohol, milk casein, etc.) dyed a light brown color and sodium dichromate is placed in the recesses corresponding to the openings of the shadow mask. Fill and fully cure using UV light or a heat source. The thickness of the organic material 57 filled in this recess can be controlled arbitrarily.

Then, using an organic solvent such as methylene chloride, only the remaining resist film 56 that is not located in the opening of the shadow mask initially formed is dissolved and removed. As a result, as shown in FIG. 10, a pattern printing plate of the shadow mask is obtained in which the portions corresponding to the openings of the shadow mask are opaque and have a convex non-transparent layer 52.

〔Effect of the invention〕

According to the present invention, in the exposure step of the shadow mask manufacturing process, the mask layer and the pattern printing can be instantly brought into complete contact with the plate, making it possible to significantly improve production efficiency. Further, according to the present invention, since pattern printing is simple in preparing a plate and requires a small number of steps, the number of pattern defects in a shadow mask can be greatly reduced, and the rate of occurrence of mask defects can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a process for explaining the manufacturing process of the present invention, FIG. 2 is a schematic diagram of a pattern original, and FIGS. 3 and 4 are process diagrams for explaining other manufacturing processes of the present invention. FIG. 5 is a schematic diagram of another pattern original plate, FIG. 6 is a schematic diagram of a printing plate for pattern printing of the present invention, and FIGS. 7 to 10 are for explaining other manufacturing steps of the present invention. FIG. Figure 2 Figure 5 Figure 4 Figure 4 Figure 6

Claims (4)

[Claims] (1) A pattern printing plate for a shadow mask, characterized in that an opaque layer with a thickness of 3 μm to 50 μm is formed on a light transmitting plate in a portion corresponding to the opening in the effective area of the shadow mask. (2) An opaque layer with a thickness of 3 μm to 50 μm is formed on the light transmitting plate in the areas corresponding to the openings in the effective area of the shadow mask, and in the areas corresponding to the non-effective areas of the shadow mask. A pattern printing plate for a shadow mask, characterized in that a discontinuous light-transmitting layer with a thickness of 3 μm to 50 μm is formed. (3) A method for manufacturing a printing plate used in an exposure process in which a shadow mask pattern is printed on a photoresist film formed on both main surfaces of a shadow mask material, the light transmission plate having an unexposed emulsion layer on both sides. an exposure step of closely exposing a pattern master in which portions corresponding to the openings in the effective area of the shadow mask are opaque; a developing step of forming an inverted pattern in the emulsion layer; and a developing step of forming an inverted pattern in the emulsion layer. an etching step for etching away impermeable pores; an exposure and development step for turning the emulsion layer remaining on the light-transmitting plate into an opaque layer; and a fixing step for fixing the opaque layer. A method for producing a patterned shadow mask pattern printing plate, comprising: (4) A method for manufacturing a printing plate used in an exposure process in which a shadow mask pattern is printed on a photoresist film formed on both main surfaces of a shadow mask material, the light transmission plate having an unexposed emulsion layer on both sides. an exposure step of closely exposing a pattern original in which portions corresponding to the openings in the effective area of the shadow mask and desired portions corresponding to the non-effective areas are opaque; and a reverse pattern is formed on the emulsion layer. an etching process to etch away the non-transparent holes of the inverted pattern; and an etching process to remove the non-transparent holes of the reversal pattern, and convert only the portion of the emulsion layer remaining on the light-transmitting plate that corresponds to the effective area into a non-transparent layer. 1. A method for producing a pattern printing plate for a shadow mask, comprising an exposure and development step for fixing the emulsion layer, and a fixing step for fixing the emulsion layer.