JPH0131319B2 - - Google Patents
Info
- Publication number
- JPH0131319B2 JPH0131319B2 JP9148081A JP9148081A JPH0131319B2 JP H0131319 B2 JPH0131319 B2 JP H0131319B2 JP 9148081 A JP9148081 A JP 9148081A JP 9148081 A JP9148081 A JP 9148081A JP H0131319 B2 JPH0131319 B2 JP H0131319B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- contact
- metal plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000003566 sealing material Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- -1 etc. are preferred Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は高密度・高信頼性の微細厚膜印刷回路
板の改良された製造方法に関するものである。微
細厚膜印刷回路基板は電流が、必要とされる小型
コイル、高密度コネクター、高密度配線などの分
野で要求されており、例えばコイルの製造法とし
ては、通常巻き線方式が用いられているが、この
方法では小型のコイルを製造する事は困難であ
り、かつ巻き線の状態にバラツキが生じる。また
銅箔をエツチングしたいわゆるプリントコイル
は、サイドエツチングの為、フアインパターンは
得られず、たかだか２〜３本／mmのパターンしか
得られずこの方法も小型のコイルを製造する事は
むつかしい。しかしながら、近年モーターの小型
化にともない、フアインパターンを有するフアイ
ンコイルの開発が要望されている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved method for manufacturing high density, high reliability micro thick film printed circuit boards. Fine thick-film printed circuit boards are required in fields such as small coils, high-density connectors, and high-density wiring where electric current is required. For example, wire winding is usually used to manufacture coils. However, it is difficult to manufacture small coils using this method, and variations occur in the state of the windings. Furthermore, so-called printed coils made by etching copper foil do not produce fine patterns because of side etching, and only a pattern of 2 to 3 wires/mm can be obtained at most, making it difficult to manufacture small coils using this method. However, as motors have become smaller in recent years, there has been a demand for the development of fine coils having fine patterns.
本発明者らは先に特願昭55−166614、56−
55100〜55102にある様に金属薄板上にレジストを
回路部以外の所に設け、電解メツキにより回路部
に導電体を形成した後該金属薄板の全面又は回路
部以外の所を除去し印刷回路基板を得る微細厚膜
印刷回路基板の製造方法を提案した。そしてこれ
らの微細厚膜印刷回路基板の製造方法において、
レジストパターンを形成した金属薄板への電解メ
ツキ工程では、電流密度条件により形成された微
細厚膜印刷回路基板の占積率が大きな影響をうけ
る。しかしながら従来のメツキで行われてきた様
なメツキ電流のとり方、たとえばクリツプを使つ
たり、バレルを使つたりした場合、被メツキ物以
外にもメツキ電流が流れ、被メツキ物の電流密度
を制御することはむずかしい。しかも、バレルや
クリツプは、もれた電流によりメツキされるた
め、メツキ中に時々刻々とバレルやクリツプを通
つてもれる電流が変化する。このためメツキ浴全
体に流す電流を制御しても被メツキ物である印刷
回路板に流れる電流が制御できず、電流密度を管
理することは困難である。 The present inventors previously filed Japanese Patent Application No. 55-166614, 56-
As shown in 55100 to 55102, a resist is provided on a thin metal plate in areas other than the circuit area, a conductor is formed in the circuit area by electrolytic plating, and then the entire surface of the metal thin plate or the area other than the circuit area is removed to form a printed circuit board. A method for manufacturing fine thick film printed circuit boards was proposed. And in the manufacturing method of these fine thick film printed circuit boards,
In the electrolytic plating process for a thin metal plate with a resist pattern formed thereon, the space factor of the fine thick film printed circuit board formed is greatly influenced by the current density conditions. However, if the plating current is taken in the way that has been done in conventional plating, such as using a clip or a barrel, the plating current flows beyond the object to be plated, controlling the current density of the object to be plated. It's difficult to do. Moreover, since the barrel and clip are plated by leaking current, the current leaking through the barrel and clip changes from moment to moment during plating. For this reason, even if the current flowing through the entire plating bath is controlled, the current flowing through the printed circuit board, which is the object to be plated, cannot be controlled, and it is difficult to control the current density.
本発明は上記問題点を解決した、電流密度の管
理が容易なメツキ工程を含む微細厚膜印刷回路基
板の製造方法に関するものである。 The present invention relates to a method for manufacturing a fine thick film printed circuit board that solves the above problems and includes a plating process that allows easy control of current density.
即ち本発明は、金属薄板上にレジストを回路部
以外の所に設け、電解メツキにより回路部に導電
体を形成した後該金属薄板の全面又は回路部以外
の所を除去することを含む微細厚膜印刷回路板の
製造方法の電解メツキ工程において、被メツキ物
にメツキ電流を流す電極として、被メツキ物と電
気的接続を行うための接点と、その接点及び被メ
ツキ物の接点との接続部をメツキ液からシールす
るシール材を備えている電解メツキ用メツキ電極
を使つて電解メツキすることにより、工程管理が
容易な微細厚膜印刷回路基板の製造方法を提供す
るものである。 That is, the present invention provides a micro-thickness method that includes providing a resist on a thin metal plate at a location other than the circuit portion, forming a conductor in the circuit portion by electrolytic plating, and then removing the entire surface of the thin metal plate or the portion other than the circuit portion. In the electrolytic plating process of the method for manufacturing membrane printed circuit boards, a contact point for making an electrical connection with the object to be plated as an electrode for passing plating current through the object to be plated, and a connecting part between the contact and the contact point of the object to be plated. The present invention provides a method for manufacturing fine thick-film printed circuit boards that is easy to control by electroplating using a plating electrode for electrolytic plating that is equipped with a sealing material that seals the substrate from the plating liquid.
本発明の方法によれば、接点部をメツキ液から
シールすることにより初めて、被メツキ物に流す
メツキ電流、ひいては、電流密度を厳密かつ、再
現性良く制御することが可能となつた。その結
果、膜厚はメツキ時間のみで制御が可能である。
またメツキにより形成された導体ラインの厚さと
巾の太りの関係は電流密度の影響を強くうけるの
で、本発明の方法によれば、メツキラインの加工
精度もあがる。さらに当然のことながら不要部に
メツキがつかないので原材料の無駄を省くことが
できる。以上のことから本発明の製造方法は工業
的に優れたものである。 According to the method of the present invention, by sealing the contact portion from the plating liquid, it has become possible to strictly control the plating current flowing through the object to be plated, and thus the current density with good reproducibility. As a result, the film thickness can be controlled only by the plating time.
Furthermore, since the relationship between the thickness and the width of the conductor line formed by plating is strongly influenced by the current density, the method of the present invention also improves the processing accuracy of the plating line. Furthermore, since unnecessary parts are not plated, waste of raw materials can be avoided. From the above, the manufacturing method of the present invention is industrially superior.
微細厚膜印刷回路基板の製造方法の全工程を簡
単に述べると、金属薄板の回路部以外の部分にレ
ジストを形成し、次に回路部に電解メツキにより
導電体を形成する。その後、レジストを剥離しメ
ツキにより回路パターンを形成した面と反対側の
面を耐エツチング性のある皮膜でおおい、金属薄
板の回路部以外をエツチング除去するか、又は裏
側から金属薄板を全面除去するか、あるいは、裏
面に、表の回路部に対応する所にレジストを形成
した後回路部以外の金属薄板をエツチング除去し
て印刷回路基板を得る。 To briefly describe the entire process of manufacturing a fine thick film printed circuit board, a resist is formed on a portion of a thin metal plate other than the circuit portion, and then a conductor is formed on the circuit portion by electrolytic plating. After that, the resist is peeled off and the surface opposite to the surface on which the circuit pattern is formed by plating is covered with an etching-resistant film, and the thin metal plate other than the circuit portion is etched away, or the thin metal plate is completely removed from the back side. Alternatively, a printed circuit board is obtained by forming a resist on the back surface at a location corresponding to the circuit section on the front surface, and then removing the thin metal plate other than the circuit section by etching.
本発明に使用される金属薄板としては、導電体
でありかつエツチングが可能なものであれば良い
が、好ましくは電解メツキ導電体と異なるエツチ
ング特性を持つものが良く、この場合は金属薄板
をエツチング除去する際に電解メツキ導電体はエ
ツチングされず、高精度の金属薄板エツチングが
可能となる。これに適したものとしては、アルミ
ニウム、スズ、亜鉛などがある。また膜厚として
は、１〜500μｍ特に５〜200μｍ更には10〜100μ
ｍが好ましい範囲である。1μｍ以下の膜厚では、
取り扱い難く、かつメツキ膜厚に分布が生じ易
い。また500μｍ以上の膜厚では、エツチング除
去に時間がかかり生産性が低下する。 The thin metal plate used in the present invention may be any material as long as it is a conductor and can be etched, but it is preferably one that has etching characteristics different from electroplated conductors; in this case, the thin metal plate can be etched. During removal, the electrolytically plated conductor is not etched, allowing highly accurate etching of the metal thin plate. Suitable materials include aluminum, tin, and zinc. In addition, the film thickness is 1 to 500 μm, especially 5 to 200 μm, and even 10 to 100 μm.
m is a preferred range. At a film thickness of 1 μm or less,
It is difficult to handle, and the plating film thickness tends to be uneven. Further, if the film thickness is 500 μm or more, it takes time to remove the film by etching, and productivity decreases.
本発明において行われるパターン部以外の部分
にレジストを形成する方法としては、スクリーン
印刷或いはグラビア印刷などで形成しても良い
が、フアインパターンが得易いフオトレジストを
用いて形成するのが好ましい。形成法としては、
塗布、露光、現像プロセスを経て得る事ができ
る。フオトレジストとしては、イーストマンコダ
ツク社のKPR、KOR、KPL、KTFR、KMER、
東京応化社のTPR、OMR81、富士薬品工業の
FSRなどのネガ型、およびイーストマンコダツ
ク社のKADR、シプレー社のAZ−1350などのポ
ジ型などがあるが、耐メツキ性に優れたものが好
ましく、特にネガ型が好ましく使用される。ま
た、ドライフイルムレジストも使用可能である。
膜厚は厚い方がメツキの太り防止として役立つ
が、余り厚過ぎるとフアインパターンが得られな
くなつてしまい、0.1〜50μｍ、特に１〜10μｍが
好ましい。0.1μｍ以下ではピンホールが生じ易
い。 As a method for forming a resist on a portion other than the pattern portion used in the present invention, screen printing or gravure printing may be used, but it is preferable to use a photoresist that can easily form a fine pattern. As for the formation method,
It can be obtained through coating, exposure, and development processes. Photoresists include Eastman Kodak's KPR, KOR, KPL, KTFR, KMER,
Tokyo Ohkasha's TPR, OMR81, Fuji Pharmaceutical Co., Ltd.
There are negative types such as FSR, and positive types such as KADR from Eastman Kodak Co. and AZ-1350 from Shipley, but those with excellent plating resistance are preferred, and negative types are particularly preferably used. A dry film resist can also be used.
The thicker the film thickness, the more useful it is in preventing the plating from becoming thicker, but if it is too thick, it will become impossible to obtain a fine pattern, so 0.1 to 50 μm, particularly 1 to 10 μm, is preferable. If the thickness is 0.1 μm or less, pinholes are likely to occur.
電解メツキの種類としては、導電体であれば何
でも良いが、銀、金、銅、ニツケル、スズなどが
好ましく、特に導電性および経済性の点から銅が
好ましい。銅の電解メツキとしては、シアン化銅
メツキ、ピロリン酸銅メツキ、硫酸銅メツキ、ホ
ウフツ化銅メツキなどがあるが、特にピロリン酸
銅メツキが好ましい。本方法に対しては、一般に
行われているメツキ法が適用される。しかし微細
パターンを電解メツキする場合には重要な因子と
しては陰極の電流密度があり、陰極電流密度が小
さい場合は、膜厚方向以上に幅方向への太りが生
じ、陰極電流密度としては3Α／ｄm2以上、特に
5Α／ｄm2以上、更には8Α／ｄm2以上が好まし
く、陰極電流密度を大きくすると幅方向への太り
が抑制される。そのため本発明の方法による電流
密度の制御を行なうことは、特に微細厚膜印刷回
路にとつて有効で、配線密度の低い所で使うこと
も可能であるが、工業的には３本／mm以上、特に
５本／mm以上の配線密度に対し有効である。 Any type of electrolytic plating may be used as long as it is a conductor, but silver, gold, copper, nickel, tin, etc. are preferred, and copper is particularly preferred from the standpoint of conductivity and economy. Examples of electrolytic plating for copper include copper cyanide plating, copper pyrophosphate plating, copper sulfate plating, copper borofluoride plating, and copper pyrophosphate plating is particularly preferred. A commonly used plating method is applied to this method. However, when electrolytically plating fine patterns, the cathode current density is an important factor. If the cathode current density is small, the film becomes thicker in the width direction than in the thickness direction, and the cathode current density is 3A / dm 2 or more, especially
It is preferably 5A/dm 2 or more, more preferably 8A/dm 2 or more, and increasing the cathode current density suppresses thickening in the width direction. Therefore, controlling the current density using the method of the present invention is particularly effective for fine thick film printed circuits, and can be used in areas with low wiring density, but industrially it is difficult to control current density at 3 lines/mm or more. This is particularly effective for wiring densities of 5 wires/mm or more.
電解メツキ用電極は、被メツキ物にメツキ電流
を流すための接点部と、それをメツキ液からシー
ルするシール材とからなる。第１図、第２図にメ
ツキ電極の構造の例を示す。 Electrolytic plating electrodes consist of a contact portion for passing plating current through the object to be plated, and a sealing material for sealing the contact portion from the plating liquid. FIGS. 1 and 2 show examples of the structure of plating electrodes.
接点部は被メツキ物に接触し電気を流す接点２
と接点を被メツキ物に圧着するための第２図の様
な弾性支持体６とからなる。第１図においては第
２図の様な弾性支持体６を特に使わずシート状シ
ール材１に弾性支持体の役目も持たせてある。接
点２は導電性が高く耐薬品性がある方が望ましい
が、一般には銅、ステンレスなどが材料として使
われる。接点の形状は、被メツキ物との接触が完
全に行われれば何でも良いが、第２図の接点２の
様に被メツキ物に接触する部分に突起物がある方
が、被メツキ物と電極間の接触抵抗を減らすうえ
で好ましい。上記接点２を被メツキ物に圧着する
作用をおよぼす弾性支持体６は、弾性があれば何
でも良いが、バネやゴム等が使われ、また第１図
の様に後述するシール材の弾性を利用してシート
状シール材に代用させても良い。一方シール材は
第２図の様なシール用Ｏ−リング５や、それと同
等の形状を有する物を用いても良い。Ｏ−リング
状の物をシール材として使用すれば小さい力を加
えるだけで被メツキ物の電極との接点部をメツキ
液から容易にシールすることができる。またシー
状シール材を使う場合はＯ−リング状の物を使う
場合に比べシールするための圧力を幾分大きくす
る必要はあるが、接点２をシール材１にうめ込む
ことで弾性支持体６、たとえばバネやゴム等の部
品が不要となり構造が簡易になる。なお一般には
接点部およびシール材を支持する支持体３が使わ
れる。なお４は電線である。 The contact part is contact 2 that contacts the object to be plated and conducts electricity.
and an elastic support 6 as shown in FIG. 2 for crimping the contact to the object to be plated. In FIG. 1, the elastic support 6 as shown in FIG. 2 is not particularly used, and the sheet-shaped sealing material 1 also has the role of an elastic support. It is desirable that the contact 2 has high conductivity and chemical resistance, but copper, stainless steel, or the like is generally used as the material. The shape of the contact may be of any shape as long as it makes complete contact with the object to be plated, but it is better to have a protrusion on the part that comes into contact with the object, like contact 2 in Figure 2, so that the object to be plated and the electrode are in contact with each other. This is preferable in order to reduce the contact resistance between the two. The elastic support 6, which acts to press the contact point 2 onto the object to be plated, may be made of any material as long as it has elasticity, but springs, rubber, etc. may be used, and as shown in Fig. 1, the elasticity of the sealing material described later may be used. It may also be used as a sheet-shaped sealing material instead. On the other hand, the sealing material may be a sealing O-ring 5 as shown in FIG. 2, or an object having a similar shape. If an O-ring-shaped object is used as a sealing material, the contact portion of the object to be plated with the electrode can be easily sealed from the plating liquid by applying only a small force. In addition, when using a sealing material, it is necessary to increase the sealing pressure somewhat compared to when using an O-ring-like material, but by embedding the contact point 2 into the sealing material 1, the elastic support 6 For example, parts such as springs and rubber are not required, and the structure is simplified. Note that a support 3 is generally used that supports the contact portion and the sealing material. Note that 4 is an electric wire.
レジストの剥離は市販の剥離液を使えば良く、
たとえばインダスト−リ−ケミ−ラボラトリ
（Indust−Ri−Chem−Laboratory）社製レジス
トストリツパーＪ−100等を用いて、スプレー或
いは浸漬などによれば良い。ただし剥離液は金属
薄板、メツキ金属を侵さぬ物を選ぶ必要がある。 To remove the resist, use a commercially available remover.
For example, spraying or dipping may be performed using a resist stripper J-100 manufactured by Indust-Ri-Chem-Laboratory. However, it is necessary to choose a stripping solution that will not attack the thin metal plate or plated metal.
金属薄板をエツチング除去する方法としては、
使用した金属薄板を溶解する溶液を用いて、スプ
レー或いは浸漬などによりエツチングする方法が
用いられる。また、金属薄板としてアルミニウ
ム、スズ、亜鉛を用いた場合は、電解メツキ導電
体をエツチングしない例えばアルカリ水溶液でエ
ツチングする事が好ましいが、希塩酸等の酸性水
溶液でエツチングする事も可能である。 The method of etching a thin metal plate is as follows:
Etching is performed by spraying or dipping using a solution that dissolves the used thin metal plate. Furthermore, when aluminum, tin, or zinc is used as the thin metal plate, it is preferable not to etch the electrolytically plated conductor, for example, by etching with an alkaline aqueous solution, but it is also possible to etch with an acidic aqueous solution such as dilute hydrochloric acid.
本発明により得られた微細厚膜印刷回路基板は
工業的には、抵抗値の小さい小型コイル、高密度
コネクター、高密度配線などにおいて特に好適で
ある。 The fine thick film printed circuit board obtained by the present invention is industrially particularly suitable for use in small coils with low resistance, high-density connectors, high-density wiring, etc.
以下に本発明の態様を一層明確にする為に、実
施例を挙げて説明するが、本発明は以下の実施例
に限定されるものでなく、種々の変形が可能であ
る。 EXAMPLES In order to further clarify aspects of the present invention, examples will be described below, but the present invention is not limited to the following examples, and various modifications can be made.
実施例 １
膜厚40μｍアルミニウム薄板上に、イーストマ
ンコダツク社製ネガ型レジスト「マイクロレジス
ト747−110est」を乾燥後、膜厚が5μｍになる様
に塗布、プレベークして、回路パターンマスクを
通して高圧水銀ランプで露光し、専用の現像液お
よびリンス液を用いて現像し、ポストベークし
て、回路部以外の部分にレジストを形成した。Example 1 After drying, a negative resist "Microresist 747-110est" manufactured by Eastman Kodak Co., Ltd. was applied on a thin aluminum plate with a film thickness of 40 μm to a film thickness of 5 μm, prebaked, and exposed to high pressure through a circuit pattern mask. It was exposed to light using a mercury lamp, developed using a special developer and rinse solution, and post-baked to form a resist in areas other than the circuit area.
次いで、メツキ液としてハーシヨウ村田社製ピ
ロリン酸銅メツキ液を用いた。メツキに使用した
電極は、塩化ビニール製の板に２mm厚シリコーン
ゴムシートを貼り付け、その上に銅箔をはり付け
て接点とした物である。メツキ電源からは耐メツ
キ液性のある絶縁被覆を持つ電線を使い接点につ
なげたこの電極を用いて電流密度が8Α／ｄm2と
なる様にメツキ用定電流電源を調節し、100μｍ
厚の銅層を回路部に形成した。 Next, a copper pyrophosphate plating solution manufactured by Hershiyo Murata Co., Ltd. was used as the plating solution. The electrodes used for plating were made by pasting a 2 mm thick silicone rubber sheet on a vinyl chloride plate, and pasting copper foil on top of it to form a contact point. From the plating power supply, use a wire with an insulating coating that is resistant to plating liquid, and use this electrode connected to the contact to adjust the constant current power supply for plating so that the current density is 8Α/dm 2 , and the current density is 100 μm.
A thick copper layer was formed on the circuit section.
メツキ時間に対するメツキ厚の増加量は１分当
り1.70μｍであつた。これは7.7Α／ｄm2に相当し
電流密度の誤差は3.8％であつた。また150回同じ
電極を用いてメツキを行つたところ、メツキ厚の
平均と分散は、96.3μｍ、2.0μｍであつた。 The amount of increase in plating thickness with respect to plating time was 1.70 μm per minute. This corresponded to 7.7A/dm 2 and the error in current density was 3.8%. When plating was performed 150 times using the same electrode, the average and variance of the plating thickness were 96.3 μm and 2.0 μm.
比較例 １
実施例１の電極をクリツプによる電極に変え
て、メツキを行つたところ、メツキ膜厚の時間に
対する増加分は１分当り1.06μｍでこれは電流密
度としては4.8Α／ｄm2に当り電流密度の誤差は
60％であつた。また150回同じ電極を用いてメツ
キを行つたところ、メツキ膜厚の平均と分散は、
49.6μｍ、13.3μｍであつた。Comparative Example 1 When plating was performed by replacing the electrode in Example 1 with a clip electrode, the increase in plating film thickness over time was 1.06 μm per minute, which corresponds to a current density of 4.8A/ dm2. The error in current density is
It was 60%. Furthermore, when plating was performed using the same electrode 150 times, the average and variance of the plating film thickness were as follows.
They were 49.6 μm and 13.3 μm.
実施例 ２
膜厚20μｍスズ薄板上に、イーストマンコダツ
ク社製ネガ型レジスト「マイクロレジスト747−
110cst」を乾燥後、膜厚が5μｍになる様に塗布、
プレベークして、回路パターンマスクを通して高
圧水銀ランプで露光し、専用の現像液およびリン
ス液を用いて現像し、ポストベークして、回路部
以外の部分にレジストを形成した。Example 2 A negative resist "Microresist 747-" manufactured by Eastman Kodak Co., Ltd.
110cst" after drying, apply it to a film thickness of 5μm,
It was prebaked, exposed to light using a high pressure mercury lamp through a circuit pattern mask, developed using a special developer and rinse solution, and postbaked to form a resist in areas other than the circuit portion.
次いで、メツキ液としてハーシヨウ村田社製ピ
ロリン酸銅メツキを用いた。メツキに使用した電
極は、塩化ビニールの板に３mmφO−リングを貼
り付け、中央部に銅接点がバネにより保持されて
いる物である。メツキ電源からは耐メツキ液性の
ある絶縁被膜を持つ電線を使い接点につなげた、
この電極を用いて電流密度が8Α／ｄm2となる様
にメツキ用定電流電源を調節し、100μｍ厚の銅
層を回路部に形成した。 Next, a copper pyrophosphate plating manufactured by Harshio Murata Co., Ltd. was used as a plating liquid. The electrode used for plating was a 3mmφ O-ring attached to a vinyl chloride plate, with a copper contact held in the center by a spring. The plating power supply is connected to the contacts using electric wires with an insulating coating that is resistant to plating liquid.
Using this electrode, a constant current power supply for plating was adjusted so that the current density was 8A/dm 2 , and a 100 μm thick copper layer was formed on the circuit portion.
メツキ時間に対するメツキ厚の増加量は１分当
り1.75μｍであつた。これはほぼ8.0Α／ｄm2に相
当し電流密度の誤差は〜０％であつた。また150
回同じ電極を用いてメツキを行つたところメツキ
厚の平均と分散は、99.4μｍ、0.6μｍであつた。 The increase in plating thickness with respect to plating time was 1.75 μm per minute. This corresponded to approximately 8.0A/dm 2 and the error in current density was ~0%. 150 again
When plating was performed twice using the same electrode, the average and variance of the plating thickness were 99.4 μm and 0.6 μm.
第１図は、シート状ゴムをシール材に使い、そ
のゴムにより接点をメツキ物に圧着する形式の電
極の断面図、第２図はＯ−リングをシール材とし
て使い、接点を弾性支持体によりメツキ面に圧着
する形式の電極の断面図を示す。
１……シート状シール材、２……接点、３……
支持体、４……電線、５……シール用Ｏ−リン
グ、６……弾性支持体。
Figure 1 is a cross-sectional view of an electrode that uses a sheet of rubber as a sealing material and the contacts are crimped onto a plated object. A cross-sectional view of an electrode that is crimped onto a plating surface is shown. 1...Sheet-shaped sealing material, 2...Contact, 3...
Support, 4... Electric wire, 5... O-ring for sealing, 6... Elastic support.
Claims (1)
け、電解メツキにより回路部に導電体を形成した
後、該金属薄板の全面又は回路部以外の所を除去
することを含む微細厚膜印刷回路基板の製造方法
の電解メツキ工程において、被メツキ物にメツキ
電流を流す電極として、被メツキ物と電気的接続
を行うための接点と、その接点及び被メツキ物の
接点との接続部をメツキ液からシールするシール
材を備えている電解メツキ用メツキ電極を使つて
電解メツキすることを特徴とする微細厚膜印刷回
路基板の製造方法。1. A fine thick film printed circuit that involves providing a resist on a thin metal plate at a location other than the circuit portion, forming a conductor in the circuit portion by electrolytic plating, and then removing the entire surface of the thin metal plate or the portion other than the circuit portion. In the electrolytic plating process of the substrate manufacturing method, a contact point for making an electrical connection with the object to be plated is used as an electrode for passing a plating current through the object to be plated, and a connection part between that contact and a contact point of the object to be plated is coated with plating liquid. 1. A method for producing a fine thick film printed circuit board, characterized in that electrolytic plating is performed using a plating electrode for electrolytic plating that is equipped with a sealing material that seals from the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148081A JPS57207393A (en) | 1981-06-16 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9148081A JPS57207393A (en) | 1981-06-16 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57207393A JPS57207393A (en) | 1982-12-20 |
| JPH0131319B2 true JPH0131319B2 (en) | 1989-06-26 |
Family
ID=14027560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9148081A Granted JPS57207393A (en) | 1981-06-16 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57207393A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02166790A (en) * | 1988-12-20 | 1990-06-27 | Minolta Camera Co Ltd | Plating method for printed board |
-
1981
- 1981-06-16 JP JP9148081A patent/JPS57207393A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57207393A (en) | 1982-12-20 |
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