JPH01313195A - Laser beam marking device - Google Patents

Laser beam marking device

Info

Publication number
JPH01313195A
JPH01313195A JP63143008A JP14300888A JPH01313195A JP H01313195 A JPH01313195 A JP H01313195A JP 63143008 A JP63143008 A JP 63143008A JP 14300888 A JP14300888 A JP 14300888A JP H01313195 A JPH01313195 A JP H01313195A
Authority
JP
Japan
Prior art keywords
collimator
mask
laser
lens
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63143008A
Other languages
Japanese (ja)
Inventor
Seiji Iwama
岩間 誠司
Takashi Kasukawa
粕川 隆士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Development and Engineering Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Device Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Device Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP63143008A priority Critical patent/JPH01313195A/en
Publication of JPH01313195A publication Critical patent/JPH01313195A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To obtain fine marking with constant quality by providing a collimator which converges once at least a laser beam after passing through a mask and again spreads the beam to return it to parallel luminous fluxes and incorporating a diaphragm to intercept an axial outer beam into the collimator. CONSTITUTION:A laser luminous flux emitted from a laser beam oscillator 1 is shaped in a proper cross-sectional shape by a beam shaping optical system 2 and then, projected on the mask 3. The laser luminous flux after passing through the mask 3 is converged by a collimator first lens 7 and passes a focus 10 but the axial outer beam due to the spread of the laser beam and the beam other than parallel components by the diffraction and diffusion on the mask 3 cannot passes the focus 10. The laser beam emitted from a collimator second lens 8 is made to only the parallel components by the diaphragm 9 and even if a work 5 to be machined is placed on any place on an optical axis behind the collimator second lens 8, the clear marking with the same size can be formed.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) この発明は、レーザマーキング装置に係り、特にそのマ
ーキング光学系の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser marking device, and particularly to an improvement in its marking optical system.

(従来の技術) 従来、レーザマーキング装置は第2図に示すように構成
され、レーザ発振器1から出射されたレーザ光は、2つ
の凸レンズからなるビーム整形光学系2を通り、その光
束は適当な断面形状を持つように整形される。この整形
されたレーザ光は、マスク3に照射される。このマスク
3は、例えばレーザ光を透過する部分と遮蔽する部分と
でマーキングしたいパターンを形成したものである。マ
スク3を通過したレーザ光は、1つ又は複数の組みレン
ズによる結像レンズ4を通って被加工物5に照射される
(Prior Art) Conventionally, a laser marking device is configured as shown in FIG. Shaped to have a cross-sectional shape. The mask 3 is irradiated with this shaped laser light. This mask 3 has a pattern to be marked, for example, in a part that transmits laser light and a part that blocks laser light. The laser light that has passed through the mask 3 is irradiated onto the workpiece 5 through an imaging lens 4 made up of one or more assembled lenses.

この時、マスク3に形成されたパターンが、結像レンズ
4によって被加工物5上に結像されているため、被加工
物5上にマスク3のパターンがマーキングされる。
At this time, since the pattern formed on the mask 3 is imaged onto the workpiece 5 by the imaging lens 4, the pattern of the mask 3 is marked on the workpiece 5.

尚、マスク3は、金属板を打ち抜いたものや、すりガラ
スを使ったものや無機物をガラス表面に焼成したものな
ど、色々なものが考えられる。
The mask 3 may be made of various types, such as one made by punching out a metal plate, one made of frosted glass, or one made of an inorganic material baked on the glass surface.

(発明が解決しようとする課題) 上記従来のレーザマーキング装置では、結像レンズ4に
よりマスク3のパターンを結像させるため、被加工物5
はマスク3と結像レンズ4との距離及び結像レンズ4の
焦点距離とで決まる結像位置に設置する必要がある。
(Problem to be Solved by the Invention) In the conventional laser marking device described above, in order to image the pattern of the mask 3 using the imaging lens 4,
needs to be installed at an imaging position determined by the distance between the mask 3 and the imaging lens 4 and the focal length of the imaging lens 4.

光源としてレーザのような平行光束を用いた場合、基本
的には結像点以外の位置においても像のボケはない。し
かし、実際にはレーザ光の拡がり角やマスク3を通過す
る際の回折光、散乱光により被加工物5が結像位置から
動いた場合は、像のボケが生じコントラストの良い鮮明
なマーキングは得られない。更に、レーザ光束は、結像
レンズ4を通過することにより、収斂、発散するので、
被加工物5の位置により像の大きさが変化する。
When a parallel light beam such as a laser is used as a light source, there is basically no blurring of the image even at positions other than the imaging point. However, in reality, if the workpiece 5 moves from the imaging position due to the spread angle of the laser beam or the diffracted light or scattered light when passing through the mask 3, the image will become blurred and clear marking with good contrast will not be possible. I can't get it. Furthermore, since the laser beam converges and diverges by passing through the imaging lens 4,
The size of the image changes depending on the position of the workpiece 5.

従って、被加工物5の表面に凹凸があったり、平面でな
い場合は適正な像が結像されず、良好なマーキングが出
来ないという不具合が生じる。又、このようなレーザマ
ーキング装置では、被加工物5の表面を結像点に保つた
めの手動、又は自動調整機構が必要となり、高価になる
という欠点がある。
Therefore, if the surface of the workpiece 5 has irregularities or is not flat, a proper image will not be formed and good marking will not be possible. In addition, such a laser marking device requires a manual or automatic adjustment mechanism to maintain the surface of the workpiece 5 at the imaging point, which has the disadvantage of being expensive.

この発明は、上記事情に鑑みなされたもので、被加工物
の表面が凹凸でも良好なマーキングが出来るレーザマー
キング装置を提供することを目的とする。
The present invention was made in view of the above circumstances, and an object of the present invention is to provide a laser marking device that can perform good marking even when the surface of a workpiece is uneven.

[発明の構成] (課題を解決するための手段) この発明は、レーザ発振器から出射されたレーザ光を、
少なくともレンズ及びマスクを通して被加工物に照射す
ることにより、この被加工物上に上記マスクのパターン
をマーキングするレーザマーキング装置において、上記
レーザ光が上記マスクを通った後、少なくとも1回は収
斂させ、再び拡げて平行光束に戻すコリメータを設け、
このコリメータ内に絞りを組み込んだレーザマーキング
装置である。
[Structure of the Invention] (Means for Solving the Problems) This invention provides a method for converting laser light emitted from a laser oscillator into
In a laser marking device that marks a pattern of the mask on the workpiece by irradiating the workpiece through at least a lens and a mask, the laser beam is converged at least once after passing through the mask; A collimator is installed to expand the beam again and return it to a parallel beam.
This is a laser marking device with a diaphragm built into the collimator.

(作用) この発明によれば、被加工物の表面が平面でない場合、
凹凸がある場合でも、良好なマーキングが実現する。又
、被加工物の大きさが異なり、マーキング面位置を一定
に保つことが困難な場合でも、問題なくマーキングする
ことが出来る。
(Operation) According to this invention, when the surface of the workpiece is not flat,
Even when there are unevenness, good marking is achieved. Further, even if the workpieces have different sizes and it is difficult to keep the marking surface position constant, marking can be performed without problems.

(実施例) 以下、図面を参照して、この発明の一実施例を詳細に説
明する。
(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

この発明によるレーザマーキング装置は、第1図に示す
ように構成され、従来例(第2図)と同一箇所には同一
符号を付すことにする。
The laser marking device according to the present invention is constructed as shown in FIG. 1, and the same parts as in the conventional example (FIG. 2) are given the same reference numerals.

即ち、レーザ発振器1から出射されるレーザ光の光軸上
には、2つの凸レンズからなるビーム整形光学系2とマ
スク3及びコリメータ6が所定間隔をおいて順次配設さ
れている。
That is, on the optical axis of the laser beam emitted from the laser oscillator 1, a beam shaping optical system 2 consisting of two convex lenses, a mask 3, and a collimator 6 are sequentially arranged at a predetermined interval.

この場合、コリメータ6はレーザ光束を収斂させるコリ
メータ第ルンズ7とレーザ光束を平行光束に戻すコリメ
ータ第2レンズ8により構成されている。
In this case, the collimator 6 includes a collimator lens 7 that converges the laser beam and a collimator second lens 8 that returns the laser beam to a parallel beam.

更に、コリメータ第ルンズ7によってレーザ光束が収斂
さ、れた位置(以下、焦点10)には、この焦点10を
通る主光線以外を遮断するための絞り9が設けられてい
る。そして、被加工物5はコリメータ6のレーザ光軸上
であれば、何処に設置しても良く、普通は被加工物5の
押さえ治具や、マーキング時に発生する煙等の影響がな
いような適当な位置に置く。
Further, at a position where the laser beam is converged by the collimator lens 7 (hereinafter referred to as a focal point 10), an aperture 9 is provided to block rays other than the chief ray passing through the focal point 10. The workpiece 5 can be placed anywhere as long as it is on the laser optical axis of the collimator 6, and is usually placed in a place where it will not be affected by a holding jig for the workpiece 5 or smoke generated during marking. Place it in an appropriate position.

動作時には、従来と同様に、レーザ発振器1から出射さ
れたレーザ光束は、ビーム整形光学系2で適当な断面形
状に整形された後、マスク3に照射される。このマスク
3を通ったレーザ光束は、コリメータ第ルンズ7により
収斂し、焦点10を通過するが、レーザ光の拡がりに起
因する軸外光やマスク3での回折、散乱による平行成分
以外の光は、焦点10を通過出来ず、ここに設けられた
絞り9によりコリメータ第2レンズ8から出射されるレ
ーザ光は平行成分のみとなり、コリメータ第2レンズ8
の後の光軸上、何処に被加工物5を置いても、同一の大
きさで鮮明なマーキングが出来る。
During operation, the laser beam emitted from the laser oscillator 1 is shaped into an appropriate cross-sectional shape by the beam shaping optical system 2, and then irradiated onto the mask 3, as in the prior art. The laser beam passing through the mask 3 is converged by the collimator lens 7 and passes through the focal point 10, but off-axis light due to the spread of the laser beam and light other than parallel components due to diffraction and scattering at the mask 3 are , the laser beam cannot pass through the focal point 10, and the laser beam emitted from the collimator second lens 8 becomes only parallel components due to the aperture 9 provided here.
No matter where the workpiece 5 is placed on the optical axis after the mark, clear markings of the same size can be made.

このように、この発明では被加工物5の表面が平面でな
い場合、凹凸がある場合でも、良好なマ−キングが実現
する。又、被加工物5の大きさが異なり、マーキング面
位置を一定に保つことが困難場合でも、問題なくマーキ
ングすることが出来る。
In this way, according to the present invention, good marking can be achieved even when the surface of the workpiece 5 is not flat or uneven. Furthermore, even if the workpieces 5 have different sizes and it is difficult to keep the position of the marking surface constant, marking can be performed without problems.

(他の実施例) 上記実施例では、コリメータ第ルンズ7の焦点位置とコ
リメータ第2レンズ8の焦点位置を共に焦点10に来る
ように配置して、コリメータ6から出るレーザ光を平行
光束としているが、コリメータ第2レンズ8の位置を光
軸方向に動かすことにより光束を広げたり、収斂させた
りすることが出来る。これを利用して、被加工物5の位
置が固定されている場合、コリメータ第2レンズ8の位
置を動かしてマーキングの大きさを調整することが出来
る。
(Other Examples) In the above example, the focal position of the collimator lens 7 and the focal position of the collimator second lens 8 are both arranged to be at the focal point 10, so that the laser beam emitted from the collimator 6 is made into a parallel beam. However, by moving the position of the collimator second lens 8 in the optical axis direction, the light beam can be expanded or converged. Utilizing this, when the position of the workpiece 5 is fixed, the size of the marking can be adjusted by moving the position of the collimator second lens 8.

又、コリメータ第ルンズ7とコリメータ第2レンズ8で
構成されるコリメータ6の倍率を変えることにより、縮
小・等倍・拡大のいかなる比率にても、マスクパターン
をマーキングすることが出来る。
Furthermore, by changing the magnification of the collimator 6 composed of the collimator lens 7 and the collimator second lens 8, the mask pattern can be marked at any ratio of reduction, same magnification, or enlargement.

更に、マスク3が透過型である場合、光軸上に複数のマ
スクを重ねて置き、組合せパターンを形成することが考
えられるが、この場合でも各マスクの位置の違いによる
マーキング像の大きさの変化やボケの影響なく良好なマ
ーキングが得られる。
Furthermore, if the mask 3 is a transmission type, it is conceivable to place multiple masks one on top of the other on the optical axis to form a combination pattern, but even in this case, the size of the marking image may vary due to the difference in the position of each mask. Good markings can be obtained without any change or blurring.

[発明の効果] この発明によれば、マスクの位置、被加工物の位置に依
存せず、一定品質の良好なマーキングが得られるので、
自由度の大きいマーキングシステムを実現することが出
来る。
[Effects of the Invention] According to the present invention, good marking with constant quality can be obtained regardless of the position of the mask or the position of the workpiece.
It is possible to realize a marking system with a large degree of freedom.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例に係るレーザマーキング装
置を示す概略構成図、第2図は従来のレーザマーキング
装置を示す概略構成図である。 1・・・レーザ発振器、2・・・ビーム整形光学系、3
・・・マスク、5・・・被加工物、6・・・コリメータ
、7・・・コリメータ第ルンズ、8・・・コリメータ第
2レンズ、9・・・絞り、10・・・焦点。 出願人代理人  弁理士 鈴江武彦
FIG. 1 is a schematic diagram showing a laser marking device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a conventional laser marking device. 1... Laser oscillator, 2... Beam shaping optical system, 3
...Mask, 5. Workpiece, 6. Collimator, 7. Collimator first lens, 8. Collimator second lens, 9. Aperture, 10. Focus. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

【特許請求の範囲】 レーザ発振器から出射されたレーザ光を、少なくともレ
ンズ及びマスクを通して被加工物に照射することにより
、この被加工物上に上記マスクのパターンをマーキング
するレーザマーキング装置において、 上記レーザ光が上記マスクを通った後、少なくとも1回
は収斂させ、再び拡げて平行光束に戻すコリメータを設
けると共に、該コリメータ内に軸外光を遮断する絞りを
有することを特徴とするレーザマーキング装置。
[Scope of Claims] A laser marking device that marks a pattern of the mask on a workpiece by irradiating the workpiece with a laser beam emitted from a laser oscillator through at least a lens and a mask, comprising: A laser marking device characterized by having a collimator that converges the light at least once after passing through the mask and then expanding it again to return it to a parallel beam, and further comprising a diaphragm within the collimator that blocks off-axis light.
JP63143008A 1988-06-10 1988-06-10 Laser beam marking device Pending JPH01313195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63143008A JPH01313195A (en) 1988-06-10 1988-06-10 Laser beam marking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63143008A JPH01313195A (en) 1988-06-10 1988-06-10 Laser beam marking device

Publications (1)

Publication Number Publication Date
JPH01313195A true JPH01313195A (en) 1989-12-18

Family

ID=15328807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63143008A Pending JPH01313195A (en) 1988-06-10 1988-06-10 Laser beam marking device

Country Status (1)

Country Link
JP (1) JPH01313195A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147817A (en) * 2004-11-19 2006-06-08 Canon Inc Laser processing equipment and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147817A (en) * 2004-11-19 2006-06-08 Canon Inc Laser processing equipment and method
US7807940B2 (en) 2004-11-19 2010-10-05 Canon Kabushiki Kaisha Laser processing apparatus and laser processing method

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