JPH01311144A - Resin composition for vibration-damping metallic plate - Google Patents
Resin composition for vibration-damping metallic plateInfo
- Publication number
- JPH01311144A JPH01311144A JP63141418A JP14141888A JPH01311144A JP H01311144 A JPH01311144 A JP H01311144A JP 63141418 A JP63141418 A JP 63141418A JP 14141888 A JP14141888 A JP 14141888A JP H01311144 A JPH01311144 A JP H01311144A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- resin composition
- vibration
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 32
- 238000013016 damping Methods 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims abstract description 10
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 39
- 239000000155 melt Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005977 Ethylene Substances 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive effect Effects 0.000 description 18
- 239000004831 Hot glue Substances 0.000 description 13
- 239000001993 wax Substances 0.000 description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000012943 hotmelt Substances 0.000 description 5
- -1 weight% Chemical compound 0.000 description 4
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218628 Ginkgo Species 0.000 description 1
- 235000011201 Ginkgo Nutrition 0.000 description 1
- 235000008100 Ginkgo biloba Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
童栗上■科里分立
本発明は、制振金属板用樹脂組成物に関し、詳しくは、
騒音発生源に割振材として用いられる振動減衰性制振金
属板において、金属板間に介在される樹脂層を形成する
制振性、加工性及び接着性にすぐれる樹脂組成物に関す
る。[Detailed Description of the Invention] The present invention relates to a resin composition for vibration-damping metal plates.
The present invention relates to a resin composition having excellent vibration-damping properties, workability, and adhesiveness and forming a resin layer interposed between metal plates in vibration-damping metal plates used as a damping material for noise sources.
ｌ米亘肢王
近年、交通機関の発達、住居と工場や事業場との接近に
伴って、地域社会の環境保全の見地から、各種の交通手
段や機械等から発生する騒音対策が重要な課題となって
おり、特に、自動車のオイルパン、ダッシュパネル、ホ
ッパーのシュート部、汎用エンジンカバー、その他金属
加工機械の振動低減部材等への制振金属板の採用が提案
されており、或いは一部では既に実用化されている。In recent years, with the development of transportation systems and the proximity of residences to factories and businesses, countermeasures against noise generated by various transportation methods and machinery have become an important issue from the perspective of environmental conservation in local communities. In particular, it has been proposed that vibration-damping metal plates be used in automobile oil pans, dash panels, hopper chutes, general-purpose engine covers, and other vibration-reducing parts of metal processing machines, or some It has already been put into practical use.
割振金属板は、一般に、対向する金属板とその間に積層
される樹脂層とからなり、割振性のほか、特に、金属板
と樹脂層との間の接着性や延性にすぐれることが強く要
求される。Distributed metal plates generally consist of opposing metal plates and a resin layer laminated between them, and in addition to their distributive properties, there is a strong demand for excellent adhesion and ductility between the metal plates and the resin layer. be done.
従来、かかる制振金属板は、ホットメルト接着剤を用い
るホットメルト・ラミネート法、溶剤型接着剤を用いる
乾式ラミネート法、熱接着性フィルムを用いるフィルム
・ラミネート法等によって製造されている。これらのな
かでも、ホットメルト・ラミネート法は、瞬間接着によ
って制振金属板を高速大量生産することができ、更に、
用いる接着剤が溶剤を含まないために人体に対する毒性
や火災のおそれがなく、取扱いの面でも安全性が高い。Conventionally, such vibration-damping metal plates have been manufactured by a hot-melt lamination method using a hot-melt adhesive, a dry lamination method using a solvent-based adhesive, a film lamination method using a heat-adhesive film, and the like. Among these, the hot-melt lamination method allows high-speed mass production of vibration-damping metal plates by instant bonding.
Since the adhesive used does not contain solvents, there is no danger of toxicity to the human body or fire, and it is highly safe to handle.
このように、ホットメルト・ラミネート法は、多くの利
点を有する反面、ホットメルト接着剤が熱可塑性樹脂か
らなるので、接着の耐熱性に自ずから限界があるうえに
、従来、ホットメルト接着剤を用いる割振金属板は、振
動減衰性能が高くても、樹脂層と金属板との密着性や樹
脂の延性が低く、その結果、制振金属板をオイルパン等
に深絞り加工する際に樹脂層が剥離し、或いは破断する
ことが多い。As described above, the hot melt lamination method has many advantages, but since the hot melt adhesive is made of thermoplastic resin, there is a natural limit to the heat resistance of the adhesive. Even if the damping metal plate has high vibration damping performance, the adhesion between the resin layer and the metal plate and the ductility of the resin are low, and as a result, when the vibration damping metal plate is deep drawn into an oil pan, etc., the resin layer is It often peels off or breaks.
■が”しようとするｉ
本発明者らは、ホットメルト・ラミネート法における上
記利点に注目して、制振金属板用樹脂組成物としての改
善を図るべく鋭意研究した結果、ホットメルト接着剤に
おけるベース樹脂としてエチレン−アクリル酸共重合体
を用い、これに粘着付与樹脂及び酸化防止剤を所定量配
合し、更に必要に応じてワックスを配合することによっ
て、割振性を損なうことなく、積層時において樹脂組成
物の金属板に対する濡れ性を改善し、かくして、樹脂組
成物の金属板への接着強度を著しく向上させることがで
きることを見出して、本発明に至ったものである。The present inventors paid attention to the above-mentioned advantages of the hot-melt lamination method, and as a result of intensive research aimed at improving the resin composition for vibration-damping metal plates, they found that By using an ethylene-acrylic acid copolymer as the base resin, adding a predetermined amount of a tackifying resin and an antioxidant, and further adding wax as needed, it is possible to maintain the stability during lamination without impairing the distribution properties. The present invention was achieved based on the discovery that it is possible to improve the wettability of a resin composition to a metal plate, thereby significantly improving the adhesive strength of the resin composition to the metal plate.
課 を ンするための
本発明による制振金属板用樹脂組成物は、アクリル酸含
Ｍ１０〜３０重量％、メルトインデックス１００ル３０
００
アクリル酸共重合体１００重量部について、粘着付与樹
脂３〜３０重量部と酸化防止剤０．５〜３． ０重量部
とを添加することを特徴とする。The resin composition for vibration-damping metal plates according to the present invention for use in the present invention contains acrylic acid in an amount of 10 to 30% by weight, and has a melt index of 100 l30.
00 For 100 parts by weight of acrylic acid copolymer, 3 to 30 parts by weight of tackifier resin and 0.5 to 3.0 parts by weight of antioxidant. It is characterized by adding 0 parts by weight.
本発明において、ホットメルト接着剤のベース樹脂とし
て用いるエチレン−アクリル酸共重合体は、通常の使用
環境温度範囲である約４０℃から約１００℃の温度にわ
たって、即ち、中高温域において、割振性が高いと共に
、金属に対して高い接着性を得ることができるように、
アクリル酸を１０〜３０重量％、エチレンを９０〜７０
重量％を含み、メルトインデックスが１００〜３０００
ｇ／分の範囲にあるものが用いられる．特に好ましくは
、アクリル酸を２０〜３０重量％、エチレンを８０〜７
０重量％を含み、そのメルトインデックスが３００〜１
０００ｇ／分に範囲にあるものが用いられる。In the present invention, the ethylene-acrylic acid copolymer used as the base resin of the hot-melt adhesive has a dispersion property over a temperature range of about 40°C to about 100°C, which is the normal usage environment temperature range, that is, in a medium-high temperature range. In addition to high adhesiveness to metals,
10-30% by weight of acrylic acid, 90-70% of ethylene
Including weight%, melt index is 100-3000
Those in the g/min range are used. Particularly preferably, acrylic acid is 20 to 30% by weight and ethylene is 80 to 7% by weight.
0% by weight and its melt index is 300-1
000 g/min is used.
エチレン−アクリル酸共重合体において、アクリル酸含
量が１０重量％よりも少ないときは、割振性に劣り、３
０重量％を越えるときは、ブロッキング等の面で樹脂の
取扱いが困難となる。また、メルトインデックスが１０
ｇ／分よりも小さいときは、樹脂組成物の溶融粘度が高
すぎ、他方、３０ ０ ０ ｇ／分を越えるときは、樹
脂組成物の凝集力が不足し、接着力が低下する。In the ethylene-acrylic acid copolymer, when the acrylic acid content is less than 10% by weight, the distributability is poor, and 3
When it exceeds 0% by weight, handling of the resin becomes difficult due to blocking and the like. Also, the melt index is 10
When it is less than 3000 g/min, the melt viscosity of the resin composition is too high, and on the other hand, when it exceeds 3000 g/min, the cohesive force of the resin composition is insufficient, resulting in a decrease in adhesive strength.
本発明において用いるホットメルト接着剤は、上記した
ベース樹脂と共に、粘着付与樹脂と必要に応じてワック
スとを含有する。これら粘着付与樹脂及びワックスは、
従来よりホットメルト接着剤において知られているもの
であってよく、従って、粘着付与樹脂としては、例えば
、ロジンのはカ、カムロジン、ウッドロジン、トール油
ロジン、水添ロジン、重合ロジン、不均化ロジン等のロ
ジンＥｌ ’Ｉ− 体、テルペン樹脂、テルペン・フェ
ノール樹脂、石油樹脂、クマロン・インデン樹脂等を用
いることができ、また、ワックスとしては、例えば、マ
イクロクリスタリンワックス、モンタンワックス、低分
子量ポリエチレンワックスの酸化物やエステル化物等を
用いることができる。The hot melt adhesive used in the present invention contains a tackifying resin and, if necessary, wax in addition to the base resin described above. These tackifying resins and waxes are
The tackifying resin may be one conventionally known in hot melt adhesives, and therefore, examples of the tackifying resin include rosin resin, camrosin, wood rosin, tall oil rosin, hydrogenated rosin, polymerized rosin, disproportionated rosin, etc. Rosin El' I-forms such as rosin, terpene resins, terpene/phenol resins, petroleum resins, coumaron/indene resins, etc. can be used, and as waxes, for example, microcrystalline wax, montan wax, low molecular weight polyethylene Wax oxides, esterified products, etc. can be used.
更に、本発明においては、ホットメルト接着剤は、少量
の酸化防止剤を含有する。Furthermore, in the present invention, the hot melt adhesive contains a small amount of antioxidant.
本発明において用いられるホットメルト接着剤は、通常
、ベース樹脂７０〜９０重量％、粘着付与樹脂３〜３０
重量％、好ましくは５〜２０重量％、及び酸化防止剤０
． ５〜３重量％を含有し、必要に応じて、ワックス１
０重量％以下、好ましくは３〜５重量％を含有する。The hot melt adhesive used in the present invention usually contains 70 to 90% by weight of the base resin and 3 to 30% by weight of the tackifying resin.
% by weight, preferably 5-20% by weight, and 0 antioxidants
．． 5 to 3% by weight, optionally wax 1
It contains 0% by weight or less, preferably 3 to 5% by weight.
本発明において用いられるホットメルト接着剤は、工業
的には、通常、粘着付与樹脂、ワックス等の軟化点や溶
融粘度の低い成分から、軟化点や溶融粘度の高い前記ベ
ース樹脂としてのエチレン−アクリル酸共重合体を順次
、撹拌混合釜に投入し、これらを混合溶融させ、通常、
１５０〜１８０℃の温度、５０〜１１００ｒｐの条件に
て数時間、加熱混合すれば、本発明にて用いるホットメ
ルト接着剤を得ることができる。Industrially, the hot melt adhesive used in the present invention is usually made from components with low softening points and melt viscosity such as tackifying resins and waxes, and ethylene-acrylic as the base resin with high softening points and melt viscosity. The acid copolymers are sequentially put into a stirring mixing pot, mixed and melted, and usually
The hot melt adhesive used in the present invention can be obtained by heating and mixing for several hours at a temperature of 150 to 180° C. and a speed of 50 to 1100 rpm.
本発明によれば、制振金属板は、好ましくは、上記した
ようなホットメルト接着剤を厚さ３０〜４００μｍ、好
ましくは５０〜１５０μｍのフィルムとなし、これを２
枚又はそれ以上の対向する金属板の間に挟み、これらを
加圧加熱して、金属板間に樹脂層を形成して、金属板を
接着することによって得ることができる。しかし、ホッ
トメルト接着剤を一方又は両方の金属板に溶融塗布し、
これら金属板を加圧加熱してもよい。According to the present invention, the damping metal plate is preferably made of a hot melt adhesive as described above in the form of a film with a thickness of 30 to 400 μm, preferably 50 to 150 μm, and
It can be obtained by sandwiching one or more metal plates facing each other, pressing and heating them to form a resin layer between the metal plates, and then bonding the metal plates. However, if hot melt adhesive is melt applied to one or both metal plates,
These metal plates may be heated under pressure.
上記金属板は、その構成金属種において特に限定される
ものではなく、また、金属板が同じ又は異なる金属種か
らなるものでもよい。かかる金属板としては、従って、
例えば、表面処理鋼板やステンレス鋼板を含む種々の鋼
板、アルミニウム板、銅板、これらの表面処理金属板等
、適宜の金属板が割振金属板の要求特性や用途に応じて
、適宜に用いられる。The above-mentioned metal plate is not particularly limited in its constituent metal species, and the metal plates may be made of the same or different metal species. As such a metal plate, therefore,
For example, appropriate metal plates such as various steel plates including surface-treated steel plates and stainless steel plates, aluminum plates, copper plates, and surface-treated metal plates thereof can be used as appropriate depending on the required characteristics and uses of the distributed metal plate.
主ユ皇四及
本発明による制振金属板用樹脂組成物は、ベース樹脂と
して所定の単量体組成を有するエチレン−アクリル酸共
重合体に粘着付与樹脂、酸化防止剤、及び必要に応じて
ワックスを配合してなるホットメルト接着剤組成物から
なり、加工性にすぐれると共に、中高温域において、金
属板に対して、高い接着強度と共に割振性を有する。The resin composition for vibration-damping metal plates according to the present invention comprises an ethylene-acrylic acid copolymer having a predetermined monomer composition as a base resin, a tackifier resin, an antioxidant, and optionally It is made of a hot melt adhesive composition containing wax, and has excellent processability and has high adhesive strength and distribution properties to metal plates in the medium to high temperature range.
大隻拠
以下に実施例を挙げて本発明を説明するが、本発明はこ
れら実施例により何ら限定されるものではない。The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples in any way.
実施例１
第１表に示すように、ベース樹脂に所定量の添加剤を加
え、ロール表面温度８０−１００℃にて小型混練ロール
を用いて、２０分間混練して、種々の組成を有する樹脂
組成物を調製した。それぞれの樹脂組成物の溶融粘度を
併せて第１表に示す。Example 1 As shown in Table 1, a predetermined amount of additives were added to the base resin and kneaded for 20 minutes using a small kneading roll at a roll surface temperature of 80-100°C to obtain resins with various compositions. A composition was prepared. The melt viscosity of each resin composition is also shown in Table 1.
本発明の樹脂組成物は、溶融粘度が低く、特に、１８０
℃での溶融粘度が低い。即ち、１８０℃で５００ポイズ
以下の低粘度ホットメルト接着剤であって、通常のホッ
トメルトコーターを用いて金属板に容易に塗布すること
ができ、しかも得られた制振金属板は曲げやプレス成形
性にすぐれる。The resin composition of the present invention has a low melt viscosity, especially 180
Low melt viscosity at °C. That is, it is a low-viscosity hot-melt adhesive with a viscosity of 500 poise or less at 180°C, and can be easily applied to a metal plate using an ordinary hot-melt coater, and the resulting damping metal plate can be easily bent or pressed. Excellent moldability.
上記それぞれの樹脂組成物を厚さ１００μｍのスペーサ
と共に２枚の冷延鋼板（０，８Ｘ２００Ｘ２５０＋＋ｎ
）の間に挾み、油圧プレスを用いて、１７０℃、３０
ｋｇｆ／ｃｍ”にて５分間、加熱加圧した。Each of the above resin compositions was applied to two cold rolled steel plates (0.8X200X250++n) together with a 100μm thick spacer.
) and using a hydraulic press at 170℃, 30℃.
It was heated and pressurized for 5 minutes at "kgf/cm".
この割振金属板から短冊型の試料を作製し、Ｂ＆に社製
複素弾性係数測定装置を用いて、共振法にて振動減衰試
験を行なった。また、接着力については、剪断引張強度
をＪＩＳ Ｋ ６８５０に準じて、また、Ｔ剥離強度を
ＪＩＳに６８５４に準じて測定した。樹脂組成物の溶融
粘度は、コントラバス社の高温用粘度計レオマット３０
を用いて、温度１６０℃又は１８０℃で、剪断速度１０
０５ｅｃ−’の条件にて測定した。A strip-shaped sample was prepared from this distributed metal plate, and a vibration damping test was conducted using a resonance method using a complex elastic modulus measuring device manufactured by B& Co., Ltd. Regarding adhesive strength, shear tensile strength was measured according to JIS K 6850, and T-peel strength was measured according to JIS 6854. The melt viscosity of the resin composition was measured using a high-temperature viscometer Rheomat 30 manufactured by Contrabas.
using a shear rate of 10 at a temperature of 160°C or 180°C.
The measurement was carried out under the conditions of 05ec-'.
結果を第１図から第８図に示す。The results are shown in FIGS. 1 to 8.
第１図は、エチレン−アクリル酸共重合体への粘着付与
樹脂の添加量が樹脂組成物の制振性に及ぼす影響を示す
。粘着付与樹脂の添加量は、樹脂組成物の制振性に大き
い影響を与えない。FIG. 1 shows the influence of the amount of tackifying resin added to the ethylene-acrylic acid copolymer on the damping properties of the resin composition. The amount of the tackifier resin added does not have a large effect on the vibration damping properties of the resin composition.
第２図は、ベース樹脂への粘着付与樹脂の添加量と樹脂
組成物の接着強度との関係を示し、エチレン−アクリル
酸共重合体１００重量部に対して、約１０重量部の粘着
付与樹脂を添加するとき、接着強度が最大となることが
認められる。Figure 2 shows the relationship between the amount of tackifying resin added to the base resin and the adhesive strength of the resin composition. It is observed that the adhesive strength is maximum when .
第３図は、異なる粘着付与樹脂をベース樹脂１００重量
部に対して、それぞれ２５重量部加えてなる樹脂組成物
を用いたときの制振性を示す、制振性は、粘着付与樹脂
の種類には殆ど依存しないことが認められる。Figure 3 shows the damping properties when using resin compositions in which 25 parts by weight of each of different tackifying resins are added to 100 parts by weight of the base resin. It is recognized that there is little dependence on
第４図は、異なる粘着付与樹脂をベース樹脂１００重量
部に対して、それぞれ２５重量部加えてなる樹脂組成物
を用いたときの接着強度を示す。FIG. 4 shows the adhesive strength when using resin compositions in which 25 parts by weight of different tackifying resins were added to 100 parts by weight of the base resin.
接着強度は、粘着付与樹脂の種類によって若干変化する
ものの、粘着付与樹脂を用いることによって、共通して
高い接着強度を得ることができる。Although the adhesive strength varies slightly depending on the type of tackifying resin, high adhesive strength can generally be obtained by using a tackifying resin.
第５図に示すように、樹脂組成物へのワックスの添加に
よって、中温域（６０〜８０℃）での樹脂組成物の割振
性が僅かに低下するが、第６図に示すように、すワック
スの添加は、ベース樹脂１００重量部に対して０．５重
量部程度であるとき、樹脂組成物の接着強度、特に、Ｔ
剥離強度が改善される。As shown in FIG. 5, the addition of wax to the resin composition slightly reduces the dispersion properties of the resin composition in the medium temperature range (60 to 80°C), but as shown in FIG. When the wax is added in an amount of about 0.5 parts by weight based on 100 parts by weight of the base resin, the adhesive strength of the resin composition, especially T
Peel strength is improved.
第７図は、先のエチレン−アクリル酸共重合体とは別の
ベース樹脂に粘着付与樹脂を配合したときの樹脂組成物
の制振性を示し、６０℃以上の温度域では、粘着付与樹
脂の種類を変えても、制振性はほぼ同じであるが、第８
図に示すように、接着強度が改善されることが認められ
る。Figure 7 shows the vibration damping properties of a resin composition when a tackifying resin is blended with a base resin other than the ethylene-acrylic acid copolymer. The damping performance is almost the same even if the type of
As shown in the figure, it is recognized that the adhesive strength is improved.
第１図は、粘着付与樹脂の添加量が樹脂組成物の制振性
に及ぼす影響を示すグラフ、第２図は、粘着付与樹脂の
添加量が接着強度に及ぼす影響を示すグラフ、第３図は
、粘着付与樹脂の添加が樹脂組成物の制振性能に及ぼす
影響を示すグラフ、第４図は、粘着付与樹脂の添加量が
樹脂組成物の接着強度に及ぼす影響を示すグラフ、第５
図は、ワックスの添加量と割振性との関係を示すグラフ
、第７図は、樹脂組成物の接着強度に及ぼすワックス添
加の影響を示すグラフ、第７図は、粘着付与樹脂が樹脂
組成物の割振性に及ぼす影響を示すグラフ、第８図は、
粘着付与樹脂が樹脂組成物の接着強度に及ぼす影響を示
すグラフである。
特許出願人 株式会社神戸製鋼所
代理人 弁理士 牧 野 逸 部
第１図
ミニ度（°０）
第２図
ト １２３
第３図
擢り斐（１Ｃ）
第４図
第５図
１炭とＣ）
第６図
ノ ｊ
乙“零７図
１度（°Ｃ）
第８図
７ ３ ？Figure 1 is a graph showing the effect of the amount of tackifying resin added on the vibration damping properties of the resin composition, Figure 2 is a graph showing the effect of the amount of tackifying resin added on adhesive strength, and Figure 3 FIG. 4 is a graph showing the effect of the addition of the tackifying resin on the vibration damping performance of the resin composition, FIG. 4 is a graph showing the effect of the amount of the tackifying resin added on the adhesive strength of the resin composition, and FIG.
The figure is a graph showing the relationship between the amount of wax added and the splitting property. Figure 7 is a graph showing the influence of wax addition on the adhesive strength of the resin composition. Figure 7 shows that the tackifying resin is a resin composition. Figure 8 is a graph showing the influence of
1 is a graph showing the influence of a tackifying resin on the adhesive strength of a resin composition. Patent Applicant Kobe Steel Co., Ltd. Agent Patent Attorney Ittsu Makino Department Figure 1 Miniature degree (°0) Figure 2 G 123 Figure 3 Ginkgo (1C) Figure 4 Figure 5 Figure 1 Charcoal and C) Figure 6 j
B “Zero 7 1 degree (°C) 8 7 3 ?
Claims (2)
ックス１００〜３０００ｇ／１０分であるエチレン−ア
クリル酸共重合体１００重量部について、粘着付与樹脂
３〜３０重量部と酸化防止剤０．５〜３．０重量部とを
添加することを特徴とする制振金属板用樹脂組成物。(1) For 100 parts by weight of an ethylene-acrylic acid copolymer having an acrylic acid content of 10 to 30% by weight and a melt index of 100 to 3000 g/10 minutes, 3 to 30 parts by weight of a tackifier resin and 0.5 to 0.5 parts by weight of an antioxidant. 3.0 parts by weight of a resin composition for a vibration-damping metal plate.
いて、ワックス１０重量部以下を添加することを特徴と
する請求項第１項記載の制振金属板用樹脂組成物。(2) The resin composition for vibration-damping metal plates according to claim 1, wherein 10 parts by weight or less of wax is added to 100 parts by weight of the ethylene-acrylic acid copolymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63141418A JPH01311144A (en) | 1988-06-08 | 1988-06-08 | Resin composition for vibration-damping metallic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63141418A JPH01311144A (en) | 1988-06-08 | 1988-06-08 | Resin composition for vibration-damping metallic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01311144A true JPH01311144A (en) | 1989-12-15 |
Family
ID=15291545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63141418A Pending JPH01311144A (en) | 1988-06-08 | 1988-06-08 | Resin composition for vibration-damping metallic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01311144A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6140400A (en) * | 1996-01-18 | 2000-10-31 | Wacker-Chemie Gmbh | Redispersible tackifier powders |
| JP2001261904A (en) * | 2000-03-22 | 2001-09-26 | Du Pont Mitsui Polychem Co Ltd | Ethylene copolymer composition |
| US10119050B2 (en) * | 2014-06-26 | 2018-11-06 | Arkema France | Adhesive sealing composition |
-
1988
- 1988-06-08 JP JP63141418A patent/JPH01311144A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6140400A (en) * | 1996-01-18 | 2000-10-31 | Wacker-Chemie Gmbh | Redispersible tackifier powders |
| JP2001261904A (en) * | 2000-03-22 | 2001-09-26 | Du Pont Mitsui Polychem Co Ltd | Ethylene copolymer composition |
| JP4690517B2 (en) * | 2000-03-22 | 2011-06-01 | 三井・デュポンポリケミカル株式会社 | Ethylene copolymer composition |
| US10119050B2 (en) * | 2014-06-26 | 2018-11-06 | Arkema France | Adhesive sealing composition |
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