JPH01309505A - Microwave oscillator - Google Patents

Abstract

PURPOSE:To improve the vibration proof and to adjust the oscillated frequency by providing a frequency regulating mechanism where a dielectric oscillator is sealed by a case inner cover having an elasticity, a resin is in a space between the case inner cover and the case outer cover and the ceiling of the inner cover is depressed depending on a pressure of the filled resin. CONSTITUTION:The dielectric resonator 1 and a base 4 are mounted in a case main body 6, and sealed by the case inner cover 7 made of an elastic metal. Furthermore, the outside of the case inner cover 7 is sealed by the case outer cover 8 and a resin 9 is felled in a space between the case inner cover 7 and the case outer cover 8. The ceiling of the case inner cover 7 is pressed by a pressure of the resin 9 and the position of the ceiling is changed by the resin pressure. Thus, the distance between the ceiling of the case inner cover 7 and the dielectric resonator 1 is changed and the oscillated frequency is changed. Thus, the pressure of the resin filled in the space is varied to adjust the oscillating frequency while keeping the sealing state and no moving part such as a screw is needed, a stable characteristic against the vibration is obtained.

Description

[Detailed description of the invention] Industrial applications The present invention relates to microwave oscillators.

2. Description of the Related Art Microwave oscillators often use a dielectric oscillator in which a dielectric resonator is coupled to a solid-state oscillation element. FIG. 3 shows a configuration diagram of a conventional microwave oscillator. In Fig. 3, 1 is a dielectric resonator, 2 is a microstrip line,
3 is a solid-state oscillation element, 4 is a substrate, 5 is a spacer, 6 is a housing body, 11 is a housing lid, and 12 is a screw. The solid-state oscillation element 3 and the microstrip line 2 are formed on a substrate 4. A dielectric resonator 1 attached to a spacer 5 is coupled to a solid state oscillation element 3 via a microstrip line 2. The dielectric resonator 1 and the substrate 4 are mounted on a housing body 6 and sealed with a housing lid 11. The screw 12 is screwed through a screw hole provided in the ceiling of the housing lid 11.

In the conventional microwave oscillator configured as described above, the distance between the screw 12 and the dielectric resonator 1 is changed by changing the screwing amount of the screw 12 screwed into the ceiling of the housing lid 11. Adjust the oscillation frequency.

Problems to be Solved by the Invention However, in the above-described configuration, since there is a gap between the screw 12 and the tapped hole, it is easily affected by the humidity of the outside air. Also, what was being done to solve the problem of screws loosening due to vibration and changing the oscillation frequency?

In view of these points, it is an object of the present invention to provide a microwave oscillator in which a solid-state oscillation element and a dielectric resonator are completely sealed, and which is resistant to vibration and whose oscillation frequency can be adjusted.

Means for Solving the Problems The present invention mounts a dielectric oscillator formed of a dielectric resonator and a solid-state oscillation element in a housing body, seals the dielectric oscillator with an elastic cylinder inner lid, and closes the housing. At least a portion of the exterior of the internal lid is sealed with an outer housing lid, a space between the inner housing lid and the outer housing lid is filled with resin, and the pressure of the filled resin presses the ceiling part of the inner lid. This is a microwave oscillator characterized by being provided with a frequency adjustment mechanism.

Effect of the Invention With the above-described configuration, the position of the ceiling of the inner housing lid changes due to the pressure of the resin filled between the outer housing lid and the inner housing lid, and the relationship between the dielectric resonator and the ceiling of the housing inner lid changes. Since the distance changes, the oscillation frequency can be changed. Moreover, at this time, since the dielectric oscillator is completely sealed, it is not adversely affected by the humidity of the outside air. Additionally, since no screws are used, it exhibits stable characteristics against vibration.

Embodiment FIG. 1 shows a configuration diagram of a microwave oscillator in an embodiment of the present invention. Note that elements common to those in the conventional example are given the same numbers and explanations are omitted.

In Figure 1, 1 is a dielectric resonator, 2 is a micros)
IJ tube line, 3 is a solid-state oscillation element, 4 is a substrate, 5 is a spacer, 6 is a housing body, 7 is an inner lid of the housing, 8 is an outer lid of the housing,
9 is resin. The solid-state oscillation element 3 and the microstrip line 2 are formed on a substrate 4'', and the solid-state oscillation element 3 is coupled to the dielectric resonator 1 via the microstrip line 2. The dielectric resonator 1 and the substrate 4 attached to the spacer 5 are mounted on a housing body 6 and sealed with a housing inner lid 7 made of elastic metal. Furthermore, an outer housing lid 8 seals the outside of the inner housing lid 7, and a space between the inner housing lid 7 and the outer housing lid 8 is filled with resin 9.

In the microwave oscillator of this embodiment configured as described above, when the space between the inner case cover 7 and the outer case cover 8 is filled with resin 9, the inner case cover 7 presses against the ceiling part due to the pressure of the resin 9. oppressed. Since the housing inner lid 7 has elasticity, the position of the ceiling changes due to the pressure of the resin. Therefore,
The distance between the ceiling of M7 inside the housing and the dielectric resonator 1 changes,
Oscillation frequency changes.

As described above, according to this embodiment, since the oscillation circuit and the dielectric resonator are completely sealed, they are not adversely affected by the humidity of the outside air. Moreover, by changing the pressure of the resin filling the space between the inner lid and the outer lid of the housing, the oscillation frequency can be adjusted while maintaining the sealed state. Additionally, since it does not have moving parts such as screws, it exhibits stable characteristics against vibration.

In this embodiment, the housing body 6, the housing inner lid 7, and the housing outer lid 8
The structure of the resin 9 is as shown in FIGS. 2(a) and 2(b).
The configuration shown in (c) may also be used. (a) is a cross-sectional view of a microwave oscillator with a first different configuration; (b) is a cross-sectional view of a second microwave oscillator;
Cross-sectional view of a microwave oscillator with another configuration, (C)
is a sectional view of a microwave oscillator according to a third alternative configuration.

In FIG. 2(a), only the ceiling portion of the inner case cover 7 has elasticity, and the outer case cover 8 has a recess in a portion directly above the dielectric resonator 1. In FIG. In FIG. 2(b), the inner lid 7 of the casing has recessed portions on the outside of the portion directly above the dielectric resonator 1, and the bottoms of these four portions are thin and exhibit elasticity. Second
In Figure (C), only the ceiling portion of the inner case lid 7 has elasticity and does not come into direct contact with the outer case cover 8, but is surrounded by resin 9, which improves sealing reliability.

Furthermore, in this embodiment, the resin 9 is made of a material exhibiting thermal expansion characteristics that inversely compensates for the temperature characteristics of the dielectric resonator 1, thereby improving the temperature characteristics of the oscillator. Furthermore, in this embodiment, the resin 9 may be a thermosetting resin. In this case, by applying heat and curing the resin 9 after filling it, a robust casing can be realized. Further, the outer case cover 8 may be made of resin. In this case, the microwave oscillator can be made into 11Mff1, and furthermore, it becomes easy to seal the outer lid of the casing after filling the resin 9.

As described in the detailed description of the invention, according to the present invention, the oscillation circuit and dielectric resonator are completely sealed, so that they are not adversely affected by the humidity of the outside air. Furthermore, by changing the pressure of the resin filling the space between the inner lid and the outer lid of the housing, the oscillation frequency can be adjusted while maintaining the sealed state. Additionally, since it does not have moving parts such as screws, it exhibits stable characteristics against vibration.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a microwave oscillator according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a microwave oscillator according to another embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional microwave oscillator. It is. DESCRIPTION OF SYMBOLS 1... Dielectric resonator, 2... Microphone, loss strip line, 3... Solid state oscillation element, 4... Substrate, 5...
Spacer, 6... Housing body, 7... Housing inner lid, 8.
...Outside the casing/lid, 9...Resin. Name of agent: Patent attorney Toshio Nakao Hakaichi Meijyo
Ba

Claims (3)

[Claims] (1) A dielectric oscillator formed by a dielectric resonator and a solid-state oscillation element is mounted in a housing body, the dielectric oscillator is sealed with a housing inner lid made of an elastic conductor, and the outside of the housing inner lid is sealed. At least a portion of the housing is sealed with an outer lid, a space between the inner lid of the housing and the outer lid of the housing is filled with resin, and a frequency adjustment mechanism is provided that presses the ceiling of the inner lid with the pressure of the filled resin. A microwave oscillator characterized by: (2) The microwave oscillator according to claim 1, wherein the resin filling the space between the inner lid and the outer lid of the housing exhibits thermal expansion characteristics that inversely compensate for the temperature characteristics of the dielectric resonator. (3) The microwave oscillator according to claim 1, wherein the space between the inner lid of the housing and the outer lid of the housing is located only directly above the dielectric resonator.