JPH01308034A - Lead frame carrying device - Google Patents

Lead frame carrying device

Info

Publication number
JPH01308034A
JPH01308034A JP63139666A JP13966688A JPH01308034A JP H01308034 A JPH01308034 A JP H01308034A JP 63139666 A JP63139666 A JP 63139666A JP 13966688 A JP13966688 A JP 13966688A JP H01308034 A JPH01308034 A JP H01308034A
Authority
JP
Japan
Prior art keywords
lead frame
lead
pushers
lead frames
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63139666A
Other languages
Japanese (ja)
Inventor
Ryuichiro Mori
隆一郎 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63139666A priority Critical patent/JPH01308034A/en
Publication of JPH01308034A publication Critical patent/JPH01308034A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate adhesion of adjacent fellow lead frames and to prevent a simultaneously conveyance of a plurality of sheets of the lead frames by a method wherein pressing pieces, each recess-curved in the face to oppose, to the side end faces of the lead frame at the uppermost position of the stacked lead frames, are pressure-welded from both side directions in the longitudinal direction of the lead frame. CONSTITUTION:A separating device 11 is constituted of pushers 11b, each recess-curved in the face 11a to come into contact opposingly with each side end face 1a in the longitudinal direction of a lead frame 1, a pressing device (not shown in first and second diagrams), which is provided with the pushers to make to perform freely an advance and retreat motion and simultaneously pressure-welds horizontally the pushers. For separating the lead frame by the separating device of the above constitution, lead frames are first placed on a receiving stand 2a of an elevating device 2 a plurality of sheets and the lead frame placed at the uppermost position is made to ascend to a position to correspond to the pushers. Then, both pushers are made to abut on the lead frame and the lead frame is pressed and deflected from both side direction. At this time, as the recessed curved faces 11a are abutted on the lead frame, the adjacent lead frames are respectively changed their amounts of warpage and are forcibly separated. Accordingly, the simultaneous conveyance of a plurality of sheets of the lead frames is prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は複数枚積み重ねられたリードフレームを上部か
ら一枚ずつ搬送する取出し具を備えたリードフレーム移
載装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame transfer device equipped with a take-out tool for transporting a plurality of stacked lead frames one by one from above.

〔従来の技術〕[Conventional technology]

第３図は従来のこの種リードフレーム移載装置を示す側
面図で、同図において１はり一ドフレーム、２はこのリ
ードフレーム１を所定高さまで押し上げるための昇降装
置で、この昇降装置２は前記リードフレーム１を支持す
る受は台２＆に有し、この受は台２ａを連結棒２ｂを介
して昇降させる駆動装置（図示せず）を備えている。３
は前記リードフレーム１を受は台２ａ上の所定位置に保
つためのガイド板で、前記受は台２ａの両側方に配置さ
れている。４は受は台２ａ上のリードフレーム１を搬送
するための搬送装置で、リードフレーム１を吸着する吸
着ノズル４ａを有する吸着搬送具４ｂを備えている。ま
た、この吸着搬送具４ｂは、前記昇降装置に対して上方
から進退自在かつ後工程の加工装置（図示せず）等に対
して往復動自在に設けられている。FIG. 3 is a side view showing a conventional lead frame transfer device of this kind. In the same figure, 1 is a lead frame, 2 is a lifting device for lifting the lead frame 1 to a predetermined height; A support for supporting the lead frame 1 is provided on the stand 2&, and this support is equipped with a drive device (not shown) for raising and lowering the stand 2a via a connecting rod 2b. 3
1 is a guide plate for keeping the lead frame 1 at a predetermined position on the stand 2a, and the supports are arranged on both sides of the stand 2a. Reference numeral 4 denotes a conveyance device for conveying the lead frame 1 on the stand 2a, and includes a suction conveyance tool 4b having a suction nozzle 4a for suctioning the lead frame 1. Further, the suction conveyance tool 4b is provided so as to be able to move forward and backward from above with respect to the lifting device and to be able to move back and forth relative to a processing device (not shown) in a subsequent process.

このように昇降装置２．ガイド板３および搬送装置４と
から構成されたリードフレーム移載装置によってリード
フレーム１を移載させるには、先ずリードフレーム１を
昇降装置２の受は台２ａ上に複数枚載置させた状態で受
は台２ａを上昇させる。この際、リードフレーム１はガ
イド板３によつて整列されることになる。そして、複数
枚積み重ねられたリードフレーム１，１・・・・・のう
ち最上位のリードフレーム１がガイド板３の上縁より高
くなる位置まで上昇された際に受は台２ａ　ｆ停止させ
る。次いで、吸着搬送具４ｂを下降させ最上位のリード
フレーム１を吸着ノズル４ａに吸着させた後、この吸着
搬送具４ｂ’ｌ移動させてリードフレーム１を後工程の
加工装置等に移載させる。このようにして、リードフレ
ーム１が移載されることになる。In this way, the lifting device 2. In order to transfer the lead frame 1 using the lead frame transfer device composed of the guide plate 3 and the transfer device 4, first, a plurality of lead frames 1 are placed on the platform 2a of the lifting device 2. Then the receiver raises the platform 2a. At this time, the lead frame 1 is aligned by the guide plate 3. Then, when the uppermost lead frame 1 among the plurality of stacked lead frames 1 is raised to a position higher than the upper edge of the guide plate 3, the receiver is stopped on the stand 2a. Next, the suction conveyance tool 4b is lowered to suction the uppermost lead frame 1 to the suction nozzle 4a, and then the suction conveyance tool 4b'l is moved to transfer the lead frame 1 to a post-process processing device or the like. In this way, the lead frame 1 is transferred.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかるに、このように構成された従来のリードフレーム
移載装置においては、吸着搬送具４ｂでリードフレーム
１を搬送する際に、リードフレーム１の表面に施された
めつき等のために互いに隣り合うリードフレーム１どう
しが密層されていると、第４図に示すように複数枚同時
に搬送されてしまうという問題があった。However, in the conventional lead frame transfer device configured as described above, when the lead frame 1 is transported by the suction transport tool 4b, adjacent leads may be separated from each other due to the impingement or the like applied to the surface of the lead frame 1. When the frames 1 are stacked closely together, there is a problem in that a plurality of frames are conveyed at the same time, as shown in FIG.

〔課題を解決するための手段〕 本発明に係るリードフレーム移載装置は、槓み重ねられ
たリードフレームのうち最上位のリードフレームの側端
面に対向する凹曲面が形成された押圧片をリードフレー
ムの長手方向両側方から圧接させる分離装置を備えたも
のである。[Means for Solving the Problems] The lead frame transfer device according to the present invention leads a pressing piece having a concave curved surface facing the side end surface of the uppermost lead frame among stacked lead frames. It is equipped with a separation device that presses the frame from both sides in the longitudinal direction.

〔作用〕[Effect]

押圧片をリードフレームに圧接させることにより最上位
のリードフレームが撓み、このリードフレームとこのリ
ードフレームに隣接するリードフレームとが分離される
。By pressing the pressing piece against the lead frame, the uppermost lead frame is bent, and this lead frame and the lead frame adjacent to this lead frame are separated.

〔実施例〕〔Example〕

以丁、その構成等を図に示す実施例により詳細に説明す
る。The structure and the like will be explained in detail with reference to embodiments shown in the drawings.

第１図は本発明に係るリードフレーム移載装置〃を示す
側面図、第２図は本発明の分離装置によってリードフレ
ームを分離させている状態金示す側面図である。これら
の図において第３因で説明したものと同一もしくは同号
部材については同一符号を示し、ここにおいて詳細な説
明は省略する。FIG. 1 is a side view showing a lead frame transfer device according to the present invention, and FIG. 2 is a side view showing a state in which lead frames are separated by the separating device of the present invention. In these figures, the same reference numerals are given to the same members as those explained in the third factor, and the detailed explanation will be omitted here.

これらの図において、１１はリードフレーム１゜１を分
離させるだめの分離装置で、この分離装置１１はリード
フレーム１の長手方向側端面１ａと対接する凹曲面１１
ａが形成されたプッシャー１１ｂと、このプッシャー１
１ｂをリードフレーム１に対して進退自在に設けると共
に、水平に圧接させる加圧装置（図示せず）とから構成
されている。また、前記プッシャー１１ｂの凹曲面１１
＆は、所定の曲率半径ｔｔ、′にもって形成されており
、若干下側を指向するように、換言すればこの凹曲面１
１＆によって形成される円の中心が凹曲面１１＆の円周
方向中央部より下側に位置付けられるように形成されて
いる。さらにまた、このプッシャー１１ｂは、ガイド板
３の上方であってリードフレーム１の長手方向両側方と
対向する位置に、凹曲面ｔｔａをＩＪ　−ドフレーム１
の側端面１ａにそれぞれ対向させて配置されている。す
なわち、複数枚積み重ねられたリードフレームｉ　、ｌ
　＠ａｉｍ・のうち最上位のリードフレーム１がプッシ
ャー１１ｂ　、　１１ｂによって挾まれるようにして両
側方から押圧されることになる。In these figures, reference numeral 11 denotes a separation device for separating the lead frame 1. This separation device 11 has a concave curved surface 11 that is in contact with the longitudinal side end surface 1a of the lead frame 1.
pusher 11b formed with a and this pusher 1
The lead frame 1b is provided so as to be movable forward and backward with respect to the lead frame 1, and includes a pressure device (not shown) for horizontally pressing the lead frame 1b into contact with the lead frame 1. Further, the concave curved surface 11 of the pusher 11b
& is formed with a predetermined radius of curvature tt,', and is oriented slightly downward, in other words, this concave curved surface 1
The center of the circle formed by 1 & is positioned below the circumferential center of the concave curved surface 11 &. Furthermore, this pusher 11b has a concave curved surface tta at a position above the guide plate 3 and facing both sides of the lead frame 1 in the longitudinal direction.
are arranged to face the side end surfaces 1a of the. That is, a plurality of stacked lead frames i, l
The uppermost lead frame 1 of @aim is held between the pushers 11b and 11b and is pressed from both sides.

このように構成された分離装置１１によってリードフレ
ーム１を分離させるには、先ずリードフレーム１を昇降
装置２の受は台２ａ上に複数枚載置させた状態で受は台
２ａを上昇させる。そして、複数枚積み重ねられたリー
ドフレーム１．１・−−・のうち最上位のリードフレー
ム１がプッシャー１１ｂと対応する位置まで上昇された
際に受は台２ａを停止させる。次いで、両プツシ−ｒ’
−１１ｂ。In order to separate the lead frames 1 using the separating device 11 configured as described above, first, a plurality of lead frames 1 are placed on the stand 2a of the lifting device 2, and then the stand 2a is raised. Then, when the uppermost lead frame 1 among the plurality of stacked lead frames 1.1 is raised to a position corresponding to the pusher 11b, the receiver stops the stand 2a. Next, both pushies r'
-11b.

１１ｂ　ｔリードフレーム１に当接させ、リードフレー
ム１を両側方から押圧させて第２図に示すように撓ませ
る。この際、リードフレーム１には凹曲面ｌｌａが当接
するため、プッシャー１１ｂによって押圧されるリード
フレーム１，１・・・・・はそれぞれ反り量が変わるこ
とになり、強制的に分離されることになる。そして、プ
ッシャー１１ｂ　ｅ退行させ、吸着搬送具４ｂを下降さ
せ最上位のリードフレーム１を吸着ノズル４＆によって
搬−送することによってリードフレーム１が移載される
ことになる。この際、リードフレーム１を搬送するにあ
たり前記分離装置１１によって隣接するリードフレーム
どうしが分離されているため、吸着搬送具４ｂにはリー
ドフレーム１が一枚のみ吸着されることになる。11b T is brought into contact with the lead frame 1, and the lead frame 1 is pressed from both sides to bend it as shown in FIG. At this time, since the concave curved surface lla comes into contact with the lead frame 1, the amount of warpage of the lead frames 1, 1, . Become. Then, the lead frame 1 is transferred by retracting the pusher 11b, lowering the suction conveyance tool 4b, and conveying the uppermost lead frame 1 by the suction nozzle 4&. At this time, since adjacent lead frames are separated by the separation device 11 when transporting the lead frame 1, only one lead frame 1 is attracted to the suction transport tool 4b.

なお、本実施例ではリードフレーム１を搬送すせるため
に吸着搬送具４ｂを使用した例を示したが、リードフレ
ーム１を把持するクランプ搬送機構を備えたものでもよ
い。また、本実施例では複数枚積み重ねられたリードフ
レーム１を昇降装置２で押し上げる構造の移載装置を示
したが、このような限定にとられれることなく、例えば
分離装置１１と搬送装置４とをリードフレーム１の残量
に対応させて上下動させる構造としてもよい。Although this embodiment shows an example in which the suction conveyance tool 4b is used to convey the lead frame 1, it may be provided with a clamp conveyance mechanism for gripping the lead frame 1. Further, in this embodiment, a transfer device is shown in which a plurality of stacked lead frames 1 are pushed up by the lifting device 2, but without being limited to this, for example, the separating device 11 and the conveying device 4 can be It is also possible to have a structure in which the lead frame 1 is moved up and down in accordance with the remaining amount of the lead frame 1.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明のリードフレーム移載装置は
、積み重ねられたリードフレームのうち最上位のリード
フレームの側端面に対向する凹曲面が形成された押圧片
をリードフレームの長手方向両側方から圧接させる分離
＃Ｃ置を備えたため、押圧片をリードフレームに圧接さ
せることにより最上位のリードフレームが撓み、このリ
ードフレームとこのリードフレームに隣接するリードフ
レームとが分離されることになる。したがって、リード
フレームが複数枚同時に搬送されるようなことが防止さ
れるから、ジャム停止が防止され、装置の稼働率を向上
させることができる。As explained above, the lead frame transfer device of the present invention moves the pressing piece having a concave curved surface facing the side end face of the uppermost lead frame among the stacked lead frames from both sides in the longitudinal direction of the lead frame. Since the separation position #C for pressure contact is provided, the uppermost lead frame is bent by bringing the pressure piece into pressure contact with the lead frame, and this lead frame and the lead frame adjacent to this lead frame are separated. Therefore, since a plurality of lead frames are prevented from being conveyed at the same time, jam stoppage is prevented, and the operating rate of the apparatus can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係るリードフレーム移載装置を示す側
面図、第２図は本発明の分離装置によってリードフレー
ムを分離させている状態を示す側面図、第３図は従来の
リードフレーム移載装置を示す側面図、第４図はリード
フレームが複数枚搬送されている状態を示す側面図であ
る。 １・・・・リードフレーム、４ａ　・　・−・吸着ノズ
ル、４ｂ　・・・・吸着搬送具、１１ａ・・・・凹曲面
、１１ｂ・・・・プソシト−０ 代理人　　大　　岩　　増　　雄 塙１２ １　：　　リード７Ｖ−ム ４ａ：ｏ、駿籠ノス＋−レ ４ｂ：　　媛４搬り具 １１０：　　凹曲面 １１ｂ：７一ンイー ；２ニ ア３〕 Ａ４図FIG. 1 is a side view showing a lead frame transfer device according to the present invention, FIG. 2 is a side view showing lead frames being separated by the separation device of the present invention, and FIG. 3 is a side view showing a lead frame transfer device according to the present invention. FIG. 4 is a side view showing the mounting device, and FIG. 4 is a side view showing a state in which a plurality of lead frames are being conveyed. 1...Lead frame, 4a...Suction nozzle, 4b...Suction conveyor, 11a...Concave curved surface, 11b...Psocito-0 Agent Masu Oiwa 12 1 : Lead 7V-mu 4a: o, Sunkanosu+-re 4b: Hime 4 carrying tool 110: Concave curved surface 11b: 7 1 in; 2 near 3] A4 drawing

Claims (1)

【特許請求の範囲】[Claims] 　複数枚積み重ねられたリードフレームを上部から一枚
ずつ搬送する取出し具を備えたリードフレーム移載装置
において、前記積み重ねられたリードフレームのうち最
上位のリードフレームの側端面に対向する凹曲面が形成
された押圧片をリードフレームの長手方向両側方から圧
接させる分離装置を備えたことを特徴とするリードフレ
ーム移載装置。In a lead frame transfer device equipped with a take-out tool for transporting a plurality of stacked lead frames one by one from above, a concave curved surface is formed opposite to a side end surface of the uppermost lead frame among the stacked lead frames. What is claimed is: 1. A lead frame transfer device comprising a separation device that presses the pressed pieces from both sides in the longitudinal direction of the lead frame.
JP63139666A 1988-06-06 1988-06-06 Lead frame carrying device Pending JPH01308034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63139666A JPH01308034A (en) 1988-06-06 1988-06-06 Lead frame carrying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63139666A JPH01308034A (en) 1988-06-06 1988-06-06 Lead frame carrying device

Publications (1)

Publication Number Publication Date
JPH01308034A true JPH01308034A (en) 1989-12-12

Family

ID=15250591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63139666A Pending JPH01308034A (en) 1988-06-06 1988-06-06 Lead frame carrying device

Country Status (1)

Country Link
JP (1) JPH01308034A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229429A (en) * 1990-02-05 1991-10-11 Matsushita Electron Corp Lead-frame separator
US5288065A (en) * 1992-03-06 1994-02-22 De La Rue Giori S.A. Method for separating sheets of paper stacked in reams and device for implementing this method
US5941681A (en) * 1996-03-20 1999-08-24 Giesecke & Devrient Gmbh Apparatus for processing flat, flexible objects, for example plastic or paper cards
US6682065B2 (en) * 2000-02-08 2004-01-27 Meco Pak Aktiebolag Device for feeding objects piece by piece
EP1498352A1 (en) * 2002-03-14 2005-01-19 Alexei Borisovich Bogatyrev Device for pulling out packing material from a container in order to band a stack of bank notes
EP1260579B1 (en) * 2001-05-17 2010-07-07 Ab Biodisk Method for application of thin objects and package of the latter
US20110139582A1 (en) * 2009-12-15 2011-06-16 Xerox Corporation System and method for transporting variable-sized media
JP6191933B1 (en) * 2016-08-18 2017-09-06 日産スチール工業株式会社 Food pack takeout device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229429A (en) * 1990-02-05 1991-10-11 Matsushita Electron Corp Lead-frame separator
US5288065A (en) * 1992-03-06 1994-02-22 De La Rue Giori S.A. Method for separating sheets of paper stacked in reams and device for implementing this method
US5941681A (en) * 1996-03-20 1999-08-24 Giesecke & Devrient Gmbh Apparatus for processing flat, flexible objects, for example plastic or paper cards
US6682065B2 (en) * 2000-02-08 2004-01-27 Meco Pak Aktiebolag Device for feeding objects piece by piece
EP1260579B1 (en) * 2001-05-17 2010-07-07 Ab Biodisk Method for application of thin objects and package of the latter
EP1498352A1 (en) * 2002-03-14 2005-01-19 Alexei Borisovich Bogatyrev Device for pulling out packing material from a container in order to band a stack of bank notes
EP1498352A4 (en) * 2002-03-14 2006-07-05 Alexei Borisovich Bogatyrev Device for pulling out packing material from a container in order to band a stack of bank notes
US20110139582A1 (en) * 2009-12-15 2011-06-16 Xerox Corporation System and method for transporting variable-sized media
JP6191933B1 (en) * 2016-08-18 2017-09-06 日産スチール工業株式会社 Food pack takeout device

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