JPH01305589A - Working method for electrode wiring - Google Patents

Abstract

PURPOSE:To prevent connecting parts from being damaged and to increase the reliability after connected, by providing common electrode wiring in the peripheral part of an insulating substrate, and separating the common electrode wiring from a terminal section when the corner sections of the insulating substrate are cut. CONSTITUTION:The central part of the lower board of a TFT electrode board 1 is covered with the upper board of a common electrode board 2. Then, a short-circuiting electrode 3 forming the periphery of the board 1 is provided outside the board 1, and a gate electrode terminal 7 and a source electrode terminal 8 are short-circuited. Here, the reason why the common electrode wiring is provided in the peripheral part of the board 1 is because the board 2 covers the lower board of the board 1. In the case of working the electrode 3, the corners of an insulating substrate 6 are obliquely cut. At the same time, the electrode 3 being the common electrode wiring is cut off from a terminal section, and the electrode 7 and 8 are separated from each other. This method prevents the connecting parts from being damaged in the case of removing the electrode 3, and increases the reliability after connection.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrode processing method, and more particularly to a method for cutting and removing a common electrode wiring after its use, which is used as a countermeasure against static electricity or a disconnection defect.

[Prior Art] FIGS. 3(a) and 3(b) are plan and cross-sectional external views of a matrix liquid display device according to the present invention. Assembly is the third step
As shown in figure (b), T P T electrode substrate 1 and common electrode substrate 2
Assemble them with a certain gap between them, and seal the entire area with adhesive except for the injection hole where the liquid crystal will be filled. Next, fill the liquid crystal material through the injection hole, seal the injection hole, and attach a polarizing plate.
The LCD panel is completed. The detailed circuit inside the TPT electrode substrate 1 is as shown in FIG. Number 3 is a short circuit between the gate electrode 4 and the source electrode 5 provided on the outside of the TFT electrode substrate 1.
It is formed on the outer periphery of the F T electrode substrate 1.

Although only the four corners (four display elements) of the display section are shown in Figure 4, there are actually several hundred in total (enemy elements) in the vertical and horizontal directions, and their omitted parts are shown as dotted lines. is displayed. Generally, the TPT electrode substrate 1 is easily charged with static electricity during the ravinta process, but as shown in Fig. 3(a), the gate electrode and the source electrode are short-circuited at the terminal part, forming a short link 3, which can damage the TPT. It will not be done. Conventional processing methods for incorporating this liquid crystal display panel into a module are described in Japanese Patent Application Laid-Open No. 61-59475.
This is a method of opening by cutting the - dotted chain line portion in Figure (a).

[Problem to be solved by the invention]

The method of cutting the glass substrate with a dicing saw to open the link 3 in Show 1 of ``TFT Electrode Substrate 2'' requires cutting the TPT electrode substrate 1 for cutting, and the substrate size must be made thicker. Things that must not happen. Furthermore, there is a risk that chipping may occur at the cut portion during the cutting operation, and the substrate itself may be distorted, resulting in breakage during assembly. Furthermore, when the fine pitch connector is connected to the electrode terminal portion of the TFT electrode substrate 1, there is a risk that the fine pitch connector may contact the cut corner portion of the substrate and be damaged. There is also a method of removing the connecting portion of the short ring 3 of the TFT electrode substrate 1 by hole-etching, but the process becomes complicated in the final step, resulting in a loss of 1 to high.

The purpose of the present invention is to eliminate the margin for cutting the TPT electrode substrate when removing the TPT electrode substrate after the short electrode function has been completed, and to facilitate the work so that there is no damage during assembly due to cutting the substrate. .

[Means to solve the problem]

In order to open the short ring without taking the cut margin of the TPT electrode substrate, the present invention arranges a short ring around the TPT electrode substrate, and sets the corner part of the substrate at an angle of zero to the substrate surface.
Cut at -20° to 90°.

The cutting method is by using a tarinder, airbrushing, etc.

[Effect]

In the above cutting operation, the show milling around the top of the TPT electrode substrate is removed at the same time as the substrate is cut.

Therefore, the show 1-ring is cut off from the tip of each electrode terminal, and each terminal is separated.

〔Example〕

The present invention will be explained below using examples.

FIG. 1 shows a plan view of the Actidama 1-RIX liquid crystal display substrate 6 that requires processing of the short electrode 3. As shown in FIG. The configuration is such that the gate and source electrode terminals 7.8 on the surface of the active matrix TPT electrode substrate lower plate 1 are drawn out around the TFT electrode substrate 1, and each is connected to the short electrode 3 by a terminal connection electrode 9 to prevent electrostatic damage of the TPT. ing. Further, a color filter is formed on the upper plate of the common electrode substrate 2, and a liquid crystal is sealed between the second plate and the lower plate to constitute an active matrix display substrate 6.

In Figure 4, the central part of the lower plate of the TPT electrode substrate 1 is covered by the upper plate of the common electrode substrate 2, and the lower substrate covered by the common electrode substrate 2 is the same as the TPT electrode substrate described in Figure 4. It has the same element configuration as , and the source line and source line glue -l
- When forming the electrode 5, extend the source line and at the same time connect the short electrode 3 to the lead electrode of this source line by 'I' F.
A polysilicon film is formed on the outer periphery of the T-electrode substrate 1 surface, and then when forming the electrode and the lead wire of the wire 1 to the case 1, the wire 1 is extended and connected to the short electrode 3. After forming the short electrode 3 in this manner, the short electrode 3 is electrically grounded and a liquid crystal alignment process such as a rubbing method is performed to manufacture the liquid crystal.

Next, as shown in FIG. 2, the 7-trix type liquid crystal display substrate 6 is attached to an XY moving table 10 equipped with a substrate fixing mechanism such as vacuum suction. The corner portion of the board 6 is processed by T P
This is performed by setting an angle of 0=45° to the surface of the T-electrode substrate 6 and driving a motor 13 connected to a rotating shaft 12 of a rod-shaped grinder 1. The processing area extends from the outer periphery of the display substrate 6 to the dashed-dotted line in FIG.
is removed from the terminal connection electrode portion 9 of the goo 1 to electrode and source electrode terminals 7 and 8, and the gate electrode terminal 7 and source electrode terminal 8 are separated. The workability of an 800 mm thick aluminum electrode is that the line width of the gate and source electrode terminals 7 and 8 is 150 μm, while the terminal connection electrode 9 connects the short electrode.
With a line width of 157 zm, it is possible to completely eliminate the adhesion of shavings to the electrode.

FIG. 5 is a diagram illustrating a second embodiment of the present invention. T.P.
A first polycrystalline silicon film is formed on a T electrode substrate 1, and a gate oxide film is formed on the second polycrystalline silicon film. The first polycrystalline silicon constitutes the electrode line 14, and one side (left side)
The signal input terminals of are short-circuited to each other to form a common electrode 15.

On the other hand, one side (lower side) of the source electrode line 16 is also all short-circuited. This is to test for disconnection defects, so one electrode of the tester is connected to the common electrode 15, and the other electrode is sequentially contacted with the source or the non-shorted side of the electrode signal input terminal from Goo 1 to each signal line. It measures and inspects the resistance of The present invention is also useful when the common electrode 15 used in this manner is removed after use.

The processing area is the one-dot chain line A-A of the TPT electrode electrode substrate part.
', TPT electrode substrate surface and cutting angle 0-3 to B-B' part
This is a case where the substrate is shaved at 0°. As a result, common electrode 1
5 can be removed, the gate electrode line and the source electrode line are each opened, and the terminal portions can be independently separated, resulting in a trouble-free 7-trix substrate.

For active matrix display device assembly,
Embodiment] The connection between the source and gate electrode terminals 7 (8) formed on the TPT electrode substrate 1 in accordance with 1 and 2 and the connector 17 is as shown in the cross section of FIG. However, 1.8
．． 19 is a connector resin part and a connector solder part. As a feature of the present invention, there is no need to make the substrate size larger than necessary due to the cutting of the common electrode as described in the conventional method. Connector 1 glued to the terminal part on the board
7 is formed at a small constant angle, so that there is a margin even if the connector 17 is bent to some extent, and the connector does not form an extreme electrode at the corner of the TFT electrode substrate, thereby reducing damage such as wear of the connector.

Further, in FIG. 7, an example will be described in which a tapered chamfered portion 20 is provided at a corner portion of a substrate used as a substrate such as a TPT electrode substrate. A substrate 21 with chamfered corners on which short electrodes 3 are formed from the beginning of the manufacturing process is used, or short electrodes 3 are formed on the chamfered parts during the process. In this way, in the step of separating the electrode terminals 22, the amount of cutting of the glass substrate can be reduced and the work becomes easier.

Therefore, considering the present invention as a substrate, a substrate whose corner portions are chamfered in advance can be prepared as a product.

〔Effect of the invention〕

According to the present invention, the short ring connecting the terminals pulled out around the glass substrate can be easily separated and removed by simply scraping the edge portion around the glass substrate, and the short ring connecting the terminal pulled out around the glass substrate can be easily separated and removed. A comparable electrode substrate can be formed without providing a cutting margin in advance, and characteristics can be maintained even when an active matrix display or the like is incorporated. In addition, chamfering the edges of the glass substrate prevents cracks from entering the edges of the substrate during terminal bonding, etc., and reduces damage to fine pitch connectors that connect to electrode terminals on the glass substrate. , improve reliability after connection.

[Brief explanation of the drawing]

FIG. 1 is an explanatory plan view of the first embodiment of the present invention, FIG. 2 is an explanatory diagram of the method of processing a glass substrate according to the present invention, FIG. 3 is an explanatory diagram of the conventional method, and FIG. Element and wiring configuration diagram, FIG. 5 is a plan view of the second embodiment of the present invention, FIG. 6 is a connection diagram of the electrode terminal of the board and connector according to the present invention, and FIG. 7 is a detailed explanatory diagram of the present invention. It is. 1.TPT electrode substrate, 3. Short electrode, 7.Ge-l-
Electrode terminal, 8 Source electrode terminal, 9 ・Terminal connection electrode,
15... Common electrode, 20 Chamfered portion, 21II- =470-

Claims (11)

[Claims] 1. In a method of processing a common electrode wiring that connects terminals of circuits formed on an insulating substrate, the common electrode wiring is provided on the periphery of the insulating substrate, and when cutting a corner portion of the insulating substrate, the common electrode wiring is provided on the insulating substrate. An electrode wiring processing method characterized by removing the common electrode wiring from the terminal part and separating the terminal part. 2. The electrode wiring processing method according to item 1, characterized in that it is applied to a common electrode wiring removal method for electrostatic damage prevention and disconnection detection on an active matrix substrate as a common electrode wiring connecting terminal parts of circuits and the like. 3. An electrode wiring processing method according to item 1, characterized in that the processing inclination angle with respect to the substrate surface is 20° to 90°. 4. An electrode wiring processing method characterized in that a grinder is used as the processing means according to item 1. 5. An electrode wiring processing method characterized in that an airbrush sib is used as the processing means according to item 1. 6. A board characterized in that corner portions are chamfered to facilitate terminal division by removing the common electrode wiring as described in item 1. 7. A substrate characterized in that a short electrode is provided on the chamfered portion of the substrate according to item 6. 8. In the processing method of item 1, the rotary whetstone is positioned perpendicular to the side of the glass substrate, the whetstone axis is at an angle θ to the glass substrate surface, and the whetstone moves the substrate or the rotary whetstone parallel to the side of the substrate. A device characterized by cutting the corners of a board. 9. An apparatus characterized in that the corner cutting of the substrate according to item 8 is performed by airbrushing. 10. A small angle θ is provided between the processed corner portion of the active matrix display TFT electrode substrate etc. manufactured in accordance with item 1 and the connector bonded to the terminal portion on the electrode substrate, so that the connector wears out at the edge portion. An electrode substrate characterized by being difficult to clean. 11. 10. The electrode substrate according to item 10, wherein the edge portion of the substrate is chamfered to prevent cracks from forming during terminal bonding or the like.