JPH01302844A - Manufacture of package cover - Google Patents
Manufacture of package coverInfo
- Publication number
- JPH01302844A JPH01302844A JP13155988A JP13155988A JPH01302844A JP H01302844 A JPH01302844 A JP H01302844A JP 13155988 A JP13155988 A JP 13155988A JP 13155988 A JP13155988 A JP 13155988A JP H01302844 A JPH01302844 A JP H01302844A
- Authority
- JP
- Japan
- Prior art keywords
- bath
- plated
- nickel
- gold
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 36
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010931 gold Substances 0.000 claims abstract description 18
- 229910052737 gold Inorganic materials 0.000 claims abstract description 18
- 230000007935 neutral effect Effects 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 4
- 229910017709 Ni Co Inorganic materials 0.000 claims abstract description 3
- 229910003267 Ni-Co Inorganic materials 0.000 claims abstract description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 claims abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 9
- 239000007921 spray Substances 0.000 abstract description 5
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 3
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 101100390562 Mus musculus Fen1 gene Proteins 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 101100119953 Pyrococcus furiosus (strain ATCC 43587 / DSM 3638 / JCM 8422 / Vc1) fen gene Proteins 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半感体集積回路（ＩＣ）素子を収容するパンケ
ージに用いられるハーメチックシールカバーの製造方法
の改善に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a method of manufacturing a hermetic seal cover used in a pan cage housing a semi-sensitive integrated circuit (IC) device.
ＩＣ素子のパフケージの一種に多層セラミック基板を用
いるものがある。この基板は所定の導電回路を印刷した
グリーンシートを複数枚重ね合わせて焼成し、ＩＣパッ
ケージ用に成型したものであり、ＩＣ搭載用の窪みと、
該窪みの周囲にＩＣ素子上の電極とワイヤボンディング
される内部リードが露出して設けられており、外部リー
ドをろう付けした後露出金属部分に金メッキして使用に
供される。One type of puff cage for IC devices uses a multilayer ceramic substrate. This board is made by stacking and firing multiple green sheets printed with a predetermined conductive circuit and molding them into an IC package.
An internal lead wire-bonded to an electrode on the IC element is exposed around the recess, and after the external lead is brazed, the exposed metal portion is plated with gold for use.
このような多層セラミック基板を用いるパッケージの場
合、ＩＣ素子収容部を覆うカバーが必要で、通常Ｆｅ−
Ｎｉ合金、Ｆｅ Ｎｉ −Ｃｏ合金等の金属板にニッ
ケルを下地メッキし、その上に金メッキを施したものを
用いている。In the case of a package using such a multilayer ceramic substrate, a cover is required to cover the IC element accommodating part, and it is usually made of Fe-
A metal plate made of Ni alloy, Fe Ni -Co alloy, etc. is plated with nickel as a base plate, and then gold plated thereon.
ところが、従来のこの種のパッケージカバーは塩水噴霧
試験に対して極めて弱いのが通常である。However, conventional package covers of this type are usually extremely susceptible to salt spray tests.
そこで本発明の目的は塩水噴霧試験に対する抵抗が大で
、耐食性が良好でしかも耐熱性、ソルダビリティ−にも
優れたパッケージカバーを得ることにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to obtain a package cover that has high resistance to salt spray tests, good corrosion resistance, and excellent heat resistance and solderability.
上記目的を達成するため本発明の方法は、Ｆｅ −Ｎｉ
合金、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属製カバーの表面に
先ずスルファミン酸浴、次いでワット浴でニッケルをメ
ッキし、次に該ニッケルメッキ膜上に酸性浴次いで中性
浴にて金メッキを施す点に特徴がある。In order to achieve the above object, the method of the present invention provides Fe-Ni
The surface of a metal cover made of alloy, Fe-Ni-Co alloy, etc. is first plated with nickel in a sulfamic acid bath, then in a Watts bath, and then gold plating is applied on the nickel plating film in an acid bath and then a neutral bath. There are characteristics.
スルファミン酸ニッケル浴はＦｅ Ｎ１合金、Ｆｅ−
Ｎ１−Ｇｏ金合金の密着性が良く、表面の凹凸に対して
空洞を形成することなく均質なメッキ膜ができ、メッキ
膜の内部応力が小さく高速メッキが可能という長所があ
る。反面スルファミン酸浴によると浴成分中の硫黄が化
合物となってメッキ膜の結晶粒界に析出し易く、これが
耐食性を低下する一因となっている。このためスルファ
ミン酸浴は下地の第１層目に適している。この第１層目
のニッケルメッキ膜上には更にワット浴によりニッケル
メッキする。ワット浴はニッケルメッキ浴としては最も
一般的で安価であるが、内部応力が高く厚メッキには適
しない。しかし反面緻密なニッケルメッキ膜が得られる
ので、第２Ｎ目に適用すれば第１層目の耐食性の弱点を
補うことができる。Nickel sulfamate bath is FeN1 alloy, Fe-
The adhesion of the N1-Go gold alloy is good, a homogeneous plating film can be formed without forming cavities in response to surface irregularities, and the internal stress of the plating film is small, making high-speed plating possible. On the other hand, in the case of a sulfamic acid bath, the sulfur in the bath components becomes a compound and tends to precipitate at the grain boundaries of the plating film, which is a factor in reducing the corrosion resistance. For this reason, the sulfamic acid bath is suitable for the first layer of the base. This first layer of nickel plating film is further plated with nickel using a Watt bath. Watt bath is the most common and inexpensive nickel plating bath, but it has high internal stress and is not suitable for thick plating. However, since a dense nickel plating film can be obtained, if it is applied to the 2Nth layer, it can compensate for the weakness in the corrosion resistance of the first layer.
このようにして、ニッケルを２層メッキした後、更に金
を２層にメンキする。第２層のニッケルメッキ膜上には
先ず酸性浴で金メッキする。この浴は下地ニッケルメッ
キ層とのなじみが良く緻密で密着性の良好な金メッキ膜
が得られるからである。After plating two layers of nickel in this way, two more layers of gold are plated. The second layer of nickel plating film is first plated with gold in an acid bath. This is because this bath has good compatibility with the base nickel plating layer, and a dense gold plating film with good adhesion can be obtained.
しかしながらこの酸性浴による金メッキ膜のみでは４５
０℃程度の加熱で変色が生じる欠点がある。However, with only the gold plating film formed by this acidic bath, 45
It has the disadvantage that discoloration occurs when heated to about 0°C.
この欠点は更に第４Ｎとして中性浴による金メッキを施
すことにより解消できる。ニッケルメッキ膜上に直接中
性浴で金メッキする方法はニッケル膜との密着性を損う
上、中性メッキ浴中に下地ニッケルメッキから不純物が
混入し易く、再現性の良い金メッキ作業がしにくい。This drawback can be overcome by further applying gold plating in a neutral bath as the fourth N. The method of directly plating gold on a nickel plating film in a neutral bath impairs the adhesion with the nickel film, and impurities from the base nickel plating tend to get mixed into the neutral plating bath, making it difficult to perform gold plating with good reproducibility. .
厚さ０．２５ｍｍ、外形寸法１３ｍ角のコバール板に脱
脂処理、化学研磨を施し、スルファミン酸浴を用いて厚
さ３μｍのニッケルメッキを施し、次いでワット浴を用
いて３μｍのニッケルメッキを施した０次にこのニッケ
ルメッキ膜上に酸性浴を用いて０．５μｍの金メッキを
、更に中性浴により１．５μｍ厚の金メッキを施した。A Kovar plate with a thickness of 0.25 mm and an external dimension of 13 m square was subjected to degreasing treatment, chemical polishing, nickel plating to a thickness of 3 μm using a sulfamic acid bath, and then nickel plating to a thickness of 3 μm using a Watt bath. Next, on this nickel plating film, gold plating was applied to a thickness of 0.5 μm using an acidic bath, and then gold plating was applied to a thickness of 1.5 μm using a neutral bath.
メッキは何れもバレル型メッキ装置を用いた。用いたメ
ッキ浴の組成及びメッキ条件は次の通りである。A barrel-type plating device was used for all plating. The composition of the plating bath used and the plating conditions are as follows.
（イ）スルファミン酸ニッケルメッキ浴スルファミン酸
ニッケル６００ ｇ／ｊ！、塩化ニッケル１０ｇ／ｊ！
、硼酸４０ｇ／ｌ、ｐＨ４、浴温５０℃、電流密度０．
５ Ａ／ｄｍ”。(a) Nickel sulfamate plating bath Nickel sulfamate 600 g/j! , nickel chloride 10g/j!
, boric acid 40g/l, pH 4, bath temperature 50°C, current density 0.
5 A/dm”.
（ロ）ワット浴
硫酸ニッケル２４０ｇ／ｌ、塩化ニッケル４５ｇ／ｌ、
硼酸３０ ｇ／ｌ、 ｐＨ４゜５、浴温５０℃、電流密
度２Ａ／ｄｍ”。(b) Watt bath nickel sulfate 240g/l, nickel chloride 45g/l,
Boric acid 30 g/l, pH 4°5, bath temperature 50°C, current density 2A/dm".
（ハ）酸性金メッキ浴
シアン化合カリウム１０ｇ／ｌ、リン酸二水素カリウム
９６ｇ／Ｉｆ、クエン酸２４ｇ／ｌ ％ Ｃｏ添加剤０
．２ｇ／ｌＳｐ＋目、浴温４０℃、電流密度１．５Ａ／
＋１ｍ”。(c) Acidic gold plating bath Potassium cyanide 10g/l, Potassium dihydrogen phosphate 96g/If, Citric acid 24g/l % Co additive 0
．． 2g/lSp+ eyes, bath temperature 40℃, current density 1.5A/
+1m”.
（ニ）中性メッキ浴
シアン化金カリウム５ｇ／ｌ、クエン酸カリウム１５０
ｇ／ｌ、リン酸二水素ナトリウム１５ ｇ／ｌ、ｐｔｌ
？、浴温７０℃、電流密度ＬＡ／ｄｍ”。(d) Neutral plating bath Potassium gold cyanide 5g/l, Potassium citrate 150
g/l, sodium dihydrogen phosphate 15 g/l, ptl
? , bath temperature 70°C, current density LA/dm”.
上記のようにメンキしたパッケージカバー５個を塩水噴
霧試験槽に入れ、２４時間試験に供した。Five package covers that had been torn as described above were placed in a salt spray test tank and subjected to a 24 hour test.
試験後テストサンプルを清浄にし、乾燥後１０倍の実体
顕微鏡下でメッキ面の観察を行ない腐食状況を測定した
。又、市販のパッケージカバー５個についても比較のた
め同様の試験を行ない、腐食状況を測定した。測定結果
を第１表に示す。腐食状況は腐食発生面積率（％）で示
した。After the test, the test sample was cleaned, dried, and the plated surface was observed under a stereoscopic microscope with a magnification of 10 times to measure the state of corrosion. Further, similar tests were conducted on five commercially available package covers for comparison, and the corrosion status was measured. The measurement results are shown in Table 1. The corrosion status was expressed as the corrosion occurrence area ratio (%).
第１表
第１表から本発明法によるパッケージカバーが塩水噴霧
試験に対して強い抵抗力を持つことが良（分る。Table 1 From Table 1, it can be seen that the package cover made by the method of the present invention has good resistance to the salt spray test.
本発明により耐食性が格段に優れたパッケージカバーを
得ることができた。このカバーは耐熱性、ソルダビリテ
ィ−にも優れ、極めて信頼性の高いＩＣパッケージを構
成することができる。According to the present invention, it was possible to obtain a package cover with significantly excellent corrosion resistance. This cover has excellent heat resistance and solderability, and can constitute an extremely reliable IC package.
特許出願人 住友金属鉱山株式会社Patent applicant: Sumitomo Metal Mining Co., Ltd.
Claims (1)
製カバーの表面に先ずスルファミン酸浴、次いでワット
浴でニッケルをメッキし、次に該ニッケルメッキ膜上に
酸性浴次いで中性浴にて金メッキを施すことを特徴とす
るパッケージカバーの製造方法。(1) The surface of a metal cover made of Fe-Ni alloy, Fe-Ni-Co alloy, etc. is first plated with nickel in a sulfamic acid bath and then in a Watts bath, and then the nickel plating film is plated in an acid bath and then in a neutral bath. A method for manufacturing a package cover, characterized in that the package cover is plated with gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13155988A JPH01302844A (en) | 1988-05-31 | 1988-05-31 | Manufacture of package cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13155988A JPH01302844A (en) | 1988-05-31 | 1988-05-31 | Manufacture of package cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01302844A true JPH01302844A (en) | 1989-12-06 |
Family
ID=15060901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13155988A Pending JPH01302844A (en) | 1988-05-31 | 1988-05-31 | Manufacture of package cover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01302844A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5583379A (en) * | 1993-09-03 | 1996-12-10 | Ngk Spark Plug Co., Ltd. | Outer lead for a semiconductor IC package having individually annealed plated layers |
-
1988
- 1988-05-31 JP JP13155988A patent/JPH01302844A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5583379A (en) * | 1993-09-03 | 1996-12-10 | Ngk Spark Plug Co., Ltd. | Outer lead for a semiconductor IC package having individually annealed plated layers |
| US5668060A (en) * | 1993-09-03 | 1997-09-16 | Ngk Spark Plug Co., Ltd. | Outer lead for a semiconductor IC package and a method of fabricating the same |
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