JPH01301870A - Ion beam milling device - Google Patents

Abstract

PURPOSE:To prevent temp. rise in substrates by a simplified constitution by disposing spare chambers capable of evacuation on both sides of a treatment chamber, moving holders to move objects of working into the treatment chamber, and providing means of cooling the holders in the spare chambers, respectively. CONSTITUTION:Gate valves 4a, 4b are closed and the inside of a treatment chamber 1 is evacuated to high vacuum. A substrate 11 is placed on a stand 8a3 of a holder 8a in a spare chamber 3a and the inside of the spare chamber 3a is reduced to high vacuum. The gate valve 4a is opened and the holder 8a is turned and allowed to reach the treatment chamber 1, and an ion beam from an ion source 2 irradiates the substrate 11 ion milling treatment to the substrate 11 is executed. In a spare chamber 3b also, a substrate 11 is introduced and the inside of the chamber 3b is reduced to high vacuum. In the course of alternately repeated ion milling operations, cooling water via cooling water-introducing pipes 9a1, 9b1 is allowed to flow through the tubes inserted in the holders 8a, 8b, respectively, by which the substrates 11 placed on the stand 8a3 and a stand 8b3, respectively, are cooled. By this method, temp. rise in the substrates 11 can be inhibited and the breakage of the substrates 11 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ion beam milling apparatus that mills a workpiece using an ion beam.

[Prior Art] As is well known, an ion beam milling apparatus places a workpiece, such as a semiconductor substrate (hereinafter referred to as a substrate), in a high vacuum processing chamber, and irradiates the substrate with an ion beam from an ion source. This is a device that performs processing. In this type of apparatus, as a means for introducing a workpiece into a high-vacuum processing chamber, for example, the means described in Japanese Patent Application Laid-Open No. 59-208836 has been proposed. In this method, two independent preliminary chambers are installed, and a substrate inserted into one preliminary chamber is transported to the entrance of the processing chamber by a transport device, transferred to a transfer device inside the processing chamber, and then transferred to a transfer device inside the processing chamber. The material is transferred from the loading device to the electrode in the processing chamber and processed, and after the processing is completed, it is transferred to the transfer device, and then transferred from this transfer device to another transfer device, and by this transfer device. Transported to the other preliminary room. With such a configuration, processing within the processing chamber is executed.

[Problems to be Solved by the Invention] In general, in an ion beam milling apparatus, the substrate receives a very large amount of energy, and the temperature of the substrate increases significantly. Therefore, there is a possibility that the substrate may be damaged. Therefore, it is desirable to cool the substrate during processing. However, it is difficult to perform such cooling with the above-mentioned conventional apparatus, and even if some kind of cooling means is provided, the configuration will inevitably become extremely complicated.

The purpose of the present invention is to solve the problems in the above-mentioned prior art,
An object of the present invention is to provide an ion beam milling device capable of cooling a substrate with a simple configuration.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides an ion source that generates an ion beam and accelerates the ion beam, and a processing chamber in which a workpiece is processed using the ion beam. Ion beam milling is equipped with nine preliminary chambers arranged on both sides of this processing chamber that can be evacuated, and a valve device that maintains a high degree of vacuum and seals the gap between each of these preliminary chambers and the processing chamber. In the apparatus, a holder provided in each of the preparatory chambers for placing the workpiece and moving it between predetermined positions in the preparatory chamber and the processing chamber; and a cooling means provided in the holder for cooling the workpiece. It is characterized by having the following.

[Operation] A workpiece is placed on a holder in one of the preliminary chambers, and the preliminary chamber is evacuated. Next, the valve device is opened to open the space between the preliminary chamber and the processing chamber. Then, the holder is moved to position the workpiece at a predetermined position within the processing chamber. In this state, the workpiece is processed by the ion beam. During this processing, the workpiece is placed on a holder in the other preliminary chamber, and this preliminary chamber is evacuated.

When processing is completed, the holder is moved to position the workpiece in one of the preliminary chambers, the valve device between this preliminary chamber and the processing chamber is closed, and the preliminary chamber is opened to the atmosphere to complete the process. Take out the object.

During this time, when the evacuation of the other preliminary chamber is completed,
The valve device/device between the processing chamber and the processing chamber is opened, the holder is moved to position the workpiece at a predetermined position within the processing chamber, and processing is executed. Such operations are repeated alternately. During this operation, the holder is cooled by the cooling means, so
The workpiece placed on the holder is also cooled.

[Example] Hereinafter, the present invention will be explained based on illustrated embodiments.

1 and 2 are a plan sectional view and a front sectional view, respectively, of an ion beam milling apparatus according to an embodiment of the present invention. In each figure, 1 is a processing chamber in which a substrate is processed with an ion beam, and 2 is an ion source placed above the processing chamber 1. The ion source 2 includes a gas inlet 2g for introducing gas such as Ar, CF, etc., a filament 2f for ionizing the introduced gas, and a terminal 2t for the filament 2f.

2t, and an ion source electrode 2e that accelerates generated ions and emits them into the processing chamber 1 as an ion beam.

3a and 3b are preliminary chambers located on both sides of the processing chamber 1; 4a;
, 4b are gate valves provided between the processing chamber 1 and each preliminary chamber 3a, 3b, and 5a, 5b are opening/closing doors for opening and closing the preliminary chambers 3a, 3b and the outside. The above gate valves 4a, 4b
seals or opens the space between the processing chamber 1 and each preliminary chamber 3a, 3b by valve action. A vacuum exhaust port 6 evacuates the inside of the processing chamber 1 to a high degree of vacuum, and is connected to a vacuum exhaust device (not shown). 7a and 7b are preliminary rooms 3a,
This is a vacuum exhaust port for evacuating the inside of 3b to a high degree of vacuum, and is connected to a vacuum exhaust device, which is also not shown.

Reference numerals 8a and 8b are holders provided in each preparatory chamber, and have the function of placing a substrate thereon and moving it. Each holder 8a, 8b has a rotating shaft 8a1, 8b1, and this rotating shaft 8a.
□, arm 8a2°8b2 fixed to 8b□, and arm 8
Tables 8a, 8b fixed to a2 and 8b2 and on which the substrate is placed
, is composed of. In addition.

Although not shown, the holders 8a and 8b are equipped with a rotation mechanism and a tilting mechanism for rotating and tilting the substrate to suit processing. 9a and 9b are holders 8a and 8b
This is a holder cooling drive unit that rotates the holder and introduces cooling water. 9a1 and 9a2 are a cooling water introduction pipe and a cooling water discharge pipe, respectively, in the holder cooling drive section 9a, and 9b, 9b are a cooling water introduction pipe and a cooling water discharge pipe, respectively, in the holder cooling drive section 9b.

These cooling water inlet pipes and cooling water discharge pipes are connected to each holder 8a.
, 8b and reaches one unit 8a38b3. Incidentally, reference numerals 9a, 9b3 are cooling water rotation introduction/extraction mechanisms, and even if the holders 8a, 8b rotate, the cooling water can be supplied and discharged without any problem.

Since such a mechanism is well known, its explanation will be omitted. 1
Reference numerals 0a and 10b indicate gate valve operation units that open and close the gate valves 4a and 4b. 11 indicates a substrate.

Next, the operation of this embodiment will be explained. First, each gate valve 4a is operated by the gate valve operation parts 10a and 10b.

4b is closed to seal the processing chamber 1, and the inside of the processing chamber 1 is brought to a high vacuum through the vacuum exhaust port 6. Next, the opening/closing door 5a of the preliminary chamber 3a is opened, the substrate 11 is placed on the stand 8a3 of the holder 8a, and the opening/closing door 5a is closed.

Then, the inside of the preparatory chamber 3a is brought to a high degree of vacuum by the vacuum evacuation lower a. In this state, the gate valve operating section 10a is operated to open the gate valve 4a, but even if the gate valve 4a is opened, the vacuum in the processing chamber 1 is not broken. Next.

When the rotation axis 8a□ of the holder 8a is rotated by the holder drive unit 9a, the arm 8a25 and the stand 8a3 rotate around the rotation axis 8a□, and pass through the gate valve 4a which is in the open state to perform processing as shown by the broken line in the figure. It reaches a predetermined position in chamber 1 (the position where processing is performed by the ion beam) and stops. In this state, an ion beam is emitted from the ion source 4, and ion milling processing is performed.

During the above operation, in the preliminary chamber 3b, the opening/closing 1i5b is opened and the substrate 11 is placed on the stand 8b of the holder 8b, and the opening/closing i5b is closed and the vacuum evacuation lower b is used to bring the chamber to a high vacuum. The following operations are performed.

On the other hand, when the processing in the processing chamber 1 is completed, the holder 8a is rotated by the holder quick-acting part 9a, and the arm 8a and the stand 8a return to the position shown by the solid line in the figure. is closed, and the preliminary chamber 3a and the processing chamber 1 are cut off.Next, the preliminary chamber 3a is leaked to the atmosphere by a leak valve (not shown), and then opened/closed 7jii
5a is opened, the processed substrate 11 is removed, and a new substrate 1 is removed.
1 is placed on the stand 8a3. Then, the opening/closing door 5a is closed, and the interior of the preliminary chamber 3a is evacuated to a high degree of vacuum.

In the operation of taking out the processed substrate 11, the holder 8
After a is returned to the preliminary chamber 3a and the gate valve 4a is closed, the gate valve 4b is opened by the gate valve operation section 10b, the holder 8b is rotated by the holder drive section 9b, and the table 8
b is moved to the position indicated by the broken line in the figure. Next, the ion beam from the ion source 2 performs ion milling on the substrate on the table 8b. When this process is completed, the holder 8b returns to the preliminary chamber 3b, and the gate valve 4b
is closed, the preliminary chamber 3b is leaked to the atmosphere, the opening/closing door 5b is opened, and a new substrate 11 is placed on the stand 8a3. Ion milling is performed by repeating these operations alternately from face to face.

During the above operation, cooling water is supplied from the cooling water introduction pipes 9a0 and 9b□, and this cooling water is supplied to the holder 8a.

It flows through the tube inserted into the tube 8b, and the base 8a.

Pass near 8b□ and return, during this time holder 8a.

8b and a cooling water discharge pipe 9a after removing heat from the board.
It is discharged from 9b2. For this reason, the holders 8a and 8b are cooled, so that one holder 8a, 8b is cooled.

The substrate 11 placed on 8b is also cooled.

In this way, in this embodiment, preparatory chambers are arranged on both sides of the processing chamber, and a holder for setting the substrate is provided in each preparatory chamber, and cooling water is allowed to flow inside this holder. It is possible to suppress the temperature rise of the substrate, and as a result,
Damage to the board can be prevented. Furthermore, by opening and closing the gate valves between each preparatory chamber and the processing chamber, the holder in the preparatory chamber, which has a high degree of vacuum, is always rotated and returned to its original position to take substrates in and out of the processing chamber. can be maintained at a high degree of vacuum without being exposed to the atmosphere. As a result, it is possible to prevent the film adhering to the inner wall of the processing chamber from absorbing moisture, and even when the processing chamber is evacuated during the processing operation, the evacuation time can be extremely short. or,
Since the film can be prevented from absorbing moisture, there is no fear that the film will peel off due to moisture absorption and fall onto the substrate, and the occurrence of defective products can be suppressed. Furthermore, while the substrate placed in one holder is being processed, a new substrate can be set in the other holder, which reduces the time required to exhaust the processing chamber and reduces the overall processing time. It can be significantly shortened. Furthermore, in order to position the substrate at a predetermined position in the processing chamber, it is only necessary to rotate the holder, so that the means for moving the substrate can be simply configured.

In addition, in the description of the above embodiment, a holder for setting only one substrate was described, but a holder for setting a plurality of substrates may also be used. FIG. 3 is a partial plan view of such a holder, where 8a2 is an arm of the holder, and 8a3' is a base of the holder. Four substrates 11 can be placed on the bases 8a, ′, and in this case, the rotation mechanism provided in the holder described above rotates the bases 8a, ′ to sequentially position each substrate 11 at a predetermined position. can do. Furthermore, the holder is not limited to one that rotates, and may be any type of holder that can move the workpiece from the preliminary chamber to the processing chamber. moreover,
Cooling is not limited to cooling water, and any suitable medium such as gas can be used.

[Effects of the Invention] As described above, in the present invention, a preliminary chamber equipped with a holder is arranged on both sides of a processing chamber, and a cooling means is provided in the holder, so that temperature rise of the substrate can be suppressed with a simple configuration. damage to the substrate can be prevented. Moreover, by opening and closing the valves between each preparatory chamber and the processing chamber, the holder in the preparatory chamber on the side with a high degree of vacuum is always activated to take the workpieces in and out of the processing chamber. As a result, the processing chamber is not exposed to the atmosphere, which prevents the film adhering to the walls of the processing chamber from absorbing moisture, which in turn greatly shortens the exhaust time of the processing chamber. It is possible to prevent deterioration of the product by preventing peeling. Additionally, since the workpiece can be set in the holder in the other pre-chamber during processing in the processing chamber, this reduces the exhaust time of the processing chamber and significantly reduces the overall processing time. Can do 6

[Brief explanation of the drawing]

1 and 2 are a plan sectional view and a front sectional view, respectively, of an ion beam milling apparatus according to an embodiment of the present invention, and FIG. 3 is a plan view of a part of a holder. 1...Processing chamber, 2...Ion source, 3a
, 3b... Preparation room, 4a, 4b... Gate valve, 5a, 5b... Opening/closing door, 6, 7a, 7
b...Vacuum exhaust port, 8a, 8b...Holder, 9a, 9b...Holder cooling drive section, 9a
1, 9b,... Cooling water introduction pipe, 9a2, 9b,
......Cooling water discharge pipe, 9a3.9b,...
...Cooling water rotation lead-in/out mechanism, 11... Board. Figure 1: 1: Danger 2: Inogen 3a, 3b, 4th room 4a, 4b Kate valve 8a, 8b /II + Rec' 9a, 9b: Josekunra J excitement 9cn, 9b + Oki full XJ immigration 9a2, 9b2:,'/ThZIIAJIF birth 9a3
, 9b3: ;+#*Oo Ji Xi * Enter J [11:1 Uncle Fig. 2 Fig. 3

Claims (1)

[Claims] 1. An ion source that generates an ion beam and accelerates the ion beam, a processing chamber in which a workpiece is processed with the ion beam, and an ion source arranged on both sides of the processing chamber and capable of being evacuated. In the ion beam milling apparatus, the ion beam milling apparatus is equipped with a preparatory chamber and a valve device that maintains and seals a high degree of vacuum between each of the preparatory chambers and the processing chamber. An ion beam milling apparatus comprising: a holder for placing the ion beam and moving the holder between predetermined positions in the preparatory chamber and the processing chamber; and a cooling means provided in the holder for cooling the holder. 2. In claim 1, the holder includes a rotating shaft provided in the preliminary chamber, an arm attached to the rotating shaft, and an arm attached to the arm on which the workpiece is placed. An ion beam milling device comprising: 3. In claim 1, the cooling means:
An ion beam milling device characterized in that the ion beam milling device is a cooling pipe inserted into the holder.