JPH01301021A - End face cutting method and device for optical disc substrate - Google Patents

End face cutting method and device for optical disc substrate

Info

Publication number
JPH01301021A
JPH01301021A JP12981588A JP12981588A JPH01301021A JP H01301021 A JPH01301021 A JP H01301021A JP 12981588 A JP12981588 A JP 12981588A JP 12981588 A JP12981588 A JP 12981588A JP H01301021 A JPH01301021 A JP H01301021A
Authority
JP
Japan
Prior art keywords
substrate
optical disc
optical disk
disc substrate
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12981588A
Other languages
Japanese (ja)
Inventor
Tsutomu Itano
板野 勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP12981588A priority Critical patent/JPH01301021A/en
Publication of JPH01301021A publication Critical patent/JPH01301021A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve the yield of molded product by blasting fine powder through a nozzle to the inner and outer circumferential end sections of an optical disc substrate while rotating thereby deburring the substrate thereafter removing the dust through supersonic cleaning. CONSTITUTION:A burred optical disc substrate 201 is contained in a protective jig 111 except the inner and outer circumferential end sections and rotated with high speed through a motor 101. Then fine powder 103 having hardness equal to or slightly lower than that of the substrate is blasted, by means of a compressor 102, through a nozzle 112 to the end face of the substrate in order to deburr the substrate 302. Dust produced from the substrate 201 and used powder 103 are collected through a dust collector 105 and a suction unit 104 into a collection box 107. Thereafter, the optical disc substrate 201 is contained together with the protective jig 111 in a cleaning tank 108 and subjected to supersonic cleaning though a supersonic vibrator 109. By such arrangement the substrate can be deburred when it is shaped thus improving the yield remarkably.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、光ディスク基板の端面加工方法および装置、
特に、コンピュータの大容量記憶媒体として用いられる
つりある光ディスク媒体の製造方法および装置における
光ディスク基板の端面加工方法および装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention provides a method and apparatus for processing an end face of an optical disk substrate,
In particular, the present invention relates to a method and apparatus for processing the end face of an optical disk substrate in a method and apparatus for manufacturing a sized optical disk medium used as a large-capacity storage medium for computers.

〔従来の技術〕[Conventional technology]

従来の光ディスク基板の端面加工方法および装置は例が
なく、光ディスク基板の端面形状の改善の努力は主に成
形方法の改善に依存していた。
There are no conventional optical disc substrate end face processing methods and apparatuses, and efforts to improve the end face shape of optical disc substrates have mainly relied on improving the molding method.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、このような上述した従来の光ディスク媒
体の製造工程は、まず基板の成形を行ない、次に記録膜
の成膜を行なう。さらに貼り合わせを行なった後ハード
コートを行う。
However, in the above-described conventional manufacturing process of an optical disk medium, a substrate is first formed, and then a recording film is formed. After further bonding, a hard coat is applied.

このような光ディスク媒体の製造工程において、基板の
成形時に光ディスクの内外周の端面に僅かなバリが生ず
る。前述のように、このパリの発生をなくすように成形
方法の改善がなされているが現状の技術ではまだ完全に
これをなくすことはできていない。
In the manufacturing process of such an optical disk medium, slight burrs are generated on the inner and outer peripheral end surfaces of the optical disk during molding of the substrate. As mentioned above, improvements have been made to molding methods to eliminate the occurrence of this flaking, but the current technology has not yet been able to completely eliminate it.

このような光ディスク基板の内外周に生じたバリは折れ
易く、成膜工程以降の各工程における光ディスク基板の
ハンドリングの際に折れた物が記録面に付着して欠陥と
なり光ディスク媒体製造における歩留り低下の原因とな
っていた。
Such burrs formed on the inner and outer peripheries of the optical disk substrate are easily broken, and when the optical disk substrate is handled in each process after the film formation process, the broken objects adhere to the recording surface and become defects, resulting in a decrease in yield in the production of optical disk media. It was the cause.

具体的には、成膜時のゴミ付着は、付着した部分に成膜
されないため、記憶容量が減るだけでなく、大きい場合
にはフォーカスサーボやトラックサーボの誤動作を招き
重大な欠点となっていた。
Specifically, dust adhesion during film deposition not only reduces storage capacity because the film is not deposited on the adhered area, but if it is large, it can cause malfunctions of the focus servo and track servo, which is a serious drawback. .

さらに貼り合わせの際の貼り合わせ部分でのゴミ付着は
、貼り合わせた後での貼り合わせ強度を著しく低下させ
る原因となっていた。
Furthermore, the adhesion of dust at the bonded portion during bonding causes a significant decrease in bonding strength after bonding.

またハードコートの際に、コート面にゴミ付着があった
場合にはその部分が他の部分より厚く塗布されるためレ
ンズ効果を生じ、書き込みや読み取りの際のエラーの原
因となっていた。
Furthermore, if there is dust adhering to the coated surface during hard coating, the coating will be thicker on that area than on other areas, creating a lens effect and causing errors during writing and reading.

さらに、ハードコートの場合には、パリが折りでゴミと
ならない場合にも周辺部、特に外周側でハードコート面
側にパリが湾曲している場合には、外周付近でハードコ
ートの膜厚が厚くなりレンズ効果を生じる原因となって
いた。
Furthermore, in the case of hard coats, even if the edges do not become dust due to folding, the film thickness of the hard coat may decrease near the periphery, especially if the edges are curved toward the hard coat surface on the outer periphery. This caused the film to become thick and cause a lens effect.

このように、成形時に生じるパリは直接1間接に以後の
各工程に影響を及ぼし光ディスク媒体の製造において歩
留りを低下させる原因となっていた。また、このような
パリによるゴミは通常のゴミと異なり自から発生するも
のであるためクリーンルームのクラスを上げても対応し
きhない深刻な問題であった。
As described above, the particles generated during molding directly or indirectly affect subsequent steps, causing a decrease in yield in the production of optical disk media. In addition, unlike ordinary garbage, such garbage is generated by itself, so it is a serious problem that cannot be addressed even by upgrading the clean room class.

すなわち、従来の光ディスク基板の端面のパリの除去方
法では、光ディスク媒体の製造の歩留りを向上できない
という欠点があった。
In other words, the conventional method for removing pars from the end surface of an optical disk substrate has the disadvantage that it is not possible to improve the yield of manufacturing optical disk media.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の光ディスク基板の端面加工方法は、光ディスク
基板を回転させながら、該光ディスク基板の内外周の端
部にノズルから微粒粉体を吹きつけ加工する加工工程と
、吹きつけ加工により生じたゴミを超音波洗浄で除去す
る除去工程とを含んで構成される。
The method for processing the end face of an optical disk substrate of the present invention includes a processing step of spraying fine powder from a nozzle onto the inner and outer peripheral edges of the optical disk substrate while rotating the optical disk substrate, and removing dust generated by the blowing process. and a removal step of removing by ultrasonic cleaning.

また、本発明の光ディスク基板の端面加工装置は、光デ
ィスク基板の内外周の端部を除く他の部分を保護する手
段と、該光ディスク基板を回転させる駆動手段とノズル
から微粒粉体を噴射させる手段、超音波洗浄槽を含んで
構成される。
Further, the end face processing apparatus for an optical disk substrate of the present invention includes means for protecting other parts of the optical disk substrate except for the inner and outer peripheral edges, a driving means for rotating the optical disk substrate, and a means for injecting fine powder from a nozzle. , consists of an ultrasonic cleaning tank.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す概略図、第2図は第1
図に示す保護治具を含む一例を示す斜視図である。
FIG. 1 is a schematic diagram showing one embodiment of the present invention, and FIG. 2 is a schematic diagram showing an embodiment of the present invention.
FIG. 2 is a perspective view showing an example including the protective jig shown in the figure.

成形後の内外周にパリが生じた光°ディスク基板を、後
に詳述する保護治具110に治め、モーター101から
伝達系を経て前記保護治具110に治めた光ディスク基
板201を回転させている。
An optical disk substrate with cracks formed on the inner and outer circumferences after molding is held in a protection jig 110, which will be described in detail later, and an optical disk substrate 201 held in the protection jig 110 is rotated from a motor 101 via a transmission system. .

光ディスク基板201の場合、特に同一半径における全
周での形状および重量の均一性が重要であり、この観点
から端面加工時の均一性を考えた場合、回転速度は速い
方が望ましい。
In the case of the optical disk substrate 201, it is particularly important to have uniformity in shape and weight over the entire circumference at the same radius, and from this point of view when considering uniformity during end face processing, it is desirable that the rotation speed be high.

微小な粉流体を噴射するノズル111には、噴射圧力を
得るためのフンプレッサ102と微小な粉粒体103を
入れたホッパー104がそれぞれ接続されている。
A nozzle 111 for ejecting fine powder fluid is connected to a hump presser 102 for obtaining jetting pressure and a hopper 104 containing fine powder 103.

第1図に示す実施例ではノズル111は1個のみを記し
ているが2個のノズルがあれば内外周の端面を同時に加
工することができる。
In the embodiment shown in FIG. 1, only one nozzle 111 is shown, but if two nozzles are provided, the inner and outer peripheral end faces can be processed simultaneously.

また、粉粒体103の材質としては通常光ディスク基板
201としてPC(ポリカーボネイト)やPMMA (
アクリル)が使用されているため、これらの材質と同程
度若しくはそれ以下の硬度を持った物を用いる。   
 ゛ 端面加工後の粉粒体103および光ディスク基板201
から生じたゴミは集塵器105と吸引器106を通して
回収箱107に回収されている。
Further, the material of the powder 103 is usually PC (polycarbonate) or PMMA (
(Acrylic) is used, so a material with hardness comparable to or less than these materials should be used.
゛Powder material 103 and optical disk substrate 201 after edge processing
The generated garbage is collected into a collection box 107 through a dust collector 105 and a suction device 106.

このように、光デイ、スフ基板201を回転させながら
端面加工することにより、光ディスク基板201の端面
全周に渡って前述のパリを除去し均一な加工面が得られ
る。
In this way, by processing the end face while rotating the optical disc substrate 201, the above-mentioned pars can be removed over the entire circumference of the end face of the optical disc substrate 201, and a uniform processed surface can be obtained.

この場合のノズル111からの粉粒体103の噴射量、
噴射圧力、加工時間等は、光ディスク基板201の材質
、パリの程度によって実験的に決める。
In this case, the amount of powder and granular material 103 sprayed from the nozzle 111,
The injection pressure, processing time, etc. are determined experimentally depending on the material of the optical disc substrate 201 and the degree of paring.

次に、図中矢印で示したように、洗浄槽108.超音波
振動子109.電源110からなる超音波洗浄器により
研摩後の光ディスク基板201の超音波洗浄を行なう。
Next, as shown by the arrow in the figure, the cleaning tank 108. Ultrasonic transducer 109. The optical disk substrate 201 after polishing is subjected to ultrasonic cleaning using an ultrasonic cleaner including a power source 110.

なお、通常光ディスク媒体の製造は、クリーンルーム内
で行なわれるため上述の装置は隔壁で囲まれ一体化され
るとともに例えば噴射室、清掃室、予備室等のように必
要に応じて各種の室が設けられるが本発明で特に限定す
るものではない。
Since optical disk media are usually manufactured in a clean room, the above-mentioned equipment is surrounded by partition walls and integrated, and various rooms are provided as necessary, such as an ejection chamber, a cleaning room, a preliminary room, etc. However, it is not particularly limited in the present invention.

次に、前述の本発明に用いる保護治具の一例を第2図に
示す。
Next, FIG. 2 shows an example of the protective jig used in the above-mentioned present invention.

光ディスク基板201は上下の支持体202゜203に
より挟まれ、内外周の端面のみが露出している。上下の
支持体202,203の形状は、内外周の端部において
光ディスク基板201を支持する側に一定の幅で凸にな
っている。このため光ディスク基板201のグループ面
およびグルブ領域と反対側の面は、支持体202,20
3とは直接接触しないばかりでなく外部から隔離保護さ
れる。
The optical disk substrate 201 is sandwiched between upper and lower supports 202 and 203, and only the inner and outer peripheral end surfaces are exposed. The shapes of the upper and lower supports 202, 203 are convex with a constant width at the ends of the inner and outer peripheries toward the side that supports the optical disk substrate 201. Therefore, the group surface of the optical disk substrate 201 and the surface opposite to the groove area are provided with supports 202 and 20.
Not only does it not have direct contact with 3, it is isolated and protected from the outside.

上記一定幅の凸部はエツジとする場合や0リングを使用
する場合もある。
The convex portion having a constant width may be an edge or an O-ring.

前述の超音波洗浄を行なう際に、グループ面を直接洗浄
液と接触させないようにするためにはこの部分を0リン
グとし保護治具111に光ディスク基板201を治めた
まま洗浄する方法が有効である。
When performing the above-mentioned ultrasonic cleaning, in order to prevent the group surface from coming into direct contact with the cleaning liquid, it is effective to use an O-ring in this area and perform cleaning while the optical disc substrate 201 is held in the protective jig 111.

上下の支持体202,203にはそれぞれ中心軸固定腕
204,206を介して中心軸2’05゜207が取り
付けられている。中心軸205,207は光ディスク基
板201を回転させるための回転軸となるとともに、デ
ィスク内径と同程度の中空とすることにより、保護治具
111と光ディスク基板201との位置合わせに用いる
A central shaft 2'05° 207 is attached to the upper and lower supports 202, 203 via central shaft fixing arms 204, 206, respectively. The center shafts 205 and 207 serve as rotation axes for rotating the optical disc substrate 201, and are used for positioning the protection jig 111 and the optical disc substrate 201 by making them hollow to the same extent as the inner diameter of the disc.

また、上下の支持板202,203は上下の支持板固定
腕208,209とネジ210により互いに固定される
Further, the upper and lower support plates 202 and 203 are fixed to each other by upper and lower support plate fixing arms 208 and 209 and screws 210.

中心軸205,207の中空の部分は、内周端部の加工
のためのノズル111を挿入する場合にも利用される。
The hollow portions of the central shafts 205 and 207 are also used when inserting the nozzle 111 for processing the inner peripheral end.

このように、本発明に用いる保護治具111は光ディス
ク基板201を回転させながら端面加工ができ、しかも
グループ面を保護しながら超音波洗浄ができる。
In this way, the protection jig 111 used in the present invention can process the end face while rotating the optical disc substrate 201, and can perform ultrasonic cleaning while protecting the group face.

〔発明の効果〕〔Effect of the invention〕

本発明の光ディスク基板の端面加工方法および装置は、
光ディスク基板を回転させながら端面加工を行なうと同
時に、グループを有効に保護する保護手段を有し、しか
も超音波洗浄することにより、成形時のパリの除去が可
能となり歩留りを大幅に向上できるという効果がある。
The optical disc substrate end face processing method and apparatus of the present invention include:
While rotating the optical disk substrate while processing the end face, it also has a protective means that effectively protects the group, and ultrasonic cleaning makes it possible to remove debris during molding, greatly improving yield. There is.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の光ディスク媒体の端面加工装置の一実
施例を示す概略図、第2図は第1図に示す保護治具の一
例を含む斜視図である。 101・・・・・・モーター、102・・・・・・コン
プレッサ、103・・・・・・粉粒体、104・・・・
・・ホッパー、105・・・・・・集塵器、106・・
・・・・吸引器、107・・・・・・回収箱、108・
・・・・・洗浄槽、109・・・・・・超音波振動子、
110・・・・・・電源、111・・・・・・保護治具
、112・・・・・・ノズル、201・・・・・・光デ
ィスク基板、202゜203・・・・・・支持体、20
4,206・・・・・・中心軸固定腕、205,207
・・・・・・中心軸、208,209・・・・・・支持
体固定腕、210・・・・・・ネジ。 ゛代理人 弁理士  内 原   晋 万10
FIG. 1 is a schematic view showing an embodiment of the optical disk medium end face processing apparatus of the present invention, and FIG. 2 is a perspective view including an example of the protection jig shown in FIG. 1. 101... Motor, 102... Compressor, 103... Powder, 104...
...Hopper, 105... Dust collector, 106...
...Suction device, 107... Collection box, 108.
...Cleaning tank, 109...Ultrasonic vibrator,
110...Power supply, 111...Protective jig, 112...Nozzle, 201...Optical disc substrate, 202°203...Support , 20
4,206... Central axis fixed arm, 205,207
... Central shaft, 208, 209 ... Support fixing arm, 210 ... Screw.゛Representative Patent Attorney Shinman Uchihara 10

Claims (1)

【特許請求の範囲】 1、光ディスク基板を回転させながら内外周の端部にノ
ズルから微粒粉体を吹きつけ加工する加工工程と、前記
加工工程により生じたゴミを超音波洗浄で除去する除去
工程とを含むことを特徴とする光ディスク基板の端面加
工方法。 2、光ディスク基板の内外周の端部を除く他の部分を保
護する保護手段と、前記光ディスク基板を回転させる駆
動手段と、ノズルから微粒粉体を噴射させる噴射手段と
、超音波洗浄槽とを含むことを特徴とする光ディスク端
面加工装置。
[Claims] 1. A processing step in which fine powder is sprayed from a nozzle onto the inner and outer edges of the optical disk substrate while rotating it, and a removal step in which dust generated in the processing step is removed by ultrasonic cleaning. A method for processing an end face of an optical disk substrate, the method comprising: 2. A protection means for protecting other parts of the optical disc substrate except for the inner and outer peripheral edges, a driving means for rotating the optical disc substrate, an injection means for injecting fine powder from a nozzle, and an ultrasonic cleaning tank. An optical disc edge processing device comprising:
JP12981588A 1988-05-26 1988-05-26 End face cutting method and device for optical disc substrate Pending JPH01301021A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12981588A JPH01301021A (en) 1988-05-26 1988-05-26 End face cutting method and device for optical disc substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12981588A JPH01301021A (en) 1988-05-26 1988-05-26 End face cutting method and device for optical disc substrate

Publications (1)

Publication Number Publication Date
JPH01301021A true JPH01301021A (en) 1989-12-05

Family

ID=15018906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12981588A Pending JPH01301021A (en) 1988-05-26 1988-05-26 End face cutting method and device for optical disc substrate

Country Status (1)

Country Link
JP (1) JPH01301021A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05329825A (en) * 1992-05-29 1993-12-14 Hirade Seimitsu:Kk Method for removing flash
JP2007152477A (en) * 2005-12-02 2007-06-21 Mitsubishi Materials Corp Method of producing surface coated cutting insert
JP2020157426A (en) * 2019-03-27 2020-10-01 株式会社東京精密 Chamfering device with blast unit and chamfering method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05329825A (en) * 1992-05-29 1993-12-14 Hirade Seimitsu:Kk Method for removing flash
JP2007152477A (en) * 2005-12-02 2007-06-21 Mitsubishi Materials Corp Method of producing surface coated cutting insert
JP2020157426A (en) * 2019-03-27 2020-10-01 株式会社東京精密 Chamfering device with blast unit and chamfering method

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