JPH01300576A - Manufacture of superconducting element - Google Patents

Manufacture of superconducting element

Info

Publication number
JPH01300576A
JPH01300576A JP63131258A JP13125888A JPH01300576A JP H01300576 A JPH01300576 A JP H01300576A JP 63131258 A JP63131258 A JP 63131258A JP 13125888 A JP13125888 A JP 13125888A JP H01300576 A JPH01300576 A JP H01300576A
Authority
JP
Japan
Prior art keywords
superconducting
thin plate
superconducting thin
polishing
insulating plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63131258A
Other languages
Japanese (ja)
Inventor
Teruhiko Ienaga
照彦 家永
Masanobu Yoshisato
善里 順信
Takaaki Ikemachi
隆明 池町
Minoru Takai
高井 穣
Maruo Jinno
丸男 神野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP63131258A priority Critical patent/JPH01300576A/en
Publication of JPH01300576A publication Critical patent/JPH01300576A/en
Pending legal-status Critical Current

Links

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To provide a superconducting element having desired characteristics with good reproducibility by interposing a superconducting thin plate between insulating plates suitable for polishing, and polishing the superconducting thin plate simultaneously with the insulating plates into configurations as desired. CONSTITUTION:A superconducting thin film 11 is interposed between insulating plates 10 and 14 suitable for polishing, so that the superconducting thin plate 11 is polished into desired shape together with the insulating plates 10, 14. Thus, the superconducting thin plate 11 also can be worked with the same high working precision as the insulating plates 10 and 14, and a sensing section 15 of the superconducting element 11 can be worked with a high precision of the order of 1mum that is very close to the grain size of the superconducting material. In this manner, a superconducting element having characteristics as desired can be produced with high reproducibility.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は磁気センサーなどの超電導素子の製造方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method of manufacturing a superconducting element such as a magnetic sensor.

(ロ)従来の技術 最近、Y B a* Cus O、−δで代表される酸
化物超電導材料が出現し、超電導産業が活発化している
。その1つのテーマは磁気浮上車両、無損失電力伝送や
電力貯蔵などの電力分野であり、他のテーマとしては5
QUID素子や磁気センサーなどの各種の超寛導素子分
舒である。
(B) Prior Art Recently, oxide superconducting materials represented by YBa*CusO, -δ have appeared, and the superconductivity industry has become active. One of the themes is the power field such as magnetic levitation vehicles, lossless power transmission and power storage, and other themes include five
These are various superconducting elements such as QUID elements and magnetic sensors.

後者の一例として代表的な超電導磁気センサーを第7図
に示す、この図において、(1)はアルミナなどの絶縁
性基板、(2)は該基板(1)上に配置された超電導体
で、両端に幅広の電極部(3)(3)が、中央部には幅
狭のくびれ部(4)が設けられている。この超電導体(
2)の厚みは約10μm、くびれ部(4)の幅も約10
μmで、このくびれ部(4)は他の個所より結合状態が
不安定で磁気的な影響を受は易く、超電導磁気センサー
として機能する。
As an example of the latter, a typical superconducting magnetic sensor is shown in FIG. 7. In this figure, (1) is an insulating substrate such as alumina, (2) is a superconductor placed on the substrate (1), Wide electrode portions (3) (3) are provided at both ends, and a narrow constriction portion (4) is provided at the center. This superconductor (
The thickness of 2) is about 10 μm, and the width of the constriction part (4) is also about 10 μm.
μm, the constriction (4) has a more unstable bonding state than other parts and is more susceptible to magnetic influences, so it functions as a superconducting magnetic sensor.

(ハ)発明が解決しようとする課題 ところが超電導磁気センサーとして充分な機能を果たす
為には上記した形状の弱結合部は寸法的に大き過ぎ、感
度を上げるにはより結合状態の弱い結合部が必要である
。結合状態を弱いものとするには、弱結合部、即ちくび
れ部〈4)の断面積を小さいものとする方法が最も一般
的であるが、所定の精度で再現性良くくびれ部(4〉を
形成するには現在の加工方法では上記した寸法が限度で
、これより小さくすることは困難である。
(c) Problems to be solved by the invention However, the weak coupling part of the above shape is too large in size to perform a sufficient function as a superconducting magnetic sensor, and in order to increase the sensitivity, a weak coupling part with a weaker coupling state is required. is necessary. The most common way to weaken the bond is to reduce the cross-sectional area of the weak bond, that is, the constriction (4). Current processing methods are limited to the above-mentioned dimensions, and it is difficult to make the dimensions smaller than this.

(ニ)課題を解決するための手段 本発明はこのような課題を解決すべく為されたものであ
って、超電導薄板を研磨加工に適した絶縁性板体で挾み
込み、該両絶縁性、板体と同時に超電導薄板を所望の形
状に研磨加工するものである。
(d) Means for Solving the Problems The present invention has been made to solve such problems, and consists of sandwiching a superconducting thin plate between insulating plates suitable for polishing, , the superconducting thin plate is polished into a desired shape at the same time as the plate.

(ホ)作用 本発明に依れば、絶縁性板体の加工精度で超電導薄板が
加工でき、所望の特性の超電導素子を再現性良く製造す
ることができる。
(E) Function According to the present invention, a superconducting thin plate can be processed with the processing precision of an insulating plate, and a superconducting element with desired characteristics can be manufactured with good reproducibility.

(へ)実施例 本発明の第1の工程は、第1図に示す如く、研磨加工に
適した絶縁性基板、例えば結晶化ガラス基板(10)の
表面に超電導薄板(11)を少なくとも該ガラス基板(
10)の一つの端面に接した状態で接着するところにあ
る。この超電導薄板(11)としては、現在、製法が確
立されていて常に液体窒素温度(77K)以上の温度で
確実に超電導状態を示す、例えば、Y B am Cu
n Ot−δなどの希土類系のもの、或いはそれ以外の
例えばBi系の超電導材料などが用いられる。またこの
超電導薄板(11)の接着には、その超電導薄板(11
)の劣化温度より低い融点を有する低融点ガラス、例え
ば日本1気硝子(株)社製の’LS−0800,が用い
られる。
(F) Example As shown in FIG. 1, the first step of the present invention is to place a superconducting thin plate (11) on the surface of an insulating substrate suitable for polishing, for example, a crystallized glass substrate (10). substrate(
10) is to be bonded while in contact with one end face of. This superconducting thin plate (11) is made of YB am Cu, for example, which has an established manufacturing method and always exhibits a superconducting state at a temperature higher than the liquid nitrogen temperature (77K).
Rare earth materials such as n Ot-δ, or other superconducting materials such as Bi-based superconducting materials are used. In addition, the superconducting thin plate (11) is bonded to the superconducting thin plate (11).
) is used, such as 'LS-0800 manufactured by Nippon Ikki Glass Co., Ltd., which has a melting point lower than the deterioration temperature of the glass.

尚、この低融点ガラスの軟化点は353℃で、封着温度
は400℃であるので、ここで要求移れる条件を満たし
ている。
Incidentally, since the softening point of this low melting point glass is 353° C. and the sealing temperature is 400° C., the requirements can be met here.

この時結晶化ガラス基板(10)の厚みは05rmで1
〜21m角程度であり、また超電導薄板(10)は超電
導バルク体を内周刃加工機、或いはダイヤモンドワイヤ
カ7夕などを用いて100μLL1程度の厚みにスライ
スされたものである。
At this time, the thickness of the crystallized glass substrate (10) is 05rm and 1
The superconducting thin plate (10) is a superconducting bulk body sliced into a thickness of about 100 μLL1 using an internal blade processing machine or a diamond wire cutter.

第2の工程は、ガラス基板(10)に接着きれた超電導
薄板〈11〉を現在の加工精度の限度である10μm程
度の厚さにまで切削研磨すると同時に、その切削加工さ
れた超電導薄板(11)をレーザ加工法などを用いて所
望の形状にバターニングするところにある(第2図)、
ここで云う所望形状とは、超電導薄板(11)のガラス
基板(10)の端面に接した部分を頂点とし、その部分
に対してt流を供給するt流端子(12)(12)と同
部分の電位を検出する検出端子(13)(13)とが構
成移れる形状を云う。
The second step involves cutting and polishing the superconducting thin plate <11> that has been completely adhered to the glass substrate (10) to a thickness of about 10 μm, which is the limit of current processing accuracy, and at the same time cutting and polishing the superconducting thin plate <11> that has been cut. ) is patterned into the desired shape using a laser processing method (Figure 2).
The desired shape mentioned here is the same as the t-flow terminal (12) (12), which has the apex at the part of the superconducting thin plate (11) that is in contact with the end surface of the glass substrate (10), and supplies the t-flow to that part. This refers to a shape in which the configuration of the detection terminals (13) (13) for detecting the potential of the parts can be changed.

第3の工程は、第3図に示すように、所望形状にパター
ニングきれた超電導薄板(11)の上面の少なくとも、
ガラス基板〈10〉の端面に接した部分に該ガラス基板
(10)と同じく研磨加工に適した結晶化ガラス基板(
14)を先と同様に低融点ガラスを用いて接着し、少な
くとも超電導薄板(11)の頂点部分を研磨加工に適し
た結晶化ガラス基板(10)(14)で挾み込むところ
にある。
As shown in FIG. 3, the third step includes at least the upper surface of the superconducting thin plate (11) that has been patterned into a desired shape.
A crystallized glass substrate (10), which is suitable for polishing like the glass substrate (10), is placed in contact with the end surface of the glass substrate (10).
14) is adhered using low-melting glass as before, and at least the top portion of the superconducting thin plate (11) is sandwiched between crystallized glass substrates (10) and (14) suitable for polishing.

本発明の最終工程は、第4図に示すように結晶化ガラス
基板(10)(14)に依って挾み込まれた超電導薄板
(11)を両ガラス基板(10)(14)の研磨加工と
同時に研磨し、該超電導薄板(11)を所定のサイズに
設定するところにある。この研磨加工工程は本発明のポ
イントとなるところである。即ち、結晶化ガラスは研磨
加工に適した材料であるので、現在の技術では1μmオ
ーダの高精度で再現性良く加工できる。従ってこのよう
に結晶化ガラス基板(10)(14>に挾み込まれた超
電導薄板(11)もそれと同し精度で研磨加工される。
The final step of the present invention is to polish the superconducting thin plate (11) sandwiched between the crystallized glass substrates (10) and (14) by polishing both glass substrates (10) and (14) as shown in FIG. At the same time, the superconducting thin plate (11) is polished to a predetermined size. This polishing process is the key point of the present invention. That is, since crystallized glass is a material suitable for polishing, it can be processed with high precision on the order of 1 μm and with good reproducibility using current technology. Therefore, the superconducting thin plates (11) sandwiched between the crystallized glass substrates (10) (14>) are also polished with the same precision.

この最終工程に於ては、超電導薄板(11)のガラス基
板(10)の端面に接した頂点部分の幅を超電導素子の
センシング部分(15)として要求きれる2〜4μm程
度に設定している。この値は、超電導薄板(11)を構
成している超電導材料のダレインサイズに近イ以したも
のである。
In this final step, the width of the apex portion of the superconducting thin plate (11) in contact with the end surface of the glass substrate (10) is set to about 2 to 4 μm, which is sufficient for the sensing portion (15) of the superconducting element. This value is close to the diameter size of the superconducting material constituting the superconducting thin plate (11).

このようにして得られた超電導素子の両端の電流端子(
12)(12)から所定の値に設定いれたセンシング部
分(15)にt流を流し、中央の検出端子(13)(1
3)の電圧変化を検出することに依ってセンシング部分
(15)での磁界や赤外線の変化を検知するセンサーと
して動作する。
Current terminals (
12) Flow t current from (12) to the sensing part (15) set to a predetermined value, and connect the central detection terminal (13) (1
By detecting the voltage change in step 3), it operates as a sensor that detects changes in the magnetic field or infrared rays at the sensing portion (15).

第5図に本発明方法の他の実施例を示しており、最終工
程の研磨加工時にセンシング部分(15)に凹(16)
みを設けるものである。このような構成にすれば、例え
ばこの超電導素子を赤外線センサーに応用した場合、被
検出赤外線を導入する光ファイバーなどのガイドとして
の作用させることができる。
FIG. 5 shows another embodiment of the method of the present invention, in which a recess (16) is formed in the sensing portion (15) during the final polishing process.
The purpose of this is to provide additional benefits. With such a configuration, when this superconducting element is applied to an infrared sensor, for example, it can be made to act as a guide for an optical fiber or the like that introduces infrared rays to be detected.

第6図は本発明方法を更に発展きせて、類1導素子を集
積化した場合を示しており、各ガラス基板(10)・・
に複数の超電導薄板(11)・・・を形成すると同時に
、ガラス基板(10)・・・(14)・・・と超電導薄
板(11)  ・とを交互に積着することに依って、セ
ンシグ部分(15)・・・がマトリックス化きれた超電
導素子を得ることができる。
FIG. 6 shows a case in which the method of the present invention is further developed to integrate class 1 conductive elements, and each glass substrate (10)...
Sensing is achieved by forming a plurality of superconducting thin plates (11)... and at the same time alternately stacking glass substrates (10)...(14)... and superconducting thin plates (11)... A superconducting element in which the portions (15)... are formed into a matrix can be obtained.

(ト)発明の効果 本発明は以上の説明から明らかな如く、超電導薄板を研
磨加工に適した絶縁性板体で挾み込み、該両絶縁性板体
と同時に超電導薄板を所望の形状に研磨加工しているの
で、絶縁性板体の高い加工精度で超電導薄板が加工でき
る。従って超電導素子のセンシング部分を超電導材料の
ダレインサイズに近似した1μmオーダーの高精度で加
工でき、所望の特性の超電導素子を再現性良く製造する
ことができる。
(G) Effects of the Invention As is clear from the above description, the present invention involves sandwiching a superconducting thin plate between insulating plates suitable for polishing, and polishing the superconducting thin plate into a desired shape at the same time as both insulating plates. Because it is processed, superconducting thin plates can be processed with the high processing accuracy of insulating plates. Therefore, the sensing portion of the superconducting element can be processed with high accuracy on the order of 1 μm, which approximates the diameter size of the superconducting material, and a superconducting element with desired characteristics can be manufactured with good reproducibility.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第4図は本発明方法を工程順に示した斜視図、
第5図は本発明の他の実施例を示した斜視図、第6図は
本発明方法を更に発展許せた場合の斜視図、第7図は従
来構造を示した斜視図である。 (10)(14)   ・ガラス基板、(11)  ・
  超電導薄板、 (12)  −・・を流端子、 (13〉  ・・・検出端子、 (15)・・・・ ・センシング部分。
Figures 1 to 4 are perspective views showing the method of the present invention in the order of steps;
FIG. 5 is a perspective view showing another embodiment of the present invention, FIG. 6 is a perspective view of a case where the method of the present invention can be further developed, and FIG. 7 is a perspective view of a conventional structure. (10) (14) ・Glass substrate, (11) ・
Superconducting thin plate, (12) -... flow terminal, (13>... detection terminal, (15)... - sensing part.

Claims (1)

【特許請求の範囲】[Claims] (1)研磨加工に適した絶縁性基板表面に超電導薄板を
取り付け、その超電導薄板の上に研磨加工に適した絶縁
性上板を張り付け、両絶縁性板体に依って挾まれた超電
導薄板を該両絶縁性板体と同時に研磨加工して所望の形
状に設定することを特徴とした超電導素子の製造方法。
(1) A superconducting thin plate is attached to the surface of an insulating substrate suitable for polishing, an insulating upper plate suitable for polishing is pasted on top of the superconducting thin plate, and the superconducting thin plate sandwiched between the two insulating plates is A method for manufacturing a superconducting element, characterized in that both of the insulating plates are simultaneously polished and set into a desired shape.
JP63131258A 1988-05-27 1988-05-27 Manufacture of superconducting element Pending JPH01300576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63131258A JPH01300576A (en) 1988-05-27 1988-05-27 Manufacture of superconducting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63131258A JPH01300576A (en) 1988-05-27 1988-05-27 Manufacture of superconducting element

Publications (1)

Publication Number Publication Date
JPH01300576A true JPH01300576A (en) 1989-12-05

Family

ID=15053714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63131258A Pending JPH01300576A (en) 1988-05-27 1988-05-27 Manufacture of superconducting element

Country Status (1)

Country Link
JP (1) JPH01300576A (en)

Similar Documents

Publication Publication Date Title
US4016644A (en) Methods of fabricating low pressure silicon transducers
CA1317478C (en) Multisensor piezoelectric elements and a method for making the same
EP0244530A3 (en) Thin oxide fuse in an integrated circuit
US4009516A (en) Pyroelectric detector fabrication
EP0260673A3 (en) Active matrix element and method of manufacturing the same
US4542294A (en) Infrared detector and method of producing the same
JPS59186345A (en) Manufacture of semiconductor device
JPH01300576A (en) Manufacture of superconducting element
JP3296016B2 (en) Manufacturing method of semiconductor strain sensor
KR930002280B1 (en) Semiconductor circuit device contact system
JPH0437020A (en) Preparation of thermocompression bonding wafer
JPH0196548A (en) Sensor element
JPS61229342A (en) Connection for bump electrode
JPH06209140A (en) Manufacture of semiconductor laser
JPH01293581A (en) Manufacture of superconductive element
USH434H (en) Contacts to III-V semiconductors
JPH07113992A (en) Optical waveguide parts
JPH0543565U (en) Multi-beam semiconductor laser device
JPH0714069B2 (en) Method of manufacturing force conversion element
JP2974309B1 (en) Manufacturing method of liquid crystal display device
JPH0560268B2 (en)
JPS6356970A (en) Manufacture of josephson device
JPS63275155A (en) Manufacture of semiconductor device
JPS60256902A (en) Manufacture for magnetic head
JPS57153481A (en) Plane type josephson junction element and its manufacturing method