JPH01299837A - 積層板の製造方法 - Google Patents

積層板の製造方法

Info

Publication number
JPH01299837A
JPH01299837A JP12865888A JP12865888A JPH01299837A JP H01299837 A JPH01299837 A JP H01299837A JP 12865888 A JP12865888 A JP 12865888A JP 12865888 A JP12865888 A JP 12865888A JP H01299837 A JPH01299837 A JP H01299837A
Authority
JP
Japan
Prior art keywords
formula
laminate
molding
flame retardant
varnish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12865888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424373B2 (enExample
Inventor
Toshiharu Takada
高田 俊治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12865888A priority Critical patent/JPH01299837A/ja
Publication of JPH01299837A publication Critical patent/JPH01299837A/ja
Publication of JPH0424373B2 publication Critical patent/JPH0424373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP12865888A 1988-05-26 1988-05-26 積層板の製造方法 Granted JPH01299837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12865888A JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12865888A JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Publications (2)

Publication Number Publication Date
JPH01299837A true JPH01299837A (ja) 1989-12-04
JPH0424373B2 JPH0424373B2 (enExample) 1992-04-24

Family

ID=14990249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12865888A Granted JPH01299837A (ja) 1988-05-26 1988-05-26 積層板の製造方法

Country Status (1)

Country Link
JP (1) JPH01299837A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194211A (ja) * 2001-10-29 2002-07-10 Hitachi Chem Co Ltd 印刷配線板用樹脂組成物、ワニス、プリプレグ及びそれを用いた印刷配線板用積層板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7217423B2 (ja) * 2018-09-26 2023-02-03 パナソニックIpマネジメント株式会社 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194211A (ja) * 2001-10-29 2002-07-10 Hitachi Chem Co Ltd 印刷配線板用樹脂組成物、ワニス、プリプレグ及びそれを用いた印刷配線板用積層板

Also Published As

Publication number Publication date
JPH0424373B2 (enExample) 1992-04-24

Similar Documents

Publication Publication Date Title
EP0581314B1 (en) Modified dicyanate ester resins having enhanced fracture thoughness
CN101796132B (zh) 环氧树脂组合物、使用该环氧树脂组合物的半固化片、覆金属箔层压板以及印刷线路板
TW202142603A (zh) 印刷配線板用的樹脂組成物、帶樹脂層支撐體、預浸體、積層板、多層印刷配線板及其應用、毫米波雷達用印刷配線板
JP2004002653A (ja) プリント基板用プリプレグ及びその製造法とプリント基板
EP0449292B1 (en) Multilayer printed circuit board and production thereof
JP7155595B2 (ja) 樹脂組成物、樹脂フィルム、金属張積層板、プリント配線板及び半導体パッケージ
CN104760369A (zh) 一种含氟聚酰亚胺覆铜箔板及其制备方法
JPH01299837A (ja) 積層板の製造方法
US5206074A (en) Adhesives on polymide films and methods of preparing them
CN104844801B (zh) 一种含硅聚酰亚胺覆铜箔板及其制备方法
JPH0289634A (ja) 積層板用ガラス基材及び積層板
US20220339920A1 (en) Polyimide composite film for use in flexible metal clad substrate
WO2024043083A1 (ja) 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP2003238681A (ja) 樹脂組成物、プリプレグ及び積層板
JPH01299835A (ja) 積層板の製造方法
JPH10273532A (ja) 積層板用樹脂組成物、該組成物を用いたプリプレグ及び積層板
JP2004018615A (ja) 樹脂組成物、プリプレグ及び積層板
JPH02302446A (ja) プリプレグおよびそれを用いた配線基板
JPH0424372B2 (enExample)
JPH0288673A (ja) 積層板用樹脂組成物
JPH0424370B2 (enExample)
JP2003017820A (ja) 比誘電率安定化型プリント配線板材料及びその用途
JPH10273533A (ja) 印刷配線板用樹脂ワニス及びそれを用いたプリプレグ、金属張り積層板の製造方法
JPH0288674A (ja) 硬化性樹脂組成物
WO2024018946A1 (ja) 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板