JPH01298604A - Wiring material for substrate wiring and method for substrate wiring - Google Patents
Wiring material for substrate wiring and method for substrate wiringInfo
- Publication number
- JPH01298604A JPH01298604A JP12837488A JP12837488A JPH01298604A JP H01298604 A JPH01298604 A JP H01298604A JP 12837488 A JP12837488 A JP 12837488A JP 12837488 A JP12837488 A JP 12837488A JP H01298604 A JPH01298604 A JP H01298604A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- board
- substrate
- wiring material
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 title abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 239000000155 melt Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板配線用配線材および基板配線方法に関し
、特に、プリント配線基板、セラミック基板などの配線
基板上にワイヤー配線を行う場合に用いる基板配線用配
線材および基板配線方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a wiring material for board wiring and a board wiring method, and in particular, to a wiring material used for wiring on a wiring board such as a printed wiring board or a ceramic board. The present invention relates to a wiring material for board wiring and a board wiring method.
従来、電子部品を実装するプリント配線基板。 Traditionally, printed wiring boards are used to mount electronic components.
セラミック基板などの配線基板上において、配線基板中
に収容しきれない配線、後で付加する電子部品間の配線
、設計変更により後から補修する回路の配線などは、後
で必要な回路の配線をそれぞれワイヤーの配線材により
ワイヤー配線するようにしている。On a wiring board such as a ceramic board, wiring that cannot be accommodated in the wiring board, wiring between electronic components that will be added later, wiring of circuits that will be repaired later due to design changes, etc., must be replaced with the wiring that will be needed later. Each wire is wired using a wire wiring material.
このようなプリント配線基板におけるワイヤー配線の配
線方法に関しては、例えば、実開昭５４−１２４９６２
号公報、または特開昭６２−１９４６９７号公報に記載
されているような配線方法がある。Regarding the wiring method of wire wiring in such a printed wiring board, for example, Japanese Utility Model Application Publication No. 54-124962
There is a wiring method as described in Japanese Patent Application Laid-open No. 194697/1983.
ところで、プリント配線基板、セラミック基板の配線基
板上などにおいて、ワイヤー配線を行う場合に用いられ
る配線材は、配線基板が高密度化しているため、微細な
径の導電線材に絶縁被膜を被覆した構造の配線材が用い
られる。一般にワイヤー配線を行う配線材は、配線の作
業性が良く。By the way, the wiring materials used for wire wiring on printed wiring boards, ceramic substrates, etc. have a structure in which conductive wires with a fine diameter are coated with an insulating film because the wiring boards are becoming denser. wiring materials are used. Generally, wiring materials used for wire wiring have good wiring workability.
しかも特種な構造でなく、製造が容易なものが所望され
る。Moreover, it is desired that the structure is not special and that it is easy to manufacture.
配線の作業性をよくした配線方法として、前記した実開
昭５４−１２４９６２号公報に記載の配線方法がある。As a wiring method that improves the workability of wiring, there is a wiring method described in the above-mentioned Japanese Utility Model Application Publication No. 54-124962.
この配線方法は、配線基板上で配線した配線材の固定を
、格子状に配置したルートピンにより固定するようにし
た配線方法である。This wiring method is a wiring method in which wiring members wired on a wiring board are fixed using route pins arranged in a grid pattern.
この配線方法においては、ルートピンにより配線材を固
定しながら配線するようにしており、配線の作業性はよ
くなっているものの、特に配線した配線材の配線基板上
における特性インピーダンス等の電気的性能が配慮され
たものではなかった。In this wiring method, wiring is done while fixing the wiring material with a route pin, and although the workability of wiring is improved, the electrical performance such as the characteristic impedance of the wired wiring material on the wiring board is particularly poor. It wasn't something that was considered.
このため、配線基板上に行った配線は、特性インピーダ
ンス等の電気的性能が良好なものとはなっていない。For this reason, the wiring formed on the wiring board does not have good electrical performance such as characteristic impedance.
これに対して、配線基板上に行った配線の特性インピー
ダンス等の電気的性能を良好にするものとして、特開昭
６２−１９４６９７号公報に記載の配線方法がある。こ
の配線方法では、プリント基板上の配線される配線材を
グランドに接続された導電層と所定間隔で配線すること
により、他の配線に対する電気特性の影響を損なうこと
のない配線となるようにしている。すなわち、この配線
方法では、単線の配線材を張架するプリント基板の所定
面にグランドに接続された導電層を備え、絶縁被膜で被
覆した配線材を該導電層に沿って配線を行うことにより
、ツイストペア線、平行２芯線などの特殊な構造の配線
材を用いることなく、所定の電気的性能を得ている。配
線の特性インピーダンスは配線材と導電層との間隔によ
って定まるため、この配線方法では、配線基板に対して
一定間隔で配線材を固定する必要がある。しかし、配線
材により配線を行って、配線基板のグランド接続の導電
層に対して一定間隔を保った状態で配線材を固定するこ
とは、張架する配線材の長さが長い場合は困難となり、
配線材の浮きが生じて、配線材とグランド接続された配
線層との間隔が変動する。このため、この配線方法では
、張架する配線材の所定箇所に接着剤または溶剤を塗布
し。On the other hand, there is a wiring method described in JP-A-62-194697 that improves the electrical performance such as the characteristic impedance of the wiring formed on the wiring board. In this wiring method, the wiring material on the printed circuit board is connected to a conductive layer connected to the ground at a predetermined interval, so that the wiring does not affect the electrical characteristics of other wiring. There is. That is, in this wiring method, a conductive layer connected to the ground is provided on a predetermined surface of a printed circuit board on which a single wire wiring material is stretched, and the wiring material covered with an insulating film is routed along the conductive layer. , a predetermined electrical performance is obtained without using special wiring materials such as twisted pair wires or parallel two-core wires. Since the characteristic impedance of the wiring is determined by the distance between the wiring material and the conductive layer, in this wiring method, it is necessary to fix the wiring material to the wiring board at a constant interval. However, it is difficult to perform wiring using wiring material and fixing the wiring material while maintaining a constant distance from the conductive layer of the wiring board's ground connection when the length of the wiring material to be stretched is long. ,
The wiring material floats, and the distance between the wiring material and the ground-connected wiring layer fluctuates. Therefore, in this wiring method, adhesive or solvent is applied to predetermined locations of the wiring material to be stretched.
接着剤の硬化または絶縁被膜の溶着により、グランド接
続の配線層に固着するようにしている。溶剤による溶着
は、例えば、配線材の＃！緻被被覆ナイロン材で形成し
、溶剤としてアルコール液を塗布することにより、配線
材を覆う絶縁被膜を外側の一部を溶剤で溶かし、溶剤を
蒸発させて固着するようにしている。By curing the adhesive or welding the insulating film, it is fixed to the wiring layer for ground connection. Solvent welding can be used, for example, for #! of wiring materials. It is made of densely coated nylon material and is coated with an alcohol solution as a solvent, so that part of the outer part of the insulation coating covering the wiring material is dissolved with the solvent, and the solvent is evaporated and fixed.
しかし、張架する配線材の所定箇所に接着剤または溶剤
を塗布し、接着剤の硬化または絶縁被膜の溶着により、
配線材を配線基板に一定間隔で固着する配線方法は、接
着剤または溶剤の塗布がプリント配線基板の実装工程の
ワイヤー配線作業中の作業であり、−様に接着剤または
溶剤を塗布することは容易ではない。−様に接着剤また
は溶剤が塗布できないと、配線材が配線基板上から浮き
上がることがあり、配線材とグランド接続された配線層
との間隔が変動する。また、溶剤の塗布量が多くなると
絶縁被膜が極端に薄くなる場合があり、絶縁性能が悪く
なる。このように、配線材の浮きによる特性インピーダ
ンスが変動し、また、溶剤による溶着では絶縁性能が悪
くなる虞れがあり、所定の電気的性能が得られないとい
う問題点があった。However, by applying adhesive or solvent to predetermined locations of the wiring material to be stretched, and curing the adhesive or welding the insulation coating,
In the wiring method where wiring materials are fixed to the wiring board at regular intervals, the application of adhesive or solvent is done during the wire wiring work in the mounting process of the printed wiring board. It's not easy. - If the adhesive or solvent cannot be applied, the wiring material may be lifted off the wiring board, and the distance between the wiring material and the ground-connected wiring layer changes. Furthermore, if the amount of solvent applied increases, the insulation coating may become extremely thin, resulting in poor insulation performance. As described above, the characteristic impedance fluctuates due to the lifting of the wiring material, and there is a risk that insulation performance may deteriorate when welding with a solvent, resulting in problems in that predetermined electrical performance cannot be obtained.
本発明は、上記問題点を解決するためになされたもので
ある。The present invention has been made to solve the above problems.
本発明の目的は、配線作業が容易であり、所定の電気的
性能が得られる基板配線用配線材を提供することにある
。An object of the present invention is to provide a wiring material for board wiring that allows easy wiring work and provides a predetermined electrical performance.
本発明の他の目的は、配線作業が容易であり、所定の電
気的性能が得られる基板配線方法を提供することにある
。Another object of the present invention is to provide a board wiring method that allows easy wiring work and provides a predetermined electrical performance.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
上記目的を達成するため、本発明においては、基板配線
用配線材が、導電線材と、前記湛電線材を覆う被覆用絶
縁被膜と、前記被覆用絶縁被膜の外側を覆う被覆用絶縁
被膜より融点が低い固着用絶縁被膜とからなる構造とさ
れる。In order to achieve the above object, in the present invention, a wiring material for board wiring has a melting point higher than that of a conductive wire material, an insulating film for covering that covers the electric wire material, and an insulating film for covering that covers the outside of the insulating film for covering. It has a structure consisting of an insulating coating for adhesion with low resistance.
また、基板配線方法は、導電線材を覆う被覆用絶縁被膜
の外側に、融点が低い固着用絶縁被膜を被覆した構造の
基板配線用配線材により配線基板上の電気的接続点の間
のワイヤー配線を行い、配線した配線材を配線層えで配
線基板に押圧し、押圧と同時に、固着用絶縁被膜のみが
溶ける温度で固着用絶縁被膜のみを溶融させ、配線基板
上の電気的接続点の間の配線材を配線基板に固着するこ
とにより基板配線を行うことを特徴とする。In addition, in the board wiring method, wires are routed between electrical connection points on a wiring board using a board wiring wiring material having a structure in which a bonding insulating film with a low melting point is coated on the outside of a covering insulating film that covers a conductive wire material. Then, the wired wiring material is pressed against the wiring board using a wiring layer, and at the same time as the pressing, only the insulating film for adhesion is melted at a temperature that melts only the insulating film for adhesion, and the bonding insulating film is melted between the electrical connection points on the wiring board. The present invention is characterized in that board wiring is performed by fixing the wiring material to the wiring board.
前記手段によれば、基板配線用配線材は、導電線材を覆
う絶縁被膜が、内側の被覆用絶縁被膜と融点の低い外側
の固着用絶縁被膜との２層構造とされる。外側の固着用
絶縁被膜は、内側の被覆用絶縁被膜の融点より低いもの
とされているため、基板配線用配線材により配線を行い
、配線を行った配線材を配線材押えで配線基板に押圧す
ると同時に、熱源により固着用絶縁被膜のみが溶ける温
度で押圧部を加熱する。これにより、固着用絶縁被膜を
溶融させて、溶融と同時に線材を配線材押えで押圧して
固着する。この押圧し加熱する作業を、配線基板上で配
線して配線材上の数箇所または全ての箇所に渡って行っ
て、配線材を基板に固着する。According to the above means, in the wiring material for board wiring, the insulating coating covering the conductive wire has a two-layer structure of an inner coating insulating coating and an outer fixing insulating coating having a low melting point. The melting point of the outer insulating film for adhesion is said to be lower than that of the inner insulating film for covering, so wiring is performed using a wiring material for board wiring, and the wired wiring material is pressed onto the wiring board using a wiring material presser. At the same time, the pressing part is heated by a heat source to a temperature at which only the fixing insulating coating melts. As a result, the fixing insulating coating is melted, and at the same time as it is melted, the wire is pressed by the wiring material presser and fixed. This pressing and heating operation is performed over several or all locations on the wiring material by wiring on the wiring board, thereby fixing the wiring material to the board.
このようにして、配線基板上の配線を行うことにより、
配線材の浮きが生ずることはない、ここでの配線基板上
に配線材を固着する作業は、配線した配線材を押圧して
加熱するだけなので、簡単な作業工程により行うことが
できる。更に配線材を加熱して固着する場合においても
、溶融するのは外側の固着用絶縁被膜だけなので、配線
した配線材の絶縁性能が低下することはない、さらに配
線した配線材は、配線基板上で一定間隔を保って固着で
きるので、配線材の特性インピーダンスを配線基板の特
性インピーダンスにマツチングさせるようにすることが
できる。これにより、絶縁性能、特性インピーダンス等
の所定の電気的性能を有する配線基板上の配線を１作業
性よく行うことができる。By performing wiring on the wiring board in this way,
The work of fixing the wiring material on the wiring board without causing any lifting of the wiring material can be accomplished by a simple work process, since the wired wiring material is simply pressed and heated. Furthermore, even when the wiring material is heated and fixed, only the outer adhesion insulating coating melts, so the insulation performance of the wired wiring material does not deteriorate. Since the wires can be fixed at regular intervals, the characteristic impedance of the wiring material can be matched to the characteristic impedance of the wiring board. Thereby, wiring on a wiring board having predetermined electrical performance such as insulation performance and characteristic impedance can be easily performed in one work.
以下、本発明の一実施例を図面を用いて具体的に説明す
る。Hereinafter, one embodiment of the present invention will be specifically described using the drawings.
なお、実施例を説明するための全回において、同一要素
であるものは同一符号を付け、その繰り返しの説明は省
略する。In all the explanations of the embodiments, the same elements are given the same reference numerals, and repeated explanations thereof will be omitted.
第１ａ図は１本発明の一実施例にかかる基板配線用配線
材を配線基板上に配線した固着前の状態の断面図であり
、第１ｂ図は、基板配線用配線材を配線基板上に配線し
た後に加熱して配線基板に固着した状態の断面図である
。FIG. 1a is a cross-sectional view of the wiring material for board wiring according to an embodiment of the present invention before it is fixed on the wiring board, and FIG. FIG. 3 is a cross-sectional view of a state in which the wire is wired and then heated and fixed to the wiring board.
第２図は、本発明の他の実施例にかかる基板配線用配線
材を配線した状態の断面図であり、配線基板内にグラン
ド配線部層を設けて、配線材の特性インピーダンスを低
くする場合の実施例である。FIG. 2 is a cross-sectional view of a wiring material for board wiring according to another embodiment of the present invention, in which a ground wiring layer is provided in the wiring board to lower the characteristic impedance of the wiring material. This is an example.
第３図は、本発明の別の他の実施例にかかる基板配線用
配線材を配線した状態の断面図である。FIG. 3 is a sectional view of a state in which a wiring material for board wiring according to another embodiment of the present invention is wired.
第３図に示す実施例は、第２図に示す実施例と同様に、
配線材の特性インピーダンスを低くする場合の実施例で
あるが、この場合は配線基板の上にグランド配線部層を
設けて、配線材の特性インピーダンスを低くした場合の
実施例である。The embodiment shown in FIG. 3 is similar to the embodiment shown in FIG.
This is an example in which the characteristic impedance of the wiring material is lowered, and in this case, a ground wiring layer is provided on the wiring board to lower the characteristic impedance of the wiring material.
第１ａ図、第１ｂ図、第２図、および第３図において、
４は熱源、１０は基板配線用配線材、１１は導電線材、
１２は被覆用絶縁被膜、１３は加熱される前の固着用絶
縁被膜である。また、１４は配線基板である。１３ａは
熱源４からの加熱により配線が固着された状態の固着用
絶縁被膜、１５はグランド配線層である。第１ａ図に示
されるように、基板配線用配線材１０は、導電線材１１
と、導電線材１１を覆う被覆用絶縁被膜１２と、被覆用
絶縁被膜１２の外側を覆う融点が低い固着用絶縁被膜１
３とからなる構造になっている。被覆用絶縁被膜１２と
しては、例えば、高融点のポリイミドを用い、固着用絶
縁被膜１３としては１例えば、低融点のポリイミドを用
いる。この基板配線用配線材１０を用いて配線基板にお
いてワイヤー配線を行い、配線基板１４上に配設した後
（第１ａ図）、基板配線用配線材１０を押圧して、熱源
４により加熱すると、外側の固着用絶縁被膜１３が溶融
して、第１ｂ図のような状態となって、配線材が配線基
板１４に固着される。In Figures 1a, 1b, 2, and 3,
4 is a heat source, 10 is a wiring material for board wiring, 11 is a conductive wire material,
12 is an insulating coating for coating, and 13 is an insulating coating for fixing before being heated. Further, 14 is a wiring board. 13a is an insulating coating for fixing the wiring to which it is fixed by heating from the heat source 4, and 15 is a ground wiring layer. As shown in FIG. 1a, the wiring material 10 for board wiring includes a conductive wire material 11
, a covering insulating film 12 that covers the conductive wire 11 , and a fixing insulating film 1 with a low melting point that covers the outside of the covering insulating film 12 .
It has a structure consisting of 3. The covering insulating film 12 is made of, for example, high melting point polyimide, and the fixing insulating film 13 is made of, for example, low melting point polyimide. Wire wiring is performed on the wiring board using this wiring material 10 for board wiring, and after disposing it on the wiring board 14 (FIG. 1a), the wiring material 10 for board wiring is pressed and heated by the heat source 4. The outer fixing insulating film 13 is melted into a state as shown in FIG. 1b, and the wiring material is fixed to the wiring board 14.
このようにして、配線基板１４に配線材を固着して配線
を行う場合に、配線材の特性インピーダンスを低くした
配線とするには、第２図に示すように、配線基板１４の
中にグランド配線層１５を設ける構造とする。また、第
３図に示すように、配線基板１４の上部にグランド配線
層１５を設けた構造の配線基板１４として、配線材の特
性インピーダンスが低くなるようにする。In this way, when wiring is performed by fixing the wiring material to the wiring board 14, in order to achieve wiring with a low characteristic impedance of the wiring material, as shown in FIG. The structure is such that a wiring layer 15 is provided. Further, as shown in FIG. 3, the wiring board 14 has a structure in which a ground wiring layer 15 is provided on the top of the wiring board 14, so that the characteristic impedance of the wiring material is low.
第４図は１本発明の一実施例にかかる基板配線用配線材
を用いて配線基板上に配線した後に加熱して配線材を配
線基板に固着する基板配線方法を説明する図である。第
４図を参照して、セラミック基板において補修配線を行
う場合の基板配線方法を説明する。基板配線用配線材で
ある補修線ｌは、・まず、その先端１ａが補修バッド２
にボンディングされる。次に配線基板上に沿って補修線
１を配設して、補修線１を配線層え５で押圧しながら、
収束した熱源４により補修線１を順次に局部的に加熱す
る。ここでの収束した熱源４としては、例えば、レーザ
光、赤外線をレンズにより収束し。FIG. 4 is a diagram illustrating a substrate wiring method in which a wiring material for substrate wiring according to an embodiment of the present invention is used to wire on a wiring board and then heated to fix the wiring material to the wiring board. Referring to FIG. 4, a substrate wiring method for performing repair wiring on a ceramic substrate will be described. The repair wire l, which is a wiring material for board wiring, - First, its tip 1a is connected to the repair pad 2.
is bonded to. Next, arrange the repair line 1 along the wiring board, and while pressing the repair line 1 with the wiring layer 5,
The repair wire 1 is successively locally heated by the converged heat source 4. As the converged heat source 4 here, for example, laser light or infrared light is converged by a lens.
また、熱風をノズルにより収束して用いる。加熱温度は
被覆用絶縁被膜１２の融点より低く、固着用絶縁被膜１
３の融点より高くなるようにする。これにより、固着用
絶縁被膜１３のみが溶は出して、補修線１とセラミック
基板の間を埋めて、補修線１がセラミック基板に固着さ
れることになる。この配線層え５により押圧して収束し
た熱ｇ４により加熱して固着する箇所は、所定の間隔を
あけて行えば良いが、固着をより完全なものにするには
。In addition, hot air is converged by a nozzle and used. The heating temperature is lower than the melting point of the covering insulating film 12, and the fixing insulating film 1
The melting point of No. 3 should be higher than that of No. 3. As a result, only the fixing insulating coating 13 melts out, filling the space between the repair wire 1 and the ceramic substrate, and fixing the repair wire 1 to the ceramic substrate. The parts to be heated and fixed by the heat g4 converged by pressing with this wiring layer 5 may be spaced at a predetermined interval, but in order to make the fixing more complete.
配線層え５により押圧し加熱する箇所を増やす。The number of places to be pressed and heated is increased by the wiring layer 5.
第５図は、固着用被膜強度と被膜膜厚の関係を示した図
である。固着後の補修線１を配線基板からはがし、再度
加熱し押圧して固着するような場合を考えると絶縁被膜
の被膜膜厚は、固着被膜強度がワイヤー強度に等しいと
きの臨界膜厚ＴＣ２より小さくする必要がある。膜厚が
Ｔｅ３より小さければ補修線１を配線基板からはがす際
に導電線材が断線することがない、また、被膜膜厚は、
固着被膜強度がルーティングする時の強度に等しい臨界
膜厚ＴＣＩより大きくする必要がある。膜厚がＴＣＩよ
り大きければ、ルーティング中に補修線１が配線基板か
らはがれることはない、したがって、ここでの基板配線
用配線材である補修線の絶縁被膜の被膜膜厚は、固着被
膜強度がワイヤー強度に等しいときの臨界膜厚ＴＣ２よ
り小さく、固着被膜強度がルーティングする時の強度に
等しい臨界膜厚ＴＣ１より大きくする。FIG. 5 is a diagram showing the relationship between adhesion coating strength and coating thickness. Considering the case where the fixed repair wire 1 is peeled off from the wiring board and fixed by heating and pressing again, the film thickness of the insulating film is smaller than the critical film thickness TC2 when the fixed film strength is equal to the wire strength. There is a need to. If the film thickness is smaller than Te3, the conductive wire material will not be disconnected when the repair wire 1 is peeled off from the wiring board, and the film thickness is
The adhesive coating strength must be greater than the critical thickness TCI, which is equal to the routing strength. If the film thickness is larger than TCI, the repair wire 1 will not be peeled off from the wiring board during routing. Therefore, the film thickness of the insulation film of the repair wire, which is the wiring material for board wiring here, has a fixed film strength. It is smaller than the critical film thickness TC2 when the strength of the bonding film is equal to the wire strength, and larger than the critical film thickness TC1 when the adhesive film strength is equal to the strength when routing.
以上、説明したように、本実施例によれば、基板配線用
配線材の補修線１をセラミック基板に簡単な作業により
強固に固着することができる。このため、補修線１の浮
きがなくなり、補修線１の浮きによる特性インピーダン
スの変動を抑えて、補修線の特性インピーダンスをセラ
ミック基板の配線基板の特性インピーダンスとマツチン
グさせることができる。これにより、ワイヤー配線を行
った補修線１における反射ノイズを低減することができ
、所定の電気的性能を有する基板配線とすることかでき
る。As described above, according to this embodiment, the repair wire 1 of the wiring material for board wiring can be firmly fixed to the ceramic substrate by a simple operation. Therefore, floating of the repair wire 1 is eliminated, variation in characteristic impedance due to floating of the repair wire 1 is suppressed, and the characteristic impedance of the repair wire can be matched with the characteristic impedance of the wiring board of the ceramic substrate. Thereby, it is possible to reduce the reflected noise on the repair line 1 where wire wiring has been performed, and it is possible to provide board wiring having predetermined electrical performance.
以上、本発明を実施例にもとづき具体的に説明したが、
本発明は、前記実施例に限定されるものではなく、その
要旨を逸脱しない範囲において種々変更可能であること
は言うまでもない。The present invention has been specifically explained above based on examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.
以上、説明したように、本発明によれば、配線作業が簡
易に行えて、電気的性能の低下がない基板配線用配線材
が提供される。このような基板配線用配線材を用いて配
線基板のワイヤー配線を行うことにより、配線した配線
材の配線基板上における浮きを押さえて、配線材を基板
に固着させることができる。配線した配線材は、配線基
板上で一定間隔を保って固着できるので、配線材の特性
インピーダンスを配線基板の特性インピーダンスにマツ
チングさせることができる。これにより、所定の電気的
性能を有する基板配線とすることができる。As described above, according to the present invention, there is provided a wiring material for board wiring, which allows wiring work to be performed easily and does not cause deterioration in electrical performance. By wiring the wiring board using such a wiring material for board wiring, it is possible to prevent the wired material from floating on the wiring board and to fix the wiring material to the board. Since the wired wiring material can be fixed on the wiring board at a constant interval, the characteristic impedance of the wiring material can be matched to the characteristic impedance of the wiring board. Thereby, the board wiring can have a predetermined electrical performance.
第１ａ図は、本発明の一実施例にかかる基板配線用配線
材を配線基板上に配線した固着前の状態の断面図。
第１ｂ図は、基板配線用配線材を配線基板上に配線した
後に加熱して配線基板に固着した状態の断面図、
第２図は、本発明の他の実施例にかかる基板配線用配線
材を配線した状態の断面図、
第３図は、本発明の別の他の実施例にかかる基板配線用
配線材を配線した状態の断面図、第４図は１本発明の一
実施例にかかる基板配線用配線材を用いて配線基板上に
配線した後に加熱して配線材を配線基板に固着する基板
配線方法を説明する図。
第５図は、固着被膜強度と被膜膜厚の関係を示す図であ
る。
図中、１・・・補修線、２・・・補修パッド、４・・・
熱源、５・・・配線層え、１０・・・基板配線用配線材
、１１・・・導電線材、１２・・・被覆用絶縁被膜、１
３・・・固着用絶縁被膜、１４・・・配線基板、１５・
・・グランド配線層。
繁１ａ濶 情１ｂ回
第２国 第３図FIG. 1a is a cross-sectional view of a wiring material for board wiring according to an embodiment of the present invention in a state before it is wired on a wiring board and fixed. FIG. 1b is a cross-sectional view of a wiring material for board wiring wired on a wiring board and then heated and fixed to the wiring board. FIG. 2 is a wiring material for board wiring according to another embodiment of the present invention. FIG. 3 is a sectional view of a wiring material for board wiring according to another embodiment of the present invention, and FIG. 4 is a sectional view of a wiring material according to another embodiment of the present invention. FIG. 2 is a diagram illustrating a board wiring method in which wiring is wired on a wiring board using a wiring material for board wiring, and then heated to fix the wiring material to the wiring board. FIG. 5 is a diagram showing the relationship between adhesive film strength and film thickness. In the figure, 1... repair line, 2... repair pad, 4...
Heat source, 5... Wiring layer, 10... Wiring material for board wiring, 11... Conductive wire material, 12... Insulating coating for coating, 1
3... Insulating film for adhesion, 14... Wiring board, 15.
...Ground wiring layer. Shige 1a 濶 情 1b 2nd country Figure 3
Claims (2)
、前記被覆用絶縁被膜の外側を覆う被覆用絶縁被膜より
融点が低い固着用絶縁被膜とからなる構造の基板配線用
配線材。1. A wiring material for board wiring having a structure consisting of a conductive wire, an insulating coating covering the conductive wire, and an insulating fixing coating having a lower melting point than the insulating coating covering the outside of the insulating coating.
い固着用絶縁被膜を被覆した構造の基板配線用配線材に
より配線基板上の電気的接続点の間のワイヤー配線を行
い、配線した配線材を配線押えで配線基板に押圧し、押
圧と同時に、固着用絶縁被膜のみが溶ける温度で固着用
絶縁被膜のみを溶融させ、配線基板上の電気的接続点の
間の配線材を配線基板に固着する基板配線方法。2. A wiring material in which wires are routed between electrical connection points on a wiring board using a board wiring wiring material that has a structure in which a bonding insulating film with a low melting point is coated on the outside of a covering insulating film that covers the conductive wire material. is pressed onto the wiring board with a wiring holder, and at the same time as the pressure is applied, only the insulating film for adhesion is melted at a temperature that melts only the insulating film for adhesion, thereby fixing the wiring material between the electrical connection points on the wiring board to the wiring board. Board wiring method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12837488A JPH01298604A (en) | 1988-05-27 | 1988-05-27 | Wiring material for substrate wiring and method for substrate wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12837488A JPH01298604A (en) | 1988-05-27 | 1988-05-27 | Wiring material for substrate wiring and method for substrate wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01298604A true JPH01298604A (en) | 1989-12-01 |
Family
ID=14983243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12837488A Pending JPH01298604A (en) | 1988-05-27 | 1988-05-27 | Wiring material for substrate wiring and method for substrate wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01298604A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014002681A1 (en) * | 2012-06-25 | 2014-01-03 | 三菱重工業株式会社 | Adhesion method and adhesion equipment, and method of manufacturing a structure |
-
1988
- 1988-05-27 JP JP12837488A patent/JPH01298604A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014002681A1 (en) * | 2012-06-25 | 2014-01-03 | 三菱重工業株式会社 | Adhesion method and adhesion equipment, and method of manufacturing a structure |
| JP2014006381A (en) * | 2012-06-25 | 2014-01-16 | Mitsubishi Heavy Ind Ltd | Adhesion method, adhesive appliance, and manufacturing method for structure |
| CN104246557A (en) * | 2012-06-25 | 2014-12-24 | 三菱重工业株式会社 | Adhesion method and adhesion equipment, and method of manufacturing a structure |
| EP2869100A4 (en) * | 2012-06-25 | 2016-03-16 | Mitsubishi Heavy Ind Ltd | Adhesion method and adhesion equipment, and method of manufacturing a structure |
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