JPH0129080B2 - - Google Patents

Description

[Detailed Description of the Invention] <Technical Field> The present invention automatically transports and supplies an electronic circuit board (hereinafter referred to as a board) before mounting electronic components to an automatic component mounting machine, and automatically transports and supplies a board after mounting electronic components. It relates to a device that collects and transports the equipment.

<Prior Art> As this type of substrate supply/transport device, there is one shown in FIG. 1, for example. That is, a magazine in which a predetermined number of boards are stacked and stored is mounted on the board supply device 1, and the boards are sequentially supplied one by one from the board supply device 1 to the automatic mounting machine 2. and,
In the automatic mounting machine 2, after the board is positioned, the electronic component is inserted into a hole provided in the board, and its lead wires are bent to mount the component on the board. Next, after the board with components attached is discharged from the automatic mounting machine 2, it is stored in the storage device 3 and prepared for transportation to the next process (single connection method, see A in the same figure), or it is transported to the next supply. Device 1
(double connection system, see figure B).

However, in such a system, the substrate supply device 1 is used to supply different substrates to each automatic mounting machine 2 or to each line that is a connection of these machines.
In addition, a different magazine must be attached to each substrate supply device 2, which is a process that reduces productivity.

<Purpose of the Invention> The present invention has been made in view of the above, and is capable of randomly transporting and supplying multiple types of boards to multiple automatic component mounting machines using a single board feeding device, and collecting and transporting boards on which electronic components have been mounted. The purpose of the present invention is to provide an automatic substrate feeding and transporting device.

<Summary of the Invention> For this purpose, in the present invention, the board itself is provided with a board selection means for emitting a signal for selecting the automatic component mounting machine to which the board is supplied, and the board selects a plurality of types of electronic circuit boards one by one. A substrate supply device that sets the substrate at the supply position, a supply-side handling manipulator that grips the substrate set at the substrate supply position, and a supply-side handling manipulator that grips the substrate in response to a signal from the substrate selection means. A supply-side board distribution and collection device that transports the corresponding board to the board supply side of the automatic component mounting machine and releases the board grip of the handling manipulator at the transport position, and a board discharge side of the component mounting machine. A discharge-side handling manipulator that grips a board on which a certain component is attached, and a discharge-side board distribution and collection device that transports the handling manipulator to a predetermined position and releases the handling manipulator's grip on the board at that position. a conveyance path in the supply side substrate distribution and collection device and a conveyance path in the discharge side substrate distribution and collection device are arranged in parallel, and the plurality of automatic component mounting machines are arranged between the conveyance paths. This system is intended to improve productivity by configuring an automatic supply and transportation device for circuit boards.

<Example> The present invention will be described below based on an example shown in FIGS. 2 to 6.

Configuration: In other words, each board is provided with a bar code or a photoelectric reading hole as a board selection means to indicate the type of board, and as shown in FIG. The board supply device 11 is equipped with a board supply device 11 that can be used. Here, the setting of the magazine 13 in the substrate supplying device 11 to the substrate supplying position is performed using the magazine mounting table 3 as shown in FIG.
This is done by the stroke of an air cylinder 34 disposed at the bottom of 3.

The substrates in the magazine 13 mounted on the substrate supply device 11 are lifted up by a lift. That is, motor 3
5 is transmitted to the ball screw shaft 37 by the bevel gear 36, and this rotation causes the shaft 3 to
A lift 38 connected to a nut 38a containing a ball screwed into the nut 38a is raised.

Further, a barcode reader 32 or a photoelectric reader is provided adjacent to the substrate supply device 11.

Then, the substrate in the magazine 13 at the substrate supply position is lifted up and gripped by the supply-side handling manipulator 15, and then the automatic component corresponding to the substrate selection signal read by the barcode reader 32 or the photoelectric reader It is adapted to be conveyed to the supply side of the mounting machine 20.

Here, the supply-side handling manipulator 15 includes a pair of claws 16 that open and close each other to grip the substrate, as shown in FIG.
These claws 16 are designed to move in the vertical direction (the opening/closing mechanism and the vertical movement mechanism of the claws 16 are not shown). This handling manipulator 15 is suspended on a rail 17,
A wire 18 stretched in a loop shape having a portion parallel to the rail 17 is driven by a pulley (not shown) to move in the direction of the rail 17. That is, rail 17, wire 1
8, a pulley, a motor that drives the pulley, a control device 14 that supplies a drive signal to the motor, a barcode reader 32, and the like constitute a supply side distribution and collection device.

Three station conveyors 19 on the supply side are provided in a direction perpendicular to the rail 17, an automatic parts mounting machine 20 is installed on the opposite side of the conveyor 19 from the rail 17, and a discharge side of the automatic parts mounting machine 20 is installed. A discharge side station conveyor 21 is installed.

When the board is moved to the supply side of the component mounting machine 20 by the supply side station conveyor 19, the supply claw 22 and the table discharge claw 23 of the supply and discharge device of the component mounting machine 20 shown in FIG. 6 are lowered. , then moves to the left in the figure, sets the board on the component mounting machine table 24, and moves the board with the components mounted onto the beam conveyor 25. Next, the beam conveyor 25 rises, and the board on which the parts are attached is pushed to the left in the figure by the ejection claw 26, and is ejected onto the ejection side conveyor 21.

On the other hand, the board set on the table 24 is positioned by inserting taper pins into positioning holes provided in the board, and then predetermined electronic components are attached to the board.

A rail 27 is provided perpendicularly to the discharge side conveyor 21, that is, parallel to the rail 17 of the supply side distribution and collection device, and a discharge side handling manipulator 28 having exactly the same configuration as the supply side is suspended on this rail 17. be done. Then, this manipulator 28 is connected to the rail 27 in the same manner as on the supply side.
These constitute the discharge side collection and distribution device. That is, the rail 17 as a transport path in the supply side substrate distribution and collection device and the rail 27 as a transport path in the discharge side substrate distribution and collection device are arranged in parallel, and the plurality of automatic component mounting machines 20 are arranged in parallel. Rail 17, 27
The configuration is such that it is placed between the two.

A substrate storage device 29 is installed near one end of the rail 27 of this discharge side collection and distribution device, and a connecting conveyor 30 with the next process is installed on the opposite side of the rail 27 from the discharge side conveyor 21. The board on which parts are attached, which is gripped by the discharge-side handling manipulator 28, is transported to these as appropriate.

Signals for sequentially operating the above-mentioned devices are issued from a control device 14, and this control device 14 is constituted by, for example, a microcomputer.

Effect Next, the action will be explained.

When a start signal is issued from the control device 14, as shown in FIG. The thickness increases by one sheet. When the barcode reader 32 or the photoelectric reader detects the barcode, which is a substrate selection signal emitted from the substrate itself, or the hole for photoelectric reading, the claw 16 of the supply-side handling manipulator 15 is lowered. and grasp the uppermost substrate of the stacked substrates in the substrate supply device.

When it is confirmed that the board is held by the manipulator 15, the control device 14 issues a signal to drive the pulley to which the wire 18 is stretched, and the manipulator 15 is pulled by the wire 18 and is held by the manipulator 15. The board is moved to the supply station conveyor 19 installed upstream of the component mounting machine 20 corresponding to the board, and the grip on the board is released there. Then, the boards on the supply station conveyor 19 are supplied to individual automatic component mounting machines 20, and after the parts are mounted through the process described above, they are transferred to the discharge station conveyor 2.
1.

Then, the board with the components attached is held by the discharge-side handling manipulator 28, and the handling manipulator 28 is moved to the next process conveyor 30 or board storage device 29 in response to a signal from the control device 14. Then, the grip on the substrate is released, and the ejection and conveyance of the substrate is completed.

On the other hand, the supply side handling manipulator 15
After the substrate has been conveyed to the supply station conveyor 19, it returns to the substrate supply position and is ready for the next substrate conveyance. In other words, it is not necessary to store the same type of board in each magazine 13, and several types of boards can be stored in one magazine 13, and only two magazines 13 can be installed as shown in FIGS. 3 and 4. By doing so, two or more types of substrates can be supplied to several types of automatic component mounting machines 20. However, the number of magazines 13 can be selected as appropriate, such as three or more, or just one, depending on the use.

Furthermore, the rails 17 and 27 constituting the distribution and collection devices on the supply side and the discharge side do not necessarily have to be straight, but may be three-dimensionally curved.

<Effects of the Invention> As explained above, according to the present invention, it is possible to randomly supply a plurality of types of boards to a plurality of component mounting machines using a single board supply device, so that components can be There is no need to provide a substrate supply device for each mounting machine, and the troublesome process of loading a magazine containing substrates into each substrate supply device is omitted. In addition, since the board with parts attached is automatically transported to the next process,
The conventional process of collecting the board for each component mounting machine and transporting it to the next process is also omitted.
Since the degree of freedom in line configuration is increased by these, it becomes possible to configure a more efficient line, and effective use of work space and improvement in productivity are achieved. In addition, since the board itself is equipped with a board selection means, different types of boards can be stacked on the board supply device, which greatly streamlines board stacking compared to a method in which boards are stacked at different locations for each type. In addition, there is also the advantage that selection errors due to incorrect stacking positions of the substrates will not occur, and that the substrate supply device can be made smaller and the installation space can be reduced.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a conventional substrate supply and transportation device.
A indicates a single connection method, and B indicates a multiple connection method. Fig. 2 is a plan view showing the overall configuration of an embodiment of the present invention, Fig. 3 is a plan view showing the main parts of the substrate supply device as above, Fig. 4 is a sectional view taken along line A-A as above, and Fig. 5 is as above. FIG. 6 is a perspective view showing the configuration of the board distribution and collection device, and a side view showing the movement of the board in the electronic component automatic mounting machine. 11...Substrate supply device, 14...Control device, 1
5... Supply side handling manipulator, 17
... Supply side rail, 27 ... Discharge side rail, 28
...Discharge side handling manipulator.

Claims (1)

[Claims] 1. In an automatic electronic circuit board supply and transportation device that supplies multiple types of electronic circuit boards to individual automatic component mounting machines selected from a plurality of automatic component mounting machines for each type, and collects and transports the boards after components have been mounted, the electronic circuit board itself is provided with a board selection means for emitting a signal to select an automatic component mounting machine to which the board is supplied, and a board supply device that sets a plurality of types of electronic circuit boards one by one at a board supply position, and the board supply device. a supply-side handling manipulator that grips a board set in a position; and a board supply of an automatic component mounting machine that causes the handling manipulator to respond to a signal from the board selection means to supply a board corresponding to the board that it is gripping. a supply-side board distribution and collection device that transports the board to the side and releases the board grip of the handling manipulator at the transport position; and a discharge-side handling device that grips the board on which components have been mounted on the board discharge side of the automatic component mounting machine. The supply side substrate distribution and collection device comprises a manipulator, and a discharge side substrate distribution and collection device that transports the handling manipulator to a predetermined position and releases the substrate grip of the handling manipulator at the transport position. An automatic supply and conveyance device for electronic circuit boards, wherein a conveyance path in the substrate distributing device and a conveyance path in the discharge side board distribution and collection device are arranged in parallel, and the plurality of automatic component mounting machines are arranged between the conveyance paths.