JPH01287911A - Manufacture of chip type inductor - Google Patents
Manufacture of chip type inductorInfo
- Publication number
- JPH01287911A JPH01287911A JP1234988A JP1234988A JPH01287911A JP H01287911 A JPH01287911 A JP H01287911A JP 1234988 A JP1234988 A JP 1234988A JP 1234988 A JP1234988 A JP 1234988A JP H01287911 A JPH01287911 A JP H01287911A
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- coil
- type inductor
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 2
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 238000004804 winding Methods 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
〔分野の概要〕
本発明は、電磁ノイズを防止する回路に使用するノイズ
防止素子で、特にチップ型インダクタの製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Overview of the Field] The present invention relates to a noise prevention element used in a circuit for preventing electromagnetic noise, and particularly to a method for manufacturing a chip type inductor.
従来のチップ型インダクタは、小型のものについては、
表面実装化（ＳＭＤ）されている。プリント基板にチッ
プ型インダクタを搭載しておき、クリーム半田を付着し
、赤外線等の熱処理を加えることによりチップ型インダ
クタをプリント基板上に接続する。Conventional chip-type inductors are small in size.
It is surface mounted (SMD). A chip-type inductor is mounted on a printed circuit board, cream solder is applied, and heat treatment such as infrared rays is applied to connect the chip-type inductor to the printed circuit board.
次に、チップ型インダクタを図面を参照して詳細に説明
する。Next, the chip type inductor will be explained in detail with reference to the drawings.
第２図、第３図は、従来のチップ型インダクタを示す構
成図である。FIGS. 2 and 3 are configuration diagrams showing a conventional chip-type inductor.
第２図に示すチップ型インダクタは、リード端子１とコ
イル２とモールド加工樹脂３により構成され、コイル２
の巻線材の端部をリード端子１に接続し、エポキシ樹脂
等のモールド加工樹脂３によりモールド加工し仕上げら
れている。The chip-type inductor shown in FIG. 2 is composed of a lead terminal 1, a coil 2, and a molded resin 3.
The ends of the winding material are connected to lead terminals 1, and finished by molding with molding resin 3 such as epoxy resin.
第３図に示すチップ型インダクタは、リード端子１とコ
イル２とケース８と蓋４と樹脂５（コア固定及び絶縁性
向上のため、シリコン樹脂等を用いる。）により構成さ
れ、コイル２をケース８中に収納し、巻線材の端部をリ
ード端子１に接続し、樹脂５によりケース８内に封止し
たのち、蓋４により固定する。The chip-type inductor shown in Fig. 3 is composed of a lead terminal 1, a coil 2, a case 8, a lid 4, and a resin 5 (silicon resin or the like is used to fix the core and improve insulation). The ends of the winding wires are connected to the lead terminals 1 , sealed in the case 8 with resin 5 , and then fixed with the lid 4 .
上述した従来のチップ製品は、第２図のモールドタイプ
においては、リード端子を接続したコイル自体をエポキ
シ樹脂等によりモールド加工する構造となっているため
、樹脂加工時に磁性コアの特性を悪くするという欠点が
あり、第３図のケースタイプにおいては、コイルを固定
したケース内にシリコン樹脂等で封止し、蓋で固定する
構造となっているため、耐湿性が悪いという欠点があっ
た。The conventional chip products mentioned above, in the mold type shown in Figure 2, have a structure in which the coil itself to which the lead terminals are connected is molded with epoxy resin, etc., which has the potential to deteriorate the characteristics of the magnetic core during resin processing. The case type shown in FIG. 3 has a disadvantage in that it has poor moisture resistance because it has a structure in which the coil is fixed in the case, sealed with silicone resin, etc., and fixed with a lid.
本発明のチップ型インダクタは、コイルを絶縁材よりな
るケースに収納し、巻線材の端部をケース下面に固定さ
れているリード端子に接続し、コイルが収納されたケー
ス中に絶縁性の高い樹脂を流し込んでコイルを固定させ
たのち、ケース上面を他の樹脂との付着性を向上させる
ため、紫外線照射等によりモールド接着するケース表面
の樹脂面を荒し、モールド樹脂によりケースの上面をモ
ールド加工により、樹脂によりケースを完全に封止する
ことを目的とする。In the chip-type inductor of the present invention, a coil is housed in a case made of an insulating material, and the ends of the winding material are connected to lead terminals fixed to the bottom surface of the case. After pouring resin and fixing the coil, in order to improve the adhesion of the top surface of the case with other resins, the resin surface of the case that will be bonded with the mold is roughened by UV irradiation, etc., and the top surface of the case is molded with mold resin. The purpose is to completely seal the case with resin.
絶縁材よりなるケース中にコイルを収納し、巻線端末を
リード端子に接続したのち、ケース内部に電気絶縁性樹
脂を流し込んでコイルを固定し、形成したチップ型イン
ダクタに於て、コイルをシリコン樹脂でモールドした後
、樹脂を充填するケース上面を紫外線による照射を行っ
た後、熱硬化性樹脂を用い、ケース上面を覆い樹脂モー
ルドし封止したことを特徴とするチップ型インダクタで
ある。After storing the coil in a case made of insulating material and connecting the winding terminals to lead terminals, electrically insulating resin is poured into the case to fix the coil. This is a chip type inductor characterized in that after molding with resin, the upper surface of the case filled with resin is irradiated with ultraviolet rays, and then the upper surface of the case is covered with a thermosetting resin and sealed by resin molding.
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は、本発明の一実施例を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of the present invention.
ポリブチレンテレフタレート、ポリプロピレン等の電気
絶縁材質であるエンジニアプラスチックスにより成°形
されたケース８に、鉄、或いは鉄合金の圧粉磁心を用い
た磁心、或いはフェライト等の環状磁心に銅線を複数回
巻いて形成したコイル２を収納し、コイル２の巻線材の
端部を、あらかじめケース８に固定しているリード端子
１に接続し、ケース８の上部開口部より、コイル２を収
納したまま、ケース８内部の耐振性及び耐湿性を向上さ
せるため、シリコン等の樹脂５でケース８内部を封止す
る。The case 8 is made of engineered plastics, which are electrically insulating materials such as polybutylene terephthalate and polypropylene, and includes a magnetic core using a dust core of iron or iron alloy, or a ring-shaped magnetic core such as ferrite, and a plurality of copper wires. The coil 2 formed by winding is stored, the end of the winding material of the coil 2 is connected to the lead terminal 1 fixed in advance to the case 8, and the coil 2 is inserted through the upper opening of the case 8 while the coil 2 is stored. In order to improve the vibration resistance and moisture resistance inside the case 8, the inside of the case 8 is sealed with a resin 5 such as silicone.
次に、ケース上部面７を他の物質との付着力を強化させ
るために、ケース上面７（ハツチング部でケースの上面
全面）に紫外線等、エネルギーの大きな光を照射させる
ことにより、前記ケース上面の表面を活性化して荒い面
とする。照射時間は１分程度でよい。さらにケース上面
をエポキシ等の熱硬化性樹脂により、ケース８の上面を
覆う形にモールド加工を行ないコイルを封止した構造と
するものである。Next, in order to strengthen the adhesion of the case top surface 7 with other substances, the case top surface 7 (the entire top surface of the case at the hatching part) is irradiated with high energy light such as ultraviolet rays. Activate the surface to make it rough. The irradiation time may be about 1 minute. Further, the upper surface of the case 8 is molded with a thermosetting resin such as epoxy to cover the upper surface of the case 8, thereby sealing the coil.
以上、本発明の実施例について説明したが、コモンモー
ドコイル、或いはノーマルモードコイル等の用途に応じ
て、端子の数を変化させる等、上述した実施例に限定さ
れず、本発明の主旨を逸脱しない範囲において種々の変
形が可能である。Although the embodiments of the present invention have been described above, the number of terminals may be changed depending on the application of the common mode coil or normal mode coil, etc., and the invention is not limited to the above-mentioned embodiments. Various modifications are possible within the range that does not occur.
本発明によるチップ型インダクタは、絶縁材よりなるケ
ース中にコイルを収納し、巻線材の端部をケース下面に
固定されているリード端子に接続したのち、ケース中に
絶縁性の高い樹脂を流し込みコイルを固定し、ケース上
面を他の樹脂との付着性を向上させるため、紫外線照射
等によりケース上面の樹脂面を荒し、樹脂でケース上面
をモールド加工により封止する構造とすることによって
、コアの特性の低下を防ぐことと、部品内部の耐湿性を
向上させるという効果がある。The chip-type inductor according to the present invention houses a coil in a case made of insulating material, connects the ends of the winding material to lead terminals fixed to the bottom of the case, and then pours highly insulating resin into the case. In order to fix the coil and improve the adhesion of the top surface of the case with other resins, the top surface of the case is roughened by UV irradiation, etc., and the top surface of the case is sealed with resin by molding. This has the effect of preventing deterioration of the properties of the parts and improving the moisture resistance inside the parts.
第１図は本発明によるチップ型インダクタの構造を示す
斜視図。
第２図は従来の一体モールド型チップ型インダクタの構
造を示す斜視図。
第３図は従来のケースを使用したチップ型インダクタの
構造を示す斜視図。
１・・・リード端子。
２・・・コイル。
３・・・モールド加工樹脂。
４・・・蓋。
５・・・樹脂（シリコン等耐湿性向上のため）。
６・・・ケース上部モールド加工樹脂。
７・・・ケース上面。
８・・・ケース。
特許出願人 東北金属工業株式会社
第１図
第２図
第３図FIG. 1 is a perspective view showing the structure of a chip-type inductor according to the present invention. FIG. 2 is a perspective view showing the structure of a conventional integrally molded chip type inductor. FIG. 3 is a perspective view showing the structure of a chip-type inductor using a conventional case. 1...Lead terminal. 2...Coil. 3...Mold processing resin. 4... Lid. 5...Resin (silicon, etc. to improve moisture resistance). 6... Case upper mold processing resin. 7...Top surface of the case. 8...Case. Patent applicant: Tohoku Metal Industry Co., Ltd. Figure 1 Figure 2 Figure 3
Claims (1)
リード端子に接続したのち、ケース内部に電気絶縁性樹
脂を流し込んでコイルを固定し、形成したチップ型イン
ダクタに於て、コイルをシリコン樹脂でモールドした後
、樹脂を充填するケース上面を紫外線による照射を行っ
た後、熱硬化性樹脂を用い、ケース上面を覆い樹脂モー
ルドし封止したことを特徴とするチップ型インダクタ。After storing the coil in a case made of insulating material and connecting the winding terminals to lead terminals, electrically insulating resin is poured into the case to fix the coil. A chip type inductor characterized in that after molding with resin, the upper surface of the case filled with resin is irradiated with ultraviolet rays, and then the upper surface of the case is covered with a thermosetting resin and sealed by resin molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1234988A JPH01287911A (en) | 1988-01-21 | 1988-01-21 | Manufacture of chip type inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1234988A JPH01287911A (en) | 1988-01-21 | 1988-01-21 | Manufacture of chip type inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01287911A true JPH01287911A (en) | 1989-11-20 |
Family
ID=11802805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1234988A Pending JPH01287911A (en) | 1988-01-21 | 1988-01-21 | Manufacture of chip type inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01287911A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090077791A1 (en) * | 2005-09-22 | 2009-03-26 | Radial Electronics, Inc | Magnetic components |
| US9754714B2 (en) | 2009-07-31 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
| US9754712B2 (en) | 2005-09-22 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
| US10049803B2 (en) | 2005-09-22 | 2018-08-14 | Radial Electronics, Inc. | Arrayed embedded magnetic components and methods |
| US10431367B2 (en) | 2005-09-22 | 2019-10-01 | Radial Electronics, Inc. | Method for gapping an embedded magnetic device |
| US10522279B2 (en) | 2005-09-22 | 2019-12-31 | Radial Electronics, Inc. | Embedded high voltage transformer components and methods |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5095771A (en) * | 1973-12-26 | 1975-07-30 | ||
| JPS62162321A (en) * | 1986-01-13 | 1987-07-18 | Matsushita Electric Ind Co Ltd | Manufacture of electronic apparatus |
-
1988
- 1988-01-21 JP JP1234988A patent/JPH01287911A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5095771A (en) * | 1973-12-26 | 1975-07-30 | ||
| JPS62162321A (en) * | 1986-01-13 | 1987-07-18 | Matsushita Electric Ind Co Ltd | Manufacture of electronic apparatus |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090077791A1 (en) * | 2005-09-22 | 2009-03-26 | Radial Electronics, Inc | Magnetic components |
| US9355769B2 (en) * | 2005-09-22 | 2016-05-31 | Radial Electronics, Inc. | Methods for manufacturing magnetic components |
| US9754712B2 (en) | 2005-09-22 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
| US10049803B2 (en) | 2005-09-22 | 2018-08-14 | Radial Electronics, Inc. | Arrayed embedded magnetic components and methods |
| US10347409B2 (en) | 2005-09-22 | 2019-07-09 | Radial Electronics, Inc. | Arrayed embedded magnetic components and methods |
| US10431367B2 (en) | 2005-09-22 | 2019-10-01 | Radial Electronics, Inc. | Method for gapping an embedded magnetic device |
| US10522279B2 (en) | 2005-09-22 | 2019-12-31 | Radial Electronics, Inc. | Embedded high voltage transformer components and methods |
| US9754714B2 (en) | 2009-07-31 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
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