JPH01286206A - Micro-soldering sheet - Google Patents
Micro-soldering sheetInfo
- Publication number
- JPH01286206A JPH01286206A JP11559188A JP11559188A JPH01286206A JP H01286206 A JPH01286206 A JP H01286206A JP 11559188 A JP11559188 A JP 11559188A JP 11559188 A JP11559188 A JP 11559188A JP H01286206 A JPH01286206 A JP H01286206A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- melting point
- micro
- insulating member
- polymer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 23
- 238000002844 melting Methods 0.000 claims abstract description 32
- 230000008018 melting Effects 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 239000002861 polymer material Substances 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- -1 polytetrafluoro-ethylene Polymers 0.000 abstract description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 abstract description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 229920006122 polyamide resin Polymers 0.000 abstract 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 abstract 1
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 10
- 239000011888 foil Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000012777 electrically insulating material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（、）産業上の利用分野
本発明は、７レキンプル回路基板（以下、ＦＰＣと略す
）の電極部とリノッド回路基板（以下、ＰＣＢと略す）
の電極を電気的に接合する用途等に用いるマイクロソル
ダリングシートに関するものである。DETAILED DESCRIPTION OF THE INVENTION (,) Industrial Application Field The present invention is directed to the electrode part of a 7-requin pull circuit board (hereinafter abbreviated as FPC) and the linod circuit board (hereinafter abbreviated as PCB).
The present invention relates to a micro soldering sheet used for electrically bonding electrodes.
（ｂ）従来の技術
近年の電子機器の開発傾向は、薄型化、小型化が進み、
各素子の電気的接合は多数個配設した電極を短時間で、
しかも確実に接合する技術が要求されている。これらの
接合技術としては以下のものが挙げられる。(b) Conventional technology In recent years, the development trend of electronic devices has been toward thinner and smaller sizes.
Electrical connection of each element can be achieved by using a large number of electrodes in a short time.
Moreover, a technique for reliably joining them is required. These joining techniques include the following.
（１）金細線を各素子の電極に溶着するワイヤーポンデ
イグ法。(1) Wire bonding method in which thin gold wires are welded to the electrodes of each element.
（２）素子の各電極部にクリームはんだを塗布し、その
上に相手方の素子を重ね合わせて高温にさらす、いわゆ
るす７０−はんだ法。(2) So-called 70-soldering method, in which cream solder is applied to each electrode part of the element, and the other element is placed on top of it and exposed to high temperature.
（ｃ）発明が解決しようとする課題
しかしながら、上記（１）の方法では金細線を用いてお
りその強度面より太さを過度に細くできず、しかもこの
金細線を素子の各電極に溶着するため、互いに隣接する
電極間のリークを防止するために電極が０．２〜０．４
１１＋１以下の細ピッチに用いることができない上、接
合部の厚みを薄くできないなどの問題がある。(c) Problems to be Solved by the Invention However, in the method (1) above, a thin gold wire is used, and the thickness cannot be made excessively thin due to its strength, and furthermore, the thin gold wire must be welded to each electrode of the element. Therefore, in order to prevent leakage between adjacent electrodes, the electrodes are
There are problems in that it cannot be used for fine pitches of 11+1 or less and that the thickness of the joint cannot be made thin.
又、上記（２）の方法では、各々の電極間にはんだが流
れ込み、いわゆるはんだブリッジが起こり電極間リーク
が発生しやす（信頼性が劣るのである。Furthermore, in the method (2) above, solder flows between each electrode, so-called solder bridges occur, and leakage between electrodes is likely to occur (reliability is poor).
（ｄ）課題を解決するための手段
本発明者らは、導電部材が電気絶縁部材で区画されて電
気的に独立しており、ＦＰＣ，ＰＣＢ等の配線基板との
接続の際に、電極同士を易融金属で接合すると共に、電
極間のブリッジによるリークを防止することができる信
頼性の高いマイクロンルグリングシートについて鋭意検
討を重ねてきた。(d) Means for Solving the Problems The present inventors have discovered that conductive members are separated by electrically insulating members and are electrically independent, and that when connecting to wiring boards such as FPCs and PCBs, electrodes We have been conducting extensive research on a highly reliable micron luggling sheet that can be joined with easily melted metals and prevent leaks due to bridges between electrodes.
その結果、導電部材を易融金属で形成すると共に、それ
らを区画する耐熱性電気絶縁部材を、該易融金属の溶融
温度以上、好ましくは、易融金属の溶融温度より２０℃
以上高い融点を有する耐熱性高分子材料で形成すると、
上記課題を解決しうろことを見い出し、本発明を完成す
るに至ったものである。As a result, the conductive member is formed of an easily melted metal, and the heat-resistant electrically insulating member that partitions them is formed at a temperature higher than the melting temperature of the easily melted metal, preferably 20°C higher than the melting temperature of the easily melted metal.
When formed from a heat-resistant polymer material with a melting point higher than
The inventors have found a way to solve the above problems and have completed the present invention.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明のマイクロソルグリングシートでは、導電部材が
電気絶縁部材で区画されて電気的に独立しているマイク
ロソルグリングシートであって、上記導電部材が易融金
属で形成されており、且つ、上記電気絶縁部材はその融
点が上記導電部材の融点より高い耐熱高分子材料で形成
されていることを特徴とするものである。In the micro sorg ring sheet of the present invention, the conductive member is partitioned by an electrically insulating member and is electrically independent, and the conductive member is made of an easily melted metal, and The electrically insulating member is characterized in that it is made of a heat-resistant polymer material whose melting point is higher than that of the electrically conductive member.
そして、本発明の特徴は、導電部材として易融金属を用
い、且つ電気絶縁部材としてその融点が導電部材の融点
より高い耐熱性高分子材料で形成したものを用いた点に
ある。A feature of the present invention is that an easily melted metal is used as the conductive member, and a heat-resistant polymer material whose melting point is higher than that of the electrically insulating member is used as the electrically insulating member.
又、本発明に用いられる易融金属としては、鉛、錫、銀
、金、イン７ウム、ビスマス等の単体或いはこれらのう
ちの２種以上からなる合金であって、箔状に形成でさる
ものであれば特に限定されるものではない。In addition, the easily meltable metals used in the present invention include lead, tin, silver, gold, indium, bismuth, etc., or alloys of two or more of these, which can be formed into a foil shape. It is not particularly limited as long as it is.
又、本発明に用いられる耐熱性高分子材料としては、導
電部材として用いる易融金属の溶融温度以上の融点のも
のであれば、接着性の有無を問わず特に限定されるもの
ではないが、ポリテトラフルオロエチレン樹脂等のフッ
素系団脂、ポリアミドイミド樹脂、ポリイミド樹脂等の
耐熱性のものであり、しかも切削加工性に優れているも
のが好ましい。Further, the heat-resistant polymer material used in the present invention is not particularly limited, as long as it has a melting point higher than the melting temperature of the easily melted metal used as the conductive member, regardless of whether it has adhesive properties or not. It is preferable to use a fluorine-based resin such as polytetrafluoroethylene resin, a polyamideimide resin, a polyimide resin, etc., which are heat resistant and have excellent machinability.
本発明のマイクロソルグリングシートにおいて、電気絶
縁部材はその融点が導電部材の融点より２０℃以上高い
耐熱性高分子材料で形成されているものを用いることに
より、電極同士を一層確実に電気的に接合で外、しかも
電気絶縁部材の耐熱性が高く、従って、溶けた易融金属
を電気絶縁部材が区画、保持し、このため電極間に易融
金属の流れ込みがなく、易融金属によるブリッジが一層
起こり難く電極間リークが発生しなくなり＊ａ性が極め
て高くなるのである。In the microsol ring sheet of the present invention, the electrically insulating member is made of a heat-resistant polymer material whose melting point is 20°C or more higher than the melting point of the conductive member, thereby ensuring that the electrodes are electrically connected to each other more reliably. In addition, the heat resistance of the electrically insulating material is high, and therefore the electrically insulating material partitions and holds the melted easily melted metal, so that the easily melted metal does not flow between the electrodes, and a bridge made of the easily melted metal is formed. This makes it even more difficult to cause leakage between the electrodes, and the *a property becomes extremely high.
次に本発明のマイクロソルグリングシートの製造方法に
ついて説明する。Next, the method for manufacturing the microsol ring sheet of the present invention will be explained.
本発明においては、先ず、易融金属箔の片面或いは両面
に耐熱性電気絶縁部材を積層して積／！Ｉフィルムを形
成する工程Ａを実施する。In the present invention, first, a heat-resistant electrical insulating member is laminated on one or both sides of an easily melted metal foil. Step A of forming an I film is carried out.
この工程Ａは、例えば（ａ）易融金属箔の片面或いは両
面に耐熱性電気絶縁部材を積層し、これを加熱して互い
に接合したり、或いは（ｂ）易融金属箔及び／又は耐熱
性電気絶縁部材に接着剤を塗布し、これらを上記（ａ）
のように積層、接合する等の方法により行われる。This step A may include, for example, (a) laminating a heat-resistant electrical insulating member on one or both sides of an easily melted metal foil and bonding them together by heating, or (b) laminating a heat-resistant electrically insulating member on one or both sides of an easily melted metal foil, Apply adhesive to electrically insulating members and attach them to (a) above.
This is done by stacking, bonding, etc.
次に上記工程Ａで得られた積層フィルムの複数をその易
融金属箔と耐熱性電気絶縁部材とが交互になるように積
層一体化して直方体状の積層体を形成する工程Ｂを実施
する。Next, Step B is carried out in which a plurality of the laminated films obtained in Step A are laminated and integrated so that the easily meltable metal foils and the heat-resistant electrically insulating members alternate to form a rectangular parallelepiped-shaped laminate.
ここにおいて、積層一体化するとは、易融金属箔と耐熱
性電気絶縁部材を加熱、加圧等の捏作により接合して剥
離しないようにすることであり、この場合、耐熱性電気
Ｊａ縁部材が接着性を有しないときには、換言すると、
素材の性質上圧いに接合しないときには、これらの各部
材間に各種の接着剤を塗工したり或いは接着性フィルム
を介在させてこれらの部材が互いに接合しあうようにし
てもよい。Here, laminating and integrating means to bond the easily meltable metal foil and the heat-resistant electrical insulating member by heating, pressurizing, etc. so that they do not separate.In this case, the heat-resistant electrical insulating member In other words, when does not have adhesive properties,
When it is not possible to bond them together under pressure due to the nature of the materials, these members may be bonded to each other by applying various adhesives or by interposing an adhesive film between them.
次に、上記工程Ｂで得られた直方体状の積層体を、これ
を構成する積層フィルムのＭｔＭ方向に切断して縞状の
フィルムを製造する工程Ｃを実施する。 ・
更に、上記工程Ｂで得られた縞状のフィルムと耐熱性電
気絶縁部材が交互になるように多重に積層−像化して直
方体状のマイクロソルダリングシート素材を得る工程り
を実施する。Next, Step C is carried out in which the rectangular parallelepiped-shaped laminate obtained in Step B is cut in the MtM direction of the laminate film constituting this to produce a striped film. - Furthermore, a step is carried out in which the striped film obtained in the above step B and the heat-resistant electrical insulating member are alternately laminated and imaged to obtain a rectangular parallelepiped-shaped micro-soldering sheet material.
この耐熱性電気絶縁部材としては上記工程Ａで用いるも
のと同一のものであっても異種であってもよい。This heat-resistant electrically insulating member may be the same as that used in step A above, or may be of a different type.
又、この工程りにおいて、積層−像化するとは、上記工
程Ｂにおける積層−像化と同様の意義である。Furthermore, in this step, the term "lamination and imaging" has the same meaning as the lamination and imaging in step B above.
本発明においては、最後に、上記工程りで得られたマイ
クロソルダリングシート素材を積層方向にフィルム状に
切断する工程Ｅを実施する。In the present invention, finally, a step E is performed in which the microsoldering sheet material obtained in the above steps is cut into a film shape in the lamination direction.
上記各工程を経ることにより目的とするマイクロンルグ
リングシートが得られる。By passing through each of the above steps, the desired micron rug ring sheet can be obtained.
（ｅ）作用
本発明のマイクロソルダリングシートは、上記構成を有
するものであり、導電部材が易融金属で形成されており
、しかもその各々が独立しているうえ、電気絶縁部材の
融点が導電部材の溶融温度よりも高（設定されているか
ら、このマイクロソルダリングシートと、回路端子とを
接続する際に、導電部材の溶融温度より高い温度に加熱
、加圧しても絶縁層である電気絶縁部材が流動すること
がなく、加えて、一方の回路端子と他方の回路端子が導
電部材で互いに融着、接合されると共に、導電部材によ
るブリッジを起こすことなく確実に絶縁が保持できる作
用を有する。(e) Function The micro-soldering sheet of the present invention has the above-described structure, in which the conductive members are made of an easily melted metal, each of which is independent, and the melting point of the electrically insulating member is such that it is conductive. Higher than the melting temperature of the conductive material (because it is set, when connecting this micro-soldering sheet to the circuit terminal, even if heated and pressurized to a temperature higher than the melting temperature of the conductive material, the insulating layer The insulating material does not flow, and in addition, one circuit terminal and the other circuit terminal are fused and joined to each other by the conductive material, and the insulation can be maintained reliably without causing bridging due to the conductive material. have
本発明のマイクロソルダリングシートにおいて、電気絶
縁部材はその融点が導電部材の融点より２０“Ｃ以上高
い耐熱性高分子材料で形成されているものを用いること
により、電極同士を一層確実に電気的に接合でき、しか
も電気絶縁部材の耐熱性が高く、従って、溶けた導電部
材を電気絶縁部材が区画、保持し、このため電極間に導
電部材の流れ込みがなく、導電部材によるブリッジが一
層起こＩ）ｌｌｌくなる作用を有するのである。In the micro-soldering sheet of the present invention, the electrical insulating member is made of a heat-resistant polymer material whose melting point is 20"C or more higher than the melting point of the conductive member, thereby ensuring that the electrodes are electrically connected to each other more reliably. Moreover, the heat resistance of the electrically insulating material is high, and therefore the electrically insulating material separates and holds the melted electrically conductive material, so that there is no flow of the electrically conductive material between the electrodes, and bridging caused by the electrically conductive material is more likely to occur. ) It has the effect of increasing
（ｆ）実施例
以下、本発明を実施例に基づト詳細に説明するが、本発
明はこれに限定されるものではない。(f) Examples Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
明のマイクロソルダリングシートの ゛１第１図は本発
明のマイクロソルダリングシートの斜視図を示し、（１
）はマイクロソルダリングシートであり、該マイクロソ
ルダリングシート（１）は導電部材（２）と電気絶縁部
材（３）からなり、該導電部材（２）が電気絶縁部材（
３）で区画されて電気的に独立してなる。Figure 1 shows a perspective view of the micro soldering sheet of the present invention.
) is a micro-soldering sheet, the micro-soldering sheet (1) is composed of a conductive member (2) and an electrically insulating member (3), and the electrically conductive member (2) is composed of an electrically insulating member (
3) and are electrically independent.
そして、上記導電部材（２）は易融金属で形成されてお
り、且つ、上記電気絶縁部材（３）の融点が上記導電部
材の融点より高い耐熱性高分子材料で形成されている。The electrically conductive member (2) is made of an easily melted metal, and the electrically insulating member (3) is made of a heat-resistant polymer material whose melting point is higher than that of the electrically conductive member.
又、本発明のマイクロソルダリングシート（１）におい
て、その電気絶縁部材（３）はその融点が導電部材（２
）の融点より２０℃以上高ν１耐熱性高分子材料で形成
されたものが接続抵抗が低く、しかも導電部材の流れ込
みがなく、−層信頼性の高−・接合体が得られるから好
ましい。Furthermore, in the micro-soldering sheet (1) of the present invention, the electrically insulating member (3) has a melting point equal to that of the electrically conductive member (2).
It is preferable to use a heat-resistant polymer material having a high ν1 of 20° C. or higher than the melting point of ) because it has low connection resistance, no flow of conductive members, and can provide a bonded body with high layer reliability.
明のマイクロソルダリングシートの製゛１鉛４３重１％
、錫４３重量％及びビスマス１４重１％からなる易融金
属をカレンダー成形機で、厚み３０μ曽の箔状に成形し
、易融金属箔を得る。Ming's micro soldering sheet production: 1 lead 43 weight 1%
, an easily melted metal consisting of 43% by weight of tin and 1% by weight of 14 bismuth is formed into a foil shape with a thickness of 30 μm using a calendar molding machine to obtain an easily melted metal foil.
この易融金属箔の溶融温度は１５０℃である。The melting temperature of this easily meltable metal foil is 150°C.
そして、耐熱性の電気絶縁部材である接着剤付きポリ四
７フ化エチレン樹脂フィルム（総厚み５０μｍ）を用い
、このフィルムを上記易融金属箔の片面にロール温度１
３０℃で積層し、積層フィルムを得る（工程Ａ）。Then, using an adhesive-coated polytetrafluoroethylene resin film (total thickness 50 μm), which is a heat-resistant electrical insulating member, this film was rolled onto one side of the above-mentioned easily meltable metal foil at a temperature of 1.
Lamination is performed at 30°C to obtain a laminated film (Step A).
次に、上記積層フィルムのポリ四７フ化エチレン樹ｌｌ
１ｔフィルム側に接着剤を塗布した後寸法５０論論角に
切り抜きし、これを約６００枚を積層するにあたり、そ
の易融金属箔が重ならなり１ように積層し、温度１３０
°Ｃ１圧力５ ｋｇ／ Ｃｍ”、時間３０分の条件でプ
レスし、ＳＯｍ＋ａの立方体成形品を得る（工程Ｂ）。Next, the polytetrafluoroethylene resin of the laminated film
After applying adhesive to the 1t film side, cut out 50cm square pieces and laminate about 600 sheets of this.
Pressing is carried out under the conditions of 1 °C1 pressure of 5 kg/Cm'' and 30 minutes to obtain a cubic molded product of SOm+a (Step B).
次に、上記工程で得た立方体成形品を、積層方向に切
断して厚み３０μｍ、Ｒ５０ｍ論、横５０ｍｍの縞状の
フィルムを得る（工程Ｃ）。Next, the cubic molded product obtained in the above step is cut in the stacking direction to obtain a striped film with a thickness of 30 μm, radius of 50 mm, and width of 50 mm (Step C).
更に、上記工程で得た縞状のフィルムと、表裏両面に接
着剤を塗布した厚み５０μ論のポリ四７ツ化エチレン樹
Ｎフィルム（日東電気工業株式会社製）を交互に各々約
６００枚積層し、上記プレス条件と同じ条件で５０ｍｍ
のマイクロソルダリングシート素材を得る（工程Ｄ）。Furthermore, approximately 600 sheets of each of the striped film obtained in the above process and a 50 μm thick polytetra7ethylene N film (manufactured by Nitto Electric Industries, Ltd.) coated with adhesive on both the front and back sides were laminated alternately. 50mm under the same pressing conditions as above.
A micro soldering sheet material is obtained (Step D).
最後に、上記工程で得られた素材を積層方向に、厚み５
０μ艶のフィルム状に切断し、マイクロソルダリングシ
ートを得る（工程Ｅ）。Finally, the material obtained in the above step is stacked in the stacking direction to a thickness of 5
Cut into a film with a 0μ gloss to obtain a micro-soldering sheet (Step E).
比較例１
上記実施例でポリ四７フ化エチレン樹脂フィルムの代わ
りに融点が９７℃のポリオレフィンフィルム（商品名ア
トマーＶＥ３００：三井石油化学製）を用い、上記実施
例と同様の方法で得たものを試料とした。Comparative Example 1 A polyolefin film with a melting point of 97°C (trade name Atmer VE300, manufactured by Mitsui Petrochemical) was used instead of the polytetrafluoroethylene resin film in the above example, and was obtained in the same manner as in the above example. was used as a sample.
比較例２
ホットメルト系接着剤中にカーボン粉末を配合して混合
し、該混合物を圧延して形成した市販の異方導電性フィ
ルムを試料とした。Comparative Example 2 A commercially available anisotropic conductive film was prepared by mixing carbon powder in a hot melt adhesive and rolling the mixture.
上記実施例及び各比較例で得たマイクロソルダリングシ
ート或いは異方導電性フィルムを、電極幅０．２ｍａ＋
、電極間隙０．２１１ＩＩＩのＦＰＣ２枚の間に挟み、
加熱加圧して各電極間の絶縁抵抗及び絶縁抵抗を測定し
た結果を第１表に示す。The micro-soldering sheets or anisotropic conductive films obtained in the above Examples and Comparative Examples were
, sandwiched between two FPC sheets with an electrode gap of 0.211III,
Table 1 shows the results of measuring the insulation resistance and insulation resistance between each electrode by heating and pressurizing.
第１表
第１表に示す結果より、実施例においては、導電部材が
電極面に溶着し接合されており、従って、接続抵抗が極
めて低く、又、電極間では導電部材の流れがなく、導電
部材によるブリッジ、の発生は皆無であった。Table 1 From the results shown in Table 1, in the example, the conductive member is welded and joined to the electrode surface, so the connection resistance is extremely low, and there is no flow of the conductive member between the electrodes, and the conductive member is welded and bonded to the electrode surface. There were no occurrences of bridging due to parts.
又、比較例１において、電極面は実施例と同様な状態が
みられるが、電極間には導電部材の流れが観察され、絶
縁抵抗の低下の原因であることが判明した。Further, in Comparative Example 1, although the electrode surface was in the same state as in the example, a flow of the conductive member was observed between the electrodes, which was found to be the cause of the decrease in insulation resistance.
更に、比較例２は、従来技術である異方導電性フィルム
の特性を示し、接続抵抗が至極高いことが認められる。Furthermore, Comparative Example 2 exhibits the characteristics of the conventional anisotropic conductive film, and it is recognized that the connection resistance is extremely high.
（［１）発明の効果
本発明のマイクロソルダリングシートは、導電部材が電
気絶縁部材で区画されて電気的に独立しているマイクロ
ソルダリングシートであって、上記導電部材が易融金属
で形成されており、且つ、上記電気絶縁部材はその融点
が上記導電部材の融点より高い耐熱性高分子材料で形成
されてなり、導電部材が被接合材である電極に溶着する
ことにより確実に電気的接合ができると共に接続抵抗が
極めて低いのであり、又、電極同士を接合する際、導電
部材によるブリッジの発生がな（、リークの発生もなく
、信頼性が高い効果を有するのである。([1) Effects of the Invention The micro-soldering sheet of the present invention is a micro-soldering sheet in which a conductive member is partitioned by an electrically insulating member and is electrically independent, and the conductive member is formed of an easily melted metal. In addition, the electrically insulating member is made of a heat-resistant polymer material whose melting point is higher than that of the electrically conductive member, and the electrically conductive member is welded to the electrode, which is the material to be joined, to ensure electrical continuity. It can be bonded and the connection resistance is extremely low, and when the electrodes are bonded together, there is no bridging (or leakage) caused by the conductive member, resulting in a highly reliable effect.
本発明のマイクロソルダリングシートにおいて、電気絶
縁部材はその融点が導電部材の融点より２０℃以上高い
耐熱性高分子材料で形成されているものを用いることに
より、電極同士を一層確実に電気的に接合でさ、しかも
電気絶縁部材の耐熱性が高く、従って、溶けた導電部材
を電気絶縁部材が区画、保持し、このため電極間に導電
部材の流れ込みがなく、導電部材によるブリッジが一層
起こり難くなく、信頼性が一層高くなる効果を有すので
ある。In the micro-soldering sheet of the present invention, the electrical insulating member is made of a heat-resistant polymer material whose melting point is 20°C or more higher than the melting point of the conductive member, thereby ensuring that the electrodes are electrically connected to each other more reliably. In addition, the heat resistance of the electrically insulating material is high, and therefore the electrically insulating material separates and holds the melted conductive material, so there is no flow of the electrically conductive material between the electrodes, and bridging due to the electrically conductive material is less likely to occur. This has the effect of further increasing reliability.
第１図は本発明のマイクロソルダリングシートの一実施
例を示す斜視図である。
（１）・・・マイクロソルダリングシート、（２）・・
・導電部材、（３）・・・電気絶縁部材。FIG. 1 is a perspective view showing an embodiment of the micro soldering sheet of the present invention. (1)...Micro soldering sheet, (2)...
- Conductive member, (3)... electrically insulating member.
Claims (2)
立しているマイクロソルダリングシートであって、上記
導電部材が易融金属で形成されており、且つ、上記電気
絶縁部材はその融点が上記導電部材の融点より高い耐熱
性高分子材料で形成されていることを特徴とするマイク
ロソルダリングシート。(1) A micro-soldering sheet in which a conductive member is partitioned by an electrically insulating member and is electrically independent, the conductive member being made of an easily melted metal, and the electrically insulating member having a melting point A micro-soldering sheet characterized in that the sheet is made of a heat-resistant polymer material having a melting point higher than that of the conductive member.
０℃以上高い耐熱性高分子材料で形成されている請求項
１記載のマイクロソルダリングシート。(2) The melting point of the electrically insulating member is 2 times higher than the melting point of the electrically conductive member.
The micro-soldering sheet according to claim 1, which is made of a heat-resistant polymer material that is higher than 0°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11559188A JPH01286206A (en) | 1988-05-11 | 1988-05-11 | Micro-soldering sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11559188A JPH01286206A (en) | 1988-05-11 | 1988-05-11 | Micro-soldering sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01286206A true JPH01286206A (en) | 1989-11-17 |
Family
ID=14666395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11559188A Pending JPH01286206A (en) | 1988-05-11 | 1988-05-11 | Micro-soldering sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01286206A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
-
1988
- 1988-05-11 JP JP11559188A patent/JPH01286206A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
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