JPH01278558A - Composition for injection molding production thereof and usage thereof - Google Patents
Composition for injection molding production thereof and usage thereofInfo
- Publication number
- JPH01278558A JPH01278558A JP10850688A JP10850688A JPH01278558A JP H01278558 A JPH01278558 A JP H01278558A JP 10850688 A JP10850688 A JP 10850688A JP 10850688 A JP10850688 A JP 10850688A JP H01278558 A JPH01278558 A JP H01278558A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- group
- injection molding
- composition
- degreasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 238000001746 injection moulding Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000000843 powder Substances 0.000 claims abstract description 47
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 10
- 229920000570 polyether Polymers 0.000 claims abstract description 10
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 238000004898 kneading Methods 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 4
- 125000002252 acyl group Chemical group 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000005238 degreasing Methods 0.000 abstract description 19
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- -1 cyclohexylene glycol Chemical compound 0.000 description 23
- 235000014113 dietary fatty acids Nutrition 0.000 description 10
- 239000000194 fatty acid Substances 0.000 description 10
- 229930195729 fatty acid Natural products 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 150000004665 fatty acids Chemical class 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000001993 wax Substances 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 4
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012170 montan wax Substances 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003925 fat Substances 0.000 description 2
- 235000019197 fats Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229920003146 methacrylic ester copolymer Polymers 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- 239000000263 2,3-dihydroxypropyl (Z)-octadec-9-enoate Substances 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- SZSSMFVYZRQGIM-UHFFFAOYSA-N 2-(hydroxymethyl)-2-propylpropane-1,3-diol Chemical compound CCCC(CO)(CO)CO SZSSMFVYZRQGIM-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-GDCKJWNLSA-N 3-oleoyl-sn-glycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@H](O)CO RZRNAYUHWVFMIP-GDCKJWNLSA-N 0.000 description 1
- IXSNSMTVBCIFOP-UHFFFAOYSA-N 6-(8-methylnonoxy)-6-oxohexanoic acid Chemical compound CC(C)CCCCCCCOC(=O)CCCCC(O)=O IXSNSMTVBCIFOP-UHFFFAOYSA-N 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GOJCZVPJCKEBQV-UHFFFAOYSA-N Butyl phthalyl butylglycolate Chemical compound CCCCOC(=O)COC(=O)C1=CC=CC=C1C(=O)OCCCC GOJCZVPJCKEBQV-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000207199 Citrus Species 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 235000019774 Rice Bran oil Nutrition 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- RQTFYYZAKXXZOL-UHFFFAOYSA-N [O-2].[O-2].[Al+3].[Al+3] Chemical compound [O-2].[O-2].[Al+3].[Al+3] RQTFYYZAKXXZOL-UHFFFAOYSA-N 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 description 1
- ROPXFXOUUANXRR-YPKPFQOOSA-N bis(2-ethylhexyl) (z)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C/C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-YPKPFQOOSA-N 0.000 description 1
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- ZDVYABSQRRRIOJ-UHFFFAOYSA-N boron;iron Chemical compound [Fe]#B ZDVYABSQRRRIOJ-UHFFFAOYSA-N 0.000 description 1
- BEWFIPLBFJGWSR-UHFFFAOYSA-N butyl 12-acetyloxyoctadec-9-enoate Chemical compound CCCCCCC(OC(C)=O)CC=CCCCCCCCC(=O)OCCCC BEWFIPLBFJGWSR-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- GVEHJMMRQRRJPM-UHFFFAOYSA-N chromium(2+);methanidylidynechromium Chemical compound [Cr+2].[Cr]#[C-].[Cr]#[C-] GVEHJMMRQRRJPM-UHFFFAOYSA-N 0.000 description 1
- 235000020971 citrus fruits Nutrition 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920005565 cyclic polymer Polymers 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- 229940100539 dibutyl adipate Drugs 0.000 description 1
- CYOBXMQBHXAZSU-UHFFFAOYSA-L dichlorocobalt;pyridine-3-carboxamide Chemical compound Cl[Co]Cl.NC(=O)C1=CC=CN=C1.NC(=O)C1=CC=CN=C1 CYOBXMQBHXAZSU-UHFFFAOYSA-L 0.000 description 1
- PUFGCEQWYLJYNJ-UHFFFAOYSA-N didodecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCC PUFGCEQWYLJYNJ-UHFFFAOYSA-N 0.000 description 1
- HHECSPXBQJHZAF-UHFFFAOYSA-N dihexyl hexanedioate Chemical compound CCCCCCOC(=O)CCCCC(=O)OCCCCCC HHECSPXBQJHZAF-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical group CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical compound CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 235000021323 fish oil Nutrition 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 229910021343 molybdenum disilicide Inorganic materials 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- OVLGNUHSJCCFPG-UHFFFAOYSA-N nonoxybenzene;sulfuric acid Chemical compound OS(O)(=O)=O.CCCCCCCCCOC1=CC=CC=C1 OVLGNUHSJCCFPG-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CBFCDTFDPHXCNY-UHFFFAOYSA-N octyldodecane Natural products CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 229940055577 oleyl alcohol Drugs 0.000 description 1
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- BPJZKLBPJBMLQG-KWRJMZDGSA-N propanoyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OC(=O)CC BPJZKLBPJBMLQG-KWRJMZDGSA-N 0.000 description 1
- 239000008165 rice bran oil Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910003470 tongbaite Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、射出成形用組成物、製造法および使用法に関
する。さらに詳しくは、セラミック粉末や金属粉末の射
出成形用組成物、製造法および使用法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to injection molding compositions, methods of manufacture, and methods of use. More specifically, the present invention relates to compositions for injection molding of ceramic powders and metal powders, and methods for producing and using them.
[従来の技術]
従来、射出成形用組成物、たとえば、金属粉末射出成形
用組成物として、メタクリル酸エステル共重合体とエチ
レン−酢酸ビニル共重合体またはメタクリル酸エステル
共重合体と低密度ポリエチレンをバインダーとして用い
たものがある(たとえば、特開昭59−229403号
公報)。[Prior Art] Conventionally, a methacrylic ester copolymer and an ethylene-vinyl acetate copolymer or a methacrylic ester copolymer and a low-density polyethylene have been used as an injection molding composition, for example, a metal powder injection molding composition. Some are used as binders (for example, JP-A-59-229403).
[発明が解決しようとする問題点]
しかしこのものは、成形体から有機物を除去する(以下
脱脂と略記)のに高温を要し、また長時間を要する。[Problems to be Solved by the Invention] However, this method requires high temperature and a long time to remove organic matter from the molded article (hereinafter abbreviated as degreasing).
[問題点を解決するための手段〕
本発明者らは、成形体を脱脂する温度を低くし脱脂時間
を短時間にする射出成形用組成物を得るべく鋭意検討し
た結果、本発明に到達しな。[Means for Solving the Problems] The present inventors have conducted intensive studies to obtain an injection molding composition that lowers the temperature at which molded articles are degreased and shortens the degreasing time, and as a result, they have arrived at the present invention. Na.
すなわち、本発明は:セラミック粉末および/または金
属粉末(a)およびバインダーとしてのポリエーテル(
b)からなることを特徴とする射出成形用組成物;セラ
ミック粉末および/または金属粉末(a)およびポリエ
ーテル(1〕)を加熱、混練することを!lOg、とす
る射出成形用組成物の製造法;およびセラミック粉末お
よび/または金属粉末(a)およびポリエーテル(]〕
)からなる組成物を射出成形しを加熱除去することを特
徴とする射出成形用組成物の使用法である。That is, the present invention comprises: ceramic powder and/or metal powder (a) and polyether as binder (
An injection molding composition characterized by comprising b); heating and kneading ceramic powder and/or metal powder (a) and polyether (1)! 1Og; and ceramic powder and/or metal powder (a) and polyether (]]
) is a method of using an injection molding composition, which is characterized by injection molding a composition and removing the molded material by heating.
本発明において、ポリエーテルとしては一般式%式%(
1)
(式中、R□は活性水素原子含有化合物の残基;R2は
水素原子、アルキル基、芳香族炭化水素基ま/ごはアシ
ル基:Aは炭素数1〜4のアルキレン基またはアリール
基を側鎖にもった炭素数2〜4のアルキレン基である。In the present invention, the general formula % formula % (
1) (In the formula, R□ is a residue of a compound containing an active hydrogen atom; R2 is a hydrogen atom, an alkyl group, an aromatic hydrocarbon group or an acyl group; A is an alkylene group having 1 to 4 carbon atoms or an aryl group; It is an alkylene group having 2 to 4 carbon atoms and having a group in its side chain.
nは2以」二の整数である。n is an integer greater than or equal to 2.
Illは1・〜8である。)で示される化合物かあげら
ノ′しる 。Ill is 1.~8. ).
一般式(1)において、R1の活性水素原子含有(ヒ音
物の残基を構成する活性水素原子含有化合物としては、
水、アルコール類たとえば低分子ポリオール(エチレン
グリコール、プロピレングリコール、1,3−または1
.4−ブタンジオール、1.6−ヘキザンジオール、ネ
オペンチルグリコール、シクロヘキシレングリコール、
クリセリン、トリメチロールブ1コパン、ペンタエソス
リ1ヘール、ソルピ1ヘール、シュークロースなと)お
よび−価アルコール[脂11/j族(炭素数1〜20)
または芳香族−価アルコールなど]、フェノール類たと
えば゛、多佃1フェノール類[ビスフェノールAなとの
ビスフェノールなど)]および−価フエノール類[フェ
ノールナフト−ル;アルキル基(炭素数1〜12)また
はアリール基を有するフェノール類たとえばオフチルフ
ェノール、ノニルフェノール、ドデシルフコ−ノールお
よびフェニルフェノール
/′ことえはアルカノールアミン:脂肪族または芳香族
ポリアミン(エチレンジアミン、ジエチレンhIノアミ
ンなと)および脂肪族モノアミン[モノよ/Qはジアル
キル(炭素数1〜20)アミンなと]があムナらノ′し
る。In the general formula (1), the active hydrogen atom-containing compound of R1 (active hydrogen atom-containing compound constituting the residue of the phonon) is
Water, alcohols such as low molecular weight polyols (ethylene glycol, propylene glycol, 1,3- or 1-
.. 4-butanediol, 1,6-hexanediol, neopentyl glycol, cyclohexylene glycol,
chrycerin, trimethylolbutan, pentaesosuri, sucrose) and -hydric alcohols [fats 11/j group (carbon number 1 to 20)
or aromatic-hydric alcohols], phenols such as phenols [such as bisphenol such as bisphenol A] and -hydric phenols [phenol naphthol; alkyl groups (1 to 12 carbon atoms) or Phenols having an aryl group such as ophthylphenol, nonylphenol, dodecylfuconol and phenylphenol/'Kotoeha alkanolamines: aliphatic or aromatic polyamines (ethylene diamine, diethylene hI noamine, etc.) and aliphatic monoamines [monoyo/ Q is a dialkyl (carbon number 1-20) amine].
活性水素原子含有化合物のうち好ましいものは水および
低分子ポリオールであり、さらに好ましいものはエチレ
ングリコールおよびプロピレングリコールである。Among the active hydrogen atom-containing compounds, water and low molecular weight polyols are preferred, and ethylene glycol and propylene glycol are more preferred.
一般式(1)で、R2におけるアルキル基としては炭素
数1〜20のアルキル基たとえばメチル基、エチル基、
プ1コピル基、ブチル基、ヘキシル基、オクチル基およ
びテシル基かあげらhる。芳香成度(e 7J(素基と
してはアリール基(フェニル基、ナフチル基など);ア
リールアルヘール基(ベンジルノ1!、フェネチル基な
と);アルキルアリール基(オタナルフコーニル基、ノ
ニルフェニル基なと)があ()−られる。フ′シル基と
しては、炭素数2〜20のカルボン酸からのアシル基か
あげられる。In the general formula (1), the alkyl group in R2 is an alkyl group having 1 to 20 carbon atoms, such as a methyl group, an ethyl group,
Examples include 1-copyl group, butyl group, hexyl group, octyl group and tesyl group. Aromatic degree (e 7J (as a base group, aryl group (phenyl group, naphthyl group, etc.); arylarchel group (benzylno 1!, phenethyl group, etc.); alkylaryl group (otanafuconyl group, nonylphenyl group) ) is ()-. Examples of the ph'yl group include acyl groups derived from carboxylic acids having 2 to 20 carbon atoms.
F工2のうち好ましいものは水素原子および炭素数1〜
4のアルキル基であり、さらに好ましくは水素原子、メ
チル基およびエチル基である。Among F-techniques 2, preferred are hydrogen atoms and carbon atoms of 1 to 2.
4, more preferably a hydrogen atom, a methyl group, or an ethyl group.
Aの炭素数1〜4のアルキレン基としては、メチレン基
、エチレン基、プロピレン基、ブチレン−Jl(などが
あげられ、アリール基を側鎖にもった炭素数2〜11の
アルキレン基としては、フェニルエチレン基などがあげ
られる。n個のAは同一でも異なっていてもよい。Examples of the alkylene group having 1 to 4 carbon atoms in A include methylene group, ethylene group, propylene group, butylene-Jl (and the like; examples of the alkylene group having 2 to 11 carbon atoms having an aryl group in the side chain include: Examples include phenylethylene group. n A's may be the same or different.
へのうち好ましくは、エチレン基、プロピレン基、ブチ
レン基およびエチレン基とプロピレン基の01用の基で
あり、さらに好ましくは、エチレン基である。Among them, preferred are ethylene group, propylene group, butylene group, and a group for 01 of ethylene group and propylene group, and more preferred is ethylene group.
11は、好ましくは、4〜10万である。11 is preferably 40,000 to 100,000.
111は、好ましくは、1〜3である。111 is preferably 1-3.
−殺伐(1)で示されるポリエーテルの分子足は通常1
5()〜 i,ooo万であり、好ましくは、200〜
:i00万である。-The number of molecular legs of polyether indicated by (1) is usually 1
5() to i,ooo million, preferably 200 to
:i million.
一般式(1)で示されるポリエーテルの具体例としては
、前記活性水素原子含有化合物のアルキレンオA−サイ
ド(炭素数2〜4)付加物もしくはアルキレンオキザイ
ド(炭素数2〜4)の開環重合物[ポリエチレンオキサ
イド(分子量は通常150〜1,000万)、ポリエチ
レンオキサイド(分子量は通常200〜5,000)
、ボリテ1〜ラメチレングリコール(分子量は通常20
0〜3,000> 、エチレンオキザイドープロピレン
オキザイド共重合体(分子量は通常200〜2万)など
]および環状ポルマールの開環重合物[ポリオキシメチ
レン(分子量は通常3,000〜10万)などコなとお
よびこれらの2種以上の混合物があげられる。Specific examples of the polyether represented by the general formula (1) include alkylene oxide A-side (carbon numbers 2 to 4) adducts or alkylene oxides (carbon numbers 2 to 4) adducts of the active hydrogen atom-containing compound. Ring polymers [polyethylene oxide (molecular weight usually 1.5 to 10 million), polyethylene oxide (molecular weight usually 200 to 5,000)
, Volite 1 to ramethylene glycol (molecular weight is usually 20
0 to 3,000>, ethylene oxide-propylene oxide copolymers (molecular weight usually 200 to 20,000)] and ring-opening polymers of cyclic polymers [polyoxymethylene (molecular weight usually 3000 to 100,000), etc. ) and mixtures of two or more of these.
、二へらのうち好ましくは、ポリエチレンオキサイド、
ポリプロピレンオキ→ノーイl〜およびエチレンオキザ
イドープロピレンオキサイド共重合体であり、さらに好
ましくはポリエチレンオキサイドである。, Of the two spatulas, preferably polyethylene oxide,
These are polypropylene oxide→noyl and ethylene oxide do-propylene oxide copolymers, and polyethylene oxide is more preferable.
セラミック粉末としては、酸化物(酸化アルミニウム、
酸化ケイ素、酸化ジルコニウム、酸化チタニウム、ムラ
イ1へ、コープイエライ1〜、酸化ベリリウム、酸化マ
グネシウム、チタン酸バリウムなど)、炭化物(炭化ケ
イ素、炭化ホウ素、炭化アルミニウム、炭化タングステ
ン、炭化チタン、炭化ジルコニウム、炭化ハフニウム、
炭化クロム炭化バナジウム、炭素など)、窒化物(窒化
ケイ素、窒化アルミニウム、窒化ホウ素、窒化チタンな
ど)、ケイ化物(2ケイ化モリブデンなど)、硫化物(
硫化カドミウム、硫化亜鉛など)などおよびこれら2種
以上の混合物があげられる。Ceramic powders include oxides (aluminum oxide,
Silicon oxide, zirconium oxide, titanium oxide, Murai 1, Coop Yerai 1~, beryllium oxide, magnesium oxide, barium titanate, etc.), carbides (silicon carbide, boron carbide, aluminum carbide, tungsten carbide, titanium carbide, zirconium carbide, carbide) hafnium,
chromium carbide, vanadium carbide, carbon, etc.), nitrides (silicon nitride, aluminum nitride, boron nitride, titanium nitride, etc.), silicides (molybdenum disilicide, etc.), sulfides (
cadmium sulfide, zinc sulfide, etc.) and mixtures of two or more of these.
セラミック粉末の粒径は、通常0.01μm〜100ノ
/、m、好ましくは0.1μr■1〜50μ■1である
。The particle size of the ceramic powder is usually 0.01 μm to 100 μm, preferably 0.1 μm to 50 μm.
金属粉末としては、鉄粉(カルボニル鉄粉、アトマイズ
ド鉄粉、還元鉄粉など)、ニッケル粉(カルボニルニッ
ケル粉など)、アルミニウム粉、銅粉、チタン粉、ジル
コニウム粉、亜鉛粉、クロム粉、モリブデン粉、タング
ステン粉、ベリリウム粉、ゲルマニウム粉などおよび合
金粉(鉄−二° ブチル合金粉、ステンレス銅粉、鉄−
シリコン合金粉、鉄−ボロン合金粉など)などの金属粉
末およびこれら2′M!以上の混合物があげられる。こ
れらのほかにシリコン粉、ボロン粉などの非金属粉末も
含めることができる。Metal powders include iron powder (carbonyl iron powder, atomized iron powder, reduced iron powder, etc.), nickel powder (carbonyl nickel powder, etc.), aluminum powder, copper powder, titanium powder, zirconium powder, zinc powder, chromium powder, molybdenum powder. powder, tungsten powder, beryllium powder, germanium powder, etc., and alloy powders (iron-butyl alloy powder, stainless steel copper powder, iron-
Metal powders such as silicon alloy powder, iron-boron alloy powder, etc.) and these 2'M! Examples include mixtures of the above. In addition to these, non-metallic powders such as silicon powder and boron powder can also be included.
金属粉末の粒径は通常0.1μm〜100μm、好まし
くは0.1μn1〜50μrnである。The particle size of the metal powder is usually 0.1 μm to 100 μm, preferably 0.1 μm to 50 μm.
セラミック粉末と金属粉末の混合物(炭化タングステン
−コバルト、酸化アルミニウムーアルミニウムなど)も
使用できる。この混合物としては、セラミック粉末と金
属粉末を混合したものおよびセラミック粉末と金属粉末
の合金があげられる。Mixtures of ceramic and metal powders (tungsten carbide-cobalt, aluminum oxide-aluminum oxide, etc.) can also be used. This mixture includes a mixture of ceramic powder and metal powder and an alloy of ceramic powder and metal powder.
この合金の粒径としては通常0.1μm〜100μm、
好ましくは0.1μrn〜50μmである。The grain size of this alloy is usually 0.1 μm to 100 μm,
Preferably it is 0.1 μrn to 50 μm.
本発明の組成物には、必要により可塑剤、滑剤、界面活
性剤などを加えることができる。A plasticizer, a lubricant, a surfactant, etc. can be added to the composition of the present invention, if necessary.
可塑剤としては、フタル酸ニスデル(フタル酸ジメチル
、フタル酸ジエチル、フタル酸ジブチル、フタル百褪ジ
ヘブチル、フタル酸ジーn−オクチル、フタル酸ジー2
−エチルヘキシル、フタル酸ジインノニル、フタル酸ジ
イソデシル、フタル酸ジラウリル、フタル酸ジシクロヘ
キシル、フタル酸ブチルベンジルなど)、脂肪族−塩基
酸エステル(オレイン酸ブチル、グリセリンモノオレイ
ン酸エステルなど)、脂肪族二塩基酸エステル(アジピ
ン酸ジブチル、アジピン酸ジ−n−ヘキシル、アジピン
酸ジオクヂル、アジピン酸ジー2−エチルヘキシル、ア
ジピン酸ジ、イソデシル、アジピン酸ジアルキル(ジヘ
キシル、ジオクチル、ジデシルなど〉、アジピン酸ジブ
チルジグリコール、アゼライン酸ジー2−エチルブチル
、アゼライン酸ジー2−エチルヘキシル、セバシン酸ジ
ブチル、セバシン酸ジー2−エチルヘキシル、セバシン
酸ジオクチルなど)、二価アルコールエステル(ジエヂ
レングリコールジベンゾエーI・、l・リエヂレングリ
コールジー2−エヂルブチラー1〜など)、オキシ酸エ
ステル(アセチルリシノール酸メチル、アセチルリシノ
ール酸ブチル、ブチルフタリルブチルグリコレート、ク
エン酸アセチルトリエヂルクエン酸アセデルIヘリブチ
ルなど)、リン酸エステル(リン酸1〜リエヂル、リン
酸トリブチル、リン酸トリオクチル、リン酸1〜リクロ
ロエチル、リン酸)ヘリクレジル、リン酸1〜リブトキ
シエヂル、リン酸1ヘリスジク1コ1コブYコピル、リ
ン酸1−リス−(β−クロロプロピル)、リン酸トリフ
ェニル、リン酸オクヂルジフェニル、リン酸トリスイソ
プロピルフェニルなと)、マレイン酸エステル(マレイ
ン酸ジブチル、マレイン酸ジー2−エチルヘキシルなど
)、フマル酸ジブデル、トリメリット酸1〜リアルキル
(アルキルの炭素数は、通常4〜11)、lへリメリッ
1へ酸1ヘリスー2−エチルヘキシル、ポリオキシアル
キレン安息香酸エステル(ポリオキシエチレン安息香酸
エステルなと)、ポリエステル系可塑剤(ポリアジピン
酸プロピレングリコールなと)、エポキシ系可塑剤(エ
ポキシ脂肪酸エステルなと)、ステアリン酸系可塑剤、
塩素化パラフィンなとおよびこれら2神具−1−の混合
」勿かあ(すられる。As a plasticizer, Nisder phthalate (dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diheptyl phthalate, di-n-octyl phthalate, di-2 phthalate)
-ethylhexyl, diinnonyl phthalate, diisodecyl phthalate, dilauryl phthalate, dicyclohexyl phthalate, butylbenzyl phthalate, etc.), aliphatic-basic acid esters (butyl oleate, glycerin monooleate, etc.), aliphatic dibasic acids Esters (dibutyl adipate, di-n-hexyl adipate, dioctyl adipate, di-2-ethylhexyl adipate, di, isodecyl adipate, dialkyl adipate (dihexyl, dioctyl, didecyl, etc.), dibutyl diglycol adipate, azelain) di-2-ethylbutyl acid, di-2-ethylhexyl azelaate, dibutyl sebacate, di-2-ethylhexyl sebacate, dioctyl sebacate, etc.), dihydric alcohol ester (diethylene glycol dibenzoate I, l-diethylene glycol) Di-2-ethylbutylar 1~, etc.), oxyacid esters (methyl acetyl ricinoleate, butyl acetyl ricinoleate, butylphthalyl butyl glycolate, acetyltriedyl citrate, acedel I helibutyl citrate, etc.), phosphoric acid esters (phosphoric acid 1) ~liezyl, tributyl phosphate, trioctyl phosphate, 1-lichloroethyl phosphate, helicresyl phosphate, 1-libutoxyedyl phosphate, 1-helidic 1-cob Y-copyl phosphate, 1-lis-(β-chloropropyl phosphate) ), triphenyl phosphate, ocdyldiphenyl phosphate, trisisopropylphenyl phosphate), maleic acid esters (dibutyl maleate, di-2-ethylhexyl maleate, etc.), dibdel fumarate, 1-realkyl trimellitate ( The number of carbon atoms in alkyl is usually 4 to 11), 1 helimeric acid, 1 helic acid, 2-ethylhexyl, polyoxyalkylene benzoate (polyoxyethylene benzoate, etc.), polyester plasticizer (polyadipate propylene glycol) ), epoxy plasticizer (epoxy fatty acid ester), stearic acid plasticizer,
Chlorinated paraffin and a mixture of these two divine tools -1-'Nakaaa (Surareru).
これらのうち好ましくは、フクル酸エステル、脂肪族二
塩基酸エステルおよびポリオキシアルキレン安息香酸エ
ステルである。Among these, preferred are fucuric acid esters, aliphatic dibasic acid esters, and polyoxyalkylene benzoic acid esters.
滑剤としては、脂肪族炭化水素(流動パラフィン、マイ
クロクリスタリンワックス、天然パラツー]]−−
イン、合成パラフィン、ポリオレフィンワックスおよび
これらの部分酸化物、フッ化物、塩化物など)、高級脂
肪族系アルコール(ラウリルアルコール、ステアリルア
ルコール、オレイルアルコール、混合脂肪族アルコール
など)、高級脂肪酸[ラウリン酸、ステアリン酸、混合
脂肪酸(牛脂、魚油、ヤシ油、大豆油、ナタネ油、米ヌ
カ油なとからの脂肪酸)など]、脂肪酸アミド(オレイ
ン酸アミド、ステアリン酸アミド、メヂレンービスース
テアロアミド、エチレン−ビス−ステア1コアミドなど
)、金属石けん(ステアリン酸バリウム、ステアリン酸
カルシウム、ステアリン酸亜鉛、ステアリン酸アルミニ
ウム、ステアリン酸マグネシウムなと)、脂肪酸ニスデ
ル[−価アルコールの高級脂肪酸エステル(オレイン酸
ブチルなど)、多filliアルコールの高級脂肪酸[
部分]エステル(モノオレイン酸グリセリンなど)、モ
ンタンワックスなど]、脂肪族アミン[1級アミン例え
ばC5〜3oアルキルアミン(ステアリルアミン等)、
2級および/または3級アミンたとえば特願昭63=1
−2−
一36380号明細書記載のもの]など、およびこれら
2種以」−の混合物かあげられる。これらのうち好まし
くは脂肪族炭化水素、高級脂肪酸、脂肪酸エステル、モ
ンタンワックス、および脂肪族2級および/または3級
アミンである。As lubricants, aliphatic hydrocarbons (liquid paraffin, microcrystalline wax, natural paraffin wax, synthetic paraffin, polyolefin wax and their partial oxides, fluorides, chlorides, etc.), higher aliphatic alcohols ( lauryl alcohol, stearyl alcohol, oleyl alcohol, mixed fatty alcohols, etc.), higher fatty acids [lauric acid, stearic acid, mixed fatty acids (fatty acids from beef tallow, fish oil, coconut oil, soybean oil, rapeseed oil, rice bran oil, etc.) ], fatty acid amides (oleic acid amide, stearic acid amide, medilene-bis-stearamide, ethylene-bis-stear 1 coamide, etc.), metal soaps (barium stearate, calcium stearate, zinc stearate, aluminum stearate) , magnesium stearate), fatty acid Nisdel [-higher fatty acid esters of alcohols (butyl oleate, etc.), higher fatty acids of polyalcohols [
parts] esters (such as glyceryl monooleate), montan wax, etc.], aliphatic amines [primary amines such as C5-3o alkyl amines (stearylamine, etc.),
Secondary and/or tertiary amines, e.g. Japanese Patent Application No. 63=1
-2- those described in the specification of No. 136380], and mixtures of two or more of these. Among these, preferred are aliphatic hydrocarbons, higher fatty acids, fatty acid esters, montan wax, and aliphatic secondary and/or tertiary amines.
また、界面活性剤としては、たとえば米国特許第113
314/17号明細書記載のアニオン界面活性剤(ドデ
シルベンゼンスルホン酸塩、ポリオキシエチレン(4)
ノニルフェニルエーテル硫酸塩など)。In addition, as a surfactant, for example, US Pat. No. 113
Anionic surfactant (dodecylbenzenesulfonate, polyoxyethylene (4) described in No. 314/17)
nonylphenyl ether sulfate, etc.).
非イオン界面活性剤(ポリオキシエチレン(4)ステア
リルアミン、ステアリン酸モノ−および/またはジェタ
ノールアミ1〜など)、カチオン界面活性剤(ラウリル
1〜リメチルアンモニウムクロライ1へなと)4両性界
面活性剤(ステアリルジメチルカルボA−ジメチルベタ
イン等)、およびこれらの2種以」二の混合物か挙げら
れる。Nonionic surfactants (polyoxyethylene (4) stearylamine, stearic acid mono- and/or jetanolamine 1~, etc.), cationic surfactants (lauryl 1~limethylammonium chloride 1~) 4 amphoteric Examples include surfactants (stearyldimethylcarbo-A-dimethylbetaine, etc.), and mixtures of two or more thereof.
本発明の組成物において、各成分の含有量は、組成物の
重量に基ついて(a)は通常50〜99.9%、好まし
くは、70〜999%である。(a)が50%未満ては
、成形体および脱脂後の脱脂体の強度が低下し、99.
9%を越えると成形用組成物の成形性が低下する。In the composition of the present invention, the content of each component (a) is usually 50 to 99.9%, preferably 70 to 999%, based on the weight of the composition. If (a) is less than 50%, the strength of the molded body and the degreased body after degreasing will decrease, and the strength will be 99.
If it exceeds 9%, the moldability of the molding composition decreases.
(1))は通常o、i〜50%、好ましくは0.1〜3
0%である。(1))が0.1%未満では、成形用組成
物の成形性が低下する。50%を越えると脱脂後の脱脂
能の強度か低下する。(1)) is usually o, i~50%, preferably 0.1~3
It is 0%. If (1)) is less than 0.1%, the moldability of the molding composition decreases. If it exceeds 50%, the strength of the degreasing ability after degreasing will decrease.
本発明において、(a)および頁b)に加えて、必要に
より溶剤可溶性の熱可塑性樹脂(C)を小割合[(b)
と(C)の合計の重量に基づいて、30%未満。In the present invention, in addition to (a) and page b), if necessary, a small proportion of a solvent-soluble thermoplastic resin (C) [(b)
Less than 30% based on the combined weight of and (C).
好ましくは20%未満、とくに18%以下]で用いるこ
とかできる。(C)としては特願昭61−266482
号明細書記載のものが挙げられる。It can be used preferably at less than 20%, especially at most 18%. (C) is patent application No. 61-266482.
Examples include those described in the specification of the No.
残部(可塑剤、滑剤、界面活性剤など)は通常O〜40
%である。The remainder (plasticizer, lubricant, surfactant, etc.) is usually O~40
%.
本発明の組成物は(a)および(b)必要により(C)
および残部を必要により混合および乾燥し、その後、加
熱、混練し、冷却後粉砕(粗砕)し、必要によりペレッ
I・化することにより製造することができる。The composition of the present invention comprises (a) and (b) optionally (C)
and the remainder are mixed and dried if necessary, then heated, kneaded, cooled and pulverized (crushed), and if necessary formed into pellets.
−1−記において混合はV型ミキザー、ヘンシェルミA
−ザーなとの場合、混合温度は通常O〜100°C1I
lrましくは0〜50°Cて、混合時間は通常10分〜
6時間、好ましくは30分〜2時間で行う。ボールミル
なとの場合、乾式まノごは湿式で、混合温度は通常O〜
50’(:て、混合時間は通常6時間〜72時間、好ま
しくは6時間〜36時間で行う。In -1-, mixing is done using a V-type mixer, Henschelmi A
- In the case of laser, the mixing temperature is usually O~100°C1I
Preferably at 0-50°C, mixing time is usually 10 minutes.
It is carried out for 6 hours, preferably 30 minutes to 2 hours. In the case of a ball mill, the dry method is a wet method, and the mixing temperature is usually O ~
The mixing time is usually 6 hours to 72 hours, preferably 6 hours to 36 hours.
乾煤は空気中または不活性ガス雰囲気中で、常圧ま)ご
は減圧下で、加熱および/または熱風下で行う。Dry soot is carried out in air or in an inert gas atmosphere, under normal pressure or reduced pressure, and under heating and/or hot air.
混線はパンバリーミ式ザー、プラス1〜ミル、ニーグー
、加圧ニーグー、ロールミル、スクリュー式押出機なと
の通常の混練機を用い、混線温度は通常jjO〜300
’C1好ましくは50〜200’Cで、温度コン1ヘロ
ールは定温、昇温、降温などで行う。混練時間は通常1
0分〜10時間、好ましくは10分〜3時間で行う。For mixing, use a normal kneading machine such as a Pamberimi type mixer, plus 1~mil, Nigu, pressurized Nigu, roll mill, or screw extruder, and the mixing temperature is usually JJO~300.
'C1 is preferably 50 to 200'C, and temperature control is carried out by constant temperature, temperature increase, temperature decrease, etc. Kneading time is usually 1
It is carried out for 0 minutes to 10 hours, preferably 10 minutes to 3 hours.
混練の方法として、全部を一度に仕込み混練する方法、
一部を混練し、ついて残部を加えて混線する方法[(1
))、(c)などを加えて混練し、ついで(il)を加
えて混練する方法。(a)を仕込み、ついで(b)、
(C)などを加えて混練する方法など]などがあげらノ
する。The kneading method is to mix everything at once,
A method of mixing by kneading a part and then adding the rest [(1
)), (c), etc. are added and kneaded, and then (il) is added and kneaded. Prepare (a), then (b),
(C) etc. and kneading], etc.
本発明の組成物を用いて射出成形、押出成形、プレス成
形などによりシー1へ状または複雑形状物を成形し、脱
脂し、焼結し、必要により加工して成形品を招−る。Using the composition of the present invention, a sheet 1 or a complex-shaped object is formed by injection molding, extrusion molding, press molding, etc., degreased, sintered, and processed as necessary to form a molded product.
成形は射出成形機、押出成形機、プレス成形機などの通
常の成形機を用い、成形圧力は通常10〜20、000
kK/ Iτ、好ましくは20−10.000kK/
a(、成形温度は通常20〜300’C2好ましくは5
0〜200°Cて行う。For molding, a normal molding machine such as an injection molding machine, an extrusion molding machine, or a press molding machine is used, and the molding pressure is usually 10 to 20,000.
kK/Iτ, preferably 20-10.000kK/
a (, the molding temperature is usually 20 to 300'C2, preferably 5
Perform at 0-200°C.
11(a脂は通常、酸化性、還元性または不活性ガス雰
囲気下で、減圧、常圧または加圧下で通常1〜500°
C/l+r、好ましくは1〜200 ’C/llrの昇
温速度で200〜500°Cまで昇温し、200〜50
0’Cで通常10時間以内、好ましくは5時間以内保持
することにより行わ〕′しる。11 (A fat is usually heated at 1 to 500° under reduced pressure, normal pressure, or increased pressure in an oxidizing, reducing, or inert gas atmosphere.
C/l+r, preferably 1 to 200' C/llr heating rate to 200 to 500 °C, 200 to 50
This is carried out by holding at 0'C for usually 10 hours or less, preferably 5 hours or less.
焼結は通常、酸化性、還元性または不活性ガスチ1′;
囲気下で減圧、常圧または加圧下で600℃〜2.50
0℃で行う。Sintering is usually performed using an oxidizing, reducing or inert gas mixture;
600℃~2.50 under reduced pressure, normal pressure or increased pressure under ambient atmosphere
Perform at 0°C.
[実施例]
以下、実施例および比較例により本発明をさらに説明す
るが、本発明はこれに限定されるものではない。実施例
および比較例中の部は重量部であり、欧州したアルミナ
粉末の平均粒径は1μm以下、またステンレス粉末の平
均粒径は10μrTlである。[Examples] The present invention will be further described below with reference to Examples and Comparative Examples, but the present invention is not limited thereto. In Examples and Comparative Examples, parts are parts by weight, and the average particle size of European alumina powder is 1 μm or less, and the average particle size of stainless steel powder is 10 μrTl.
実施例1
ラボプラス1へミルを用い、80°C、ローター回転1
130叩+11でポリエチレンオキサイド(分子量10
万)」−3よひアルミナ粉末を仕込み、80°C、ロー
ター凹転数501朋11で30分間混練した。この混練
物を粉砕し、射出成形用組成物(1)を得た。配合割合
を次に示す。Example 1 Using a mill to Labo Plus 1, 80°C, rotor rotation 1
Polyethylene oxide (molecular weight 10
Alumina powder was charged and kneaded for 30 minutes at 80°C and a concave rotor speed of 501 to 11. This kneaded material was pulverized to obtain a composition for injection molding (1). The blending ratio is shown below.
アルミナ粉末 100部ポリエ
チレンオキザイド(分子量10万)20.0部実施例2
実施例1と同様にして、混練、粉砕を行い、下記のt1
1成の本発明の射出成形用組成物(2)を得た。Alumina powder 100 parts Polyethylene oxide (molecular weight 100,000) 20.0 parts Example 2 Kneading and pulverization were carried out in the same manner as in Example 1, and the following t1
A single injection molding composition (2) of the present invention was obtained.
ステンレス粉末 100部ポリエ
チレンオキサイド(分子量2万)10.0部実施例3
ラボプラスhミルを用い、130°C、ローター回81
1云1730rl)Illでijでリメタクリル酸フチ
ルおよび゛ポリエチレンオキサイド(分子量20万)を
仕込み、溶融させ−たのち、アルミナ粉末およびモンタ
ンワックスを徐々に加え、全量投入後、130°C、ロ
ーター凹転数5Orpmで30分間混練した。この混練
物を粉砕し、射出成形用組成物(3)を得た。配合割合
を次に示す。Stainless steel powder 100 parts Polyethylene oxide (molecular weight 20,000) 10.0 parts Example 3 Using Labo Plus H Mill, 130°C, rotor speed 81
After charging and melting phthyl remethacrylate and polyethylene oxide (molecular weight 200,000), gradually add alumina powder and montan wax, and after adding the entire amount, heat at 130°C in a rotor concave. The mixture was kneaded for 30 minutes at a rotation speed of 5 rpm. This kneaded material was pulverized to obtain a composition for injection molding (3). The blending ratio is shown below.
ポリメタクリル酸ブチル 3.2部ポリエ
チレンオキ−ナイド(分子量20万) 15.0部モン
クンワックス 1.6部アルミナ
粉末 100部実施例4および
比較例1.2
実施例3と同様にして、混練、粉砕を行い、下記の組成
の本発明の射出成形用組成物(4)および比較例の#r
l成物酸物Julおよび(b)得な。Polybutyl methacrylate 3.2 parts Polyethylene oquinide (molecular weight 200,000) 15.0 parts Monkun wax 1.6 parts Alumina powder 100 parts Example 4 and Comparative Example 1.2 Kneaded in the same manner as Example 3 The injection molding composition (4) of the present invention having the following composition and #r of Comparative Example were prepared by pulverization.
1 compound acid Jul and (b) obtained.
実施例t1
ステンレス粉末 ioo部ポリメ
タクリル酸ブチル 1.6部ボリエナし・
ンオA−ザイ1へ(分子量20万)7.5部モンクンワ
ックス 1.0部比較例1
アルミナ粉末 100部ポリ
メタクリル酸ブチル 6.5部エナレンー
酢酸ビニル共重合(4< 5.5部フタル酸ジ
ブチル 2.5部モンクンワックス
2.9部jL較例2
スデンレス粉末 100部ポリメ
タクリル酸ブチル 3.2部エチレン−酢
酸ビニル共重合体 2.8部ノタル百褪シフ゛チ
ル 1.3部モンクンワックス
1.3部実施例5〜8、比1咬例
3〜6
実施例]。〜4の本発明の組成物(1)〜(4)および
比:liy例1.2の組成物(a)および(b)を射出
成形機(スクリュー式)を用いて、射出圧力1,500
kg/αK、成形温度150’Cて射出成形し、射出成
形体を得な。Example t1 Stainless steel powder Ioo part Polybutyl methacrylate 1.6 parts Boliena
To A-Zai 1 (molecular weight: 200,000) 7.5 parts Monkun wax 1.0 parts Comparative example 1 Alumina powder 100 parts Polybutyl methacrylate 6.5 parts Enalene-vinyl acetate copolymerization (4 < 5.5 parts Phthalate) Dibutyl acid 2.5 parts Monkun wax 2.9 parts jL comparative example 2 Sudenless powder 100 parts Polybutyl methacrylate 3.2 parts Ethylene-vinyl acetate copolymer 2.8 parts wax
1.3 parts Examples 5-8, ratio 1 bite Examples 3-6 Examples]. ~4 compositions (1) to (4) of the present invention and compositions (a) and (b) of Example 1.2 were molded at an injection pressure of 1,500 using an injection molding machine (screw type).
kg/αK and injection molding at a molding temperature of 150'C to obtain an injection molded article.
−圭9− この射出成形体を脱脂、焼結し、成形品を得/ご。-Kei 9- This injection molded body is degreased and sintered to obtain a molded product.
この成形品のミクロクラック(MC>発生状況、嵩比重
および相対密度(%)を調へた。その結果を表−1−に
示ず。The occurrence of microcracks (MC>), bulk specific gravity, and relative density (%) of this molded article were investigated.The results are not shown in Table 1-.
表−1、
注)*脱脂条件 ■:脱脂最高到達温度 300’C脱
脂時間 32時間;
■:脱脂最高到達温度 400’C
脱脂時間 52時間。Table 1, Note) *Degreasing conditions ■: Maximum degreasing temperature 300'C Degreasing time 32 hours; ■: Maximum degreasing temperature 400'C Degreasing time 52 hours.
柑焼結 イ、空気中、1.GOO’CX2時間;口、減
圧下、1 、250’CX 2時間。Citrus sintering A. In the air, 1. GOO'CX 2 hours; oral, under reduced pressure, 1,250'CX 2 hours.
4月ミクロクラック発生状況 ○:発生ぜず;×:発生。Micro crack occurrence status in April ○: No occurrence; ×: Occurrence.
[発明の効果] 本発明の組成物は、下記の効果を奏する。[Effect of the invention] The composition of the present invention has the following effects.
■ 本発明の組成物は、成形能脱脂時の脱脂温度を低下
し、また、脱脂時間を短縮することができる。(2) The composition of the present invention can lower the degreasing temperature during moldability degreasing and shorten the degreasing time.
■ 焼成体中には、炭素分等不純物をほとんど残さない
。■ Almost no impurities such as carbon remain in the fired product.
■ 射出成形により密度の高い成形体か得られる■ 紅
し軒な力’M糸i!百氷かイ号られる。■ A molded body with high density can be obtained by injection molding. Hyakuhyo is given the title.
(■ 本発明の組成物を1吏川して製造された成形品は
、相対密度か高く、高い強度を有する。(■ Molded articles produced by applying the composition of the present invention have a high relative density and high strength.
■ 」1記効果のほかに、(a)および(1))からな
る組成物を用いノコ場合、脱脂、力”直結時の変形を少
なくすることができる。(2) In addition to the effects described in item 1, when using a saw with the composition of (a) and (1)), deformation during degreasing and direct application of force can be reduced.
I;(−来、セラミック粉末や金属粉末の複雑形状の射
出成形体を脱脂するのに、高温、長時間を要し/ご。こ
ス1はバインダー等、有機物が急激に分解気(しするこ
とから生じる成形体のワレを防止するなめにとらざるを
得ない方策であった。本発明の組成物は、比較的低温で
脱脂できることから、脱脂時間の短縮がはかれる。I; (-Nowadays, degreasing complex-shaped injection molded bodies made of ceramic powder or metal powder requires high temperatures and a long time.) This is because organic substances such as binders rapidly decompose and emit gas. This was an unavoidable measure to prevent cracking of the molded product caused by this.The composition of the present invention can be degreased at a relatively low temperature, so the degreasing time can be shortened.
Claims (1)
びバインダーとしてのポリエーテル(b)からなること
を特徴とする射出成形用組成物。 2、(b)の分子量が150〜1000万である請求項
1記載の組成物。 3、(b)が一般式 ▲数式、化学式、表等があります▼(1) (式中、R_1は活性水素原子含有化合物の残基;R_
2は水素原子、アルキル基、芳香族炭化水素基またはア
シル基;Aは炭素数1〜4のアルキレン基またはアリー
ル基を側鎖にもった炭素数2〜4のアルキレン基である
。nは2以上の整数である。 mは1〜8である。)で示される化合物である請求項1
または2記載の組成物。 4、セラミック粉末および/または金属粉末(a)およ
びポリエーテル(b)を加熱、混練することを特徴とす
る射出成形用組成物の製造法。 5、セラミック粉末および/または金属粉末(a)およ
びポリエーテル(b)からなる組成物を射出成形し(b
)を加熱除去することを特徴とする射出成形用組成物の
使用法。[Claims] 1. An injection molding composition comprising ceramic powder and/or metal powder (a) and polyether (b) as a binder. 2. The composition according to claim 1, wherein the molecular weight of (b) is 1.5 to 10 million. 3. (b) is a general formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (1) (In the formula, R_1 is the residue of a compound containing an active hydrogen atom; R_
2 is a hydrogen atom, an alkyl group, an aromatic hydrocarbon group, or an acyl group; A is an alkylene group having 1 to 4 carbon atoms or an alkylene group having 2 to 4 carbon atoms having an aryl group as a side chain. n is an integer of 2 or more. m is 1-8. ) Claim 1 is a compound represented by
Or the composition according to 2. 4. A method for producing an injection molding composition, which comprises heating and kneading ceramic powder and/or metal powder (a) and polyether (b). 5. Injection molding a composition consisting of ceramic powder and/or metal powder (a) and polyether (b)
) is removed by heating.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10850688A JPH01278558A (en) | 1988-04-30 | 1988-04-30 | Composition for injection molding production thereof and usage thereof |
AT89301582T ATE100745T1 (en) | 1988-02-18 | 1989-02-17 | MOLDABLE COMPOSITION. |
EP89301582A EP0329475B1 (en) | 1988-02-18 | 1989-02-17 | Mouldable composition |
DE89301582T DE68912613T2 (en) | 1988-02-18 | 1989-02-17 | Moldable composition. |
US07/733,979 US5432224A (en) | 1988-02-18 | 1991-07-22 | Moldable composition, process for producing sintered body therefrom and products from same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10850688A JPH01278558A (en) | 1988-04-30 | 1988-04-30 | Composition for injection molding production thereof and usage thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01278558A true JPH01278558A (en) | 1989-11-08 |
Family
ID=14486507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10850688A Pending JPH01278558A (en) | 1988-02-18 | 1988-04-30 | Composition for injection molding production thereof and usage thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01278558A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007223036A (en) * | 2007-03-26 | 2007-09-06 | Allied Material Corp | Cu-w pipe and manufacturing method thereof, and electric discharging pipe electrode using the same and manufacturing method thereof |
JP2011140535A (en) * | 2010-01-05 | 2011-07-21 | Atect Corp | Method for producing organic binder and organic binder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61222953A (en) * | 1985-03-28 | 1986-10-03 | ライオン株式会社 | Additive for forming ceramics |
JPS62216955A (en) * | 1986-03-14 | 1987-09-24 | 鳴海製陶株式会社 | Ceramic composition for injection molding |
-
1988
- 1988-04-30 JP JP10850688A patent/JPH01278558A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61222953A (en) * | 1985-03-28 | 1986-10-03 | ライオン株式会社 | Additive for forming ceramics |
JPS62216955A (en) * | 1986-03-14 | 1987-09-24 | 鳴海製陶株式会社 | Ceramic composition for injection molding |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007223036A (en) * | 2007-03-26 | 2007-09-06 | Allied Material Corp | Cu-w pipe and manufacturing method thereof, and electric discharging pipe electrode using the same and manufacturing method thereof |
JP2011140535A (en) * | 2010-01-05 | 2011-07-21 | Atect Corp | Method for producing organic binder and organic binder |
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