JPH01274446A - Wafer holding basket - Google Patents

Wafer holding basket

Info

Publication number
JPH01274446A
JPH01274446A JP63103472A JP10347288A JPH01274446A JP H01274446 A JPH01274446 A JP H01274446A JP 63103472 A JP63103472 A JP 63103472A JP 10347288 A JP10347288 A JP 10347288A JP H01274446 A JPH01274446 A JP H01274446A
Authority
JP
Japan
Prior art keywords
wafer
ribs
groove
basket
separately provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63103472A
Other languages
Japanese (ja)
Inventor
Takashi Omoto
大本 隆
Tatsuhiko Matake
間竹 達彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Siltronic Japan Corp
Original Assignee
Nippon Steel Corp
NSC Electron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp, NSC Electron Corp filed Critical Nippon Steel Corp
Priority to JP63103472A priority Critical patent/JPH01274446A/en
Publication of JPH01274446A publication Critical patent/JPH01274446A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE:To prevent contact of the mirror surface of a wafer with separately provided ribs in conveying and in transportation in a pattern housed in a case and to protect the wafer from contamination and breakdown, by providing a groove in a flexible supporting mechanism, and shifting the central line of the groove from the central line of the interval between ribs. CONSTITUTION:A wafer W is insered into a gap between separately provided ribs 16 and 17 from the open upper part of a basket 1. The wafer is supported with flexible supporting mechanisms 18 and 19. A groove 21 is provided so that it is shifted from a central line 22 between the separately provided ribs 16. Since the wafer W is supported on the bottom of such a groove 21, the wafer W is inclined so that only one surface is in contact with the separately provided rib 16. Therefore, the mirror surface of the wafer W is held in the basket 1 in the non-contact state. Since vibration in conveying the wafer W is absorbed with the flexible supporting mechanism 18, shock is not applied to the wafer, and breakdown is prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体ウェーハを処理工程内において搬送す
る際に汚染から保護するとともに、ケースに収容して輸
送する際に損壊および汚染から保護するウェーハ保持用
かごに関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention protects semiconductor wafers from contamination when they are transported within a processing process, and protects them from damage and contamination when they are transported in a case. This invention relates to a wafer holding basket.

〔従来の技術〕[Conventional technology]

半導体ウェーハは、片面が鏡面研磨された状態でかごに
保持されて処理工程間を搬送され、また、同様の状態で
ケースに収納されて輸送される。従来のウェーハ保持用
かごとして、上面および底面が開放され、対向する一対
の側壁が該底面側で内方に向けて湾曲し、該側壁の左右
両端は端壁で連結され、該側壁の両内面には複数の隔置
リブが対向して設けられ、該隔置リブの間にウェーハを
挿入して多数のウェーハを平行に立てて保持する形式の
ものが使用されている。また、従来のウェーハ輸送用ケ
ースとして、このようなウェーハ保持用かごを箱に収容
して蓋をする形式のものが使用されている。
Semiconductor wafers are held in baskets with one side mirror-polished and transported between processing steps, and are also transported in the same state in cases. As a conventional wafer holding basket, the top and bottom surfaces are open, a pair of opposing side walls are curved inward on the bottom side, the left and right ends of the side walls are connected by an end wall, and both inner surfaces of the side walls are connected. A type is used in which a plurality of spacing ribs are provided facing each other, and wafers are inserted between the spacing ribs to hold a large number of wafers in parallel. Further, as a conventional wafer transport case, a case in which such a wafer holding basket is housed in a box and covered with a lid is used.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

このような従来のウェーハ保持用かごを使用するとき、
ウェーハの鏡面が隔置リブに接触して、鏡面が汚染され
るという問題があった。汚染は、主として、隔置リブを
構成しているプラスチック材料の摩耗粉(パーティクル
)が付着することにより生じる。また、従来のウェーハ
輸送用ケースにおいては、各ウェーハは、蓋を閉じた状
態では蓋内に設けられたウェーハ押さえの作用により隔
置リブと接触しないが、蓋を開放した状態では接触する
ので、やはり鏡面が汚染される。
When using such traditional wafer holding baskets,
There was a problem in that the mirror surface of the wafer came into contact with the spacing ribs and the mirror surface was contaminated. Contamination is primarily caused by adhesion of particles from the plastic material that makes up the spacing ribs. Furthermore, in conventional wafer transport cases, when the lid is closed, each wafer does not come into contact with the spacing ribs due to the action of the wafer retainer provided in the lid, but when the lid is open, each wafer comes into contact with the spacing ribs. The mirror surface is still contaminated.

本発明は、ウェーハを処理工程内において搬送する際に
も、ケースに収容して輸送する際にも、ウェーハの鏡面
を隔置リブと接触させず、ウェーハを汚染および損壊か
ら保護することを目的とする。
An object of the present invention is to protect the wafer from contamination and damage by preventing the mirror surface of the wafer from coming into contact with the spacer ribs, both when the wafer is transported within a processing process and when it is transported in a case. shall be.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の具体例を図面により説明する。第1図に示すよ
うに、本発明のウェーハ保持用かご土は、上面および底
面11が開放され、対向する一対の側壁12.13が底
面11側で内方に向けて湾曲しており、側壁12.13
の左右両端は端壁14゜15で連結され、側壁12.1
3の側内面には複数の隔置リブ16,17が対向して設
けられ、側壁12.13の底面ll側の終焉部に可撓性
支持機構18.19が設けられている。可撓性支持機構
18.19には、第2図に示すように複数の溝21が設
けられ、溝21の中心線と複数の隔置リブ16.17の
各リブ間の中心線22とがずらして設けられている。
A specific example of the present invention will be explained with reference to the drawings. As shown in FIG. 1, the wafer holding basket of the present invention has an open top surface and a bottom surface 11, and a pair of opposing side walls 12 and 13 that are curved inward on the bottom surface 11 side. 12.13
The left and right ends of the
A plurality of spaced-apart ribs 16, 17 are provided oppositely on the side inner surface of the side wall 12.13, and a flexible support mechanism 18.19 is provided at the end of the side wall 12.13 on the bottom side 11. The flexible support mechanism 18.19 is provided with a plurality of grooves 21, as shown in FIG. They are staggered.

〔作 用〕[For production]

ウェーハWは、第1図に示すかご上の開放された上部か
ら、側壁12.13の周内面に対向して設けられた隔置
リブ16,17の各間隙に装入され、可撓性支持機構1
8.19で支持される。なお、かご上の一方の端壁15
は、ウェーハWを自動機あるいは真空ビンセットで取り
出すために開放されており、割り出しバー20が中間部
に延在している。
The wafers W are loaded from the open top of the cage shown in FIG. Mechanism 1
Supported by 8.19. In addition, one end wall 15 on the car
is open for taking out the wafer W with an automatic machine or a vacuum bin set, and an indexing bar 20 extends in the middle.

かご上にウェーハが保持されている状態を第1図A−A
視の一部断面で示すと、第2図のように、隔置リブ16
の各リブ間の中心線22からずらして設けられている溝
21の底部で、ウェーハWが可撓性支持機構18に支持
されるので、ウェーハWは傾斜して一方の面のみが隔置
リブ16と接触する。ウェーハWの傾斜は、隔置リブ1
6,17を第3図のように傾斜させておくと、より確実
になる。したがって、ウェーハWの鏡面は無接触の状態
でかご土に保持される。また、ウェーハWを処理工程間
を搬送する際の振動が可撓性支持機構18で吸収される
ので、ウェーハWに衝撃がかからず、損壊が防止される
Figure 1 A-A shows the state in which wafers are held on the basket.
When shown in a partial cross section, as shown in FIG.
Since the wafer W is supported by the flexible support mechanism 18 at the bottom of the groove 21 which is provided offset from the center line 22 between each rib, the wafer W is tilted so that only one side has the spaced apart ribs. Contact with 16. The inclination of the wafer W is determined by the spacing rib 1
If 6 and 17 are tilted as shown in Fig. 3, it will be more reliable. Therefore, the mirror surface of the wafer W is held on the cage in a non-contact state. Further, since vibrations generated when the wafer W is transported between processing steps are absorbed by the flexible support mechanism 18, no impact is applied to the wafer W, and damage to the wafer W is prevented.

ウェーハWを支持したかご上は第4図のような箱主に収
容され、第5図のようなM↓を装着して輸送することが
できる。第4図の31は、かご上を収容する際にかご上
を誘導するガイドである。
The top of the basket supporting the wafers W is housed in a box holder as shown in FIG. 4, and can be transported by attaching M↓ as shown in FIG. Reference numeral 31 in FIG. 4 is a guide for guiding the top of the car when storing the top of the car.

苦土の保合凸部43.44が箱主δ係合凹部32゜33
に係合すると、かご上は、箱主内のガイド31とM↓内
の押さえ具41によって固定される。つ工−ハWは、可
撓性支持機構18.19と苦土内のウェーハ押さえ42
によって上下方向に固定される。このとき、ウェーハ押
さえ42との位置関係によってウェーハの裏面も隔置リ
ブ16,17と無接触の状態で保持される。この状態を
第6図に示すが、可撓性支持機構18が第6図のように
隔置リブ16のところで分割された非連続式になってい
ると、ウェーハWはそれぞれ独立して支持されるので、
ウェーハの挿入されてない箇所があっても、その影響を
うけて押さえ効果が低下することがない。
The retaining convex portions 43 and 44 of the black clay are the box main δ engaging concave portions 32°33
When engaged, the top of the car is fixed by the guide 31 inside the box owner and the presser 41 inside M↓. The tool W has a flexible support mechanism 18.19 and a wafer holder 42 in the clay.
It is fixed in the vertical direction by At this time, the back surface of the wafer is also held in a non-contact state with the spacing ribs 16 and 17 due to the positional relationship with the wafer holder 42. This state is shown in FIG. 6. If the flexible support mechanism 18 is of a discontinuous type divided at the spacer rib 16 as shown in FIG. 6, each wafer W is supported independently. Because
Even if there is a part where the wafer is not inserted, the holding effect will not be affected by this.

〔発明の効果〕〔Effect of the invention〕

本発明のウェーハ保持用かごを使用することにより、ウ
ェーハを処理工程内において搬送する際にも、ケースに
収容して輸送する際にも、ウェーハの鏡面を無接触の状
態で保持することができるので、ウェーハを汚染および
損壊から保護することができる。
By using the wafer holding basket of the present invention, the mirror surface of the wafer can be held in a non-contact state, both when transporting the wafer within the processing process and when transporting the wafer in a case. Therefore, the wafer can be protected from contamination and damage.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のウェーハ保持用かごの外観を示す図、
第2図および第3図は本発明のウェーハ保持用かごの一
部断面を示す図、第4図は本発明のウェーハ保持用かご
を使用してウェーハを輸送する際のケースとなる箱を示
す図、第5図は同じく蓋を示す図、第6図は該ケースに
収納されたウェーハの状態を示す図である。 上:かご、11:底面、12.11側壁、14.15:
端壁、16.17:隔置リブ、18゜19:可撓性支持
機構、20:割り出しバー、21:溝、22;中心線、
1箱、31ニガイド、32,33:係合凹部、土:蓋、
41:押さえ具、42:ウェーハ押さえ、43.41係
合凸部。 特許出願人 新日本製鐵株式會社他1名第4図 第5図 /d  2/
FIG. 1 is a diagram showing the appearance of a wafer holding basket of the present invention;
Figures 2 and 3 are partial cross-sectional views of the wafer holding basket of the present invention, and Figure 4 shows a box that serves as a case for transporting wafers using the wafer holding basket of the present invention. FIG. 5 is a diagram showing the lid, and FIG. 6 is a diagram showing the state of wafers housed in the case. Top: Basket, 11: Bottom, 12.11 Side wall, 14.15:
End wall, 16. 17: Spacing rib, 18° 19: Flexible support mechanism, 20: Index bar, 21: Groove, 22: Center line,
1 box, 31 guide, 32, 33: engagement recess, soil: lid,
41: Holder, 42: Wafer presser, 43. 41 Engagement convex portion. Patent applicant: Nippon Steel Corporation and one other person Figure 4 Figure 5/d 2/

Claims (1)

【特許請求の範囲】[Claims]  上面および底面が開放され、対向する一対の側壁が該
底面側で内方に向けて湾曲しており、該側壁の左右両端
は端壁で連結され、該側壁の両内面には複数の隔置リブ
が対向して設けられ、該側壁の前記底面側の終焉部に可
撓性支持機構が設けられ、該可撓性支持機構の溝の中心
線と前記隔置リブの間の中心線とがずらして設けられて
いることを特徴とするウェーハ保持用かご。
The top and bottom surfaces are open, a pair of opposing side walls are curved inward on the bottom side, the left and right ends of the side walls are connected by an end wall, and a plurality of spaced holes are formed on both inner surfaces of the side walls. ribs are provided oppositely, a flexible support feature is provided at the bottom end of the sidewall, and a centerline of the groove of the flexible support feature and a centerline between the spacing ribs are provided. A wafer holding basket characterized by being provided in a staggered manner.
JP63103472A 1988-04-26 1988-04-26 Wafer holding basket Pending JPH01274446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63103472A JPH01274446A (en) 1988-04-26 1988-04-26 Wafer holding basket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63103472A JPH01274446A (en) 1988-04-26 1988-04-26 Wafer holding basket

Publications (1)

Publication Number Publication Date
JPH01274446A true JPH01274446A (en) 1989-11-02

Family

ID=14354951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63103472A Pending JPH01274446A (en) 1988-04-26 1988-04-26 Wafer holding basket

Country Status (1)

Country Link
JP (1) JPH01274446A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191021A (en) * 2003-12-02 2005-07-14 Miraial Kk Thin-plate supporting vessel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191021A (en) * 2003-12-02 2005-07-14 Miraial Kk Thin-plate supporting vessel
JP4681221B2 (en) * 2003-12-02 2011-05-11 ミライアル株式会社 Thin plate support container

Similar Documents

Publication Publication Date Title
US5207324A (en) Wafer cushion for shippers
US4248346A (en) Shipping container for semiconductor substrate wafers
EP0751551B1 (en) Thin-plate supporting container
KR20130054246A (en) Thin wafer shipper
US20130146503A1 (en) Front opening unified pod with latch structure
KR970705172A (en) WAFER CUSHIONS FOR WAFER SHIPPER
EP0769986B1 (en) Conveyor cassette for wafers
JPH01274446A (en) Wafer holding basket
KR100428828B1 (en) 300 ㎜ shipping container
JPH01274447A (en) Wafer transporting case
US20050006325A1 (en) Wafer protective cassette
US5857576A (en) Wafer carrier with an anti-slip surface
JPH0729640Y2 (en) Wafer container bottom cushion
JPH0936215A (en) Carrier case
JPH01268148A (en) Wafer transporting case
KR0128756Y1 (en) A wafer carrier
KR200157451Y1 (en) Tray for storing semiconductor chip
KR100362234B1 (en) Spacer for moving of glass plate
JP3948047B2 (en) Wafer holder for wafer storage container
KR20010069062A (en) Tray for semiconductor package
JPS62199027A (en) Semiconductor wafer container
KR20230036355A (en) Waper shipping box
JP4233197B2 (en) Partition container
JPH04242581A (en) Carrying device for semiconductor device
JPH02209746A (en) Substrate housing