JPH01272775A - Method for continuously plating metallic sheet - Google Patents

Method for continuously plating metallic sheet

Info

Publication number
JPH01272775A
JPH01272775A JP10330588A JP10330588A JPH01272775A JP H01272775 A JPH01272775 A JP H01272775A JP 10330588 A JP10330588 A JP 10330588A JP 10330588 A JP10330588 A JP 10330588A JP H01272775 A JPH01272775 A JP H01272775A
Authority
JP
Japan
Prior art keywords
plating
metal plate
metal
continuous
contact point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10330588A
Other languages
Japanese (ja)
Inventor
Toshio Ishii
俊夫 石井
Yutaka Okubo
豊 大久保
Yoshiaki Ando
安藤 嘉紹
Yasuhisa Tajiri
田尻 泰久
Takeo Kusaka
日下 武夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Engineering Corp
Original Assignee
NKK Corp
Nippon Kokan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NKK Corp, Nippon Kokan Ltd filed Critical NKK Corp
Priority to JP10330588A priority Critical patent/JPH01272775A/en
Publication of JPH01272775A publication Critical patent/JPH01272775A/en
Pending legal-status Critical Current

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  • Coating With Molten Metal (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE:To stably form a molten metal plating layer on the surface of a band steel in an extremely short time by bringing a plating metal into contact with the surface of the continuously moving band steel, and projecting high energy onto the contact point and its vicinity. CONSTITUTION:A steel sheet 1 preheated to about 450 deg.C, for example, is moved in the direction as shown by the arrow, a plating material 2 of Zn, etc., preheated to about 350 deg.C by a heater 3 such as an IR heater is pressed on the surface of the two sets of pinch rolls 4a and 4b and 4c and 4d, the tip of material 2 is simultaneously irradiated with laser light, an electron beam, plasma, etc., from a high-energy body 5 to respectively heat the contact point A between the band steel 1 and the plating material and its vicinity, hence the tip of the material is melted, and a Zn plating layer 2a having a requisite thickness is formed on the steel sheet 1 in a short time.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、金属板の表面に連続的にめっきを行なう方
法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for continuously plating the surface of a metal plate.

〔従来の技術〕[Conventional technology]

従来、銅帯表面にめっき皮膜を形成させる方法として汎
用されていた溶融めっき法は、めっきの品質面と品種面
で多くの問題を有しており、又これらの問題の解決を図
ろうと多くの改善案が提案され実施されているが、いず
れも作業性、生産性、安全面及びコスト面等で根本的な
解決には到っていない。
Conventionally, the hot-dip plating method, which has been widely used to form a plating film on the surface of copper strips, has many problems in terms of the quality and type of plating, and many efforts have been made to solve these problems. Improvement plans have been proposed and implemented, but none of them have reached a fundamental solution in terms of workability, productivity, safety, cost, etc.

そこで本発明者等は、これまでの溶融めっき法とは全く
異なる新たな連続めっき方法の提案を行なっている。第
3図はこのめっき方法の原理を模式的に示したものであ
るが、移動する金属板(10)にめっき金属材(20)
を接触させ、且つその接触点でめっき金属の溶融層(2
1)を形成せしめ、該めっき金属材(20)を金属板(
10)に対して連続的に供給することにより溶融した前
記めっき金属を移動する金属板(10)の表面にめっき
皮膜(22)として連続的に付着せしめるようにしたも
のである。
Therefore, the present inventors have proposed a new continuous plating method that is completely different from the conventional hot-dip plating method. Figure 3 schematically shows the principle of this plating method.
and a molten layer of plated metal (2
1), and the plated metal material (20) is formed on a metal plate (
10), the molten plating metal is continuously deposited as a plating film (22) on the surface of the moving metal plate (10).

〔発明が解決しようとする問題点1 以上の方法では、金属板(10)との接触点に至る直前
にめっき金属材(20)を加熱溶解せしめるか、該金属
板(10)及びめっき金属材(20)をこれらの接触前
に予熱し前記接触点で主に金属板(10)の顕熱により
めっき金属材(20)を加熱溶解せしめ、これによりめ
っき金属の溶融層(21)の形成を行なっている。この
ような溶融層(21)の形成によってできるめっき皮膜
(22)の厚みHは。
[Problem to be Solved by the Invention 1] In the above method, the plated metal material (20) is heated and melted immediately before reaching the contact point with the metal plate (10), or the metal plate (10) and the plated metal material are heated and melted. (20) is preheated before these contact points, and the plating metal material (20) is heated and melted mainly by the sensible heat of the metal plate (10) at the contact point, thereby forming a molten layer (21) of the plating metal. I am doing it. The thickness H of the plating film (22) formed by forming such a molten layer (21) is as follows.

金属板(10)の移動速度をU、めっき金属材(20)
の供給速度をV、めっき金属材(20)の金属板移動方
向での厚みをWとした場合、 H=w−L によって与えられる。
The moving speed of the metal plate (10) is U, the plated metal material (20)
When the supply speed of is V and the thickness of the plated metal material (20) in the direction of metal plate movement is W, it is given by H=w−L.

ここで金属板(10)の移動速度U及びめっき金属材(
20)の厚みWを一定とした場合、めっき付着量、換言
すればめっき皮膜(22)の厚みHを大きくとろうとす
ると、めっき金属材(20)の供給速度Vを増大させな
ければならない。或いはライン速度Uを高速化した場合
に、厚みHを一定にしようとすれば、同様に供給速度V
を増大させなければならない。該供給速度Vは、前述の
ような金属板(10)及びめっき金属材(20)の加熱
乃至予熱方法を行なう限り、該金属板(10)及びめっ
き金属材(20)の加熱能力に左右される。
Here, the moving speed U of the metal plate (10) and the plating metal material (
When the thickness W of the plated metal material (20) is kept constant, in order to increase the coating amount, in other words, the thickness H of the plated film (22), the supply speed V of the plated metal material (20) must be increased. Alternatively, if the line speed U is increased and the thickness H is to be kept constant, the supply speed V
must be increased. The supply speed V depends on the heating capacity of the metal plate (10) and the plated metal material (20) as long as the heating or preheating method of the metal plate (10) and the plated metal material (20) as described above is performed. Ru.

これらの実際の加熱方法としては、前記接触点前で金属
板(10)やめっき金属材(20)に対して誘導加熱、
赤外線ヒータ、セラミックヒータ。
These actual heating methods include induction heating,
Infrared heater, ceramic heater.

抵抗線からなるヒータ等によりその外部からの加熱を行
なう方法によっている。しかし、これらの加熱によって
温度を上げる場合、第4図に示すように緩やかなカーブ
を描いて上昇する。
This method involves heating from the outside using a heater made of resistance wire or the like. However, when the temperature is raised by these heating methods, the temperature rises in a gentle curve as shown in FIG.

このように加熱コントロールのレスポンスが悪いと、上
記連続めっき法を実施する際、その立上がり時にめっき
付着量がばらつくと共に、ライン速度変更時やめっき付
着量変更時にも、瞬時にその目標値に上げて且つそれを
保持するような理想的な変更は不可能であり1歩留を悪
化させる。
If the response of the heating control is poor in this way, when implementing the continuous plating method described above, the amount of plating deposited will vary at the start of the process, and when changing the line speed or the amount of plating deposited, it will not be possible to instantly increase the amount to the target value. Moreover, an ideal change that maintains this is impossible, and the yield will deteriorate.

又、金属板(10)の顕然でめっき金属材(20)を溶
かす場合、該金属板(10)の板温によってめっき付着
量が大きく左右されるため、接触点ではこの板温を一定
に保っておく必要がある。
In addition, when melting the plated metal material (20) with the metal plate (10), the amount of plating deposited is greatly affected by the temperature of the metal plate (10), so the plate temperature must be kept constant at the point of contact. It is necessary to keep it.

本発明は以上のような問題に鑑み創案されたもので、金
属板及びめっき金属材の予熱乃至加熱方法を改良し、前
述した金属板の連続めっき方法のメリットを最大限に発
揮させようとするものである。
The present invention was created in view of the above-mentioned problems, and aims to improve the preheating and heating methods for metal plates and plated metal materials, and to maximize the advantages of the above-described continuous metal plate plating method. It is something.

〔問題点を解決するための手段〕[Means for solving problems]

このため本発明は、金属板とめっき金属材との接触点近
傍に高エネルギ体を照射して該接触点又はその近傍の金
属板及びめっき金属材を加熱するようにしたものである
Therefore, in the present invention, a high-energy body is irradiated near the contact point between the metal plate and the plated metal material to heat the metal plate and the plated metal material at or near the contact point.

本発明でいう高エネルギ体とは、レーザ光、エレクトロ
ンビーム、プラズマのように、その照射によって被照射
物に瞬時に高エネルギを付与できるようにするものであ
り、本発明はこれを照射せしめて照射部分を瞬時に加熱
昇温するために使用する。但し、その照射を行なう場合
、めっき金属が溶解する程度(例えばZnでは概略、4
20℃以上、900℃以下)にしておく必要があり、沸
点以上のように、蒸発しない範囲にコントロールするこ
とになる。又、本発明の構成は、従来法の加熱を行なう
構成と併用して上述した連続めっき方法の実施時の立上
がりの際やライン速度変更時やめっき付着量変更時のみ
使用するようにしても良い。更に、その照射は主にめっ
き金属材に対して行ない、これを予熱又は溶解せしめる
ために使用した方が良い。金属板の顕熱によるめっき金
属材の溶解を行なう場合、板温変動によるめっき付着量
のバラツキが大きな問題になることを考慮すると、照射
で該板温変動をなくし、一定温度に保持する加熱を行な
うことも考えられるが、そのエネルギは板温変動程度の
小さいものであるから、照射エネルギの大部分は実際に
溶解することになるめっき金属材に与えることになる。
The high-energy body referred to in the present invention refers to a substance such as a laser beam, an electron beam, or a plasma that can instantaneously impart high energy to an object by irradiating it. Used to instantly heat up the irradiated area. However, when performing this irradiation, the extent to which the plating metal is dissolved (for example, for Zn, approximately 4
(20°C or higher and 900°C or lower), and the temperature must be controlled within a range that does not evaporate, such as above the boiling point. Furthermore, the configuration of the present invention may be used in combination with a configuration that performs heating in the conventional method, and used only at the start-up of the above-described continuous plating method, when changing the line speed, or when changing the amount of plating deposited. . Furthermore, it is preferable that the irradiation is applied mainly to the plated metal material and used for preheating or melting it. When melting plated metal materials using the sensible heat of the metal plate, considering that variations in the amount of coating due to changes in the plate temperature become a major problem, it is necessary to use irradiation to eliminate the plate temperature fluctuations and maintain the temperature at a constant temperature. Although it is possible to do this, since the energy used is small enough to change the plate temperature, most of the irradiation energy will be given to the plated metal material that will actually be melted.

又、エネルギを多量に金属板に照射すると急速な加熱の
ため、板の形状を悪化し、操業上、望ましくないため注
意を要する。
Furthermore, if a large amount of energy is applied to the metal plate, the metal plate will be heated rapidly, which will deteriorate the shape of the plate, which is undesirable for operation, so care must be taken.

〔作  用〕[For production]

本発明では、前記接触点又はその近傍に瞬時に高エネル
ギを与えてその照射部分を急激に加熱することができる
ため、加熱コントロールのレスポンスが極めて良好にな
る。
In the present invention, it is possible to instantaneously apply high energy to the contact point or its vicinity to rapidly heat the irradiated area, resulting in extremely good heating control response.

〔実施例〕〔Example〕

以下本発明の具体的実施例を添付図面に基づいて説明す
る。
Hereinafter, specific embodiments of the present invention will be described based on the accompanying drawings.

第1図は本発明法による連続片面亜鉛めっきを行なう実
施設備を示しており、(1)は金属板たる銅帯、(2)
はめっき金属材たる亜鉛めっき材である。
Figure 1 shows the equipment for carrying out continuous single-sided galvanizing according to the method of the present invention, in which (1) is a copper strip which is a metal plate, (2)
is a galvanized metal material.

該銅帯(1)は幅1260m+oのものが図示しない赤
外線ヒータで450℃程度に加熱されて120m/mi
nのラインスピードで連続的に流れると共に、はぼ同幅
の亜鉛めっき材(2)が同じく赤外線ヒータ(3)によ
って350℃程度に予熱されながら、ピンチロール(4
a)乃至(4d)によって垂直方向に繰り出され、A点
で連続的に接触している。
The copper strip (1) has a width of 1260m+o and is heated to about 450°C with an infrared heater (not shown) to spread at a rate of 120m/mi.
While flowing continuously at a line speed of
It is fed out in the vertical direction by a) to (4d) and makes continuous contact at point A.

通常は該鋼帯(1)の有する顕熱によってその接触点で
該亜鉛めっき材(2)を溶解せしめ、40g/イ程度の
めっき皮膜(2a)付着量を得ている。
Usually, the galvanized material (2) is melted at the point of contact by the sensible heat of the steel strip (1), and an amount of coating film (2a) of about 40 g/I is obtained.

しかし、このような設備を再稼動しようとすると、上記
のような加熱装置では、その立上がり時にそれ自身が十
分暖まっていないため、緩やかな加熱曲線を描いて昇温
し、その間亜鉛めっき材(2)の供給速度は同じく緩や
かに上昇する。その結果、めっき付着量も徐々に増大し
、その間40g/mに達することがなく、歩留が悪かっ
た。
However, when attempting to restart such equipment, the heating device described above does not warm itself sufficiently when it starts up, so the temperature rises in a gentle heating curve, during which time the galvanized material (2 ) also increases slowly. As a result, the amount of plating deposited gradually increased and did not reach 40 g/m during that time, resulting in poor yield.

本実施例では、そのためレーザ光発振器(5)によって
レーザ光を前記A点近傍に照射できるようにしている。
In this embodiment, therefore, the laser beam oscillator (5) is configured to irradiate the vicinity of the point A with laser beam.

このレーザ光発振器(5)には、レーザ光を発する発振
器に目的とする照射範囲にレーザ光をスキャンできるス
キャニング装置を組み合わせたものや、シートレーザ光
を発する発振器のみで構成されるものが使用される。
This laser beam oscillator (5) may be one that combines an oscillator that emits a laser beam with a scanning device that can scan the laser beam over the target irradiation range, or one that consists only of an oscillator that emits a sheet laser beam. Ru.

又その照射角度としては、エネルギ密度をなるべく高く
する必要から照射対称物の面に対して垂直になるように
する程良い。そして、上記加熱装置の立上がり時に、こ
のレーザ光発振器(5)を用いてA点近傍(主に亜鉛め
っき材(2))に対しレーザ光を照射する。そのレーザ
光のエネルギとしては、最初から40g1rd程度のめ
っき付着量を得るために、20kw程度が必要である。
Further, as for the irradiation angle, it is better to make it perpendicular to the surface of the object to be irradiated, since it is necessary to make the energy density as high as possible. Then, when the heating device starts up, the laser beam oscillator (5) is used to irradiate the vicinity of point A (mainly the galvanized material (2)) with a laser beam. The energy of the laser beam is approximately 20 kW in order to obtain a coating weight of approximately 40 g1rd from the beginning.

第2図はこのようなレーザ光の照射を行なった結果、立
上がり時のめっき付着量の改善例を示すもので、そのう
ち破線は間接加熱装置だけによる場合を、又、実線はこ
の立上がり時にレーザ光照射を共に行なった場合を示し
ている。
Figure 2 shows an example of the improvement in the amount of plating deposited at the time of start-up as a result of irradiation with such laser light.The broken line shows the case when only indirect heating equipment is used, and the solid line shows the case where the amount of plating is improved at the time of start-up. The case where irradiation was performed together is shown.

このように本実施例による場合は、加熱コントロールの
レスポンスが良くなることによってめっき付着量が極め
て短時間に目的量に達しており1歩留が向上し、その効
果が極めて高いことが明らかとなった。又、このような
レーザ光の照射はライン速度を変更する場合や、めっき
付着量を増大する際にも有効であることは言うまでもな
い、尚、いずれの場合も、加熱装置による加熱効果の向
上と共にレーザ光照射量を次第に減衰するように制御す
るのが望ましい。又。
In this way, in the case of this example, the response of the heating control is improved, so that the amount of plating deposit reaches the target amount in a very short time, and the yield is improved by 1, and it is clear that the effect is extremely high. Ta. It goes without saying that such laser light irradiation is also effective when changing the line speed or increasing the amount of plating deposited. It is desirable to control the amount of laser light irradiation so that it is gradually attenuated. or.

鋼帯(1)及び亜鉛めっき材(2)の幅が変更された際
には、レーザ光をスキャニングするレーザ光発振器(5
)の場合、その変更幅に合わせてスキャニングの振れ幅
を変えることで、又シートレーザ光を発するレーザ光発
振器(5)の場合は、そのレーザ光発振位置をA点に対
して前後にずらすことで、その照射範囲を調整する。
When the width of the steel strip (1) and the galvanized material (2) is changed, the laser beam oscillator (5) that scans the laser beam is
), by changing the scanning amplitude according to the change width, or in the case of a laser beam oscillator (5) that emits sheet laser beam, by shifting the laser beam oscillation position back and forth with respect to point A. to adjust the irradiation range.

以上のようなレーザ光照射以外でも、プラズマやエレク
トロンビームの照射によって高エネルギ体を照射するこ
とは可能であるが、プラズマを利用する場合、シート状
にプラズマを発することのできるシートプラズマ発生器
を用いることになる。
In addition to laser beam irradiation as described above, it is possible to irradiate high-energy bodies with plasma or electron beam irradiation, but when using plasma, it is necessary to use a sheet plasma generator that can emit plasma in a sheet shape. will be used.

〔発明の効果〕〔Effect of the invention〕

以上述べた本発明法によれば、金属板とめっき金属材の
接触点近傍への高エネルギ体の照射により、加熱コント
ロールのレスポンスが飛躍的に向上することになるため
、めっき付着量が極めて短時間に所定量に達することに
なると共に、そこで安定させることができ、本発明者等
の提案に係る連続めっき方法の立上がり時や該方法での
めっき付着量増大時及びライン速度変更時に実施すると
、めっき付着量のバラツキがなくなったり、理想的なめ
っき付着量の変更が可能となる等の効果がある。又、そ
の照射によって金属板の板温を一定に保つこともできる
ため、めっき付着量の安定化にも有効であり、歩留も向
上する。
According to the method of the present invention described above, the response of heating control is dramatically improved by irradiating the vicinity of the contact point between the metal plate and the plated metal material, so the amount of plating deposited is extremely short. When the continuous plating method proposed by the present inventors is started, when the amount of plating deposited increases in the method, and when the line speed is changed, There are effects such as eliminating variations in the amount of plating deposited and making it possible to change the ideal amount of plating deposit. Moreover, since the temperature of the metal plate can be kept constant by the irradiation, it is also effective in stabilizing the amount of plating deposited and improves the yield.

尚、上述の実施例では、銅帯を横方向に走行させ片面め
っきにて説明したが、両面めっきをすることは同様の装
置を銅帯反対側に設置することで十分である。
In the above-mentioned embodiment, the copper strip was moved in the horizontal direction to perform single-sided plating, but for double-sided plating, it is sufficient to install a similar device on the opposite side of the copper strip.

又、横方向に限定されることはなく、例えば垂直方向も
可能である。その場合の鋼帯走行方向は上から下、下か
ら上でも、ともに問題のないことは言うまでもない。
Further, the direction is not limited to the horizontal direction, and, for example, the vertical direction is also possible. Needless to say, there is no problem whether the steel strip runs in the direction from top to bottom or from bottom to top.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明法の実施設備の一例を示す説明図、第2
図は上記設備によって達成される立上がり時めっき付着
量の推移を示すグラフ図、第3図は本発明者等の提案し
た連続めっき方法の原理を模式的に示す説明図、第4図
は間接加熱装置によるめっき金属材等の昇温状態を示す
グラフ図である。 図中、(1)は鋼帯、(2)は亜鉛めっき材、(3)は
赤外線ヒータ、(4a) (4b) (4c) (4d
)はピンチロール、(5)はレーザ光発振器、(10)
は金属板、(20)はめっき金属板、(21)は溶融層
、(22)はめっき皮膜を各示す。 第2図 Q 時間 第3図 算 4 図 時間
Figure 1 is an explanatory diagram showing an example of equipment for implementing the method of the present invention;
The figure is a graph showing the change in coating weight at start-up achieved by the above equipment, Figure 3 is an explanatory diagram schematically showing the principle of the continuous plating method proposed by the present inventors, and Figure 4 is indirect heating. FIG. 3 is a graph diagram showing the state of temperature increase of a plated metal material etc. by the apparatus. In the figure, (1) is a steel strip, (2) is a galvanized material, (3) is an infrared heater, (4a) (4b) (4c) (4d
) is a pinch roll, (5) is a laser beam oscillator, (10)
(20) a plated metal plate, (21) a molten layer, and (22) a plated film. Figure 2 Q Time 3 Calculation 4 Figure Time

Claims (5)

【特許請求の範囲】[Claims] (1)移動する金属板にめっき金属材を接触させ、且つ
その接触点でめっき金属の溶融層を形成せしめ、該めっ
き金属材を金属板に対して連続的に供給することにより
溶融した前記めっき金属を移動する金属板表面にめっき
皮膜として連続的に付着させる金属板の連続めっき方法
において、前記接触点近傍に高エネルギ体を照射して該
接触点又はその近傍の金属板及びめっき金属材を予熱な
いし過熱せしめることを特徴とする金属板の連続めっき
方法。
(1) The plating is melted by bringing a plating metal material into contact with a moving metal plate, forming a molten layer of plating metal at the contact point, and continuously supplying the plating metal material to the metal plate. In a continuous metal plate plating method in which metal is continuously deposited as a plating film on the surface of a moving metal plate, a high-energy object is irradiated near the contact point to remove the metal plate and plated metal material at or near the contact point. A continuous plating method for metal plates, characterized by preheating or overheating.
(2)前項記載の金属板の連続めっき方法において、高
エネルギ体の照射を主にめっき金属材に対して行ない、
これを予熱又は溶解せしめることを特徴とする特許請求
の範囲第1項記載の金属板の連続めっき方法。
(2) In the method for continuous plating of metal plates described in the previous section, irradiation with a high-energy body is mainly performed on the plating metal material,
A continuous plating method for a metal plate according to claim 1, characterized in that the metal plate is preheated or melted.
(3)照射する高エネルギ体としてレーザ光を用いるこ
とを特徴とする特許請求の範囲第1項及び第2項記載の
金属板の連続めっき方法。
(3) A continuous plating method for a metal plate according to claims 1 and 2, characterized in that a laser beam is used as the high-energy object to be irradiated.
(4)照射する高エネルギ体としてエレクトロンビーム
を用いることを特徴とする特許請求の範囲第1項及び第
2項記載の金属板の連続めっき方法。
(4) A continuous plating method for a metal plate according to claims 1 and 2, characterized in that an electron beam is used as the high-energy body to be irradiated.
(5)照射する高エネルギ体としてプラズマを用いるこ
とを特徴とする特許請求の範囲第1項及び第2項記載の
金属板の連続めっき方法。
(5) The continuous plating method for metal plates according to claims 1 and 2, characterized in that plasma is used as the high-energy body to be irradiated.
JP10330588A 1988-04-26 1988-04-26 Method for continuously plating metallic sheet Pending JPH01272775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10330588A JPH01272775A (en) 1988-04-26 1988-04-26 Method for continuously plating metallic sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10330588A JPH01272775A (en) 1988-04-26 1988-04-26 Method for continuously plating metallic sheet

Publications (1)

Publication Number Publication Date
JPH01272775A true JPH01272775A (en) 1989-10-31

Family

ID=14350518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10330588A Pending JPH01272775A (en) 1988-04-26 1988-04-26 Method for continuously plating metallic sheet

Country Status (1)

Country Link
JP (1) JPH01272775A (en)

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