JPH01272069A - Manufacture of ic socket - Google Patents
Manufacture of ic socketInfo
- Publication number
- JPH01272069A JPH01272069A JP9820488A JP9820488A JPH01272069A JP H01272069 A JPH01272069 A JP H01272069A JP 9820488 A JP9820488 A JP 9820488A JP 9820488 A JP9820488 A JP 9820488A JP H01272069 A JPH01272069 A JP H01272069A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- socket
- contact spring
- resin
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ＩＣソケットの製造方法に関し、特に、樹脂
成形タイプのＤＩＰＩＣの製造方法と同様にして行なう
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing an IC socket, and particularly to a method of manufacturing an IC socket, which is carried out in the same manner as a method of manufacturing a resin-molded type DIPIC.
［従来の技術］
従来のＩＣソケットは１例えば第３図に示すように、複
数の接点スプリング端子１０と、これら接点スプリング
端子１０を保持するハウジング部１１とからなっていた
。[Prior Art] A conventional IC socket, for example, as shown in FIG. 3, consists of a plurality of contact spring terminals 10 and a housing portion 11 that holds these contact spring terminals 10.
そしてこのようなＩＣソケットは、先ず各接点スプリン
グ端子１０と、ＩＣソケットハウジング部１１となる樹
脂成形個片とをそれぞれ分割して別個に作り、その後、
最終の組立工程でハウジング部１１の穴ないし四部１２
に接点スプリング端子１０を組み込んでかしめることに
より製造していた。Such an IC socket is first made separately by dividing each contact spring terminal 10 and a resin molded piece that becomes the IC socket housing part 11, and then,
In the final assembly process, the holes or four parts 12 of the housing part 11 are removed.
It was manufactured by incorporating the contact spring terminal 10 into the holder and caulking it.
［解決すべき問題点］
上述した従来のＩＣソケットの製造方法は、接点スプリ
ング端子１０と、ハウジング部１１とを分割して別個に
作っていたため、最終の組立加工工程が必要であり、結
果として接点スプリング端子１０とハウジング部１１に
非常に厳密な寸法精度が要求されるという問題点があっ
た。[Problems to be Solved] In the conventional IC socket manufacturing method described above, the contact spring terminal 10 and the housing part 11 are made separately, which requires a final assembly process. There is a problem in that the contact spring terminal 10 and the housing part 11 are required to have very strict dimensional accuracy.
また１組立時の最終製品組立精度の管理も重要になると
いう問題があった。There is also a problem in that it is important to manage the assembly accuracy of the final product during one assembly.
さらに、従来の製法で作られたＩＣソケットは、ハウジ
ング部１０における穴や凹部１２を、これに挿入される
ＩＣのリードの挿入ガイドまたは位置決めのガイドとし
ているため、挿入されるＩＣの幅方向に広い面積を占め
ることになるという問題があった０例えば０．３″のＤ
Ｉ Ｐ （ｄｕａｌｉｎ−ｌｉｎｅ ｐａｃｋｅｇｅ
） Ｉ Ｃのタイプにおいては１幅方向に０．４”ない
し０．５”の寸法を専有することとなり、高密度実装化
を難しくする原因となっていた。Furthermore, in IC sockets made using conventional manufacturing methods, the holes and recesses 12 in the housing portion 10 serve as insertion guides or positioning guides for the leads of the IC to be inserted into the holes and recesses 12. For example, a D of 0.3" had the problem of occupying a large area.
IP (dual-line package)
) The IC type occupies a dimension of 0.4" to 0.5" in one width direction, which makes high-density packaging difficult.
さらにまた、従来の製法のＩＣソケットは形状が画一的
にならざるを得ないという問題もあった。Furthermore, there is also the problem that conventionally manufactured IC sockets have to have a uniform shape.
本発明は上述した問題点にかんがみてなされたもので、
最終組立加工工程が不要で、しかも寸法精度の良い高密
度実装が可能であり、さらにその後のプリント板への組
立も容易なＩＣソケットを単純な工程で製造することの
できるＩＣソケットの製造方法の提供を目的とする。The present invention has been made in view of the above-mentioned problems.
An IC socket manufacturing method that does not require a final assembly process, enables high-density mounting with good dimensional accuracy, and can manufacture IC sockets in a simple process that can be easily assembled onto a printed board afterwards. For the purpose of providing.
［問題点の解決手段］
上記目的を達成するために本発明のＩＣソケットの製造
方法は、少なくともＩＣソケット−単位分の接点スプリ
ング端子をリードフレームに構成し、次いで前記接点ス
プリング端子を保持するハウジング部を前記リードフレ
ームに樹脂で一体成形し、その後、前記接点スプリング
端子とリードフレームとを切り放して接点スプリング端
子の曲げ加工を行なうことによりＩＣソケットを製造す
るものである。[Means for Solving Problems] In order to achieve the above object, the method for manufacturing an IC socket of the present invention includes forming a lead frame with at least one unit of contact spring terminals, and then forming a housing for holding the contact spring terminals. The IC socket is manufactured by integrally molding the contact spring terminal with resin on the lead frame, and then cutting off the contact spring terminal and the lead frame and bending the contact spring terminal.
［実施例］
以下、本発明に係るＩＣソケット製造方法の一実施例に
ついて図面を参照して説明する。[Example] Hereinafter, an example of the IC socket manufacturing method according to the present invention will be described with reference to the drawings.
第１図（ａ）および（ｂ）は、本製造方法に用いるリー
ドフレーム状の接点スプリング端子の平面図および側面
図であり、第２図は本方法により製造されたＩＣソケッ
トの斜視図である。1(a) and (b) are a plan view and a side view of a lead frame-shaped contact spring terminal used in this manufacturing method, and FIG. 2 is a perspective view of an IC socket manufactured by this method. .
これらの図において、ｌは接点スプリング端子であり、
銅または、鉄、あるいはニッケル合金系の素材からなっ
ている。この接点スプリング端子１には接点部１ａが形
成される。In these figures, l is the contact spring terminal;
Made of copper, iron, or nickel alloy material. This contact spring terminal 1 has a contact portion 1a formed therein.
２はリードフレームであり、キャリヤ部２ａ。2 is a lead frame, which is a carrier portion 2a.
２ａと、これらキャリヤ部２ａ、２ａ間を連結して保持
している接続部３とからなっている。このリードフレー
ムのキャリヤ部２ａ、２ａに前記接点スプリング端子ｌ
が所定数づつ形成される。2a, and a connecting portion 3 that connects and holds these carrier portions 2a, 2a together. The contact spring terminal l is attached to the carrier portions 2a, 2a of this lead frame.
are formed in predetermined numbers.
４はハウジング部５となる樹脂が成形される部分である
。Reference numeral 4 denotes a portion where the resin that will become the housing portion 5 is molded.
６は後述するように、キャリヤ部２ａの切断部であり、
７は成形後の折曲げ部分である。6 is a cut portion of the carrier portion 2a, as will be described later;
7 is a bent portion after molding.
本方法は、まず、リードフレームを外形加工し、さらに
接点部１ａの成形加工を行なって第１図に示すような、
少なくともＩＣソケット−単位分の接点スプリング端子
ｌを持つリードフレーム２を作る。In this method, first, the lead frame is processed into an external shape, and then the contact portion 1a is formed into a shape as shown in FIG.
A lead frame 2 having contact spring terminals l for at least one unit of IC socket is made.
次いで、リードフレーム２の樹脂成形部分４に熱硬化性
の樹脂を一体成形することによりＩＣソケットの原型を
作るとともに、この樹脂により各接点スプリング端子１
を保持する。Next, a prototype of the IC socket is made by integrally molding thermosetting resin on the resin molded portion 4 of the lead frame 2, and each contact spring terminal 1 is formed using this resin.
hold.
その後、切断部６でキャリヤ部２ａを切断し、折曲げ部
分７で各接点スプリング端子１をプリント板の穴ピッチ
に曲げ加工することにより第２図に示すようなＩＣソケ
ットを完成する。Thereafter, the carrier part 2a is cut at the cutting part 6, and each contact spring terminal 1 is bent at the bent part 7 to match the hole pitch of the printed board, thereby completing an IC socket as shown in FIG.
このように、本方法によれば、リードフレーム状の接点
スプリング端子加工と熱硬化性成形加工の工程で構成さ
れ、あたかも樹脂成形タイプのＤＩＰＩＣの製造方法の
ごとき方法にてＩＣソケットを製造することができる。As described above, according to this method, the IC socket is manufactured by a method similar to the method for manufacturing resin molded DIPICs, which is comprised of the steps of processing lead frame-shaped contact spring terminals and thermosetting molding. I can do it.
［発明の効果］
以上説明したように本発明によれば、接点スプリング端
子をリードフレームに構成し、ハウジング部をリードフ
レームに樹脂で一体成形することにより、寸法精度の良
い高密度実装が可能であり、その後のプリント板への組
立が容易なＩＣソケットを非常に単純な工程で製造する
ことができるという効果がある。[Effects of the Invention] As explained above, according to the present invention, high-density mounting with good dimensional accuracy is possible by configuring the contact spring terminal in the lead frame and integrally molding the housing part with the lead frame with resin. This has the effect that an IC socket that can be easily assembled onto a printed board afterwards can be manufactured in a very simple process.
第１図（ａ）および（ｂ）は、本製造方法に用いるリー
ドフレーム状の接点スプリング端子の平面図および側面
図、第２図は本方法により製造されたＩＣソケットの斜
視図、第３図は従来のＩＣソケットの斜視図である。
ｌ：接点スプリング端子
２：リードフレーム
２ａ：リードフレームキャリヤ部
３：リードフレーム接続部
４：樹脂成形部分
５：ハウジング部
６：リードフレーム切断部
７：端子折曲げ部
代理人 弁理士 渡 辺 喜 平FIGS. 1(a) and (b) are a plan view and a side view of a lead frame-shaped contact spring terminal used in this manufacturing method, FIG. 2 is a perspective view of an IC socket manufactured by this method, and FIG. 3 is a perspective view of an IC socket manufactured by this method. is a perspective view of a conventional IC socket. l: Contact spring terminal 2: Lead frame 2a: Lead frame carrier section 3: Lead frame connecting section 4: Resin molding section 5: Housing section 6: Lead frame cutting section 7: Terminal bending section Agent Patent attorney Kihei Watanabe
Claims (1)
をリードフレームに構成し、次いで前記接点スプリング
端子を保持するハウジング部を前記リードフレームに樹
脂で一体成形し、その後、前記接点スプリング端子とリ
ードフレームとを切り放して接点スプリング端子の曲げ
加工を行なうことによりＩＣソケットを製造するＩＣソ
ケットの製造方法。Contact spring terminals for at least one unit of IC socket are constructed on a lead frame, and then a housing portion for holding the contact spring terminals is integrally molded with resin on the lead frame, and then the contact spring terminals and the lead frame are cut away. A method of manufacturing an IC socket, in which the IC socket is manufactured by bending a contact spring terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9820488A JPH01272069A (en) | 1988-04-22 | 1988-04-22 | Manufacture of ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9820488A JPH01272069A (en) | 1988-04-22 | 1988-04-22 | Manufacture of ic socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01272069A true JPH01272069A (en) | 1989-10-31 |
Family
ID=14213465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9820488A Pending JPH01272069A (en) | 1988-04-22 | 1988-04-22 | Manufacture of ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01272069A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7308752B2 (en) * | 2003-06-10 | 2007-12-18 | Sony Corporation | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit |
| JP2012033427A (en) * | 2010-08-02 | 2012-02-16 | Nok Corp | Connector seal and method for manufacturing the same |
-
1988
- 1988-04-22 JP JP9820488A patent/JPH01272069A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7308752B2 (en) * | 2003-06-10 | 2007-12-18 | Sony Corporation | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit |
| JP2012033427A (en) * | 2010-08-02 | 2012-02-16 | Nok Corp | Connector seal and method for manufacturing the same |
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