JPH01272065A - Ic socket - Google Patents

Abstract

PURPOSE:To prevent the electrode deterioration by the absorption of the external force applied to an IC socket electrode when an IC is fitted or removed by using a contact pressure changing mechanism by a shape memory alloy. CONSTITUTION:A spring 1 made of a shape memory alloy is formed in a semi- circular shape at the ordinary temperature and presses an IC socket electrode 2 with the force of the shape memory alloy to keep the memory shape, and this force generates the strong contact pressure on the electrode 2. When an IC is fitted or removed, the temperature of the portion of the spring 1 is cooled to the transition temperature or below by a spray type cooling agent or the like. The force of the spring 1 to keep the memory shape is eliminated at the transition temperature or below, the spring 1 is easily deformed as compared with that at the ordinary temperature. The IC can be fitted or removed with a small force, the mechanical fatigue of the electrode 2 is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC socket, and particularly to a mechanism for generating contact pressure between an electrode of an IC socket and a pin of an IC.

[Conventional technology]

A conventional IC socket has a plate-shaped insertion part electrode as shown in FIG. 3, and uses a bent part of the electrode as a spring to generate contact pressure between the pin terminal of the IC and the electrode. Also,
As shown in FIG. 4, an IC socket equipped with a mechanism for varying the contact pressure has a mechanically movable part, and the contact pressure between the electrodes is varied by operating a lever or screw.

[Problem to be solved by the invention]

In conventional IC sockets, a portion of the electrode acts as a spring to generate contact pressure between the electrode and the IC pin.

According to this method, the spring mechanism that generates contact pressure deteriorates due to the force applied to the electrodes when the IC is mounted or removed, and the IC must be mounted several times.

Poor contact occurs due to attachment/detachment. Furthermore, if the electrode contact pressure is increased when the IC is mounted, the force applied to the IC pins increases when the IC is mounted, which may damage the IC pins or the electrodes of the IC socket.

In conventional IC sockets equipped with a mechanism for varying contact pressure, levers or screws are used to move the internal mechanism of the IC socket or the mounted IC.

This method requires a mechanism to distribute the force applied to the lever or screw to the entire IC socket, which increases the number of components that make up the IC socket, making it difficult to miniaturize. Since there are many mechanically moving parts, there is a drawback that IC mounting may not be performed reliably due to malfunctions that require high precision for individual parts.

[Means to solve the problem]

The IC socket of the present invention has a contact pressure generation mechanism using a shape memory alloy. Shape memory alloys generally have the property of returning to their memorized shape above a certain temperature. The temperature at which the alloy returns to its memorized shape can be varied by setting during alloy production. The IC socket of the present invention utilizes this property of the shape memory alloy as a spring whose pushing force changes depending on the temperature.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a structural diagram of an embodiment of the present invention.

In the figure, 1 is a leaf spring made of a shape memory alloy, 2 is a socket electrode, and 3 is an IC socket body. In FIG. 1, the spring made of the shape memory alloy 1 has a semicircular shape as shown in the figure at room temperature, and the force of the shape memory alloy to maintain the memorized shape strongly presses the socket electrode 2. This force generates strong contact pressure on the socket electrode. I
When attaching or detaching C, the temperature of the spring portion is cooled to below the transition temperature by a spray cooling method or the like. Below the transition temperature, the force of the spring to maintain its memorized shape is lost, so the spring deforms more easily than at room temperature, absorbing the force applied to the electrode when attaching or detaching an IC, and deforming it. Since the force of trying to return to the original position is also small, the IC can be attached or detached with a small force, and mechanical fatigue of the electrodes is also reduced. Furthermore, since the transition to the memorized shape of a shape memory alloy occurs within the alloy, it is very stable and does not deteriorate even if the transition is repeated.

FIG. 2 is a structural diagram of another embodiment of the present invention.

In FIG. 2, 1 is a shape memory alloy spring, 2 is a pin guide, 3 is an IC socket electrode, and 4 is an IC socket body. In Figure 2, the pin guide 2 is designed to slide in the direction of the pins of the IC socket.
The spring made of shape memory alloy No. 1 determines the sliding amount of the pin guide and the force required for sliding. The shape memory alloy spring of No. 1 has the shape and properties as in the example described above, and acts as a spring for the pin guide. At room temperature, the spring pushes the pin guide with a strong force, and this force pushes the IC pin into the IC socket electrode (3).Furthermore, the IC socket electrode and pin guide sandwich the IC pin, exerting a force to support the IC. generate. When attaching or detaching an IC, the spring is cooled to a temperature below the transition temperature to soften it, and the pin guide is slid to perform attachment or detachment. According to this method, since the shape memory alloy spring naturally returns to room temperature from a cooled state, there is no possibility that the IC will remain open due to malfunction and cause a contact failure. Furthermore, since the strength of the spring can be set within a fairly wide range, it is possible to generate a strong supporting force and prevent the IC from being pulled out or falling due to vibrations, etc.

〔Effect of the invention〕

As explained above, the present invention has a variable contact pressure mechanism using a shape memory alloy, thereby preventing electrode deterioration due to absorption of external force applied to the IC socket electrode when mounting or removing an IC, and stabilizing the electrode contact pressure during use. can be generated.

Furthermore, since the electrode is not used as a mechanism for generating contact pressure, the durability of the electrode is increased. Since strong contact pressure can be generated, vibration resistance during IC mounting is increased. Since the condition of the spring is determined by the ambient temperature, there is no possibility that the contact will not be made properly due to human error.

[Brief explanation of the drawing]

FIG. 1 is a structural diagram of an embodiment of the present invention. 1...Shape memory alloy spring, 2...I
C socket electrode, 3...IC socket body. FIG. 2 is a structural diagram of another embodiment of the present invention. 1...Shape memory alloy spring, 2...I
C pin guide, 3...IC socket electrode, 4.
・Kawa/IC Sokerato main body. 3 and 4 are structural diagrams of examples of conventional IC sockets. 1...IC socket body, 2...IC
Socket electrode, 3...IC pin guide, 4...
····lever. Agent Patent Attorney Hara Uchi

Claims (1)

[Claims] An IC socket characterized by including a spring made of a shape memory alloy as a mechanism for generating contact pressure between an electrode of the IC socket and a pin of the IC.