JPH0126868B2 - - Google Patents
Info
- Publication number
- JPH0126868B2 JPH0126868B2 JP57134238A JP13423882A JPH0126868B2 JP H0126868 B2 JPH0126868 B2 JP H0126868B2 JP 57134238 A JP57134238 A JP 57134238A JP 13423882 A JP13423882 A JP 13423882A JP H0126868 B2 JPH0126868 B2 JP H0126868B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- vinyl acetate
- ethylene
- weight
- acetate copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 46
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 31
- 239000004793 Polystyrene Substances 0.000 claims description 30
- 229920002223 polystyrene Polymers 0.000 claims description 30
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 24
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 13
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 10
- 229920000098 polyolefin Polymers 0.000 claims description 10
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 9
- 239000005977 Ethylene Substances 0.000 claims description 9
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 9
- 230000000379 polymerizing effect Effects 0.000 claims description 9
- 238000007127 saponification reaction Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 93
- 238000000034 method Methods 0.000 description 29
- 238000000465 moulding Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 7
- -1 polyethylene Polymers 0.000 description 7
- 229920001684 low density polyethylene Polymers 0.000 description 6
- 239000004702 low-density polyethylene Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 229920005669 high impact polystyrene Polymers 0.000 description 4
- 239000004797 high-impact polystyrene Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- OYLCUJRJCUXQBQ-UHFFFAOYSA-N 1-hepten-3-one Chemical compound CCCCC(=O)C=C OYLCUJRJCUXQBQ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- BDKSYBXVYUGXIG-UHFFFAOYSA-N 2-(ethylamino)ethyl prop-2-enoate Chemical compound CCNCCOC(=O)C=C BDKSYBXVYUGXIG-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- STNJBCKSHOAVAJ-UHFFFAOYSA-N Methacrolein Chemical compound CC(=C)C=O STNJBCKSHOAVAJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 235000015429 Mirabilis expansa Nutrition 0.000 description 1
- 244000294411 Mirabilis expansa Species 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 235000013334 alcoholic beverage Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 235000011850 desserts Nutrition 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PBZROIMXDZTJDF-UHFFFAOYSA-N hepta-1,6-dien-4-one Chemical compound C=CCC(=O)CC=C PBZROIMXDZTJDF-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 235000013310 margarine Nutrition 0.000 description 1
- 239000003264 margarine Substances 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 235000013536 miso Nutrition 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920013639 polyalphaolefin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000013555 soy sauce Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- FUSUHKVFWTUUBE-UHFFFAOYSA-N vinyl methyl ketone Natural products CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Wrappers (AREA)
Description
本発明は、積層体に関するものであり、更に詳
しくは、シートフオーミング法に適する積層体に
関するものである。
現在、食品、その他等の包装用容器としては、
種々の樹脂成形品が提案されているが、これの製
造方式としては、一般に、成形装置が安価である
こと、成形加工が容易であること等の理由からシ
ートフオーミング法が多用されている。
而して、かかる成形法において、シートの材料
としては、成形加工性が良いことから、ポリスチ
レンが主に使用されている。
又、近年、カツプ、トレイ等の樹脂成形品にお
いては、内容物の多様化に伴つてバリヤー性が要
求される傾向にある。本発明の目的は、ポリスチ
レン層と、高いバリヤー性を有するエチレン−酢
酸ビニル共重合体ケン化物層とを有する積層体を
提供することにある。本発明の積層体を絞り成形
することにより、高いバリヤー性を有するカツ
プ、トレイ等の食品包装用容器を得ることができ
るものである。
ところで、本発明者は、ポリスチレンのフイル
ムないしシートとエチレン−酢酸ビニル共重合体
ケン化物のフイルムないしシートとを積層するに
は、例えば、接着剤を用いて積層する方式、或
は、その両者の間に樹脂組成物を一層以上積層し
て、熱接着或は共押出しを施したりして積層する
ことを試みたものである。
しかしながら、ポリスチレンのフイルムないし
シートと、エチレン−酢酸ビニル共重合体ケン化
物のフイルムないしシートとの積層を接着剤で行
なうと、深しぼり成形の際、接着剤層での剥離、
及び層の切断が起こるという問題点がある。
また、上記の樹脂組成物を1層以上積層し、熱
接着、共押し成形する方法においても、充分な接
着力が得られるものが無く、深絞り成形を行うと
層間剥離を生ずるという問題点がある。
本発明者は、上記の問題点について、更に、
種々検討を重ねた結果スチレン単量体をグラフト
重合せしめた酢酸ビニール含有率5ないし50重量
%のエチレン−酢酸ビニール共重合体樹脂20ない
し80重量%に、カルボニル基を有するエチレン系
不飽和単量体をグラフト重合せしめたポリオレフ
インを20ないし80重量%の割合で配合してなる接
着剤組成物層がポリスチレン及びエチレン−酢酸
ビニル共重合体ケン化物と強力に熱接着し、かつ
該接着剤組成物をして、ポリスチレンとエチレン
−酢酸ビニル共重合体ケン化物を共押出、シート
成形したところ、三層は強力に接着していること
を見い出し、かかる知見に基づいて本発明を完成
したものである。
上記の本発明について以下に更に詳しく説明す
る。
まず、本発明の積層体の層構成について図面を
用いて説明すると、本発明の積層体は第1図に示
すように、ポリスチレン層1、スチレン単量体を
グラフト重合せしめた酢酸ビニル含有率5〜50重
量%のエチレン−酢酸ビニール共重合体樹脂20〜
80重量%に、カルボニル基を有するエチレン系不
飽和単量体をグラフト重合せしめたポリオレフイ
ンを20〜80重量%の割合で配合してなる接着剤組
成物層(以下「接着剤組成物層」と略称する。)
2および、エチレン−酢酸ビニル共重合体ケン化
物層(以下「ケン化物層」と略称する)3の3種
の層を順次に積層した構成からなるものである。
次に、又、本発明の積層体について別の態様の
積層体の例をあげると、第2図に示すように、上
記の第1図に示した積層体と同様にポリスチレン
層1、接着剤組成物層2およびケン化物層3の3
種の層が順次に積層し、更に上記のケン化物層3
の上に接着剤組成物2およびポリスチレン層1が
順次に積層してなる5層からなる積層体構成でも
よい。
尚、上記においては5層の多層共押出シートを
用いたが、ポリスチレン層、接着剤組成物層、ケ
ン化物層の順にて積層された部分以外の層構成及
び層の数等は上記に限定されるものではなく、適
宜の層構成でもよい。
すなわち、本発明における層構成は、上記の第
1図に示す層構成を基本として、該層構成の上に
適宜の層を設けてもよい。
上記の本発明において、ポリスチレン層を構成
するポリスチレンとしては、例えば、GPポリス
チレン、ハイインパクトポリスチレン、ミデイア
ムインパクトポリスチレン等を使用することがで
きる。
次に又、上記の本発明において、スチレン単量
体を酸酸ビニル含有率5〜50重量%のエチレン−
酢酸ビニール共重合体樹脂にグラフト重合せしめ
る方法、カルボニル基を有するエチレ系不飽和単
量体をポリオレフインにグラフト重合せしめる方
法としては、例えば、溶液状態でグラフト反応さ
せる方法(例えば特公昭44−15422号公報参照)、
溶融状態でグラフト反応させる方法(例えば特公
昭43−27421号公報参照)、その他スラリー状態で
グラフト反応させる方法、また混練機で熱と剪断
力よりグラフト反応させる方法(例えば特公昭43
−18522号公報参照)などの種々の方法がある。
次に又、上記の本発明において、接着剤組成物
層を構成するスチレン単量体をグラフト重合せし
めた酢酸ビニル含有率5〜50重量%のエチレン−
酢酸ビニル共重合体樹脂としては、例えば、公知
の方法である遊離触媒重合法で重合して得たもの
を使用することができる。
尚、本発明における接着剤組成物層のスチレン
単量体をグラフト重合せしめたエチレン−酢酸ビ
ニール共重合体含量が20重量%以下では、接着剤
組成物層とポリスチレン層の接着力が弱くなり、
スチレン単量体をグラフト重合せしめたエチレン
−酢酸ビニール共重合体含量が80重量%以上にな
ると、成形、加工適性が悪くなり、従つて、本発
明では、エチレン−酢酸ビニール共重合体含量は
20〜80重量%が好ましい。
尚、本発明において、カルボニル基を有するエ
チレン系不飽和単量体をグラフト重合せしめたポ
リオレフインが20重量%以下では、接着剤組成物
層とケン化物層の接着力が弱くなり、カルボニル
基を有するエチレン系不飽和単量体をグラフト重
合せしめたポリオレフインが80重量%以上になる
と、接着剤組成物層とポリスチレン層の接着力が
弱くなり、従つて、本発明では、カルボニル基を
有するエチレン系不飽和単量体をグラフト重合せ
しめたポリオレフインは20〜80重量%が好まし
い。
次に又、上記の本発明におけるカルボニル基を
有するエチレン系不飽和単量体としては、例えば
カルボン酸、カルボン酸塩、カルボン酸無水物、
カルボン酸エステル、カルボン酸アミドないしイ
ミド、アルデヒド、ケトン等に基づくカルボニル
The present invention relates to a laminate, and more particularly to a laminate suitable for sheet forming. Currently, containers for packaging foods, etc.
Although various resin molded products have been proposed, the sheet forming method is generally widely used as a manufacturing method for these products because the molding equipment is inexpensive and the molding process is easy. In such a molding method, polystyrene is mainly used as the sheet material because of its good moldability. Furthermore, in recent years, resin molded products such as cups and trays are required to have barrier properties as the contents become more diverse. An object of the present invention is to provide a laminate having a polystyrene layer and a saponified ethylene-vinyl acetate copolymer layer having high barrier properties. By drawing the laminate of the present invention, food packaging containers such as cups and trays having high barrier properties can be obtained. By the way, the present inventor has discovered that in order to laminate a polystyrene film or sheet and a saponified ethylene-vinyl acetate copolymer film or sheet, for example, a method of laminating using an adhesive, or a method of laminating both. An attempt was made to laminate one or more layers of a resin composition between the two and perform thermal adhesion or coextrusion. However, when a polystyrene film or sheet and a saponified ethylene-vinyl acetate copolymer film or sheet are laminated using an adhesive, peeling at the adhesive layer occurs during deep drawing molding.
Also, there is a problem that layer cutting occurs. In addition, even in the method of laminating one or more layers of the above resin composition, thermal bonding, and co-extrusion molding, there is a problem that no sufficient adhesive strength can be obtained, and delamination occurs when deep drawing is performed. be. The present inventor further addresses the above problems by:
As a result of various studies, we created an ethylene-vinyl acetate copolymer resin with a vinyl acetate content of 5 to 50% by weight, which was obtained by graft polymerizing styrene monomer to 20 to 80% by weight of an ethylenically unsaturated monomer having a carbonyl group. An adhesive composition layer comprising 20 to 80% by weight of a polyolefin graft-polymerized with polystyrene and a saponified ethylene-vinyl acetate copolymer is strongly thermally bonded to polystyrene and a saponified ethylene-vinyl acetate copolymer; When polystyrene and saponified ethylene-vinyl acetate copolymer were coextruded and formed into a sheet, they found that the three layers were strongly adhered, and based on this knowledge, they completed the present invention. . The above-mentioned present invention will be explained in more detail below. First, the layer structure of the laminate of the present invention will be explained with reference to the drawings. As shown in FIG. ~50% by weight ethylene-vinyl acetate copolymer resin20~
An adhesive composition layer (hereinafter referred to as "adhesive composition layer") comprising 80% by weight and 20 to 80% by weight of polyolefin grafted with an ethylenically unsaturated monomer having a carbonyl group. (abbreviated).
2 and a saponified ethylene-vinyl acetate copolymer layer (hereinafter referred to as "saponified layer") 3 are sequentially laminated. Next, to give an example of another aspect of the laminate of the present invention, as shown in FIG. 2, like the laminate shown in FIG. Composition layer 2 and saponified layer 3
Seed layers are sequentially laminated, and further the saponified layer 3
A 5-layer laminate structure in which the adhesive composition 2 and the polystyrene layer 1 are sequentially laminated on top of the adhesive composition 2 and the polystyrene layer 1 may be used. In addition, although a five-layer multilayer coextruded sheet was used in the above, the layer structure and number of layers other than the part laminated in the order of polystyrene layer, adhesive composition layer, and saponified material layer are limited to the above. It is not necessary to use a suitable layer structure. That is, the layer structure in the present invention is based on the layer structure shown in FIG. 1 above, and an appropriate layer may be provided on the layer structure. In the present invention described above, as the polystyrene constituting the polystyrene layer, for example, GP polystyrene, high impact polystyrene, medium impact polystyrene, etc. can be used. Next, in the above-mentioned invention, the styrene monomer is ethylene-vinyl acid containing 5 to 50% by weight.
Examples of methods for graft polymerizing a vinyl acetate copolymer resin and methods for graft polymerizing an ethylenically unsaturated monomer having a carbonyl group onto a polyolefin include a method in which a graft reaction is performed in a solution state (for example, Japanese Patent Publication No. 15422/1983). (see official bulletin),
A method of performing a graft reaction in a molten state (for example, see Japanese Patent Publication No. 43-27421), another method of performing a graft reaction in a slurry state, and a method of performing a graft reaction using heat and shear force in a kneader (for example, a method of performing a graft reaction in a kneader)
There are various methods such as (see Publication No. 18522). Next, in the above-mentioned present invention, ethylene containing 5 to 50% by weight of vinyl acetate is prepared by graft polymerizing the styrene monomer constituting the adhesive composition layer.
As the vinyl acetate copolymer resin, for example, one obtained by polymerization using a known free catalyst polymerization method can be used. In addition, if the content of the ethylene-vinyl acetate copolymer obtained by graft polymerizing the styrene monomer in the adhesive composition layer of the present invention is less than 20% by weight, the adhesive force between the adhesive composition layer and the polystyrene layer becomes weak.
If the content of ethylene-vinyl acetate copolymer grafted with styrene monomer exceeds 80% by weight, the suitability for molding and processing deteriorates. Therefore, in the present invention, the content of ethylene-vinyl acetate copolymer is
20-80% by weight is preferred. In addition, in the present invention, if the amount of polyolefin graft-polymerized with an ethylenically unsaturated monomer having a carbonyl group is less than 20% by weight, the adhesive force between the adhesive composition layer and the saponified material layer becomes weak, and the polyolefin having a carbonyl group is If the amount of polyolefin graft-polymerized with an ethylenically unsaturated monomer exceeds 80% by weight, the adhesive strength between the adhesive composition layer and the polystyrene layer becomes weak. The amount of polyolefin grafted with a saturated monomer is preferably 20 to 80% by weight. Next, examples of the ethylenically unsaturated monomer having a carbonyl group in the present invention include carboxylic acids, carboxylic acid salts, carboxylic acid anhydrides,
Carbonyl based on carboxylic acid ester, carboxylic acid amide or imide, aldehyde, ketone, etc.
【式】基を単独で、或いはシアノ(−C≡
N)基;ヒドロキシ基;エーテル基;オキシラン
[Formula] Group alone or cyano (-C≡N) group; hydroxy group; ether group; oxirane
【式】環等との組合せで有するエチレン
系不飽和単量体の1種又は2種以上の組合せを使
用することができ、その適当な例は次の通りであ
る。
A エチレン系不飽和カルボン酸:
アクリル酸、メタクリル酸、マレイン酸、フ
マル酸、クロトン酸、イタコン酸、シトラコン
酸、5−ノルボルネン−2,3−ジカルボン酸
等。
B エチレン系不飽和無水カルボン酸:
無水マレイン酸、無水シトラコン酸、5−ノ
ルボルネン−2,3−ジカルボン酸無水物、テ
トラヒドロ無水フタル酸等。
C エチレン系不飽和エステル:
アクリル酸エチル、メタクリル酸メチル、ア
クリル酸2−エチルヘキシル、マレイン酸モノ
又はジ−エチル、酢酸ビニル、プロピオン酸ビ
ニル、γ−ヒドロキシメタクリル酸プロピル、
β−ヒドロキシアクリル酸エチル、グリシジル
アクリレート、グリシジルメタクリレート、β
−N−エチルアミノエチルアクリレート等。
D エチレン系不飽和アミドないしイミド:アク
リルアミド、メタクリルアミド、マレイミド
等。
E エチレン系不飽和アルデヒドないしケトン:
アクロレイン、メタクロレイン、ビニルメチル
ケトン、ビニルブチルケトン等。
尚、本発明においては、上述した単量体の内で
も、エチレン系不飽和カルボン酸或いはエチレン
系不飽和無水カルボン酸が特に好適であり、これ
らの単量体は単独で、或いはその他の単量体との
組合せで使用される。
また、本発明におけるポリオレフインとして
は、ポリエチレン、エチレン−αオレフイン共重
合体、ポリプロピレン、ポリブテン、ポリイソブ
チレンのごときポリα−オレフインおよびポリブ
タジエン、ポリイソプレンのごときポリジオレフ
イン、あるいはこれらの共重合体等を使用し得
る。
次に又、本発明においてケン化物層を構成する
エチレン含量20〜50モル%、ケン化度90%以上の
エチレン−酢酸ビニル共重合体ケン化物として
は、公知のものを使用することができ、而して、
本発明においては、エチレン含量20モル%以下で
は耐湿性、耐水性がなく、50モル%以上ではバリ
アー性が低下するため、エチレン含量は20〜50モ
ル%が良い。
またケン化度90%以下ではバリアー性が低下す
るため、ケン化度は90%以上が必要である。
更に又、上記の本発明において、ポリスチレン
層、接着剤組成物層およびケン化物層の3層以外
に更に積層することができる他の樹脂としては、
例えば、ポリエチレン、ポリプロピレン、ポリ塩
化ビニル、ポリ塩化ビニリデン、エチレン−アク
リル酸共重合体、エチレン−メタクリル酸共重合
体、エチレン−酢酸ビニル共重合体、エチレン−
酢酸ビニル共重合体ケン化物、エチレン−α−オ
レフイン共重合体エラストマー、スチレン−ブタ
ジエン−アクリロニトリル共重合体、スチレン−
アクリロニトリル共重合体、ポリアミド、ポリカ
ーボネート、ポリスルホン、ポリアセタール、ポ
リメチルメタクリレート、ポリフエニレンオキシ
ド、ポリウレタン、ポリエチレンテレフタレー
ト、ポリブチレンテレフタレート等の樹脂を単層
もしくは複合して用いることができる。
次に本発明の積層体の製造法について説明する
と、かかる製造法としては種々の方法があり、例
えば、ポリスチレン層、接着剤組成物層、および
ケン化物層の三種を構成するそれぞれの樹脂の単
層シート及びフイルムを積層し、次いでそれらを
一体に加熱、加圧することにより三層を熱接着せ
しめる方法、又は、接着剤組成物層とケン化物層
を構成するそれぞれの樹脂の共押出フイルムを作
成し、次いで該積層フイルムにポリスチレン層を
構成するポリスチレンのフイルムないしシートを
熱接着せしめる方法等がある。
尚、本発明における加熱法としては、誘導加熱
ロールによる熱処理、ドライヤーによる熱風の吹
き付けによる熱処理、火炎による熱処理、等があ
り、80℃〜300℃、好ましくは120℃〜250℃の温
度条件にて熱処理を施こすことが好ましい。
尚、本発明において、第2図に示すような5層
構成の積層体は、共押出方式等で製造することが
でき、第2図に示す積層体の層構成の共押出シー
トを押出すに必要な温度は150℃〜250℃であり、
好ましくは180℃〜240℃である。
又、本発明における積層体において、その層構
成は、ポリスチレン層、接着剤組成物層およびケ
ン化物の三層を基本の層構成とし、これに更に同
一ないし別の層を任意に設けることができるが、
この場合は、通常の接着剤を用いて積層する方
式、或は押出し積層方式等の任意の方法で積層す
ることができる。
次に本発明の積層体を使用する成形法について
簡単に述べると、例えば、真空成形法、圧空成形
法、真空圧空成形法等がある。また、成形、内容
物充填、シール、カツテイングまでを行なうフオ
ーム・フイル・シール法(FFS法)を用いてもよ
い。
本発明によつて得られる積層体はポリスチレン
層とを接着剤組成物層1層のみを介して、強力に
接着することができ、また絞り成形性が良好であ
り、成形時に層間剥離を生じることなく高いバリ
ヤー性を有し、カツプ、トレイ等の各種の樹脂容
器を供給することができる。
また、この樹脂容器は、容器外面及び内面の平
滑性が良好であり、高いバリアー性を必要とする
味噌、醤油、デザート、ジユース、マーガリン、
バター、酒類等の食品包装用容器、薬品包装用容
器等の多方面に使用することができる。
つぎに本発明の実施例をあげて本発明について
更に具体的に説明する。
実施例 1
800μのハイインパクトポリスチレンシートに
スチレン付加量20重量%にてグラフト重合せしめ
た酢酸ビニール含有率28重量%、メルトインデツ
クス12.5g/10分のエチレン−酢酸ビニール共重
合体樹脂50重量%と、メルトインデツクス1.8
g/10分、比重0.905の無水マレイン酸付加量0.3
重量%にてグラフト重合せしめた低密度ポリエチ
レン樹脂50重量%を配合してなる組成物フイルム
を30μ積層し、さらにエチレン−酢酸ビニール共
重合体ケン化物フイルム(エチレン含有率30モル
%、ケン化度99.2%)を17μ積層し、テフロン加
工を施こした誘導加熱ロール(温度:190℃)に
通して熱接着を行なつた(第1図)。
この三層積層体の各層間の接着力を測定したと
ころ、ポリスチレン層−接着剤組成物層間の接着
力は1600gw/15mm巾、接着剤組成物層−ケン化
物層の接着力は1300gw/15mm巾であつた。
実施例 2
メルトフローインデツクス10.5g/10分、比重
1.04なるハイインパクトポリスチレン(新日本製
鉄化学(株)製、エスチレンH−60)をポリスチレン
層とし、スチレン付加量20重量%にてグラフト重
合せしめた酢酸ビニール含有率28重量%、メルト
インデツクス12.5g/10分のエチレン−酢酸ビニ
ール共重合体樹脂50重量%と、メルトインデツク
ス1.8g/10分、比重0.905の無水マレイン酸付加
量0.3重量%にてグラフト重合せしめた低密度ポ
リエチレン樹脂50重量%を配合してなる樹脂を接
着剤組成物層とし、エチレン含量33モル%、ケン
化度99.5モル%、融点180℃のエチレン−酢酸ビ
ニール共重合体ケン化物をケン化物層とし、第2
図のごとく共押出シート成形を行なつた。
各層の厚みはポリスチレン層500μ、接着剤組
成物を30μ、ケン化物層を40μとし、押出温度は
220℃とした。
この共押出シートの各層間の接着力を測定した
ところ、ポリスチレン層−接着剤組成物層間の接
着力は1300gw/15mm巾、接着剤組成物層−ケン
化物層間の接着力は1300gw/15mm巾であつた。
また、該シートを深しぼりの圧空成形を行なつ
たが、層間の剥離や、膜切れは起こらず、成形状
態は良好であつた。
実施例 3
800μのハイインパクトポリスチレンシート1
に、スチレン付加量20重量%にてグラフト重合せ
しめた酢酸ビニール含有率28重量%、メルトイン
デツクス12.5/10分のエチレン−酢酸ビニール共
重合体樹脂70重量%と、メルトインデツクス1.8
g/10分、比重0.905の無水マレイン酸付加量0.3
重量%にてグラフト重合せしめた低密度ポリエチ
レン樹脂30重量%を配合してなる接着剤組成物フ
イルム2を厚さ20μで積層し、さらにエチレン−
酢酸ビニール共重合体ケン化物、フイルム3(エ
チレン含有率30モル%、ケン化度99.2%)を17μ
積層し、さらにメルトインデツクス1.8g/10分、
比重0.905の無水マレイン酸付加量0.3重量%にて
グラフト重合せしめた低密度ポリエチレン樹脂フ
イルム4を20μ積層し、さらにサラネツクス−
26、5(旭ダウ社製商品名厚64μポリエチレン/
ポリ塩化ビニリデン/ポリエチレンの積層体)を
積層し、テフロン加工を施こした誘導加熱ロール
(温度:190℃)に通して熱接着を行なつた(第3
図)。
この積層体の各層間の接着力を測定したとこ
ろ、ポリスチレン層−接着剤組成物層間の接着力
は1500gw/15mm巾、接着剤組成物層−ケン化物
層の接着力は1300gw/15mm巾、ケン化物層−無
水マレイン酸をグラフト重合せしめた低密度ポリ
エチレン層間は剥離不能であり、また、無水マレ
イン酸をグラフト重合せしめた低密度ポリエチレ
ン層−サラネツクス26は剥離不能であつた。
また、該シートを深しぼりの圧空成形を行つた
が、層間の剥離や、膜切れは起こらず、成形状態
は良好であつた。[Formula] One type or a combination of two or more types of ethylenically unsaturated monomers having a ring etc. can be used, and suitable examples thereof are as follows. A Ethylenically unsaturated carboxylic acid: acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, 5-norbornene-2,3-dicarboxylic acid, etc. B Ethylenically unsaturated carboxylic anhydride: maleic anhydride, citraconic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, tetrahydrophthalic anhydride, etc. C Ethylenically unsaturated ester: ethyl acrylate, methyl methacrylate, 2-ethylhexyl acrylate, mono- or di-ethyl maleate, vinyl acetate, vinyl propionate, propyl γ-hydroxymethacrylate,
β-hydroxyethyl acrylate, glycidyl acrylate, glycidyl methacrylate, β
-N-ethylaminoethyl acrylate, etc. D Ethylenically unsaturated amide or imide: acrylamide, methacrylamide, maleimide, etc. E Ethylenically unsaturated aldehyde or ketone:
Acrolein, methacrolein, vinyl methyl ketone, vinyl butyl ketone, etc. In the present invention, among the above-mentioned monomers, ethylenically unsaturated carboxylic acids and ethylenically unsaturated carboxylic anhydrides are particularly preferred, and these monomers may be used alone or in combination with other monomers. Used in combination with the body. In addition, as the polyolefin in the present invention, polyethylene, ethylene-α-olefin copolymer, polyα-olefin such as polypropylene, polybutene, polyisobutylene, polydiolefin such as polybutadiene, polyisoprene, or copolymers thereof, etc. are used. It is possible. Next, in the present invention, as the saponified ethylene-vinyl acetate copolymer having an ethylene content of 20 to 50 mol% and a saponification degree of 90% or more constituting the saponified layer, known ones can be used, Then,
In the present invention, if the ethylene content is less than 20 mol%, there will be no moisture resistance or water resistance, and if it is more than 50 mol%, the barrier properties will decrease, so the ethylene content is preferably 20 to 50 mol%. Also, if the degree of saponification is less than 90%, the barrier properties will deteriorate, so the degree of saponification must be 90% or more. Furthermore, in the present invention, other resins that can be further laminated in addition to the three layers of the polystyrene layer, adhesive composition layer, and saponified layer include:
For example, polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-vinyl acetate copolymer, ethylene-
Saponified vinyl acetate copolymer, ethylene-α-olefin copolymer elastomer, styrene-butadiene-acrylonitrile copolymer, styrene-
Resins such as acrylonitrile copolymer, polyamide, polycarbonate, polysulfone, polyacetal, polymethyl methacrylate, polyphenylene oxide, polyurethane, polyethylene terephthalate, and polybutylene terephthalate can be used in a single layer or in combination. Next, the method for producing the laminate of the present invention will be explained. There are various methods for producing the laminate of the present invention. A method in which the three layers are thermally bonded by laminating a layer sheet and a film and then heating and pressurizing them together, or a coextrusion film of each resin constituting the adhesive composition layer and the saponified material layer is created. Then, there is a method of thermally bonding a polystyrene film or sheet constituting the polystyrene layer to the laminated film. In addition, heating methods in the present invention include heat treatment using an induction heating roll, heat treatment by blowing hot air with a dryer, heat treatment using flame, etc., and at a temperature of 80°C to 300°C, preferably 120°C to 250°C. It is preferable to perform heat treatment. In the present invention, a laminate having a five-layer structure as shown in FIG. 2 can be manufactured by a coextrusion method, etc., and a coextrusion sheet having the layer structure of the laminate shown in FIG. The required temperature is 150℃~250℃,
Preferably it is 180°C to 240°C. Further, in the laminate of the present invention, the basic layer structure is a polystyrene layer, an adhesive composition layer, and a saponified material layer, and the same or different layers can be optionally provided in addition to this. but,
In this case, the layers can be laminated by any method such as a lamination method using an ordinary adhesive or an extrusion lamination method. Next, a brief description of the molding method using the laminate of the present invention includes, for example, a vacuum molding method, a pressure molding method, a vacuum pressure molding method, and the like. Alternatively, a form-fill-seal method (FFS method) may be used, which involves forming, filling, sealing, and cutting. The laminate obtained by the present invention can be strongly bonded to a polystyrene layer through only one adhesive composition layer, has good drawability, and does not cause delamination during molding. It has extremely high barrier properties and can be used in various resin containers such as cups and trays. In addition, this resin container has good smoothness on the outer and inner surfaces of the container, and can be used for miso, soy sauce, desserts, youth, margarine, etc., which require high barrier properties.
It can be used in a variety of ways, such as containers for packaging foods such as butter and alcoholic beverages, and containers for packaging drugs. Next, the present invention will be described in more detail with reference to Examples. Example 1 Ethylene-vinyl acetate copolymer resin 50% by weight with a vinyl acetate content of 28% by weight and a melt index of 12.5g/10 minutes graft polymerized onto a 800μ high-impact polystyrene sheet with a styrene addition amount of 20% by weight. and melt index 1.8
g/10 min, maleic anhydride addition amount 0.3 with specific gravity 0.905
A composition film containing 50% by weight of a low-density polyethylene resin graft-polymerized at 30 μm was laminated, and a saponified ethylene-vinyl acetate copolymer film (ethylene content: 30 mol%, degree of saponification) was laminated. 99.2%) were laminated to a thickness of 17 μm and thermally bonded by passing them through a Teflon-treated induction heating roll (temperature: 190°C) (Figure 1). When the adhesive strength between each layer of this three-layer laminate was measured, the adhesive strength between the polystyrene layer and the adhesive composition layer was 1600 gw/15 mm width, and the adhesive strength between the adhesive composition layer and the saponified material layer was 1300 gw/15 mm width. It was hot. Example 2 Melt flow index 10.5g/10min, specific gravity
1.04 high impact polystyrene (manufactured by Nippon Steel Chemical Co., Ltd., Estyrene H-60) as a polystyrene layer, graft polymerized with styrene addition of 20%, vinyl acetate content 28% by weight, melt index 12.5g 50% by weight of low density polyethylene resin graft polymerized with 50% by weight of ethylene-vinyl acetate copolymer resin for /10 minutes and 0.3% by weight of maleic anhydride with a melt index of 1.8g/10 minutes and a specific gravity of 0.905. The adhesive composition layer is a resin made by blending the above, the saponified ethylene-vinyl acetate copolymer having an ethylene content of 33 mol%, a degree of saponification of 99.5 mol% and a melting point of 180°C is used as the saponified material layer,
Coextrusion sheet molding was carried out as shown in the figure. The thickness of each layer is 500μ for the polystyrene layer, 30μ for the adhesive composition, and 40μ for the saponified layer, and the extrusion temperature is
The temperature was 220℃. When the adhesive strength between each layer of this coextruded sheet was measured, the adhesive strength between the polystyrene layer and the adhesive composition layer was 1300 gw/15 mm width, and the adhesive strength between the adhesive composition layer and the saponified material layer was 1300 gw/15 mm width. It was hot. Further, the sheet was subjected to deep-drawing pressure forming, but no peeling between layers or film breakage occurred, and the forming condition was good. Example 3 800μ high impact polystyrene sheet 1
70% by weight of an ethylene-vinyl acetate copolymer resin with a vinyl acetate content of 28% by weight and a melt index of 12.5/10 minutes, which was graft-polymerized with a styrene content of 20% by weight, and a melt index of 1.8.
g/10 min, maleic anhydride addition amount 0.3 with specific gravity 0.905
An adhesive composition film 2 containing 30% by weight of a low-density polyethylene resin graft-polymerized is laminated to a thickness of 20 μm, and ethylene-
Saponified vinyl acetate copolymer, Film 3 (ethylene content 30 mol%, degree of saponification 99.2%) 17μ
Laminated, melt index 1.8g/10 minutes,
A 20μ low-density polyethylene resin film 4 graft-polymerized with a specific gravity of 0.905 and an added amount of maleic anhydride of 0.3% by weight was laminated, and Saranex-
26, 5 (Product name manufactured by Asahi Dow Co., Ltd. Thickness 64 μ polyethylene /
A laminate of polyvinylidene chloride/polyethylene) was laminated and thermally bonded by passing it through a Teflon-treated induction heating roll (temperature: 190°C).
figure). When the adhesive strength between each layer of this laminate was measured, the adhesive strength between the polystyrene layer and the adhesive composition layer was 1500 gw/15 mm width, and the adhesive strength between the adhesive composition layer and the saponified layer was 1300 gw/15 mm width, and the adhesive strength between the polystyrene layer and the adhesive composition layer was 1300 gw/15 mm width. The compound layer and the low density polyethylene layer grafted with maleic anhydride could not be separated, and the low density polyethylene layer grafted with maleic anhydride Saranex 26 could not be peeled off. Further, the sheet was subjected to deep-drawing pressure forming, but no peeling between layers or film breakage occurred, and the forming condition was good.
第1図は、本発明の積層体の層構成を示す断面
図、第2図と第3図は本発明の積層体の層構成に
ついて別の態様の層構成を示す断面図である。
1……ポリスチレン層、2……接着剤組成物
層、3……エチレン−酢酸ビニル共重合体ケン化
物層。
FIG. 1 is a sectional view showing the layer structure of the laminate of the present invention, and FIGS. 2 and 3 are sectional views showing another embodiment of the layer structure of the laminate of the invention. 1...Polystyrene layer, 2...Adhesive composition layer, 3...Saponified ethylene-vinyl acetate copolymer layer.
Claims (1)
重合せしめた酢酸ビニル含有率5〜50重量%のエ
チレン−酢酸ビニール共重合体樹脂20〜80重量%
に、カルボニル基を有するエチレン系不飽和単量
体をグラフト重合せしめたポリオレフインを20〜
80重量%の割合で配合してなる接着剤組成物層と
エチレン含量20〜50モル%、ケン化度90%以上の
エチレン−酢酸ビニール共重合体ケン化物層の三
層を上記の順にて積層してなる積層体。 2 ポリスチレン層とスチレン単量体をグラフト
重合せしめた酢酸ビニル含有率5〜50重量%のエ
チレン−酢酸ビニール共重合体樹脂20〜80重量%
に、カルボニル基を有するエチレン系不飽和単量
体をグラフト重合せしめたポリオレフインを20〜
80重量%の割合で配合してなる接着剤組成物層と
エチレン含量20〜50モル%、ケン化度90%以上の
エチレン−酢酸ビニール共重合体ケン化物層と上
記の接着剤組成物層および上記のケン化物層の5
層を順に積層してなる積層体。[Scope of Claims] 1. Ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 5 to 50% by weight and 20 to 80% by weight, which is obtained by graft polymerizing a polystyrene layer and a styrene monomer.
20 to 20% polyolefin, which is obtained by graft polymerizing ethylenically unsaturated monomers having carbonyl groups,
Three layers are laminated in the above order: an adhesive composition layer with a ratio of 80% by weight and a saponified ethylene-vinyl acetate copolymer layer with an ethylene content of 20 to 50 mol% and a saponification degree of 90% or more. A laminate made of 2 Ethylene-vinyl acetate copolymer resin with a vinyl acetate content of 5-50% by weight, which is obtained by graft polymerizing a polystyrene layer and a styrene monomer, from 20 to 80% by weight
20 to 20% polyolefin, which is obtained by graft polymerizing ethylenically unsaturated monomers having carbonyl groups,
An adhesive composition layer formed by blending in a ratio of 80% by weight, a saponified ethylene-vinyl acetate copolymer layer with an ethylene content of 20 to 50 mol% and a saponification degree of 90% or more, the above adhesive composition layer, and 5 of the above saponified layer
A laminate made by laminating layers in sequence.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13423882A JPS5924665A (en) | 1982-07-31 | 1982-07-31 | Laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13423882A JPS5924665A (en) | 1982-07-31 | 1982-07-31 | Laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5924665A JPS5924665A (en) | 1984-02-08 |
JPH0126868B2 true JPH0126868B2 (en) | 1989-05-25 |
Family
ID=15123642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13423882A Granted JPS5924665A (en) | 1982-07-31 | 1982-07-31 | Laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5924665A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61168650U (en) * | 1985-04-10 | 1986-10-20 | ||
US4707337A (en) * | 1986-08-11 | 1987-11-17 | Multi-Technology, Inc. | Medical micro pipette tips for difficult to reach places and related methods |
CA2000507C (en) * | 1988-10-19 | 1999-07-06 | Du Pont Canada Inc. | Process for the preparation of grafted polymers of improved colour |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5446281A (en) * | 1977-09-20 | 1979-04-12 | Mitsubishi Petrochem Co Ltd | Manufacture of resin laminate |
JPS5653146A (en) * | 1979-10-05 | 1981-05-12 | Mitsubishi Petrochem Co Ltd | Adherent resin composition |
JPS5653165A (en) * | 1979-10-05 | 1981-05-12 | Mitsubishi Petrochem Co Ltd | Adhesive composition |
-
1982
- 1982-07-31 JP JP13423882A patent/JPS5924665A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5446281A (en) * | 1977-09-20 | 1979-04-12 | Mitsubishi Petrochem Co Ltd | Manufacture of resin laminate |
JPS5653146A (en) * | 1979-10-05 | 1981-05-12 | Mitsubishi Petrochem Co Ltd | Adherent resin composition |
JPS5653165A (en) * | 1979-10-05 | 1981-05-12 | Mitsubishi Petrochem Co Ltd | Adhesive composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5924665A (en) | 1984-02-08 |
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