JPH01265593A - Electric component and mounting and dismounting method thereof - Google Patents
Electric component and mounting and dismounting method thereofInfo
- Publication number
- JPH01265593A JPH01265593A JP9390088A JP9390088A JPH01265593A JP H01265593 A JPH01265593 A JP H01265593A JP 9390088 A JP9390088 A JP 9390088A JP 9390088 A JP9390088 A JP 9390088A JP H01265593 A JPH01265593 A JP H01265593A
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- circuit board
- printed circuit
- component
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 26
- 229910052742 iron Inorganic materials 0.000 description 13
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、フラットパッケージ型ＩＣのような電気部
品及びこの電気部品をプリント基板に取付は或いは取外
すための取付方法及び取外し方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to an electrical component such as a flat package IC, and a method for attaching or detaching the electrical component to or from a printed circuit board. .
従来より、各種分野にＩＣ等の電気部品が多数使用され
ている。そして、例えばこのＩＣにあっては、フラット
パッケージ型等のようなものが知られている。Conventionally, many electrical components such as ICs have been used in various fields. As for this IC, for example, a flat package type is known.
ところで、このフラットパッケージ型ＩＣは、第１１図
及び第１２図に示すように、本体１００側の４つの側方
側から多数の端子１０１が突出した形状となっており、
このようなＩＣをプリント基板１０２上に実装するには
、例えばプリント基板１０２側のパターン配線（囲路）
側の所定の各ランド（囲路）部分にフラックスを塗布し
、その上に搭載したＩＣの各端子１０１部分に半田こて
１０３をあてがいながら半田付けして取付けるようにな
っている。このため、その半日ごて１０３としては、例
えば端子の配置形状に合わせて先端側が略口の字型に形
成された専用のものく以下これを口字型ごてとよぶ）を
使用することがある。By the way, as shown in FIGS. 11 and 12, this flat package type IC has a shape in which a large number of terminals 101 protrude from four sides of the main body 100.
In order to mount such an IC on the printed circuit board 102, for example, pattern wiring (enclosure) on the printed circuit board 102 side is required.
Flux is applied to each predetermined land (circle) on the side, and a soldering iron 103 is applied to each terminal 101 of the IC mounted thereon to solder the IC. Therefore, as the half-day iron 103, it is possible to use, for example, a dedicated one whose tip side is formed into a substantially ``mouth'' shape (hereinafter referred to as ``mouth-shaped iron'') to match the arrangement shape of the terminals. be.
ところで、通常一般に多くの端子を有するＩＣ等のよう
な電気部品を半田付けする場合には、まずそのＩＣが所
定位置に正しく搭載され位置合わせされた状態で取付け
なければ、ＩＣ側の各端子とプリント基板側の各ランド
とがずれたり他のもの同士と半田付けされたりして隣の
端子やランドとの間でショートする等の虞れがある。By the way, when soldering an electrical component such as an IC that generally has many terminals, the IC must first be properly mounted and aligned in a predetermined position, otherwise each terminal on the IC side will be connected. There is a risk that each land on the printed circuit board side may be misaligned or soldered to another component, resulting in a short circuit between adjacent terminals or lands.
そこで、予めそのＩＣ側を所定位置に手等で押さえるよ
うにして固定しておきながらそのＩＣ側のいくつかの端
子をまず仮止めしておき、その後金ての端子とランドと
を半田付けするような方法が取られている。ところが、
先のような口字型ごて等を用いる場合には形状的に外か
ら手でＩＣを押さえることが難しく、四隅側等に形成さ
れた隙間から細い棒状の治具等を差し入れる等の手段し
か行えないため１．取付けの際にＩＣ側が移動しやすく
問題となっている。Therefore, while holding the IC side in a predetermined position with your hand, temporarily fasten some terminals on the IC side, and then solder the metal terminals and the lands. Such a method is being adopted. However,
When using a trowel like the one mentioned above, it is difficult to press the IC from the outside by hand due to its shape, so it is necessary to insert a thin rod-shaped jig etc. through the gaps formed at the four corners etc. 1. The IC side tends to move easily during installation, which poses a problem.
また、先のＩＣ等を交換等のため取外すときには、半田
が溶けたタイミングを見計らってすばやくそのＩＣをプ
リント基板側から引き剥がさなければならないが、先の
ような口字型ごて等の場合には棒状の治具で外からタイ
ミングよく引き剥がすのが困難であり、これも問題にな
っている。Also, when removing the previous IC etc. for replacement etc., it is necessary to judge the timing when the solder melts and quickly peel off the IC from the printed circuit board side. It is difficult to peel it off from the outside in a timely manner using a rod-shaped jig, which is also a problem.
そこで、この発明は、上記した従来の欠点に鑑み、簡単
に、かつ正確に取付けることもできる電気部品とプリン
ト基板及びその取付方法並びに取外し方法を提供するこ
とを目的とするものである。SUMMARY OF THE INVENTION In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide an electrical component and a printed circuit board that can be easily and accurately attached, as well as methods for attaching and detaching the same.
即ち、この発明は、ＩＣ等の電気部品において、突起若
しくは鉤状の窪みからなる係止手段を設けたものである
。That is, the present invention provides an electric component such as an IC with a locking means consisting of a protrusion or a hook-shaped recess.
更に、この発明の電気部品の取付方法は、電気部品取付
時に、プリント基板側に電気部品を半田付けするのに先
立って、そのプリント基板の電気部品実装面とは反対面
側から作業孔を介して治具等の固定手段を挿通し、前記
電気部品を所定位置に固定しておくようになっているも
のである。Furthermore, in the method for attaching an electrical component of the present invention, when attaching an electrical component, prior to soldering the electrical component to the printed circuit board, the electrical component is soldered through the working hole from the opposite side of the printed circuit board from the surface on which the electrical component is mounted. The electric component is fixed in a predetermined position by inserting a fixing means such as a jig into the electrical component.
また、この発明の電気部品の取外し方法は、電気部品取
外し時に、プリント基板の電気部品実装面とは反対面側
から作業孔を介して治具等の突当手段を挿通し、プリン
ト基板側に電気部品を取付けていた半田を溶解しながら
突当手段によって前記電気部品を押出し取外すものであ
る。Further, in the method for removing an electrical component of the present invention, when removing the electrical component, an abutting means such as a jig is inserted through a working hole from the side opposite to the surface on which the electrical component is mounted on the printed circuit board, and The electric component is pushed out and removed by the abutment means while melting the solder that attached the electric component.
この発明の電気部品は、突起又は鉤状の窪み等からなる
係止手段が設けられており、この係止手段を利用してそ
の電気部品のプリント基板側への取付作業やプリント基
板側からの取外し時の押出作業等が容易に行える。The electrical component of the present invention is provided with a locking means consisting of a protrusion or a hook-shaped recess, and this locking means is used to attach the electrical component to the printed circuit board side or to attach the electrical component from the printed circuit board side. Extrusion work etc. during removal can be easily performed.
更に、この発明の電気部品の取付方法は、電気部品をプ
リント基板に取付ける際に、プリント基板の作業孔を介
して治具等の固定手段を挿通し、その固定手段によって
電気部品をプリント基板側に係止固定させた状態で、口
字型ごて等によって同時に素早（半田付けする。Furthermore, in the method for attaching an electrical component of the present invention, when attaching an electrical component to a printed circuit board, a fixing means such as a jig is inserted through a working hole of the printed circuit board, and the fixing means is used to attach the electrical component to the printed circuit board side. With the parts locked and fixed, quickly solder them at the same time using a mouth-shaped iron, etc.
また、この発明の電気部品の取外し方法は、電気部品を
プリント基板側から取外す際に、プリント基板の作業孔
を介して治具等の突当手段を挿通し、その突当手段によ
って電気部品を押出すような状態で、口字型ごて等によ
って簡単に取外す。Further, in the method for removing an electrical component of the present invention, when removing the electrical component from the printed circuit board side, an abutting means such as a jig is inserted through the working hole of the printed circuit board, and the electrical component is removed by the abutting means. It can be easily removed using a protruding iron, etc. while pushing it out.
以下、この発明の実施例について添付図面を参照しなが
ら説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図及び第２図はこの発明にかかる電気部品を示すも
のであり、この実施例の電気部品は、係止手段２を備え
た構成となっている。1 and 2 show an electrical component according to the present invention, and the electrical component of this embodiment is provided with a locking means 2. As shown in FIG.
電気部品１は、本体１ａの側面側から端子１ｂが突出し
たフラットパッケージ型ＩＣが使用されており、本体１
ａの下面側に係止手段２が設けられている。この実施例
の係止手段２は、本体１ａの後に説明する作業孔に対応
する位置に形成した２個の突起から構成されており、こ
れらの突起はその電気部品１を取付は取外す際に用いる
ようになっている。なお、この発明の電気部品としては
、特にこの実施例のフラットパッケージ型ＩＣに限定さ
れるものではない。また、この発明の係止手段としては
、特にこの実施例のものの他に、例えば第３図に示すよ
うに、電気部品３本体側方側に凸状の突起４を設けた構
成であっても可能である。The electrical component 1 is a flat package IC with terminals 1b protruding from the side surface of the main body 1a.
A locking means 2 is provided on the lower surface side of a. The locking means 2 of this embodiment is composed of two protrusions formed on the main body 1a at positions corresponding to working holes to be described later, and these protrusions are used when installing or removing the electrical component 1. It looks like this. Note that the electrical component of the present invention is not particularly limited to the flat package type IC of this embodiment. Further, as the locking means of the present invention, in addition to the locking means of this embodiment, for example, as shown in FIG. It is possible.
また、その係止手段としては、第４図に示すように、鉤
状の凹所５ａを設けたちの５を電気部品６本体下面側に
固着させてもよい。Further, as the locking means, as shown in FIG. 4, a hook-shaped recess 5a may be provided and a hook 5 may be fixed to the lower surface side of the main body of the electrical component 6.
次にこの発明に係るプリント基板について第５図及び第
６図を参照しながら説明する。Next, the printed circuit board according to the present invention will be explained with reference to FIGS. 5 and 6.
この実施例のプリント基板７は、第１実施例の電気部品
１の端子１ｂを接続されるパターン配線８側のランド９
で囲まれた内側であってパターン配線８が形成されてい
ない部分を利用して作業孔１０が穿設されている。The printed circuit board 7 of this embodiment has a land 9 on the pattern wiring 8 side to which the terminal 1b of the electrical component 1 of the first embodiment is connected.
A working hole 10 is bored using the inner part surrounded by , where the pattern wiring 8 is not formed.
次に、この発明に係る電気部品の取付方法について第７
図及び第８図を参照しながら説明する。Next, the seventh section describes the method for attaching electrical components according to the present invention.
This will be explained with reference to FIG. 8 and FIG.
なお、この実施例にあっては、第１実施例に示す電気部
品１を用いた場合について説明しているが、特にこれに
限定されるものではない。Although this embodiment describes a case where the electrical component 1 shown in the first embodiment is used, the present invention is not particularly limited to this.
（１） まず、第７図に示すような略Ｈ型をなし、比
較的可撓性を有する熱可塑性樹脂等によって形成された
治具等の固定手段１１を用意する。なお、この固定手段
１１は、電気部品１を正確に位置決めして固定させるた
め、所定の寸法に精度よく形成されていることが望まし
い。また、この固定手段１１については、特にこの実施
例のものに限定されるものではなく、同様の効果を奏す
るものであれば他の形状の治具等を用いてもよい。(1) First, a fixing means 11 such as a jig, which is approximately H-shaped as shown in FIG. 7 and made of a relatively flexible thermoplastic resin or the like, is prepared. Note that, in order to accurately position and fix the electrical component 1, the fixing means 11 is desirably formed to have predetermined dimensions with high precision. Furthermore, the fixing means 11 is not particularly limited to that of this embodiment, and jigs of other shapes may be used as long as they provide the same effect.
（２）そして、所定の電気部品１をその各プリント基板
７の端子１ｂがそれぞれ対応するランド９に載置される
ような状態で正しく位置決めして搭載させたならば、プ
リント基板７下面側から固定手段１１を電気部品１にセ
ットする。即ち、この固定手段１１の各鉤状ブロックＩ
ｌａが係止手段２に係止するよう作業孔１０に脚部１１
ｂを挿通させる（第７図参照）。(2) Once the predetermined electrical components 1 have been correctly positioned and mounted in such a manner that the terminals 1b of each printed circuit board 7 are placed on the corresponding lands 9, The fixing means 11 is set on the electrical component 1. That is, each hook-shaped block I of this fixing means 11
The leg portion 11 is inserted into the working hole 10 so that the
b (see Figure 7).
（３） このようにして、固定手段１１を用いて電気
部品１を所定位置に正しく固定させたならば、口字型ご
て１２を用いてフラツクスを塗布しておいたランド９と
端子１ｂとの間を半田付けする（第８図参照）。(3) After the electrical component 1 is properly fixed in the predetermined position using the fixing means 11 in this way, the land 9 and the terminal 1b to which flux has been applied using the prong-shaped iron 12 are connected. (See Figure 8).
（４）その後口字型ごて１２を取除き、半田が冷却され
てランド９側に端子１ｂが完全に固着されたならば、固
定手段１１を電気部品１から取外し、プリント基板７側
から抜き去る。(4) After that, remove the prong-shaped iron 12, and once the solder has cooled and the terminal 1b is completely fixed to the land 9 side, remove the fixing means 11 from the electrical component 1 and pull it out from the printed circuit board 7 side. leave.
したがって、この実施例の電気部品の取付方法によれば
、固定手段１１によって電気部品１の固定操作の際に電
気部品１の正確な位置決めを同時に行うことができる。Therefore, according to the electrical component mounting method of this embodiment, the electrical component 1 can be accurately positioned at the same time when the electrical component 1 is fixed by the fixing means 11.
次に、この発明に係る電気部品の取外し方法について第
９図及び第１０図を参照しながら説明する。なお、この
実施例にあっては、第１実施例に示す電気部品１を用い
た場合について説明しているが、特にこれに限定される
ものではない。Next, a method for removing electrical components according to the present invention will be explained with reference to FIGS. 9 and 10. Although this embodiment describes a case where the electrical component 1 shown in the first embodiment is used, the present invention is not particularly limited to this.
（１） まず、第９図に示すように口字型ごて１２を
用いてプリント基板７に電気部品１を半田付けしである
各端子ｉｂのランド９対応部分にその口字型ごて１２を
あてがいながら半田を溶解する。(1) First, as shown in FIG. 9, solder the electrical component 1 to the printed circuit board 7 using a prong-shaped iron 12. Melt the solder while applying it.
（２）次に第１０図、に示すような略コ字型に形成され
、比較的剛性を有する治具等の突当手段１３を用意し、
プリント基板７の下面側からその突当手段１３の両脚部
１３ａを作業孔１０に挿通させて電気部品１を押上げる
ような状態で押圧する。(2) Next, prepare an abutting means 13 such as a relatively rigid jig, which is formed into a substantially U-shape as shown in FIG.
Both legs 13a of the abutting means 13 are inserted into the working hole 10 from the lower surface side of the printed circuit board 7, and the electric component 1 is pressed upward.
（３） このようにして、口字型ごてによって半田を
溶解しながら電気部品ｌを突当手段１３によって押上げ
ると、プリント基板７側から電気部品１が容易に取外す
ことができる。(3) In this way, when the electric component 1 is pushed up by the abutting means 13 while melting the solder with the pronged iron, the electric component 1 can be easily removed from the printed circuit board 7 side.
なお、この実施例では突当手段として略コ字型の治具を
用いであるが、特にこれに限定されるものではなく、同
様の効果を奏するものであればそれでも可能であり、例
えば先の治具の替わりに指を用い、作業孔を通して指先
で突上げるようにしてもよい。In this embodiment, a substantially U-shaped jig is used as the abutment means, but the jig is not limited to this, and any other jig can be used as long as it produces the same effect. It is also possible to use a finger instead of a jig and push it up through the working hole with the tip of the finger.
以上説明してきたように、この発明に係る電気部品によ
れば、この電気部品の取付作業の際に、係止手段を利用
し簡単な操作で確実にかつ正確に取付けることが可能と
なるため、端子のショート事故が発生したりするのを有
効に防止できる。As explained above, according to the electrical component according to the present invention, when installing the electrical component, it is possible to install it reliably and accurately with a simple operation using the locking means. It is possible to effectively prevent terminal short-circuit accidents from occurring.
また、この発明に係るプリント基板によれば、例えば電
気部品が故障を起こし新しいものと取替える等のため、
その電気部品をプリント基板から取外すような場合、そ
の作業孔を介して突当手段をプリント基板の下面側から
挿入し、その電気部品に下方側から突当て押圧させるこ
とができるため、口字型ごて等を使用するとプリント基
板上面側が使用できないような場合であっても、確実に
電気部品を取外すことができる。Further, according to the printed circuit board according to the present invention, for example, when an electrical component breaks down and is replaced with a new one,
When removing the electrical component from the printed circuit board, the abutting means can be inserted from the bottom side of the printed circuit board through the working hole, and the electrical component can be abutted and pressed from the bottom side. If you use a iron or the like, you can reliably remove electrical components even if the top side of the printed circuit board cannot be used.
更に、この発明に係る電気部品の取付方法によれば、プ
リント基板の作業孔を介して固定手段を挿通し、この固
定手段によってプリント基板の下面側から電気部品が固
定できるため、例えば口字型ごて等を使用するとプリン
ト基板の上面側から操作できないような場合であっても
、簡単に電気部品を半田付けすることができる。Further, according to the method for attaching an electrical component according to the present invention, the fixing means is inserted through the working hole of the printed circuit board, and the electrical component can be fixed from the bottom side of the printed circuit board by this fixing means. If you use a soldering iron or the like, you can easily solder electrical components even if you cannot operate from the top side of the printed circuit board.
更に、この発明に係る電気部品の取外し方法によれば、
プリント基板の作業孔を介して突出手段を下面側から挿
入し、この突当手段によって電気部品をプリント基板の
下面側から押上げることができるため、例えば口字型ご
て等を使用するとプリント基板の上面側から操作できな
いような場合であっても、簡単に、かつ確実に電気部品
を剥がすことができる。Furthermore, according to the method for removing electrical components according to the present invention,
The protruding means is inserted from the bottom side through the working hole of the printed circuit board, and this abutment means can push up the electrical components from the bottom side of the printed circuit board. For example, if a protruding iron is used, the printed circuit board can be pushed up. Even in cases where it is impossible to operate from the top side of the device, electrical components can be easily and reliably removed.
第１図はこの発明に係る電気部品を下側から眺めたとき
の状態を示す斜視図、第２図は第１図における断面図、
第３図はこの発明に係る他の電気部品を示す斜視図、第
４図は更に他の電気部品を示す断面図、第５図はこの発
明に係るプリント基板を示す斜視図、第６図は第５図に
おけるｒ−ｒ矢視断面図、第７図及び第８図はそれぞれ
この発明に係る電気部品の取付方法を示す断面図、第９
図及び第１０図はそれぞれこの発明に係る電気部品の取
外し方法を示す断面図、第１１図は従来から用いられて
いるフラットパッケージ型ＩＣに半田で取付けるときの
状態を説明するための斜視図、第１２図は従来のフラッ
トパッケージ型ＩＣをプリント基板側に取付ける際の口
字型ごての操作状態を説明する断面図である。
■ ・・・電気部品。
２．４．５・・・係止手段。
７ ・・・プリント基板。
１１・・・固定手段。
１３・・・突当手段。
１０・・・作業孔。
出願人 日本電気ホームエレクト
ロニクス株式会社
代理人 弁理士 増 １）竹 夫
薯 Ｉ Ｍ
／゛
第 ２ 図
第３図
第 ５ 図
第 ７ 図
第 ８ 図
第９図
第 １０ 図FIG. 1 is a perspective view showing the electrical component according to the present invention when viewed from below, FIG. 2 is a sectional view of FIG. 1,
3 is a perspective view showing another electrical component according to the present invention, FIG. 4 is a sectional view showing still another electrical component, FIG. 5 is a perspective view showing a printed circuit board according to the present invention, and FIG. 6 is a perspective view showing another electrical component according to the invention. 5, 7 and 8 are sectional views showing the method of attaching electrical components according to the present invention, and 9.
10 and 10 are cross-sectional views showing a method for removing an electrical component according to the present invention, and FIG. 11 is a perspective view illustrating a state in which it is attached by soldering to a conventionally used flat package type IC. FIG. 12 is a cross-sectional view illustrating the operating state of the mouth-shaped iron when attaching a conventional flat package type IC to a printed circuit board. ■...Electrical parts. 2.4.5...Locking means. 7...Printed circuit board. 11...Fixing means. 13... Contingency means. 10... Working hole. Applicant NEC Home Electronics Co., Ltd. Agent Patent Attorney Masu 1) Takeo I M/゛Figure 2Figure 3Figure 5Figure 7Figure 8Figure 9Figure 10
Claims (1)
を特徴とする電気部品。 ２、電気部品取付時に、プリント基板側に電気部品を半
田付けするのに先立って、そのプリント基板の電気部品
実装面とは反対面側から作業孔を介して治具等の固定手
段を挿通し、 前記電気部品を所定位置に固定しておく ことを特徴とする電気部品の取付方法。 ３、電気部品取外し時に、プリント基板の電気部品実装
面とは反対面側から作業孔を介して治具等の突当手段を
挿通し、 プリント基板側に電気部品を取付けていた半田を溶解し
ながら突当手段によって前記電気部品を押出し取外す ことを特徴とする電気部品の取外し方法。[Claims] 1. An electrical component such as an IC, characterized in that it is provided with a locking means consisting of a protrusion or a hook-shaped recess. 2. When installing electrical components, before soldering the electrical components to the printed circuit board, insert a fixing means such as a jig through the working hole from the side opposite to the electrical component mounting surface of the printed circuit board. . A method for attaching an electrical component, comprising fixing the electrical component in a predetermined position. 3. When removing electrical components, insert a jig or other abutting means through the work hole from the opposite side of the printed circuit board from where the electrical components are mounted to melt the solder that attached the electrical components to the printed circuit board. A method for removing an electrical component, characterized in that the electrical component is pushed out and removed by an abutting means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9390088A JPH01265593A (en) | 1988-04-15 | 1988-04-15 | Electric component and mounting and dismounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9390088A JPH01265593A (en) | 1988-04-15 | 1988-04-15 | Electric component and mounting and dismounting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01265593A true JPH01265593A (en) | 1989-10-23 |
Family
ID=14095357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9390088A Pending JPH01265593A (en) | 1988-04-15 | 1988-04-15 | Electric component and mounting and dismounting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01265593A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4204882A1 (en) * | 1992-02-18 | 1993-08-19 | Helmut Walter Leicht | Soldering device for surface mounting components with close contacts - positions frame holding components over PCB, then presses component contacts against PCB contacts and solders |
| JP2011199018A (en) * | 2010-03-19 | 2011-10-06 | Yaskawa Electric Corp | Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component |
-
1988
- 1988-04-15 JP JP9390088A patent/JPH01265593A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4204882A1 (en) * | 1992-02-18 | 1993-08-19 | Helmut Walter Leicht | Soldering device for surface mounting components with close contacts - positions frame holding components over PCB, then presses component contacts against PCB contacts and solders |
| JP2011199018A (en) * | 2010-03-19 | 2011-10-06 | Yaskawa Electric Corp | Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component |
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