JPH01265406A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH01265406A JPH01265406A JP9496288A JP9496288A JPH01265406A JP H01265406 A JPH01265406 A JP H01265406A JP 9496288 A JP9496288 A JP 9496288A JP 9496288 A JP9496288 A JP 9496288A JP H01265406 A JPH01265406 A JP H01265406A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive paste
- resistance value
- organic binder
- oxidation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims abstract description 30
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 238000004898 kneading Methods 0.000 claims abstract description 3
- 238000005275 alloying Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000001035 drying Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電子機器等の配線基板に用いられる導電性ペ
ーストに関し、詳しくはＮｉを主成分とする低温形の導
電性ペーストに関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a conductive paste used for wiring boards of electronic devices, etc., and specifically relates to a low-temperature conductive paste containing Ni as a main component. .
［従来の技術］
従来、電子機器等の配線基板には、スクリーン印刷技術
を利用した集積化技術が適用されている。[Prior Art] Conventionally, integration technology using screen printing technology has been applied to wiring boards for electronic devices and the like.
この技術は、例えば、ガラス基板上に導電性ペーストを
塗布して１５０℃程度で乾燥して配線回路を形成するも
のである。通常、こうした導電性ペーストには、Ａｕ
、Ａｇ等の貴金属が用いられているが、これらは高い導
電性（例えば、Ａｇ導電性ペーストの抵抗＠：ｌＸ１０
−’Ω令ｃｍ）を必要とする箇所には適するが、ある程
度大きい抵抗°値を必要とする箇所、例えば、抵抗体や
コンデンサーとして利用する場合には適さない。In this technique, for example, a conductive paste is applied onto a glass substrate and dried at about 150° C. to form a wiring circuit. Typically, such conductive pastes include Au
, Ag and other noble metals are used, but these have high conductivity (for example, the resistance of Ag conductive paste @: lX10
Although it is suitable for locations that require a resistance of -'Ω cm), it is not suitable for locations that require a relatively large resistance value, such as when used as a resistor or a capacitor.
一方、配線基板に抵抗体を形成する場合には、Ｃを含有
した導電性ペースト（抵抗値：５Ω・Ｃｍ）等が用いら
れている。また、ＡｇとＣとの間の抵抗値を必要とする
コンデンサーや配線等に適する導電性ペーストとしては
、例えば、Ｎｉの導電性ペースト（抵抗値： １．５Ｘ
１０−１Ω・Ｃｍ）が知られている。On the other hand, when forming a resistor on a wiring board, a conductive paste containing C (resistance value: 5Ω·Cm) or the like is used. In addition, as a conductive paste suitable for capacitors, wiring, etc. that require a resistance value between Ag and C, for example, Ni conductive paste (resistance value: 1.5X
10-1Ω·Cm) is known.
［発明が解決しようとする課題］
しかしながら、さらに、各種の抵抗値、例えば、ｌＸｌ
０−２Ω◆ｃｍオーダの抵抗値を示す導電性ペーストが
求められている。しかし、例えばＮｉにＡｇ等の元素を
含有させた場合には乾燥工程でＮｉが酸化して抵抗値）
がばらついたりすることがあるので、ばらつきのない安
定した抵抗値を示す導電性ペーストが求められていた。[Problems to be Solved by the Invention] However, in addition, various resistance values, such as lXl
There is a need for a conductive paste that exhibits a resistance value on the order of 0-2 Ω◆cm. However, for example, if Ni contains elements such as Ag, the Ni will oxidize during the drying process (resistance value)
Therefore, there has been a need for a conductive paste that exhibits stable resistance values without variations.
本発明は、上述した要望に基づいてなされたものであり
、抵抗値がＡｇとＣの導電性ペーストの間に位置し、か
つ安定した特性を示す低温形の導電性ペーストを提供す
ることを目的とする。The present invention has been made based on the above-mentioned needs, and an object thereof is to provide a low-temperature conductive paste that has a resistance value between that of Ag and C conductive pastes and exhibits stable characteristics. shall be.
［課題を解決するための手段］
上記課題を解決するためになされた本発明の導電性ペー
ストは、Ｎｉ粉末にＢ粉末を混合し、またはＮｉにＢを
合金化した粉末を含有するとともに、該粉末に有機質バ
インダーを混練してなることを特徴とする。[Means for Solving the Problems] The conductive paste of the present invention made to solve the above problems contains a powder obtained by mixing Ni powder with B powder or alloying Ni with B, and It is characterized by being made by kneading an organic binder into powder.
ここで、ＢのＮｉに対する重量比は、導電性ペーストの
抵抗値を種々の値に設定したり、あるいは導電性ペース
トに対して種々の特性を得るために、各種の値を採るこ
とができるが、純Ｎｉからなる導電性ペーストの抵抗＠
（１，５Ｘ１０−１Ω令ｃｍ）とほぼ同じ抵抗値になる
Ｂの含有量が３５重量％であるから、Ｎｉより低い抵抗
値の導線性ペーストを得るためには、Ｂの含有量を３重
量％から３０重量％に調整し、一方、高い抵抗値を得る
ためには、４０重量％以上に調整すれば、純Ｎｉの抵抗
値と異なる抵抗値を得ることができる。Here, the weight ratio of B to Ni can be set to various values in order to set the resistance value of the conductive paste to various values or to obtain various characteristics for the conductive paste. , resistance of conductive paste made of pure Ni @
(1,5 x 10-1 Ω cm), the B content is 35% by weight, so in order to obtain a conductive paste with a lower resistance than Ni, the B content must be increased by 3% by weight. % to 30% by weight, and on the other hand, in order to obtain a high resistance value, by adjusting it to 40% by weight or more, it is possible to obtain a resistance value different from that of pure Ni.
Ｂは粉末としてＮｉ粉末に混合するほか、ＢとＮｉの合
金としても用いることができる。In addition to being mixed with Ni powder as a powder, B can also be used as an alloy of B and Ni.
また、Ｂは単体の粉末として用いるほかに、Ｂ化合物の
粉末でもよ＜、Ｂ化合物が當温大気中で安定であるもの
、例えば、ＢとＡＱ、 Ｃｏ、 Ｎｉ、Ｔｉ、Ｚｒと
の化合物であってもよい。In addition to using B as a single powder, it can also be used as a powder of a B compound. B compounds are stable in the atmosphere at temperatures such as compounds of B and AQ, Co, Ni, Ti, and Zr. There may be.
Ｎｉ、Ｂ、Ｂ化合物は粉末として用いた場合には、その
粒径は、１〜１０μｍ程度が望ましい。When the Ni, B, and B compounds are used as powders, the particle size is preferably about 1 to 10 μm.
これは、１μｍより小さいと乾燥して配線を形成した際
に収縮が大きく、被膜が基板から剥離したり、被膜に亀
裂が入ったりするからであり、一方、１０μｍより大き
すぎると被膜の表面粗さが大きくなるからである。This is because if it is smaller than 1 μm, the shrinkage will be large when it dries and wiring is formed, causing the film to peel off from the substrate or cracks. On the other hand, if it is larger than 10 μm, the surface of the film will become rough. This is because it becomes larger.
有機質バインダーとしては、エポキシ樹脂、アクリル樹
脂、フェノール樹脂、ポリイミド樹脂などの高分子樹脂
を、テレピネオールやカルピトールアセテート、ジエチ
レングリコール、モノエチルエーテル等の溶媒で溶かし
たものを用いることができ、その含有量は、有機質バイ
ンダーの本来の性質および導電性ペーストの抵抗値を考
慮して、１５〜４０重量％である。As the organic binder, a polymer resin such as epoxy resin, acrylic resin, phenol resin, or polyimide resin dissolved in a solvent such as terpineol, carpitol acetate, diethylene glycol, or monoethyl ether can be used, and its content is 15 to 40% by weight, taking into consideration the inherent properties of the organic binder and the resistance value of the conductive paste.
また、導電性ペーストには、必要に応じて、粘度１１節
剤（例えば、ポリビニルアルコールや分散剤（例えば、
オレイン酸）を添加して混練してもよい。The conductive paste may also contain viscosity modifiers (e.g., polyvinyl alcohol, dispersants (e.g.,
oleic acid) may be added and kneaded.
［作用］
本発明の導電性ペーストには、Ｎｉ粉末および有機質バ
インダーのほかに、Ｂが粉末または合金化されて含有さ
れている。このようにＢが含有されていると、基板上に
導電性ペーストを塗布し、大気中で１５０℃程度で乾燥
すると、Ｎｉに対してＢが選択的に酸化される。これに
より導電性ペーストの表面にＢの酸化により表面被膜が
形成され、内部のＮｉを不働態化することによりＮｉの
酸化を防止する。よって、Ｎｉ粉末だけの導電性ペース
トのように乾燥中にＮｉ酸化物が形成されて抵抗値が上
がったり、ばらついたりすることがないので、安定した
抵抗値を得ることができる。[Function] The conductive paste of the present invention contains B in the form of powder or alloy in addition to Ni powder and an organic binder. When B is contained in this way, when a conductive paste is applied onto a substrate and dried at about 150° C. in the atmosphere, B is selectively oxidized with respect to Ni. As a result, a surface film is formed on the surface of the conductive paste by oxidation of B, and oxidation of Ni is prevented by passivating the Ni inside. Therefore, unlike a conductive paste made only of Ni powder, Ni oxide is not formed during drying and the resistance value does not increase or fluctuate, so a stable resistance value can be obtained.
特に、Ｎｉに対してＢを５〜３０重量％含有させると、
本来のＮｉの酸化防止効果が有効に作用して、Ｎｉ単体
より低い抵抗値を示す導電性ペーストが得られる。In particular, when B is contained in an amount of 5 to 30% by weight relative to Ni,
The original anti-oxidation effect of Ni acts effectively, and a conductive paste that exhibits a lower resistance value than Ni alone can be obtained.
［実施例］
以下本発明の一実施例を説明する。なお、本実施例の作
用効果を明確にするために従来技術に相当する比較例と
ともに説明する。[Example] An example of the present invention will be described below. In order to clarify the effects of this example, it will be explained together with a comparative example corresponding to the prior art.
まず、Ｎｉ粉末を平均粒径で３μｍに製造し、さらにＢ
粉末を平均粒径で１μｍに製造する。First, Ni powder was manufactured to have an average particle size of 3 μm, and then B
The powder is produced with an average particle size of 1 μm.
次に、Ｎｉ粉末とＢ粉末、さらに有機質バインダーとを
混練して導電性ペーストを製造する。有機質バインダー
として、エポキシ樹脂にテレピネオールを溶剤としたも
のを用いる。なお、それらの組成は、金属粉末が８５重
量％で、有機質バインダーが１５重量％である。Next, Ni powder, B powder, and an organic binder are kneaded to produce a conductive paste. As the organic binder, an epoxy resin containing terpineol as a solvent is used. Note that their composition is 85% by weight of metal powder and 15% by weight of organic binder.
このような手法により本実施例の導電性ペーストを製造
するが、Ｂの含有量を種々の値に変えた例（試料１〜５
）を第１表に示す。The conductive paste of this example is manufactured by such a method, but examples in which the content of B is changed to various values (samples 1 to 5) are used.
) are shown in Table 1.
そして、これらの導電性ペーストを用いて、ガラス基板
上に幅０．５ｍｍ、長さ１００ｍｍ、厚さ３０μｍの線
を４００メ・ンシュにてスクリーン印刷し、１５０℃で
２０分間乾燥・固化させて導体を形成した。そして、こ
の導体の体積抵抗値を測定した。なお、比較例として、
Ｎｉ単体（試料７）、およびＡｇ単体（試料８）、Ｃ単
体（試料９）からなる導電性ペーストも同様な条件にて
製造および体積抵抗値の測定を行い、その結果を第１表
に併記する。また、Ｂの含有量に応じた体積抵抗値の変
化を第１図に示す。Then, using these conductive pastes, lines with a width of 0.5 mm, a length of 100 mm, and a thickness of 30 μm were screen printed on a 400-mesh screen on a glass substrate, and the paste was dried and solidified at 150°C for 20 minutes. A conductor was formed. Then, the volume resistance value of this conductor was measured. As a comparative example,
Conductive pastes consisting of Ni alone (sample 7), Ag alone (sample 8), and C alone (sample 9) were manufactured under the same conditions and their volume resistance values were measured, and the results are also listed in Table 1. do. Further, FIG. 1 shows the change in volume resistivity depending on the B content.
第１図および第１表から明らかなように、Ｎｉ単体から
なる試料７に対して、試料１〜５に示すようにＢを含有
させることにより、種々の抵抗値を得ることができ、そ
のうち、Ｂを３〜３０重量％含有するものでは、体積抵
抗値が低下し、そしてＢが３５重量％以上でＮｉ単体よ
り抵抗値が増加していることが分かる。As is clear from FIG. 1 and Table 1, various resistance values can be obtained by adding B to sample 7 made of simple Ni as shown in samples 1 to 5. It can be seen that in those containing 3 to 30% by weight of B, the volume resistivity value decreases, and when B is 35% by weight or more, the resistance value increases compared to Ni alone.
これらの抵抗値は、試料８ （Ａｇ）の抵抗値（Ｉ Ｘ
１０−ＡΩ・ｃｍ）と試料９（Ｃ）の抵抗値（５Ω・
ｃｍ）の間で種々の値を示している。These resistance values are the resistance value (I
10-AΩ・cm) and the resistance value of sample 9(C) (5Ω・cm)
cm).
また、実施例の試料６に示すようにＢをＮｉの合金とし
た粉末でも同様な抵抗値となる導電性特性を示した。Furthermore, as shown in Example Sample 6, a powder made of B as an alloy of Ni also exhibited conductive properties with similar resistance values.
さらに、他の実験例として、導電性ペーストのはんだ付
性について調べた結果、Ｎｉ単体の導電性ペーストと同
様に、Ｂを含有させてもはんだ付性は劣ることはなかっ
た。Furthermore, as another experimental example, the solderability of the conductive paste was investigated, and as with the conductive paste containing Ni alone, the solderability was not deteriorated even when B was included.
［発明の効果］
以上説明したように、本発明によれば、ＮｉにＢを含有
させることにより、抵抗値がＡｇ導電性ペーストとＣ導
電性ペーストの間に位置する１×１０−２Ω・ｃｍのオ
ーダで、しかも安定した特性を有する低温形の導電性ペ
ーストを提供することができる。[Effects of the Invention] As explained above, according to the present invention, by incorporating B into Ni, the resistance value is 1×10 −2 Ω·cm, which is between the Ag conductive paste and the C conductive paste. It is possible to provide a low-temperature type conductive paste having stable characteristics on the order of .
第１図は本発明の実施例により導電性ペーストの体積抵
抗値を示すグラフである。
第１表
代理人 弁理士 定立 勉（ほか２４第１図FIG. 1 is a graph showing the volume resistance value of a conductive paste according to an embodiment of the present invention. Table 1 Agent: Patent Attorney Tsutomu Setatetsu (and 24 others, Figure 1)
Claims (1)
した粉末を含有するとともに、該粉末に有機質バインダ
ーを混練してなることを特徴とする導電性ペースト。A conductive paste characterized by containing a powder obtained by mixing Ni powder with B powder or alloying Ni with B powder, and kneading the powder with an organic binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9496288A JPH01265406A (en) | 1988-04-18 | 1988-04-18 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9496288A JPH01265406A (en) | 1988-04-18 | 1988-04-18 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01265406A true JPH01265406A (en) | 1989-10-23 |
Family
ID=14124554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9496288A Pending JPH01265406A (en) | 1988-04-18 | 1988-04-18 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01265406A (en) |
-
1988
- 1988-04-18 JP JP9496288A patent/JPH01265406A/en active Pending
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