JPH01263476A - Method and apparatus for air cooling - Google Patents

Abstract

PURPOSE:To save an energy of an air-cooled cooling device by a method wherein a coolant low temperature supplied from a pump is divided into a flow passage entering a load and a flow passage flowing directly into a heat exchanger and the two flow passages are connected within the heat exchanger. CONSTITUTION:A coolant 2 such a cold water is stored within a tank 1 and the coolant 2 of low temperature is sent out to a main pipe 15 by a pump 3 having a capability AHP. The coolant 2 of low temperature sent out of the main pipe 15 is divided approximately into a second pipe 16 and a first pipe 17 of passages so as to cool a load 6. The coolant 2a of which temperature is increased flows into a heat exchanger 19. In turn, the coolant 2 of low temperature discharged out of the second pipe 16 directly flows into the heat exchanger 19 with its temperature kept low. The coolant 2a of high temperature gives heat to the coolant 2 of low temperature, gives heat to air generated by a fan 9 and then the coolant is cooled. With this arrangement, the coolant 2 discharged out of the first pipe 20 and the second pipe 21 of the heat exchanger 19 has a low temperature and both coolants are merged and they are stored again in the tank 1. The above-mentioned operation is repeated to keep the load 6 always within a normal temperature range.

Description

[Detailed Description of the Invention] (Summary) Regarding an air cooling method for protecting a load consisting of circuit elements of an electronic device from overheating due to the heat generated by the circuit element, the present invention aims to save energy in an air cooling system, making it smaller and lighter. For the purpose of achieving noise reduction, there is a step of pumping out a low-temperature refrigerant for cooling, and a step of pumping out the low-temperature refrigerant for cooling.
A step in which the low-temperature refrigerant in the - flow path cools the electronic circuit load; A step in which this refrigerant receives heat from the load and becomes a high-temperature refrigerant and flows into the heat exchanger. , the low-temperature refrigerant in the twenty flow paths directly flows into the nuclear heat exchanger, and the high-temperature refrigerant is further cooled and loses heat as the low-temperature refrigerant and the air sent by the fan in the heat exchanger. It consists of a stage in which it becomes the original low-temperature refrigerant.

[Industrial Applications 1i'] The present invention relates to an air cooling method for protecting a load consisting of circuit elements of an electronic device from heating due to heat generated by the load.

The circuit elements of electronic devices constantly generate more heat than usual, and when installed, it causes fluctuations in each ion layer of the circuit elements.
Inability to perform normal functional movements. In order to prevent this, a method is usually used in which cold air is sent to the parts 1'1 of the circuit elements to cool them down.

The air that is sent is the air inside the room where the electronic device is installed using a fan or the like.

Load circuit elements are not always exposed; they are often located deep inside the equipment in complex locations.
In this case, a refrigerant pipe is provided near the load to cool the load via the low-temperature refrigerant. The refrigerant that has gained heat is then cooled by blowing air during manufacturing.

It is important to efficiently cool the refrigerant, and the cooling capacity is determined by the air blowing capacity of the bow/pump, heat exchanger, and fan used.

Is there any way to increase the size of the heat exchanger or make the fan more powerful? In particular, making the fan more powerful can cause vibration and noise, so there is a balance between improving cooling capacity and reducing size and noise. It was difficult to find out.

Under these circumstances, a space-saving cooling method with good noise performance has been desired. In particular, even though electronic devices themselves have become smaller due to the development of integrated circuits, cooling devices have not been able to be made smaller due to the accompanying balance, so this is an area where development is needed.

[Conventional technology]

The fifth part is a diagram showing the configuration of a conventional air-cooled cooling system.
A tank 1 stores a refrigerant 2 such as cold and hot water at a low temperature. The low-temperature refrigerant 2 is flowed into the flow tube 5 via the pipe 4 by the pump 3 having a capacity of A Hp to cool the load 6 . This load 6
is a circuit element of an electronic computer, etc., which generates heat when energized, and is constantly cooled by a low-temperature refrigerant 2 so that the circuit element is maintained at a maximum allowable load temperature at which the circuit element can maintain normal operation.

The high temperature refrigerant 2 whose temperature has increased by cooling the load 6 flows into the heat exchanger 7 and is cooled by air at room temperature. The low-temperature refrigerant 2 whose temperature has decreased is stored in the tank 1 again.

The heat exchanger 7 includes a wind tunnel 8 and a B1. , and a large number of fins 11 attached around a tube 10 through which the refrigerant 2 flows.

FIG. 2 shows the temperature change of the refrigerant 2 as a function of time, and the solid line graph G shows the temperature change of the conventional refrigerant 2.

The maximum allowable load temperature T is the temperature at which IC circuit elements can operate normally, and T is the air temperature in the room where electronic computers, etc. are placed.
Then, the temperature G of the refrigerant 2 increases when passing near the load 6, and begins to decrease when it enters the heat exchanger 7.

In order to keep the maximum temperature of the refrigerant 2 always lower than the temperature 'PM, the discharge rate of the pump 3 is set to θ (ρ) per second, and the horsepower of the pump 3 is set to AHP.

If the indoor air temperature is substantially constant T, this air is blown to the heat exchanger 7 to cool the high temperature refrigerant 2 through the fins 11. At this time, the larger the air blast ■, the higher the air temperature T of the refrigerant 2.
can be approached. However, the capacity, ie, wattage, B8 of the fan 9 is set to such an extent that the refrigerant 2 only needs to have the ability to cool the load 6 to a temperature T or lower.

[Problem to be resolved by the invention car] However, in the conventional method, the temperature of the refrigerant 2 is lowered by 1° to room temperature to cool the load 6, and the temperature of the load 6 is also close to room temperature. Ideally, it is necessary to increase the capacity of the heat exchanger 7, and this is limited to increasing the surface area by combing the fins 11 and increasing the number of manholes of the fan 9. Ta. If the fins 11 are made larger, there will be a problem with the electronic devices themselves shifting in that direction as they become smaller and more dense.If the capacity of the fan 9 is increased, it will become larger and rotate at higher speeds, which will cause vibrations and noise. The problem is that it's thick (and undesirable).

This invention has been made without solving the problem mentioned in item 1-1, and aims to save energy in an air-cooled cooling device, and to achieve reduction in size, weight, and noise.

(Means for Solving the Problem) The above problem consists of a step of sending out a low-temperature refrigerant for cooling by a pump, a step of dividing the low-temperature refrigerant into two flow paths,
- a stage in which the low-temperature refrigerant in the flow path cools the load of the electronic circuit; a stage in which this refrigerant receives heat from the load and becomes a high-temperature refrigerant and flows into the heat exchanger; and a stage in which the low-temperature refrigerant in the flow path directly flows into the nuclear heat exchanger, and the high-temperature refrigerant is cooled in the heat exchanger by the low-temperature refrigerant and air sent by a fan, losing heat and becoming the original low-temperature refrigerant. The problem is solved by an air cooling method.

[Effect]

That is, in the present invention, the low-temperature refrigerant supplied from the pump is divided into two channels: a flow path that enters the load side and a flow path that directly enters the heat exchanger side.

By connecting the two flow paths within the heat exchanger, the high-temperature refrigerant that has obtained heat from the load side is subsequently cooled by the low-temperature refrigerant and the low-temperature air sent from the fan. This can improve the efficiency of the heat exchanger.

The direction of the heat exchange rate - 1 = decreases the number of wands of the fan,
The same cooling can be achieved with a smaller size and lower wattage, resulting in lower noise and lighter weight.

〔Example〕

Hereinafter, the present invention will be specifically explained with reference to an illustrated embodiment.

FIG. 1 is a diagram showing the configuration of the air cooling method of the present invention, and FIG. 2 is a graph diagram showing the cooling principle of the present invention.

A refrigerant 2 such as low-temperature cold and hot water is stored in the tank 1, and the low-temperature refrigerant 2 has a capacity of A04. King Vibrator 15 by Pump 3
sent to. The low-temperature refrigerant 2 that has exited the main vibrator 15 is divided into approximately two equal parts by the second pipe 16 and the first pipe 17 of the flow path.
The low temperature refrigerant 2 exiting the first pipe 17 flows into the cooling flow tube 5 and cools the load 6 . This load 6 generates heat when it is energized, and is constantly cooled by the low-temperature refrigerant 2 to keep the circuit elements of the load 6 at or below the maximum allowable temperature.

High-temperature refrigerant 2a whose temperature has increased by cooling the load 6
flows into the heat exchanger 19.

-1 The low temperature refrigerant 2 that has exited the second pipe 16 directly flows into the heat exchanger 19 while remaining at a low temperature.

The heat exchanger 19 includes a wind tunnel 8, a Bw fan 9 that blows indoor air into the wind tunnel 8, a first pipe 20 through which high-temperature refrigerant 2a flows, and a second pipe 21 through which low-temperature refrigerant 2 flows. , and a large number of fins 23 attached around these first and second tubes 20, 21.

The first pipe 20 and the second pipe 21 have a structure in which they are twisted together so that the approach surface is maximized, and the high temperature refrigerant 2a also gives heat to the low temperature refrigerant 2 in the second pipe 21. Katsufan 9
The wind also gives heat and is cooled. As a result, the refrigerant 2 exiting the first pipe 20 and the second pipe 21 of the heat exchanger 19 is at a low temperature, and is stored in the tank 1 again after being combined.

By repeating the above operations, the load 6 is always maintained at a normal temperature.

Figure 3 shows an enlarged side view of the inside of the heat exchanger, and Figure 4 is a cross-sectional view taken along line A-A in Figure 3, showing the first pipe 20 through which the high temperature refrigerant 2a flows and the first pipe 20 through which the low temperature refrigerant 2 flows. It is combined with the second pipe 21 in a twisted structure. First pipe 20 and second pipe 21
The first tube 20 and the second tube 21 are welded to each other by a highly thermally conductive metal 25, and a large number of flat plate-shaped fins 23 are provided on the outer periphery of the combined first tube 20 and second tube 21, spaced apart from each other.

The inflow direction of the high-temperature refrigerant 2a and the inflow direction of the low-temperature refrigerant 2 are opposite to each other as indicated by arrows in the figure, thereby increasing the efficiency of heat exchange. The high-temperature refrigerant 2a is cooled by the low-temperature refrigerant 2 in the second pipe 21 and the many fins 23 that are cooled to room temperature by air blowing. In addition, in FIG. 3, the first pipe 20
And twist the first pipe 21 together in a straight line.
Although shown as an upper tube, the upper and lower tubes may be twisted together to form a meandering long shape to further enhance the cooling effect.

The dotted line graph H in FIG. 2 shows the temperature change of the refrigerant 2 according to the present invention.If the temperature at which the IC circuit functions is the maximum allowable load temperature TO, and the indoor air temperature is T, then the refrigerant 2
When flowing near the load 6, the temperature H increases as it receives heat, and as it flows through the heat exchanger 19, it loses heat and falls.

Now let the horsepower of pump 3 be A Ill', and its refrigerant discharge h±
is 0 (r) per second, and the indoor air temperature is assumed to be approximately constant T. The low-temperature refrigerant 2 that exits the pump 3 is divided into two parts, 2θ
(ρ) flows into the flow tube 5 near the load 6.

Since the heat generation value of the load 6 is approximately constant, the 2θ low temperature refrigerant 2
In the time t11 section, the load allowable maximum temperature T4 is set to R1.
Just break through (theory" 2).

However, during the time shear 1 section, the refrigerant 2a that has reached a breakthrough temperature and has flown into the heat exchanger 19 is affected by both the low temperature refrigerant 2 at 2θ, which is flowing in at a low temperature, and the air blowing from the fan 9. The elephant that receives the cooling effect is intensely cooled,
Even when the wattage of the fan 9 is set to B or A, the wattage decreases toward room temperature.

In the time t12 section of the next cycle, the temperature of the refrigerant 2 is lower than that in the previous cycle when it leaves the pump 3, so the temperature rise due to the load is small and the breakthrough amount R2 is
,>R2.

This relatively high temperature refrigerant 2a has the same cooling effect as described above.
The temperature is lowered to near room temperature during the time interval t2°.

Furthermore, in the cooling section t13 of the load 6 in the next cycle, the room temperature of the refrigerant 2 exiting the pump 3 is lower;
Although only the refrigerant 2 of 2θ(j2) flows near the load 6, the temperature of the load 6 is set to the maximum allowable load temperature T. It can be cooled to below.

(In the section of time tzz, the relatively high temperature refrigerant 2 is further cooled to near room temperature by the same cooling effect as described above. While repeating this cycle, the refrigerant 2 flowing near the load 6 Since the original inflow temperature of the refrigerant 2 in section t14 is low, the temperature rises only to a temperature lower than the maximum allowable load temperature T, and within the heat exchanger 19, it reaches a limit in section L24. It is cooled to near room temperature.

Therefore, for the same load 6, the AHP of the pump 3 and the output B8 of the fan 9 are always T than the maximum allowable load temperature T. Able to maintain low cooling temperature.

On the contrary, this T. For supercooling, the output B11 of the fan 9 is reduced, and the fan 9 can be downsized and energy-saving so that To-→0, that is, the maximum temperature of the allowable load.

Along with this, the heat exchanger 19 is also downsized, and the noise generated by the fan 9 is also reduced.

In addition, in the above explanation, the refrigerant 2 cannot sufficiently lower the temperature of the load 6 at the start of cooling, and the maximum allowable load temperature].

Although I explained that it would exceed R+, R2...
- does not occur, so the cooling function also appears immediately after startup.

Also, since the flow paths are parallel, the flow rate 2θ of the pump 3 actually increases due to the decrease in resistance, and the amount of refrigerant 2 flowing to the load 6 also increases to nearly the original flow rate θ(I), and the flow rate of the fan 9 increases. Smaller size and lower wattage can be realized even more powerfully.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a cooling method and device that improves the efficiency of the cooling device, achieves low horsepower, is compact and lightweight, and minimizes noise and vibration.

Therefore, as electronic devices themselves become more compact, electronic devices including cooling devices, which have been lagging behind, can be made compact, making it possible to realize mobile, stationary, and highly mobile electronic devices.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of the air cooling power method of the present invention, Fig. 2 is a graph diagram showing the cooling principle of the present invention, and Fig. 3 is an enlarged side view of the inside of the heat exchanger of the present invention. 4 Figure 4j A in Figure 3
- A sectional view, and the fifth is a configuration diagram of a conventional cooling device. 2.2a... Refrigerant, 3. Pump, 6. Load, 9.. Fan, 16.17 Channel, 19. Heat exchanger, 20. First pipe, 21.. Second pipe, 23. ...Fin, 25...Metal.

Claims (2)

[Claims] 1. a step of delivering a low-temperature refrigerant (2) for cooling by a pump (3);
(17), and a step in which the low temperature refrigerant (2) in one flow path (17) cools the load (6) of the electronic circuit;
This refrigerant (2) is given heat from the load (6) to become a high temperature refrigerant (2a) and flows into the heat exchanger (19), and the low temperature refrigerant (2) in the other flow path (16) ) flows directly into the heat exchanger (19), and the high temperature refrigerant (2a) flows within the heat exchanger (19) into the low temperature refrigerant (2) and the fan (
9) The air cooling method consists of the step of being cooled by the air sent by (9), losing heat and becoming the original low-temperature refrigerant (2). 2. A pump (3) that discharges low-temperature refrigerant (2), a cooling flow pipe (5) into which this low-temperature refrigerant (2) flows and which is arranged near a load (6) consisting of an electronic circuit, and this cooling flow pipe. (5
), a heat exchanger (19) into which a high-temperature refrigerant (2a) flows out, and a fan (8) that sends low-temperature air to the heat exchanger (19). 2) and part of it is sent to the cooling flow pipe (5).
) and a second pipe (16) that directly sends the other part to the heat exchanger (19), and ) into which the high temperature refrigerant (2a) flows, and a second pipe (21) into which the low temperature refrigerant (2) flows from the first pipe (17). 1 tube (20) and 2nd tube (2
1) An air-type cooling device characterized by being twisted together.