JPH01262126A - Fire-retardant expanded resin laminated board - Google Patents
Fire-retardant expanded resin laminated boardInfo
- Publication number
- JPH01262126A JPH01262126A JP63090342A JP9034288A JPH01262126A JP H01262126 A JPH01262126 A JP H01262126A JP 63090342 A JP63090342 A JP 63090342A JP 9034288 A JP9034288 A JP 9034288A JP H01262126 A JPH01262126 A JP H01262126A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic
- expanded
- board
- composition
- foamed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims description 12
- 239000011347 resin Substances 0.000 title claims description 12
- 239000003063 flame retardant Substances 0.000 title claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 18
- 239000000057 synthetic resin Substances 0.000 claims abstract description 18
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 239000012766 organic filler Substances 0.000 claims abstract description 9
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052909 inorganic silicate Inorganic materials 0.000 claims abstract description 5
- 229920000642 polymer Polymers 0.000 claims abstract description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 abstract description 2
- 229920002978 Vinylon Polymers 0.000 abstract description 2
- 239000004794 expanded polystyrene Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 238000009415 formwork Methods 0.000 abstract description 2
- 239000011491 glass wool Substances 0.000 abstract description 2
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000011490 mineral wool Substances 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- -1 polypropylene Polymers 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 229920002635 polyurethane Polymers 0.000 abstract description 2
- 239000004814 polyurethane Substances 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 239000010455 vermiculite Substances 0.000 abstract description 2
- 235000019354 vermiculite Nutrition 0.000 abstract description 2
- 229910052902 vermiculite Inorganic materials 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000004566 building material Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical group [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 159000000003 magnesium salts Chemical class 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical group [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 241000975357 Salangichthys microdon Species 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006248 expandable polystyrene Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、住宅用断熱板、内外装板、間仕切板、カーテ
ンウオールなどとして好適に用いられる難燃性発泡樹脂
積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a flame-retardant foam resin laminate suitable for use as a heat insulating board for a house, an interior/exterior board, a partition board, a curtain wall, etc.
従来１発泡ポリスチレン等の発泡樹脂板は、断熱性、吸
音性に優れているため、各種建材などの用途に広く使用
されている。2. Description of the Related Art Foamed resin plates such as polystyrene foam have been widely used as various building materials because of their excellent heat insulation and sound absorption properties.
しかしながら、発泡樹脂板は耐熱、耐火性に劣り、この
ため発泡ポリスチレン等の発泡樹脂中に難燃材を配合す
ることも提案されているが、なおその耐熱、耐火性は十
分でない。また、難燃剤としては有機ハロゲン化物が多
用されているが、かかる難燃剤を配合した発泡樹脂板は
燃焼により有害ガスを発生する欠点がある。However, foamed resin plates have poor heat resistance and fire resistance, and although it has been proposed to incorporate flame retardants into foamed resins such as expanded polystyrene, the heat resistance and fire resistance are still insufficient. Further, although organic halides are often used as flame retardants, foamed resin plates containing such flame retardants have the disadvantage of generating harmful gases when burned.
更に、発泡樹脂板は、その機械的強度の点でも劣り、ま
た熱による膨張収縮の変化が著しいという問題をも有す
る。Furthermore, foamed resin plates have a problem in that they are inferior in mechanical strength and their expansion and contraction change significantly due to heat.
本発明は上記事情に鑑みなされたもので、耐熱。The present invention was made in view of the above circumstances, and is heat resistant.
耐火性に優れ、しかも断熱性が良好である上、機械的強
度が高く、また熱による膨張収縮の変化が少なく、この
ため建材等として有効に使用される難燃性発泡樹脂積層
板を提供することを目的とする。To provide a flame-retardant foamed resin laminate that has excellent fire resistance, good heat insulation, high mechanical strength, and little change in expansion and contraction due to heat, and is therefore effectively used as a building material, etc. The purpose is to
本発明は、上記目的を達成するため１発泡合成樹脂板の
片面又は両面に、珪酸塩を主体とする無機質珪酸塩発泡
ポリマー中に無機もしくは有機充填材が分散された発泡
無機質板を一体に積層したものである。In order to achieve the above object, the present invention has a foamed inorganic board in which an inorganic or organic filler is dispersed in an inorganic silicate foamed polymer mainly composed of silicate, which is laminated on one or both sides of a foamed synthetic resin board. This is what I did.
本発明の発泡樹脂積層板は、上述したように発泡合成樹
脂板の片面又は両面に、珪酸塩を主体とする無機質珪酸
塩発泡ポリマー中に無機もしくは有機充填材が分散され
た発泡無機質板を積層したもので、この発泡無機質板は
その密度が通常０、２〜０．９ ｇ／ａｊ、で、軽量で
あり、またその耐熱温度は通常８００〜１０００℃で、
耐熱、耐火性に優れたものであり、更に引張り、圧縮２
曲げ等の機械的応力に強く、優れた機械的特性を示し、
破壊、損傷がし難いものであると共に、熱による膨張収
縮の程度が少ないものである。しかも断熱性が良好であ
り、結露防止の点でも優れているものである。As described above, the foamed resin laminate of the present invention has a foamed inorganic board in which an inorganic or organic filler is dispersed in an inorganic silicate foamed polymer mainly composed of silicate, on one or both sides of a foamed synthetic resin board. This foamed inorganic board usually has a density of 0.2 to 0.9 g/aj, is lightweight, and has a heat resistance temperature of usually 800 to 1000°C.
It has excellent heat resistance and fire resistance, and is also resistant to tension and compression2.
It is resistant to mechanical stress such as bending and exhibits excellent mechanical properties.
It is difficult to break or damage, and the degree of expansion and contraction due to heat is small. Furthermore, it has good heat insulation properties and is also excellent in preventing dew condensation.
それ故、発泡合成樹脂板を使用する場合の耐熱。Therefore, heat resistance when using foamed synthetic resin board.
耐火性、機械的強度等の欠点を十分に補強することがで
き、特に上記発泡無機質板を発泡合成樹脂板の両面に積
層した場合はその効果がより確実に発揮され、このため
建材等として好適な特性を有しているものである。Defects such as fire resistance and mechanical strength can be sufficiently reinforced. Especially when the above-mentioned foamed inorganic board is laminated on both sides of a foamed synthetic resin board, the effect is more reliably exhibited, and therefore it is suitable as a building material, etc. It has certain characteristics.
また、上記発泡無機質板はその自己接着力で発泡合成樹
脂板に接着剤なしで強固に接着し、その製造も簡単に行
なわれるものである。Further, the above-mentioned foamed inorganic board firmly adheres to the foamed synthetic resin board without an adhesive due to its self-adhesive strength, and is easily manufactured.
以下、本発明の一実施例につき図面を参照して説明する
。Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１，２図は１本発明の難燃性発泡樹脂積層板の実施例
を示すもので、第１図の実施例は発泡合成樹脂板１の片
面に発泡無機質板２を積層一体化したもの、第２図の実
施例は発泡合成樹脂板１の両面にそれぞれ発泡無機質板
２，２を積層一体化したものである。Figures 1 and 2 show examples of flame-retardant foamed resin laminates according to the present invention, and the embodiment shown in Figure 1 is one in which a foamed inorganic board 2 is laminated and integrated on one side of a foamed synthetic resin board 1. In the embodiment shown in FIG. 2, foamed inorganic plates 2, 2 are laminated and integrated on both sides of a foamed synthetic resin plate 1, respectively.
ここで、上記発泡合成樹脂板１としては、発泡ポリスチ
レン板、発泡ポリウレタン板などが使用し得、その厚さ
は適宜選択することができるが。Here, as the foamed synthetic resin board 1, a foamed polystyrene board, a foamed polyurethane board, etc. can be used, and the thickness thereof can be selected as appropriate.
通常５〜１ｏｏ１ｍである。It is usually 5-101m.
また、上記発泡無機質板２は、珪酸塩を主体とする無機
質珪酸塩発泡ポリマー中に無機もしくは有機充填材が分
散されてなるもので、これは珪酸塩、メタ珪酸塩を主成
分とし、界面活性剤が配合されてなる無機自硬性組成物
に無機もしくは有機充填材を分散混合した配合物を発泡
硬化することによって得ることができる。Further, the foamed inorganic board 2 is made by dispersing an inorganic or organic filler in an inorganic silicate foamed polymer mainly composed of silicate. It can be obtained by foaming and curing a mixture obtained by dispersing and mixing an inorganic or organic filler into an inorganic self-hardening composition containing a filler.
上記無機自硬性組成物につき更に詳述すると、その組成
としては下記の通りである（なお、％は重量％を示す）
。To explain the above inorganic self-hardening composition in more detail, its composition is as follows (in addition, % indicates weight %)
.
珪 酸 塩 １５〜６６％、より好ましくは ３０〜６
０％力 オ リ ン ０〜２８％、より好ましくは
５〜２０％水溶性マグネシウム塩０〜１％、より好ま
しくは０．２〜０．８％珪弗化塩 ２〜２０％、より好
ましくは ５〜１５％メタ珪酸塩 ３〜５８％、より好
ましくは ３〜３０％界面活性剤 ０．１〜２％、よ
り好ましくは ０．１〜１％水 ０〜１
５％、より好ましくは ５〜１３％この場合、珪酸塩
としては珪酸ソーダ、水溶性マグネシウム塩としては塩
化マグネシウム、珪弗化塩としては珪弗化ソーダ、メタ
珪酸塩としてはメタ珪酸ソーダ、界面活性剤としてはラ
ウリル硫酸ソーダ等のアニオン系界面活性剤が好適に用
いられる。Silicate 15-66%, more preferably 30-6
0% force Olin 0-28%, more preferably
5-20% water-soluble magnesium salt 0-1%, more preferably 0.2-0.8% silicofluoride salt 2-20%, more preferably 5-15% metasilicate 3-58%, more preferably is 3-30% surfactant 0.1-2%, more preferably 0.1-1% water 0-1
5%, more preferably 5-13% In this case, the silicate is sodium silicate, the water-soluble magnesium salt is magnesium chloride, the silicofluoride salt is sodium silicofluoride, the metasilicate is sodium metasilicate, the interface is As the active agent, anionic surfactants such as sodium lauryl sulfate are preferably used.
また、無機もしくは有機充填剤としは、ロックウール、
ガラスウール等の無機繊維、ポリエステル、ポリアミド
、ポリプロピレン、ビニロン等の有機短繊維、ひる石、
シラスバルーン、ガラスバルーン、パーライト等の軽量
発泡骨材、その他砂、岩石やガラス細片など、適宜な材
料が使用できる。In addition, examples of inorganic or organic fillers include rock wool,
Inorganic fibers such as glass wool, organic short fibers such as polyester, polyamide, polypropylene, and vinylon, vermiculite,
Any suitable material can be used, such as whitebait balloons, glass balloons, lightweight foamed aggregates such as perlite, and other suitable materials such as sand, rock, and glass chips.
なお、上記充填材はその１種を単独で用いてもよく、２
種以上を併用するようにしてもよい。Note that one type of the above filler may be used alone, or two types of fillers may be used alone.
You may use more than one species in combination.
上記無機自硬性組成物に対する充填材の混合割合も種々
選択することができるが前者：後者＝９９〜５０：１〜
５０．より好ましくは９８〜６０：２〜４０（重量部）
が好適である。The mixing ratio of the filler to the above-mentioned inorganic self-hardening composition can be variously selected, but the former:latter = 99 to 50:1 to
50. More preferably 98-60:2-40 (parts by weight)
is suitable.
上記の無機自硬性組成物に充填材を分散混合した配合物
を発泡硬化することにより得られた発泡無機質板は軽量
で、その密度は通常０．２〜０．９ｇ／ａｌであり、か
つ耐熱温度は通常８００〜１０’ Ｏ０℃で、耐熱、耐
火性に非常に優れているものであると共に、上記発泡合
成樹脂板１に対して接着性が良好で、その自己接着力で
該樹脂板１に接着剤を使用することなしに固着一体化さ
れるものである。The foamed inorganic board obtained by foaming and curing the above-mentioned inorganic self-hardening composition with a filler dispersed in it is lightweight, its density is usually 0.2 to 0.9 g/al, and it is heat resistant. The temperature is usually 800 to 10'O0°C, and it has excellent heat resistance and fire resistance, and has good adhesion to the foamed synthetic resin board 1, and its self-adhesive strength allows it to adhere to the resin board 1. It can be fixed and integrated without using adhesive.
なお、上記発泡無機質板２の厚さは特に制限されるもの
ではないが、５〜１００ｍｎ＋程度が通常である。Note that the thickness of the foamed inorganic board 2 is not particularly limited, but is usually about 5 to 100 m+.
上記した積層板を製造する場合は、発泡合成樹脂板に上
述した配合物をスプレーで吹付けたり、或いは発泡合成
樹脂板を配置した型枠内に配合物を注入するなどの方法
が採用されるが、この場合配合物は十分撹拌して配合物
中に空気を巻き込んで発泡させた状態で注入するもので
ある。なお、この撹拌時間や撹拌速度は配合物中への空
気巻き込み量により相違するが、通常５０〜１０００ｒ
ｐｏ＋で５〜３０分程度の撹拌が採用される。ここで、
空気巻き込み量は最終硬化物の密度が０．２〜０．９ｇ
／ａＪになるように選定することが好ましい（なお、上
記配合物にこのように空気を巻き込まないで硬化させた
場合の密度は通常０．９〜１．４ｇ／ａＪである）、空
気を巻き込んだ配合物を静置すると、この配合物（上記
組成物）は自硬性であり、巻き込まれた空気によりエア
ボイドを形成した発泡状態で硬化すると共に、その自己
接着力により発泡合成樹脂板１に接着一体化される。When manufacturing the above-described laminate, methods such as spraying the above-mentioned compound onto a foamed synthetic resin board, or injecting the compound into a formwork in which the foamed synthetic resin board is placed are adopted. However, in this case, the blend is sufficiently stirred to entrain air into the blend and foam it before being injected. Note that the stirring time and stirring speed vary depending on the amount of air entrained in the mixture, but are usually 50 to 1000 rpm.
Po+ is used for stirring for about 5 to 30 minutes. here,
The amount of air entrained is 0.2 to 0.9 g when the final cured product has a density of 0.2 to 0.9 g.
/aJ (in addition, when the above-mentioned compound is cured without involving air in this way, the density is usually 0.9 to 1.4 g/aJ). When the compound is left to stand still, this compound (the above composition) is self-hardening, and hardens in a foamed state with air voids formed by the entrained air, and also adheres to the foamed synthetic resin board 1 due to its self-adhesive force. be integrated.
本発明の発泡無機質板は、その密度が通常０．２〜０．
９ｇ／ａＪで、軽量であり、またその耐熱温度が通常８
００〜１０００℃で、耐熱、耐火性に優れ、更に機械的
強度も高く、熱による膨張、収縮や変形がし難いもので
あり、かつ断熱効果も優れている。The foamed inorganic board of the present invention usually has a density of 0.2 to 0.
It is lightweight at 9g/aJ, and its heat resistance temperature is usually 8.
It has excellent heat resistance and fire resistance at temperatures of 00 to 1000°C, has high mechanical strength, is resistant to expansion, contraction, and deformation due to heat, and has excellent heat insulation effects.
それ故、この発泡無機板が積層されることにより、発泡
合成樹脂板の諸欠点が十分に補償され、従って本発明の
積層板は住宅用断熱板、内外装板、間仕切板、カーテン
ウオールなど、各種建材等として有効に使用することが
できるものである。Therefore, by laminating this foamed inorganic board, the various drawbacks of the foamed synthetic resin board can be fully compensated for, and therefore, the laminate board of the present invention can be used as a heat insulation board for housing, an interior/exterior board, a partition board, a curtain wall, etc. It can be effectively used as various building materials.
第１図及び第２図はそれぞれ本発明の一実施例を示す断
面図である。
１・・・発泡合成樹脂板、 ２・・・発泡無機質板。FIG. 1 and FIG. 2 are sectional views each showing an embodiment of the present invention. 1... Foamed synthetic resin board, 2... Foamed inorganic board.
Claims (1)
する無機質珪酸塩発泡ポリマー中に無機もしくは有機充
填材が分散された発泡無機質板を一体に積層してなるこ
とを特徴とする難燃性発泡樹脂積層板。1. A foamed inorganic board in which an inorganic or organic filler is dispersed in an inorganic silicate foamed polymer mainly composed of silicate is laminated on one or both sides of a foamed synthetic resin board. Flame-retardant foam resin laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63090342A JPH01262126A (en) | 1988-04-14 | 1988-04-14 | Fire-retardant expanded resin laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63090342A JPH01262126A (en) | 1988-04-14 | 1988-04-14 | Fire-retardant expanded resin laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01262126A true JPH01262126A (en) | 1989-10-19 |
Family
ID=13995851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63090342A Pending JPH01262126A (en) | 1988-04-14 | 1988-04-14 | Fire-retardant expanded resin laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01262126A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030035279A (en) * | 2001-10-30 | 2003-05-09 | 주식회사한그린텍 | A fireproof pannel and manufacturing method the same |
| KR100445672B1 (en) * | 2001-10-30 | 2004-09-07 | 주식회사한그린텍 | A non-bearing wall having fireproof |
| KR100817261B1 (en) * | 2006-06-08 | 2008-03-27 | 갑 수 한 | The hull frame plate rubber chip spread |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4860715A (en) * | 1971-12-02 | 1973-08-25 | ||
| JPS5534921A (en) * | 1978-09-04 | 1980-03-11 | Asahi Dow Ltd | Light compound body |
| JPS59111966A (en) * | 1982-12-15 | 1984-06-28 | 四国化研工業株式会社 | Composite heat insulating construction |
-
1988
- 1988-04-14 JP JP63090342A patent/JPH01262126A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4860715A (en) * | 1971-12-02 | 1973-08-25 | ||
| JPS5534921A (en) * | 1978-09-04 | 1980-03-11 | Asahi Dow Ltd | Light compound body |
| JPS59111966A (en) * | 1982-12-15 | 1984-06-28 | 四国化研工業株式会社 | Composite heat insulating construction |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030035279A (en) * | 2001-10-30 | 2003-05-09 | 주식회사한그린텍 | A fireproof pannel and manufacturing method the same |
| KR100445672B1 (en) * | 2001-10-30 | 2004-09-07 | 주식회사한그린텍 | A non-bearing wall having fireproof |
| KR100817261B1 (en) * | 2006-06-08 | 2008-03-27 | 갑 수 한 | The hull frame plate rubber chip spread |
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