JPH01261890A - Positioning jig for ic - Google Patents

Abstract

PURPOSE:To enable the precise determination of IC mounting position, by apply ing pressure in the direction connecting two apexes situated in the diagonal position of an IC main body, making the side surface of a leg closest to the apex abut to regulate the movement of the IC. CONSTITUTION:After an IC 43 is set, a pressing member 15 is moved in the arrow U direction, and pressing surfaces 18 and 19 are made to abut on the side edges 44c and 44d of two pins, respectively. The pressing member 16 is further moved, and the side edges 44a and 44b of the two pins are made to abut on the regulating surfaces 15 and 14 of a jig. When the movement is regu lated, the movement is halted. The error of positioning can be reduced, and the IC positioning of low cost is enabled without using an expensive sensor.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention is useful for ICs in which the soldering position is determined with high accuracy according to the pattern on the board, for example, when flat ICs are automatically soldered. This relates to a positioning jig.

[Prior art and its problems] Conventionally, flat ICs (hereinafter referred to as rICs) using this type of jig
The following two methods are used for positioning the J.

(1) FIG. 3 is a diagram showing a conventional IC positioning method. In this figure, a jig 3 formed into a flat plate shape
0 is provided with a rectangular hollow part 31, and this hollow part 31
The lengths of the short sides 32 and 33 are the lengths that indicate the range that restricts the position of the IC 34 in the direction of the arrow G. On the other hand, long side 35,
The length 36 indicates a range that restricts the position of the IC 34 in the direction of arrow H.

In the above configuration, when the jig 30 is first set on the substrate 41 and the IC 34 is moved in the direction of the short side 33 indicated by the arrow H, the movement in the direction of the arrow G is the inner surface 37 on the short sides 32 and 33 side. 38, and on the inner surface 39 on the short side 33 side,
As shown in the figure, when the tips of the six legs 37 of the IC 34 come into contact with each other, further movement is restricted, and in this state the position of the IC 34 on the substrate 41 is determined.

In this manner, conventionally, when positioning the IC 34 on the substrate, the positioning is performed using the tips of the legs protruding from the main body of the IC 34.

However, the length P from the main body of the IC 34 shown in FIG. 3 to the tip of the leg is ±0.4. ．． This level of dimensional accuracy has the disadvantage that positioning on the substrate becomes less reliable or reproducible.

(2) Recently, in order to overcome the drawback of (1) above, IC automatic soldering devices have been commercially available in which the IC is positioned using a visual sensor and this function is incorporated into an IC automatic soldering device.

However, when positioning the IC using the method (2), there is a drawback that positioning the IC is extremely costly and expensive.

Therefore, the present invention has been made in view of the above-mentioned problems of the conventional example, and its purpose is to accurately determine the mounting position of a flat IC on a board, and to provide an IC with an inexpensive structure. The purpose of the present invention is to provide a positioning jig.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the purpose, the IC positioning jig according to the present invention has a plurality of legs protruding from at least two sides of a rectangular main body. In an IC positioning jig for positioning a flat IC on a substrate, a hollow portion is provided to indicate a reference position when placing the IC on the substrate, and the hollow portion is located on a side surface of the IC body. When one vertex of a pair of diagonal vertices is pressed along the direction connecting the two vertices, the leg closest to the vertex on each side separated by the other vertex. It is characterized by comprising a restricting means that restricts the movement of the IC by bringing the sides into contact with each other at the same time.

Preferably, at a pair of vertices located at diagonal positions on the side surface of the IC main body, the hollow portion is arranged so that the side surface of the leg closest to the apex is formed on each side surface separated by the - vertices as a border. a guide groove for guiding a pressing means that simultaneously presses along a direction connecting the two vertices and slides the IC while maintaining the state in which it is placed; The IC is characterized by comprising a regulating means that restricts the movement of the IC by simultaneously bringing the side surfaces of the legs closest to the apex into contact on each side separated by the other apex when the IC moves. It is.

[Function] According to the above configuration, since the line connecting one vertex on the side surface of the IC body to the other vertex at the diagonal position in the hollow part of the jig is set as the moving direction of the IC, the IC on the substrate When determining the position of two diagonally located vertices, the position can be determined by the side surfaces of the legs that come out from the respective surfaces closest to the vertices.

[Embodiments] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In this embodiment, the shape of the IC is a rectangular body similar to the conventional example, and six legs are implanted on the top and bottom surfaces and all the side surfaces of the square.

FIG. 1 is a diagram showing one embodiment of an IC positioning jig according to the present invention. In FIG. 0, 1 is a jig molded into a flat plate shape according to the present embodiment. At approximately the center of the jig 1, there is provided a hollow portion 2 that penetrates enough to place the IC 43 on the substrate 42. The inner surface 3 of the jig 1 forming the hollow part 2 is formed by molding the IC 43 so as to surround the outer periphery along the tip of the bottle 44 protruding from the IC body, and the inner surface and the legs (hereinafter referred to as "
In Figure 0, on each side of the IC 43, there is a U-shaped depression on the inner surface 3 for the bottles located at both ends. 4 to 9 are disposed, and concave surfaces 10 to 12 formed by molding the inner surface 3 into a concave shape are provided at apexes 45 to 47 where the side surfaces of the IC body are connected.

Here, the shape of the concave surface 11 of the inner surface 3 facing the apex 46 will be explained.

On the two sides separated by the apex 46, the two bottles closest to each other with the apex 46 projecting from each side are approximately perpendicular;
The shape of is such that when the apex 46 side of the IC main body is brought close to the concave surface 11 of the inner surface 3 along the direction indicated by the arrow S in the figure, each bottle will close before the apex 46 comes into contact with the concave surface 11. are provided so that they come into contact almost simultaneously with the regulating surfaces 13 and 14 extending from the concave surface to the depression, thereby regulating further movement. The above-mentioned regulating surfaces 13 and 14 are formed by opposing side edges 44a and 4 of each bottle that abuts on each regulating surface.
4b and the entire side line is brought into contact with each other at the same time, the respective regulating surfaces are provided approximately parallel to the bins with which they come into contact.

Now, on the inner surface 3 located on the vertex 48 side which is diagonal to the vertex 46 when viewed from the top surface of the IC 43, the IC 43 is pressed in the direction of the arrow S in the direction in which the diagonal line between the vertex 46 and the vertex 48 is extended. Guide grooves 16 for guiding the movement of the pressing body 15 are arranged in a recessed manner. Front side 1 of pressing body 15
5a is provided with a concave surface 17 and pressing surfaces 18, 19, similar to the shape of the inner surface 3 on the vertex 46 side described above.

That is, the front surface formed by the concave surface 17 and the pressing surfaces 18 and 19, the surface formed by the concave surface 10, the concave surface 11, the regulating surface 13. It is provided so that it is almost symmetrical with respect to the line connecting the two.

When the pressing body 15 moves in the direction indicated by the arrow U in the drawing, the pressing body 15 moves its side surfaces 20 and 21 to the guiding surface 22.
It is possible to move it by sliding it on 23. here,
On each side separated by the apex 48 of the IC 43, the side edge 44c of the bottle that is the shortest distance from the apex 48
and 44d are configured so that the pressing surfaces 18 and 19 of the pressing body 15 contact almost simultaneously, and when the pressing body 15 is further moved in the direction of arrow U, the IC 43 is in the state when the pressing body 15 comes into contact with it. Move in such a way as to maintain The direction of movement of this IC 43 is on a diagonal line connecting vertices 46 and 48.

Next, a method of determining the soldering position of the workpiece C43 using the jig 1 constructed as described above will be explained with reference to FIGS. 1 and 2.

FIG. 2 is a diagram showing a method for positioning an IC on a substrate according to this embodiment. Note that this embodiment is an example of automatically soldering ICs.

First, as shown in FIG. 1, after setting the IC 43, the pressing body 15 is moved in the direction of arrow U, and the pressing surfaces 18 and 19 are
are brought into contact with the side edges 44c and 44d of the two bottles, respectively. While maintaining this state, the pressing body 15 is further moved in the direction of arrow U to bring the side edges 44a and 44b of the two bottles into contact with the regulating surfaces 13 and 14 of the jig, respectively, as shown in FIG. Once the above movement is restricted, it will be stopped. At this time, as shown in FIG.
This position of the IC 43 becomes a reference position for soldering.

As described above, in this embodiment, the tolerance range is the error due to the dimensional accuracy in the pitch of the bins. For example, as shown in FIG. 2, the dimensional accuracy due to the pitch of the bins indicated by Q in the figure is ±0.02□ The dimensional accuracy (±
0.4. ．． ), the error during positioning can be significantly reduced.

As described above, according to this embodiment, when positioning the IC at a predetermined position on the board, the IC is moved along the line connecting the vertices at diagonal positions on the IC body, and the IC is placed in the bin. By restricting movement with the side lines, errors in positioning can be reduced, and the IC can be positioned at low cost without using expensive sensors.

Now, in this embodiment, the shape of the IC when viewed from above is square, but the present invention is not limited to this, and may be rectangular, for example. Similarly, 2 at the diagonal position of the IC body
The IC may be moved along a line connecting the two vertices, and the movement of the bottle may be restricted by the restriction surface, thereby positioning the IC.

Further, in this embodiment, one jig had one hollow part, but the present invention is not limited to this, and a plurality of hollow parts may be provided to accommodate a plurality of ICs. It may be possible to make positioning possible.

Furthermore, in this embodiment, although the jig 1 is provided with the guide groove 16 for guiding the moving operation of the pressing body 15, the guide groove 16 is not provided, and similarly to the recess 11 corresponding to the apex 46, A recess corresponding to the apex 48 may be provided. In this case, the IC 43 is manually placed in the hollow portion 2 while aligning it along the recess at the upper right (in FIG. 1) corresponding to the apex 48. , the IC 43 may be positioned by manually pressing the IC 43 in the direction of the arrow S in FIG.

[Effects of the Invention] As described above, according to the present invention, when positioning an IC at a predetermined position on a substrate, the IC is moved along a line connecting diagonally located vertices on the IC body. hand,
By restricting movement at the side edges of the bottle, errors in positioning can be reduced, and the IC can be positioned at low cost without using expensive sensors.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing an embodiment of the IC positioning jig according to the present invention, Fig. 2 is a diagram showing the IC positioning method on the substrate of this embodiment, and Fig. 3 is a diagram showing the IC positioning according to the conventional example. FIG. 2 is a diagram illustrating the method. In the figure, 1.30...Jig, 2.31...Hollow part, 3
...Inner surface, 4 to 9...Indentation, 10 to 12.17...
・Concave surface, 13. 14... Regulating surface, 15... Pressing body,
15a...front, 16...guide groove, 18.19...
・Press surface, 20.21...Side surface, 22.23...Guide surface, 32°33...Short side, 34.43...-IC,
35, 36... Long side, 37-39... Inner surface, 40.
...Leg, 44...Bin, 44a, 44b, 44c, 4
4d...Side edge, 45-48...Vertex.

Claims (2)

[Claims] (1) In an IC positioning jig for positioning a flat IC having a plurality of legs protruding from at least two sides of a rectangular main body on a substrate, a reference position when placing the IC on the substrate. A hollow part is provided that indicates, and when one of a pair of vertices at diagonal positions on the side surface of the IC body is pressed along a direction connecting the two vertices, the hollow part 1. A positioning jig for an IC, comprising a regulating means for regulating the movement of the IC by simultaneously abutting the side surfaces of the legs closest to the other apex on each side separated by the other apex. (2) At a pair of vertices located at diagonal positions on the side surface of the IC body, the hollow portion is formed on each side surface separated by one apex, and the side surface of the leg closest to the apex is connected to the two vertices. A guide groove that guides a pressing means that simultaneously presses along the direction connecting the vertices and slides the IC while maintaining the state in which it is placed; and a guide groove that guides the pressing means to slide the IC by a predetermined distance Claim 1, characterized in that the device further comprises a regulating means for regulating the movement of the IC by simultaneously abutting the side surfaces of the legs closest to the apex on each side separated by the other apex as a boundary. IC positioning jig described in section.