JPH0126115Y2 - - Google Patents

Info

Publication number
JPH0126115Y2
JPH0126115Y2 JP1983112509U JP11250983U JPH0126115Y2 JP H0126115 Y2 JPH0126115 Y2 JP H0126115Y2 JP 1983112509 U JP1983112509 U JP 1983112509U JP 11250983 U JP11250983 U JP 11250983U JP H0126115 Y2 JPH0126115 Y2 JP H0126115Y2
Authority
JP
Japan
Prior art keywords
layer
znse
gaas
substrate
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983112509U
Other languages
Japanese (ja)
Other versions
JPS6020160U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983112509U priority Critical patent/JPS6020160U/en
Publication of JPS6020160U publication Critical patent/JPS6020160U/en
Application granted granted Critical
Publication of JPH0126115Y2 publication Critical patent/JPH0126115Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 (イ) 産業上の利用分野 本考案はZnSeモノリシツク型発光装置に関す
る。
[Detailed description of the invention] (a) Industrial application field The present invention relates to a ZnSe monolithic light emitting device.

(ロ) 従来技術 第1図及び第2図は従来のこの種装置を示し、
1はn型GaAs基板、2は該基板上に積層された
n型ZnSe層、3は該ZnSe層上に積層されたSiO2
から絶縁層、4は該絶縁層上に形成された金
(Au)からなる金属層であり、該金属層は一方向
に延在する複数のストライプ層4′よりなる。5
は上記基板1裏面に形成された電極であり、該電
極は上記金属層4と直交する方向に延在する複数
のストライプ電極5′より形成される。
(b) Prior art Figures 1 and 2 show a conventional device of this type.
1 is an n-type GaAs substrate, 2 is an n-type ZnSe layer stacked on the substrate, and 3 is a SiO 2 layer stacked on the ZnSe layer.
4 is a metal layer made of gold (Au) formed on the insulating layer, and the metal layer is made up of a plurality of striped layers 4' extending in one direction. 5
is an electrode formed on the back surface of the substrate 1, and the electrode is formed of a plurality of striped electrodes 5' extending in a direction perpendicular to the metal layer 4.

斯る装置において、例えば第2図中ストライプ
層及びストライプ電極の交点部分Aのみを発
光させんとして上記層−電極間に順方向バイ
アスを印加させても上記交点部分Aのみだけでは
なく他の部分まで発光してしまうという問題があ
つた。
In such a device, for example, even if a forward bias is applied between the layer and the electrode in order to cause only the intersection A of the striped layer and the stripe electrode in FIG. 2 to emit light, not only the intersection A but also other parts There was a problem that the camera would emit light.

(ハ) 考案の目的 本考案は斯る問題点に鑑みてなされたもので、
互いに直交するように配された電極間にバイアス
を印加することによりその交点部分のみで発光す
るZnSeモノリシツク型発光装置を提供せんとす
るものである。
(c) Purpose of the invention This invention was made in view of the above problems.
The present invention aims to provide a ZnSe monolithic light emitting device that emits light only at the intersections by applying a bias between electrodes arranged perpendicularly to each other.

(ニ) 考案の構成 本考案者が従来装置における問題点を検討した
ところ、上記基板1上での電流拡散が大きく、第
1図中矢印aで示す如く交点部分A近傍の層部
分間とも電流通路を形成してしまうためであるこ
とが判明した。
(d) Structure of the invention When the inventor investigated the problems with the conventional device, it was found that the current spread on the substrate 1 was large, and as shown by the arrow a in FIG. It turned out that this was due to the formation of a passageway.

本考案は斯る知見に基づいてなされたもので、
その特徴は半絶縁性GaAs基板、該基板上に積層
され一方向に延在する複数のストライプ形状のn
型GaAs層、上記基板及びGaAs層上に積層され
たn型ZnSe層、該ZnSe層上に積層された絶縁
層、該絶縁層上に積層され上記n型GaAs層と直
交する方向に延在する複数のストライプ形状の金
属層からなることにある。
This invention was made based on such knowledge,
Its features include a semi-insulating GaAs substrate, a plurality of striped nanometers stacked on the substrate and extending in one direction.
type GaAs layer, an n-type ZnSe layer laminated on the substrate and the GaAs layer, an insulating layer laminated on the ZnSe layer, laminated on the insulating layer and extending in a direction perpendicular to the n-type GaAs layer. It consists of a plurality of striped metal layers.

(ホ) 実施例 第3図A〜C図は本考案の一実施例を示し、第
3図Aは、第3図BにおけるA−A′線断面図で
あり、第3図Bは第3図AにおけるB−B′線断
面図である。
(E) Embodiment FIGS. 3A to 3C show an embodiment of the present invention, FIG. 3A is a sectional view taken along line A-A' in FIG. 3B, and FIG. It is a sectional view taken along the line BB' in Figure A.

図中、11は比抵抗107・cm以上の半絶縁性
GaAs基板、12は該基板上に形成され第3図A
中紙面垂直方向に延在するストライプ形状のn型
GaAs層であり、該層は上記基板11上全面に一
旦液相エピタキシヤル成長法等により成長後周知
のエツチング技術により形成できる。また斯る層
のキヤリア濃度は約1019/cm3である。
In the figure, 11 is semi-insulating with a resistivity of 10 7 cm or more.
A GaAs substrate 12 is formed on the substrate and FIG.
Stripe-shaped n-type extending perpendicular to the inside paper surface
This layer is a GaAs layer, which can be formed on the entire surface of the substrate 11 by a well-known etching technique after being grown by a liquid phase epitaxial growth method or the like. Also, the carrier concentration in such a layer is approximately 10 19 /cm 3 .

13は上記基板11表面及びGaAs層12上の
一部分を除いて積層されたn型ZnSe層であり、
該n型ZnSe層はフオトルミネツセンス測定で
466nm近傍に鋭い発光ピークを有している。この
ようなn型ZnSe層13は周知の分子線エピタキ
シヤル成長方法により得られる。
13 is an n-type ZnSe layer stacked on the surface of the substrate 11 and a portion of the GaAs layer 12;
The n-type ZnSe layer was determined by photoluminescence measurement.
It has a sharp emission peak near 466 nm. Such an n-type ZnSe layer 13 is obtained by a well-known molecular beam epitaxial growth method.

14は上記ZnSe層13上に積層された例えば
SiO2(二酸化シリコン)からなる絶縁層であり該
絶縁層は上記GaAs層12直上部は50Åと薄く、
その他の部分は300Åと厚くなるように上記
GaAs層12に沿つて溝部が形成されている。上
記溝部は例えばスパツタリング法等により上記
ZnSe層13上に厚さ300Åの均一なSiO2膜を形成
後エツチング等によりGaAs層に沿つて部分的に
SiO2を取除くことにより形成できる。
14 is laminated on the ZnSe layer 13, for example.
It is an insulating layer made of SiO 2 (silicon dioxide), and the insulating layer is as thin as 50 Å directly above the GaAs layer 12.
The thickness of the other parts is 300Å.
A groove portion is formed along the GaAs layer 12. The above-mentioned groove is formed by, for example, the sputtering method.
After forming a uniform SiO 2 film with a thickness of 300 Å on the ZnSe layer 13, it is partially etched along the GaAs layer.
Can be formed by removing SiO2 .

15は上記絶縁層14上に形成され第3図B中
紙面垂直方向、即ち上記GaAs層12と直交する
方向に延在するストライプ形状の金属層であり、
該金属層は例えばAu(金)からなりその層厚は約
200Åである。
15 is a striped metal layer formed on the insulating layer 14 and extending in a direction perpendicular to the paper plane in FIG. 3B, that is, in a direction orthogonal to the GaAs layer 12;
The metal layer is made of, for example, Au (gold) and has a thickness of approximately
It is 200Å.

16は上記ZnSe層13の積層されていない
GaAs層12上に形成された電極であり、該電極
はAu−Ge(ゲルマニウム)−Ni(ニツケル)合金
からなる。
16 is the ZnSe layer 13 that is not laminated.
This is an electrode formed on the GaAs layer 12, and the electrode is made of an Au-Ge (germanium)-Ni (nickel) alloy.

斯る装置において、電極とストライプ金属層
との間に順方向バイアスを印加すると電流は第
3図A,Bにおいて矢印で示す如く流れる。即ち
ストライプ金属層→絶縁層14→ZnSe層13
→GaAs層12→電極と流れ、ZnSe層13中で
は上記電極が形成されたGaAsストライプ層と
ストライプ金属層との交差する図中斜線で示す
領域Rに集中し、従つて斯る部分のみ選択的に青
色光を発光させることができる。
In such a device, when a forward bias is applied between the electrode and the striped metal layer, current flows as indicated by the arrows in FIGS. 3A and 3B. That is, stripe metal layer→insulating layer 14→ZnSe layer 13
→GaAs layer 12→electrode, and in the ZnSe layer 13, it is concentrated in the region R shown by diagonal lines in the figure, where the GaAs stripe layer on which the electrode is formed intersects with the stripe metal layer, and therefore only this region is selective. can emit blue light.

これは、GaAs層12がZnSe層13に比して導
電率が高く、斯るGaAs層12が実質的にZnSe層
13に対する電極として働きかつ、斯るGaAs層
12と金属層15との間隔が従来の金属層4と電
極15との間隔より狭いため、従来の如き電流拡
散が生じないためであると考えられる。
This is because the GaAs layer 12 has higher conductivity than the ZnSe layer 13, the GaAs layer 12 substantially acts as an electrode for the ZnSe layer 13, and the distance between the GaAs layer 12 and the metal layer 15 is This is thought to be because the distance between the metal layer 4 and the electrode 15 is narrower than in the conventional case, so current diffusion as in the conventional case does not occur.

尚、本実施例装置において金属層と電極と
の間に逆バイアスを印加すると領域Rより白色光
を発光させることもできる。
In the device of this embodiment, white light can also be emitted from region R by applying a reverse bias between the metal layer and the electrode.

(ヘ) 考案の効果 本考案によれば、光アイソレーシヨンの良好な
ZnSeモノリシツク型発光装置が得られ、また斯
る装置では基板の一主面側より正負電極を取出す
こともでき、実用的効果大なるものである。
(f) Effects of the invention According to the invention, good optical isolation can be achieved.
A ZnSe monolithic light emitting device is obtained, and in such a device, the positive and negative electrodes can be taken out from one main surface side of the substrate, which has a great practical effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は従来例を示す断面図及び平
面図、第3図A〜Cは本考案の一実施例を示し、
同図Aは同図BのA−A′線断面図、同図Bは同
図AのB−B線断面図、同図Cは平面図である。 11……半絶縁性GaAs基板、12……n型
GaAs層、13……n型ZnSe層、14……絶縁
層、15……金属層。
1 and 2 are a sectional view and a plan view showing a conventional example, and FIGS. 3A to 3C show an embodiment of the present invention,
Figure A is a sectional view taken along the line A-A' in Figure B, Figure B is a sectional view taken along the line B-B in Figure A, and Figure C is a plan view. 11...Semi-insulating GaAs substrate, 12...n type
GaAs layer, 13... n-type ZnSe layer, 14... insulating layer, 15... metal layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 半絶縁性GaAs基板、該基板上に積層され一
方向に延在する複数のストライプ形状のn型
GaAs層、上記基板及びGaAs層上に積層され
たn型ZnSe層、該ZnSe層上に積層された絶縁
層、該絶縁層上に積層され上記n型GaAs層と
直交する方向に延在する複数のストライプ形状
の金属層からなることを特徴とするZnSeモノ
リシツク型発光装置。 (2) 実用新案登録請求の範囲第1項において、上
記絶縁層には上記GaAs層に沿つて溝部が形成
されていることを特徴とするZnSeモノリシツ
ク型発光装置。
[Claims for Utility Model Registration] (1) A semi-insulating GaAs substrate, a plurality of striped n-type layers stacked on the substrate and extending in one direction.
a GaAs layer, an n-type ZnSe layer laminated on the substrate and the GaAs layer, an insulating layer laminated on the ZnSe layer, a plurality of layers laminated on the insulating layer and extending in a direction perpendicular to the n-type GaAs layer. A ZnSe monolithic light emitting device characterized by consisting of a striped metal layer. (2) Utility Model Registration Claim 1: The ZnSe monolithic light emitting device according to claim 1, wherein a groove is formed in the insulating layer along the GaAs layer.
JP1983112509U 1983-07-20 1983-07-20 ZnSe monolithic light emitting device Granted JPS6020160U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983112509U JPS6020160U (en) 1983-07-20 1983-07-20 ZnSe monolithic light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983112509U JPS6020160U (en) 1983-07-20 1983-07-20 ZnSe monolithic light emitting device

Publications (2)

Publication Number Publication Date
JPS6020160U JPS6020160U (en) 1985-02-12
JPH0126115Y2 true JPH0126115Y2 (en) 1989-08-04

Family

ID=30260795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983112509U Granted JPS6020160U (en) 1983-07-20 1983-07-20 ZnSe monolithic light emitting device

Country Status (1)

Country Link
JP (1) JPS6020160U (en)

Also Published As

Publication number Publication date
JPS6020160U (en) 1985-02-12

Similar Documents

Publication Publication Date Title
JP2716693B2 (en) Semiconductor laser
JPS609356B2 (en) Manufacturing method of semiconductor light emitting device
JP3053357B2 (en) Manufacturing method of planar buried laser diode
JPH0126115Y2 (en)
US4599787A (en) Method of manufacturing a light emitting semiconductor device
JPH0797693B2 (en) Compound semiconductor device and manufacturing method thereof
JPH0632331B2 (en) Semiconductor laser device and method of manufacturing the same
JP3652134B2 (en) Light emitting element array
JP4587515B2 (en) Manufacturing method of semiconductor light emitting device
JP2771587B2 (en) Manufacturing method of semiconductor laser
JP2523643B2 (en) Semiconductor laser device
JPH084180B2 (en) Semiconductor laser device and method of manufacturing the same
JP4436527B2 (en) Semiconductor light emitting device
JP3667208B2 (en) LED array for optical printer
JP2827605B2 (en) Semiconductor laser device
JP2817515B2 (en) Semiconductor laser device and method of manufacturing the same
JP3450992B2 (en) Semiconductor light emitting device
JPH06112592A (en) Fabrication of semiconductor laser element
JPH0194690A (en) Manufacture of buried type semiconductor laser device
JPH0244792A (en) Manufacture of semiconductor light emitting device
JPH11340584A (en) Edge type blue light-emitting laser
JPH0358191B2 (en)
JPH05167187A (en) Semiconductor laser
JPH06140718A (en) Manufacture of edge emitting type semiconductor laser element
JPS60126880A (en) Semiconductor laser device