JPH01258466A - Memory module - Google Patents
Memory moduleInfo
- Publication number
- JPH01258466A JPH01258466A JP63085445A JP8544588A JPH01258466A JP H01258466 A JPH01258466 A JP H01258466A JP 63085445 A JP63085445 A JP 63085445A JP 8544588 A JP8544588 A JP 8544588A JP H01258466 A JPH01258466 A JP H01258466A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- memory module
- terminals
- power input
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000694 effects Effects 0.000 abstract description 5
- 230000002411 adverse Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 206010067482 No adverse event Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は電子機器に使用されるメモリモジュールに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a memory module used in electronic equipment.
(従来の技術)
近年、半導体メモリの製造技術の向上と、これによるビ
ット当たりの低コスト化に伴い、電子機器に使用される
メモリ容量は増加の一途をたどっている。このようなな
かで、プリント基板上に数個のD−RAMチップを搭載
したメモリモジュールが製品化されている。このような
メモリモジュールは、カードエツジのコネクタを持ち専
用ソケットにより機器本体に装着される。ところでこの
種のモジエールの端子配列には、現在統一的な規制はな
い。このため、より使いやすい端子配列を独自に設定す
ることが可能である。(Prior Art) In recent years, with the improvement of semiconductor memory manufacturing technology and the resulting reduction in cost per bit, the memory capacity used in electronic devices has continued to increase. Under these circumstances, memory modules in which several D-RAM chips are mounted on a printed circuit board have been commercialized. Such a memory module has a card edge connector and is attached to the main body of the device using a dedicated socket. By the way, there are currently no uniform regulations regarding the terminal arrangement of this type of module. Therefore, it is possible to independently set a terminal arrangement that is easier to use.
しかしながら、従来のメモリモジュールにおいてはその
電源入力端子およびグランド端子は端子配列に関して対
称位fKは配置されてなく1組しかなかりた。However, in the conventional memory module, the power supply input terminal and the ground terminal are not arranged at symmetrical positions fK with respect to the terminal arrangement, and there is only one set.
(発明が解決しようとする課題)
このように上配従米のメモリモジュールでは、電源入力
端子およびグランド端子が端子配列に関して対称の位置
に配置されてなく1組しかなかったため、誤ってメモリ
モジュールをソケットに対して逆方向に挿着した場合は
電源ラインで衝突が起こり、また電源ラインを通して他
の箇所に悪影響を与えることがあるという問題点があっ
た。(Problem to be Solved by the Invention) In this way, in the memory module of the above-mentioned company, the power input terminal and the ground terminal were not arranged in symmetrical positions with respect to the terminal arrangement, and there was only one set, so it was possible to accidentally insert the memory module into the socket. If the power supply line is inserted in the opposite direction, there is a problem that a collision may occur in the power supply line, and that it may have an adverse effect on other parts through the power supply line.
そこで本発明はこの問題点を除去し、メモリモジュール
を逆方向に挿着した場合でも、電源ライン忙よる衝突お
よび悪影響が生じないメモリモジュールを提供すること
を目的とする。SUMMARY OF THE INVENTION An object of the present invention is to eliminate this problem and provide a memory module that does not cause collisions or adverse effects due to power line congestion even when the memory module is inserted in the opposite direction.
(課題を解決するための手段)
本発明は、複数のメモリチップを搭載したメモリモジュ
ールにおいて、電源入力端子とグランド端子とを端子配
列の両端の対称位置に配置したことを特徴とする。(Means for Solving the Problems) The present invention is characterized in that, in a memory module mounted with a plurality of memory chips, a power input terminal and a ground terminal are arranged at symmetrical positions at both ends of a terminal array.
(作 用)
本発明では、メモリモジュールを逆方向に挿着した場合
でも電源入力端子とグランド端子とを端子配列の両肩の
対称位置に配置されるため電源ラインによる衝突および
他の箇所への悪影響が生じない。(Function) In the present invention, even if the memory module is inserted in the opposite direction, the power input terminal and the ground terminal are arranged at symmetrical positions on both shoulders of the terminal arrangement, so there is no possibility of collision caused by the power line or damage to other parts. No adverse effects will occur.
(実施例)
以下、本発明の一実施例を添付図面を参照して詳細に説
明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the accompanying drawings.
第1図は本発明のメモリモジュールの一実施例を示す外
形図である。FIG. 1 is an outline diagram showing an embodiment of a memory module of the present invention.
この図において、メモリモジュール100は同じ機能を
有する合計9個のD−RAMチップ201〜209を第
1図(a)および(b)に示すようにプリント基板10
1の両面忙搭載している。また、このメモリモジュール
100は第1図(a)に矢印Xで示した端子を端子1と
し、矢印Yで示した端子を端子35として、それぞれ順
次連続した端子番号が付された端子1〜35が配列され
ている。In this figure, a memory module 100 has a total of nine D-RAM chips 201 to 209 having the same function, which are mounted on a printed circuit board 10 as shown in FIGS. 1(a) and 1(b).
Equipped with 1 double-sided bus. In addition, this memory module 100 has terminals 1 to 35, each of which has sequential terminal numbers, with the terminal indicated by arrow X in FIG. 1(a) being terminal 1 and the terminal indicated by arrow Y being terminal 35. are arranged.
第2図は本実施例のメモリモジュール1000回路図を
示したものであり、この図において記号vCCは電源入
力端子、記号G NDはグランド端子、記号RASは行
アドレスストローブ端子、記号CASは列アドレススト
ローブ端子、r号WRITEはライト端子、記号A0〜
A0はアドレス端子、記号Dout 0−Dout13
はデータ出力端子、記号DinO〜D in 8はデー
タ入力端子を表わしている。9個のD−RAMチップ2
01〜209はそのアドレス端子A 1 = A @が
それぞれ共通接続され、各D−RAMチップ201〜2
09にそれぞれ行アドレスストローブ端子RAS、行ア
ドレスストローブ端子CAS、ライト端子WRITEが
接続されている。筐た電源入力端子VCcとグランド端
子G NDO間には9個のチップコンデンサ300が並
列に接続されている。FIG. 2 shows a circuit diagram of the memory module 1000 of this embodiment. In this figure, the symbol vCC is a power input terminal, the symbol GND is a ground terminal, the symbol RAS is a row address strobe terminal, and the symbol CAS is a column address. Strobe terminal, r number WRITE is write terminal, symbol A0~
A0 is address terminal, symbol Dout 0-Dout13
represents a data output terminal, and symbols DinO to D in 8 represent data input terminals. 9 D-RAM chips 2
01 to 209 have their address terminals A 1 = A @ connected in common, and each D-RAM chip 201 to 2
09 are connected to a row address strobe terminal RAS, a row address strobe terminal CAS, and a write terminal WRITE, respectively. Nine chip capacitors 300 are connected in parallel between the power supply input terminal VCc and the ground terminal GNDO.
第3図は第2図に示した各端子を第1図に示した端子番
号との関係のもとに表にして示したものである。第3図
において、グランド端子GNDは端子番号1および35
に対応する端子lおよび35に接続され、電源入力端子
■CCは端子番号2および34に対応する端子2および
34に接続される。すなわち、電源入力端子vCCおよ
びグランド端子はメモリモジュールにおける端子配列の
両端の対称位置の端子に接続される。またデータ入力端
子DinQ〜])ingおよびデータ出力端子Dout
O〜p out 8は同一ビットに関する端子が互いに
隣接するように各端子に接続されている。例えばデータ
出力端子1) out 2とデータ入力端子Din2は
互いに隣接する端子17と181C接続され、データ出
力端子D out 7とデータ入力端子Din7は互い
に隣接する端子27と端子28に接続される。FIG. 3 is a table showing each terminal shown in FIG. 2 in relation to the terminal numbers shown in FIG. 1. In Figure 3, the ground terminals GND are terminal numbers 1 and 35.
The power input terminal CC is connected to terminals 2 and 34 corresponding to terminal numbers 2 and 34, respectively. That is, the power input terminal vCC and the ground terminal are connected to terminals at symmetrical positions at both ends of the terminal array in the memory module. Also, the data input terminal DinQ~])ing and the data output terminal Dout
O to p out 8 are connected to each terminal such that terminals related to the same bit are adjacent to each other. For example, the data output terminal 1) out 2 and the data input terminal Din2 are connected to the adjacent terminal 17 by 181C, and the data output terminal D out 7 and the data input terminal Din7 are connected to the adjacent terminals 27 and 28.
このような端子配列をとると、図示しないソケットに対
してメモリモジ為−ル100を逆方向に装着した場合で
も電源ラインによる衝突は生じない。またデータ入力端
子1)inQ〜Din8およびデータ出力端子Dout
O〜D out Bを同一ビットに関して互いに隣接す
る端子に接続するようにしたのでデータ入すクインの配
列が容易になる。With such a terminal arrangement, even if the memory module 100 is installed in the opposite direction to a socket (not shown), no collision will occur due to the power supply lines. In addition, data input terminals 1) inQ to Din8 and data output terminals Dout
Since O to D out B are connected to mutually adjacent terminals for the same bit, it is easy to arrange the quins for inputting data.
以上説明したように本発明によれば、電源入力端子とグ
ランド端子とを抱子配列の両端の対称位置に配置したた
め、メモリモジュールヲ誤って逆方向に装着した場合で
も電源ラインによる衝突および悪影響が生じないという
利点がある。また同一ビットに関するデータ入力端子と
データ出力端子を隣接する端子とすることKよってデー
タ人出力ラインの配列が容易となる。As explained above, according to the present invention, the power input terminal and the ground terminal are arranged at symmetrical positions at both ends of the holder arrangement, so even if the memory module is installed in the wrong direction, there will be no collision or adverse effects caused by the power line. It has the advantage that it does not occur. Further, by arranging the data input terminal and data output terminal related to the same bit as adjacent terminals, the arrangement of the data output lines is facilitated.
第1図は本発明のメモリモジ為−ルの一実施例を示す外
形図、第2図は本実施例のメモリモジュールの回路図、
第3図は同実施例のメモリモジュールの端子配列を示す
表である。
100・・・D−RAMモジュール、101・・・プリ
ント基板、201〜209・・・D−几AMチップ、3
00・・・チップコンデンサ。
代理人弁理士 則 近 憲 佑
同 山 下 −ムψ
(a)
第1図FIG. 1 is an outline drawing showing an embodiment of the memory module of the present invention, FIG. 2 is a circuit diagram of the memory module of the present embodiment,
FIG. 3 is a table showing the terminal arrangement of the memory module of the same embodiment. 100...D-RAM module, 101...Printed circuit board, 201-209...D-RAM chip, 3
00...Chip capacitor. Representative Patent Attorney Nori Ken Chika Yudo Yamashita -mu ψ (a) Figure 1
Claims (2)
において、電源入力端子とグランド端子とを端子配列の
両端の対称位置に配置したことを特徴とするメモリモジ
ュール。(1) A memory module equipped with a plurality of memory chips, characterized in that a power input terminal and a ground terminal are arranged at symmetrical positions at both ends of a terminal arrangement.
において、電源入力端子とグランド端子とを端子配列の
両端の対称位置に配置するとともに同一ビットに関する
データ入力端子とデータ出力端子を隣接して配置したこ
とを特徴とするメモリモジュール。(2) In a memory module equipped with multiple memory chips, power input terminals and ground terminals are arranged at symmetrical positions at both ends of the terminal arrangement, and data input terminals and data output terminals related to the same bit are arranged adjacently. A memory module featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63085445A JP2645068B2 (en) | 1988-04-08 | 1988-04-08 | Memory module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63085445A JP2645068B2 (en) | 1988-04-08 | 1988-04-08 | Memory module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01258466A true JPH01258466A (en) | 1989-10-16 |
JP2645068B2 JP2645068B2 (en) | 1997-08-25 |
Family
ID=13859074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63085445A Expired - Fee Related JP2645068B2 (en) | 1988-04-08 | 1988-04-08 | Memory module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2645068B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0683698A (en) * | 1992-09-02 | 1994-03-25 | Fujitsu Ltd | Device for method for recognizing main memory capacity |
JPH06348588A (en) * | 1992-05-19 | 1994-12-22 | Sun Microsyst Inc | Single in-line memory module |
US7102221B2 (en) | 1999-02-26 | 2006-09-05 | Hitachi, Ltd. | Memory-Module with an increased density for mounting semiconductor chips |
US7120069B2 (en) | 1991-02-28 | 2006-10-10 | Hitachi, Ltd. | Electronic circuit package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137581U (en) * | 1988-03-11 | 1989-09-20 |
-
1988
- 1988-04-08 JP JP63085445A patent/JP2645068B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137581U (en) * | 1988-03-11 | 1989-09-20 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7120069B2 (en) | 1991-02-28 | 2006-10-10 | Hitachi, Ltd. | Electronic circuit package |
US7233534B2 (en) | 1991-02-28 | 2007-06-19 | Hitachi, Ltd. | Electronic circuit package |
US7425763B2 (en) | 1991-02-28 | 2008-09-16 | Hitachi, Ltd. | Electronic circuit package |
US7701743B2 (en) | 1991-02-28 | 2010-04-20 | Rising Silicon, Inc. | Electronic circuit package |
JPH06348588A (en) * | 1992-05-19 | 1994-12-22 | Sun Microsyst Inc | Single in-line memory module |
EP0813204A2 (en) * | 1992-05-19 | 1997-12-17 | Sun Microsystems, Inc. | Single in-line memory module |
EP0813204A3 (en) * | 1992-05-19 | 1999-09-29 | Sun Microsystems, Inc. | Single in-line memory module |
JPH0683698A (en) * | 1992-09-02 | 1994-03-25 | Fujitsu Ltd | Device for method for recognizing main memory capacity |
US7102221B2 (en) | 1999-02-26 | 2006-09-05 | Hitachi, Ltd. | Memory-Module with an increased density for mounting semiconductor chips |
Also Published As
Publication number | Publication date |
---|---|
JP2645068B2 (en) | 1997-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |