JPH01258451A - Cutting and separation of electronic component lead - Google Patents

Cutting and separation of electronic component lead

Info

Publication number
JPH01258451A
JPH01258451A JP63086513A JP8651388A JPH01258451A JP H01258451 A JPH01258451 A JP H01258451A JP 63086513 A JP63086513 A JP 63086513A JP 8651388 A JP8651388 A JP 8651388A JP H01258451 A JPH01258451 A JP H01258451A
Authority
JP
Japan
Prior art keywords
cutting
lead frame
lead
cutting part
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63086513A
Other languages
Japanese (ja)
Inventor
Tadashi Komiyama
忠 込山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63086513A priority Critical patent/JPH01258451A/en
Publication of JPH01258451A publication Critical patent/JPH01258451A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To dispense with a metal mold for cutting a lead frame by a method wherein the cutting part of the lead frame is made thin to cut the cutting part of the lead frame with a laser beam and to eliminate a rise of the lead frame on the periphery of the cutting part. CONSTITUTION:The sectional area of the cutting part of a lead frame 6 is made smaller than that of other part other than the cutting part. A laser beam 15 is irradiated toward the cutting part and the cutting part is cut. At the time of cutting, the fused lead frame 6 is risen by a surface tension on the periphery of the cutting surface. However, as the cutting part is made thinner than other part other than the cutting part in advance, the cutting part does never become thicker than other part even though the lead frame 6 is risen. Thereby, a metal mold for cutting the lead frame becomes unnecessary.

Description

【発明の詳細な説明】 〔産業上の利用分舒〕 本発明は、電子部品のリード切断分離方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a method for cutting and separating leads of electronic components.

〔従来の技術〕[Conventional technology]

従来この種のリード切断分離装置は、上下一対のリード
切断用切刃を有する金型を有し、上型又は下型が上下す
るこ１とにより、間にはさまれたリードを切断して電子
部品をフレーム枠から分離するようになっていた。Conventionally, this type of lead cutting and separating device has a mold having a pair of upper and lower lead cutting blades, and by moving the upper mold or the lower mold up and down 1, it cuts the lead sandwiched between them. The electronic components were to be separated from the frame frame.

また、ビームを用いて切断する場合は、切断部にビーム
を当て、溶融させて分離するようになっていた。In addition, when cutting using a beam, the beam is applied to the cut portion to melt and separate.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のリード切断装置は、第６図、第７図、に
例を示すが、形状の異なるリードフレーム６各々専用の
金型１３を製作し、リードフレーム６の送りピッチ等が
変更された場合は、金型１３を交換するようになってい
るので、金型化がかかる上、金型工換のための工数がか
かるという欠点がある。In the conventional lead cutting device described above, examples of which are shown in FIGS. 6 and 7, a dedicated mold 13 is manufactured for each lead frame 6 having a different shape, and the feed pitch of the lead frame 6 is changed. In this case, the mold 13 has to be replaced, which has the drawback that it takes a lot of time to make the mold, and it also takes a lot of man-hours to replace the mold.

また、第８図（ａ）にその概略を、第８図（ｂ）。Moreover, the outline is shown in FIG. 8(a) and FIG. 8(b).

（ｃ）に第８図（ａ）のＡ部を拡大して示すように、ビ
ームを用いる場合は、溶融したリードフレーム材が、切
断部の周囲に盛り上がり、基板に実装する際にリード下
面にはんだが付きにくくなるなどの欠点がある。(c) shows an enlarged view of part A in Fig. 8(a). When using a beam, the molten lead frame material bulges around the cut part and touches the bottom surface of the lead when it is mounted on a board. There are drawbacks such as difficulty in soldering.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の目的は、前記問題点を解消した電子部品リード
切断分離方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for cutting and separating electronic component leads that solves the above-mentioned problems.

本発明のリード切断分離方法は、電子部品をフレーム枠
から分離するため、リードフレームの切断部分を細くし
た上で、レーザビームを照射して、リードを切断するこ
とを特徴としている。The lead cutting/separation method of the present invention is characterized in that in order to separate the electronic component from the frame, the lead frame is cut into a thinner cut portion and then a laser beam is irradiated to cut the lead.

本発明は、リード切断部を細くしてレーザビームでリー
ドを切断するので、切断部周囲が盛り上がらない。In the present invention, since the lead cutting portion is made thin and the lead is cut with a laser beam, the area around the cutting portion does not swell.

〔実施例〕〔Example〕

次に、本発明について、図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は、本発明に関する一実施例である。第２図、第
３図（ａ）、　（ｂ）は、本発明の一実施例の詳細図で
ある。第１図において、リードフレーム６は、搬送レー
ル３を通ってＸ−Ｙ方向へ移動できるレーザビームヘッ
ド１の下へ搬送され、第２図に示すように切断部の溝を
下方よりピンで支持される。FIG. 1 shows one embodiment of the present invention. 2, 3(a) and 3(b) are detailed views of one embodiment of the present invention. In FIG. 1, the lead frame 6 is conveyed through the conveyance rail 3 under the laser beam head 1 which can move in the X-Y direction, and is supported by pins from below in the groove of the cutting part as shown in FIG. be done.

次に、第２図、第３図（ａ）に示すように、切断部に向
けてレーザビーム１５を照射し切断する。Next, as shown in FIGS. 2 and 3(a), a laser beam 15 is irradiated toward the cutting portion to perform cutting.

切断の際に溶融したリードフレーム材が表面張力によっ
て切断面周囲に盛り上がるが、切断部を、あらかじめ他
の部分より薄くしておくため、リードフレーム材が盛り
上がっても、その部分が、他の部分より厚くなることは
なく、また、特に盛り上りが問題になるリードフレーム
下部は、リード押えピンによって支えられるので、下方
へのはみ出しはない（第３図（ｂ））。During cutting, the molten lead frame material bulges around the cut surface due to surface tension, but because the cut part is made thinner than other parts in advance, even if the lead frame material bulges, that part will not bulge around the cut surface. The lead frame does not become thicker, and since the lower part of the lead frame, where swelling is a problem, is supported by the lead holding pin, there is no downward protrusion (FIG. 3(b)).

第４図（ａ）、　（ｂ）は、本発明の他の実施例である
。第５図は、その平面図である。リードフレーム６は、
切断部分をリード押え１２によって支持され、リード押
え１２の中央の割れ目を通ってレーザビーム１５が照射
される。リードフレーム６は、下方を平坦（フラット）
な面で支持されるが、下方に逃げられない溶融したリー
ドフレーム資材が横方向へ広がるのを防ぐため、第５図
に示すようにリードフレーム６の切断部側面を内側へカ
ットしておく。FIGS. 4(a) and 4(b) show other embodiments of the present invention. FIG. 5 is a plan view thereof. The lead frame 6 is
The cut portion is supported by a lead holder 12, and a laser beam 15 is irradiated through a crack in the center of the lead holder 12. The lead frame 6 is flat at the bottom.
In order to prevent the molten lead frame material that cannot escape downward from spreading laterally, the side surface of the cut portion of the lead frame 6 is cut inward as shown in FIG. 5.

この実施例では、リード下方が平坦な面であり、上方か
らリード押さえで押さえているので、リードの固定が確
実であり、また装置の構造も、リード下方の構造が簡略
化されるため、コンパクトになるという利点がある。In this example, the lower part of the lead is a flat surface and is held down from above by a lead holder, so the lead is securely fixed.The structure of the device is also compact because the lower part of the lead is simplified. It has the advantage of becoming

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、リード切断部にレーザ
ビーム１５を照射して切断することにより、リード切断
用の金型が不要となり金型費用と金型交換の工数を削減
できる効果がある。As explained above, the present invention has the effect of cutting the lead cutting portion by irradiating the laser beam 15, thereby eliminating the need for a mold for cutting the lead, thereby reducing mold costs and man-hours for replacing molds. .

また、リード切断部の幅や厚さを他の部分より狭くする
ことにより、レーザビーム照射時に、リードフレーム材
の盛り上りによってリード厚が部分的に厚くなることを
防ぐことができる効果が。Furthermore, by making the width and thickness of the lead cutting part narrower than other parts, it is possible to prevent the lead thickness from becoming partially thicker due to swelling of the lead frame material during laser beam irradiation.

ある。be.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例のリード切断分離方法を示す
斜視図、第２図、第３図（ａ）、　（ｂ）は本発明の一
実施例のリード切断分離方法を説明するための詳細断面
図、第４図（ａ）は本発明の他の実施例の断面図、第４
図（ｂ）は本発明の他の実施例の平面図、第５図は、本
発明の他の実施例の部分拡大平面図、第６図、第７図は
それぞれ従来の金型を用いたリード切断分離方法の斜視
図及び断面図、第８図（ａ）〜（Ｃ）は、従来のビーム
を用いたリード切断分離方法の断面図である。 １・・・・・・レーザビームヘッド、２・・・・・・モ
ールド押え、３・・・・・・搬送レール、４・・・・・
・リード押えピン、５・・・・・・ワーク収納箱、６・
・・・・・リードフレーム、７・・・・・・ミラーａ％
　　８・・・・・・ミラーｂ、９・・・・・・リード押
えピン、ｌＯ・・・・・・モールド、１１・・・・・・
下型、１２・・・・・・リード押え、１３・・・・・・
金型、１４・・・・・・上型、１５・・・・・・レーザ
ビーム、１６・・・・・・リードの盛り上り部、１７・
・・・・・切断品収納箱。 代理人　弁理士　　内　原　　　音 茅　１　厘 茅　２　図 （ａｘ　　　　　　　　　（迭］ 葉　３　閏 華　ｂ　回 華　７［！ＵFIG. 1 is a perspective view showing a lead cutting and separating method according to an embodiment of the present invention, and FIGS. 2, 3 (a) and (b) are for explaining a lead cutting and separating method according to an embodiment of the present invention. FIG. 4(a) is a detailed sectional view of another embodiment of the present invention, FIG.
Figure (b) is a plan view of another embodiment of the present invention, Figure 5 is a partially enlarged plan view of another embodiment of the present invention, and Figures 6 and 7 are views of a conventional mold. A perspective view and a cross-sectional view of a lead cutting and separating method, and FIGS. 8(a) to (C) are cross-sectional views of a lead cutting and separating method using a conventional beam. 1... Laser beam head, 2... Mold holder, 3... Conveyance rail, 4...
・Lead holding pin, 5... Work storage box, 6.
...Lead frame, 7...Mirror a%
8...Mirror b, 9...Lead holding pin, lO...Mold, 11...
Lower die, 12...Lead presser, 13...
Mold, 14... Upper mold, 15... Laser beam, 16... Lead bulge, 17.
・・・・・・Storage box for cut items. Agent Patent Attorney Uchihara Otomaya 1 厘茅 2 图（ax （迭） foliage 3 喏花 b 海花 7[!U

Claims (1)

【特許請求の範囲】[Claims] 　電子部品等をフレーム枠から切断分離する電子部品リ
ード切断分離工程において、リードフレームの切断部分
の断面積を他より小さくした上でレーザビームを照射し
て、リードを切断することを特徴とする電子部品リード
切断方法。In an electronic component lead cutting and separation process for cutting and separating electronic components and the like from a frame, the electronic component is characterized in that the cross-sectional area of the cut portion of the lead frame is made smaller than the other parts, and then a laser beam is irradiated to cut the leads. How to cut parts leads.
JP63086513A 1988-04-08 1988-04-08 Cutting and separation of electronic component lead Pending JPH01258451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63086513A JPH01258451A (en) 1988-04-08 1988-04-08 Cutting and separation of electronic component lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63086513A JPH01258451A (en) 1988-04-08 1988-04-08 Cutting and separation of electronic component lead

Publications (1)

Publication Number Publication Date
JPH01258451A true JPH01258451A (en) 1989-10-16

Family

ID=13889066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63086513A Pending JPH01258451A (en) 1988-04-08 1988-04-08 Cutting and separation of electronic component lead

Country Status (1)

Country Link
JP (1) JPH01258451A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104860108A (en) * 2015-04-08 2015-08-26 广东硕源科技股份有限公司 Automatic cutting stacking equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104860108A (en) * 2015-04-08 2015-08-26 广东硕源科技股份有限公司 Automatic cutting stacking equipment
CN104860108B (en) * 2015-04-08 2016-10-26 广东硕源科技股份有限公司 A kind of surface trimming stack equipment

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