JPH01256189A - Semiconductor laser - Google Patents
Semiconductor laserInfo
- Publication number
- JPH01256189A JPH01256189A JP63084730A JP8473088A JPH01256189A JP H01256189 A JPH01256189 A JP H01256189A JP 63084730 A JP63084730 A JP 63084730A JP 8473088 A JP8473088 A JP 8473088A JP H01256189 A JPH01256189 A JP H01256189A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- pin diode
- light
- semiconductor laser
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 201000009310 astigmatism Diseases 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本本発明は、コンパクトディスクCD、レーザーディス
クLD、追記型光ディスク、消去可能光ディスク等の光
ディスクの分野を始め、通信分野、レーザープリンター
等の分野で使用される半導体レーザーに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention can be used in the fields of optical discs such as compact discs CDs, laser discs LDs, recordable optical discs, and erasable optical discs, as well as in the fields of communications, laser printers, etc. The present invention relates to semiconductor lasers.
従来の技術
近年、半導体レーザーを利用する分野が広がってきてお
シ、CD、LD、追記型光ディスク、消去可能光ディス
ク等の光ディスクの分野を始め、通信の分野、レーザー
プリンターの分野等に使用されている。また、追記型や
、消去可能型では高出力の半導体レーザーが必要になっ
てきている。Background of the Invention In recent years, the fields in which semiconductor lasers are used have expanded, and they are used in optical discs such as CDs, LDs, write-once optical discs, and erasable optical discs, communications, and laser printers. There is. Furthermore, high-power semiconductor lasers are becoming necessary for write-once and erasable types.
従来の半導体レーザーは第3図に示す様にベース1にボ
スト2が取シ付けられ、ポスト2の先端部にはレーザー
チップ3が固定されている。レーザーチップ3の前側端
面から出射した拡散光は窓6を透過し、出力する。窓5
はキャップ4に固定され、レーザーチップ3は密封され
る。レーザーチップ3の後側端面から出射した光の当た
る位置に配置されたPINダイオード6がレーザーチッ
プ3から出射した光のパワーを検出し、レーザーに不帰
還をかけることによシ、前側端面からの出射光を制御す
る。In a conventional semiconductor laser, as shown in FIG. 3, a post 2 is attached to a base 1, and a laser chip 3 is fixed to the tip of the post 2. The diffused light emitted from the front end face of the laser chip 3 passes through the window 6 and is output. window 5
is fixed to the cap 4, and the laser chip 3 is sealed. A PIN diode 6 placed at a position where the light emitted from the rear end face of the laser chip 3 detects the power of the light emitted from the laser chip 3, and by applying non-feedback to the laser, it is possible to detect the power of the light emitted from the front end face. Control the emitted light.
第4図に前側端面からの出射光の制御方法を示す。半導
体レーザー8の後側出射光11をPINダイオード9で
受光し、電流に変換後、増幅器12に入力する。また、
半導体レーザー8の特性と必要出射パワーから求められ
る基準電圧13をレーザー駆動力回路14に与え、レー
ザーを駆動する。FIG. 4 shows a method of controlling the light emitted from the front end face. The rear emitted light 11 of the semiconductor laser 8 is received by the PIN diode 9, converted into a current, and then input to the amplifier 12. Also,
A reference voltage 13 determined from the characteristics of the semiconductor laser 8 and the necessary output power is applied to the laser driving power circuit 14 to drive the laser.
発明が解決しようとする課題
しかしながら、従来の半導体レーザーでは、■ レーザ
ー自身が持っている非点隔差を低減できない。Problems to be Solved by the Invention However, conventional semiconductor lasers cannot reduce the astigmatism difference that the laser itself has.
■ レーザーの出射光を後側端面からの出射光で制御し
ているため、前側端面からの出射光と後側端面からの出
射光は位相が異なる。■ Since the output light of the laser is controlled by the light emitted from the rear end facet, the phases of the emitted light from the front end face and the light emitted from the rear end face are different.
■ PINダイオードを配置するため、レーザーチップ
の位置がベースから離れており、放熱係数が低い。■ Due to the placement of the PIN diode, the laser chip is located far from the base, resulting in a low heat dissipation coefficient.
という問題を有していた。There was a problem.
■の問題では光路中に設けられた別のレンズにより収束
したビームに非点収差が発生する。■の問題では最適な
出力制御ができない。■の問題ではレーザーの高出力化
に不利である。In problem (2), astigmatism occurs in the beam converged by another lens provided in the optical path. Problem (3) does not allow optimal output control. Problem (3) is disadvantageous to increasing the output power of lasers.
本発明は、上記問題点を低減または解決する半導体レー
ザーを提供するものである。The present invention provides a semiconductor laser that reduces or solves the above problems.
課題を解決するだめの手段
上記問題点を解決するために本発明の半導体レーザーは
、ビーム出射窓をレーザーの光軸に対して斜めに配置し
、レーザーからの出射光を該ビーム出射窓で反射させ、
反射した上記ビームをレーザーチップの横位置に配置し
たPINダイオードで受光し、受光した光量によりレー
ザーへの供給電流を制御することにより、レーザーから
の出射光量を安定化させるという構成を備えたものであ
る。Means for Solving the Problems In order to solve the above problems, the semiconductor laser of the present invention has a beam exit window that is arranged obliquely to the optical axis of the laser, and the light emitted from the laser is reflected by the beam exit window. let me,
The reflected beam is received by a PIN diode placed next to the laser chip, and the amount of light emitted from the laser is stabilized by controlling the current supplied to the laser based on the amount of received light. be.
作 用
本発明は上記した構成によって、上述した■〜■の問題
点を低減、または解決するものである。Operation The present invention reduces or solves the above-mentioned problems (1) to (3) by using the above-described configuration.
■の問題を解決する方法としてビーム出射窓をビームの
光軸に対して斜めに配置する方法はレーザーの持つ非点
隔差を低減できる。As a method to solve the problem (2), arranging the beam exit window obliquely with respect to the optical axis of the beam can reduce the astigmatism difference of the laser.
■の問題を解決する方法として実際に利用する前側端面
からの出射光を用いるためレーザーの出射光の最適な制
御が行える。As a method to solve the problem (1), since the light emitted from the front end surface that is actually used is used, the emitted light of the laser can be optimally controlled.
■の問題を解決する方法としてレーザーチップの下部に
PINダイオードが無いため、レーザーチップの位置を
できるだけベースに近い位置に配置できるため放熱係数
が大きく、レーザーの高出力化が容易になる。As a solution to the problem (2), since there is no PIN diode at the bottom of the laser chip, the laser chip can be placed as close to the base as possible, which increases the heat dissipation coefficient and makes it easier to increase the output of the laser.
実施例
以下本発明の一実施例の半導体レーザーについて、図面
を参照しながら説明する。第1図は本発明の実施例にお
ける半導体レーザーの構成を示したものである。EXAMPLE Hereinafter, a semiconductor laser according to an example of the present invention will be described with reference to the drawings. FIG. 1 shows the configuration of a semiconductor laser in an embodiment of the present invention.
ベース1上にあるポスト2にレーザーチップ3が固定さ
れ、レーザーチップ3の上部端面から前側出射光1oを
出射する。出射窓21は光軸に対して斜めに配置されて
おり、その角度は出射窓21の厚みとレーザーの非点隔
差によって決められる出射窓21はキャップ20に設け
られ、キャップ2oがベースに固定されることにより、
レーザー千ツブ3は密封される。A laser chip 3 is fixed to a post 2 on a base 1, and a front side emitted light 1o is emitted from an upper end face of the laser chip 3. The exit window 21 is arranged obliquely to the optical axis, and its angle is determined by the thickness of the exit window 21 and the astigmatism difference of the laser.The exit window 21 is provided in the cap 20, and the cap 2o is fixed to the base. By doing so,
Laser Sentsubu 3 is sealed.
出射窓21で反射したビームは側部のPINダイオード
用ポスト22に固定されたPINダイオ−6に入射する
。PINダイオード6の角度を入射光軸に対し斜めにし
たことにより、PINダイオード6の表面で反射したビ
ームがレーザーチップ3に戻り、ノイズを増加させると
いう問題は低減される。The beam reflected by the exit window 21 enters the PIN diode 6 fixed to the PIN diode post 22 on the side. By making the angle of the PIN diode 6 oblique to the incident optical axis, the problem that the beam reflected on the surface of the PIN diode 6 returns to the laser chip 3 and increases noise is reduced.
第2図に出射光の制御方法を示す。レーザー8からの前
側出射光1oの一部をPINダイオード6で受光した光
を電流に変換し、増幅器12で増幅しレーザー駆動回路
14に入力する。また、半導体レーザー8の特性と必要
出射パワーから求められる基準電圧13をレーザー駆動
力回路14に与え、レーザーを駆動する。FIG. 2 shows a method of controlling the emitted light. A portion of the front-side emitted light 1o from the laser 8 is received by the PIN diode 6, and is converted into a current, amplified by the amplifier 12, and input to the laser drive circuit 14. Further, a reference voltage 13 determined from the characteristics of the semiconductor laser 8 and the required output power is applied to the laser driving power circuit 14 to drive the laser.
発明の効果
以上のように本発明は、レーザービームの出射窓を斜め
にし、その出射窓での反射光を側部に配置したPINダ
イオードでの受光量に応じてレーザーの出射パワーを制
御するため、レーザー自身が持っている非点隔差を低減
でき、レーザーの前側出射光を利用しているため、出射
光の最適な出力制御ができ、レーザーチップの下部にP
INダイオードがないため、レーザーチップとベースの
距離が短くなって放熱効果が良くなり、レーザーの高出
力化が可能になる。更に別の効果としてPINダイオー
ドの受光面が光軸に対して平行の方向にあるため外部か
らの迷光を受けにくく、精度の高いレーザーの出射パワ
ーの制御をすることができるという特徴、及びレーザー
チップの後側端面の反射率を100%にできるため発光
効率を向上することができるという特徴をも有する。Effects of the Invention As described above, the present invention has an oblique exit window for the laser beam, and controls the output power of the laser according to the amount of light reflected by the exit window received by the PIN diode disposed on the side. , the astigmatism difference of the laser itself can be reduced, and since the front side emitted light of the laser is used, the output light can be controlled optimally.
Since there is no IN diode, the distance between the laser chip and the base is shortened, improving the heat dissipation effect and making it possible to increase the output of the laser. Another advantage is that the light-receiving surface of the PIN diode is parallel to the optical axis, so it is less susceptible to stray light from the outside, and the laser output power can be controlled with high precision. It also has the feature that the reflectance of the rear end face can be made 100%, so that the luminous efficiency can be improved.
第1図は本発明の一実施例における半導体レーザーを示
す断面図、第2図は同半導体レーザーの出射光の制御方
法を示すブロック図、第3図は従来の半導体レーザーを
示す断面図、第4図は従来の半導体レーザーの出射光の
制御方法を示すブロック図である。
1・・・・・・ベース、3・・・・・・レーザーチッ7
’、 4.20・・・・・・キャップ、5,21・・・
・・・出射窓、6・・・・・・PINダイオード。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名1−
(−ス
2−ff、’7ト
5−z桁爲
6−−ザlNダイχ−Y
7−鵡手FIG. 1 is a sectional view showing a semiconductor laser according to an embodiment of the present invention, FIG. 2 is a block diagram showing a method for controlling the emitted light of the semiconductor laser, and FIG. 3 is a sectional view showing a conventional semiconductor laser. FIG. 4 is a block diagram showing a conventional method for controlling light emitted from a semiconductor laser. 1...Base, 3...Laser chip 7
', 4.20... Cap, 5,21...
...Exit window, 6...PIN diode. Name of agent: Patent attorney Toshio Nakao and 1 other person1-
(-s2-ff, '7-to5-z digit 6--the lN die χ-Y 7-hand
Claims (2)
ケースのビーム出射窓を平行平板で構成し、この平行平
板を光軸に対して斜めに配置し、半導体レーザーチップ
からの出射光が上記平行平板で反射する位置に光検出器
を配置したことを特徴とする半導体レーザー。(1) The beam exit window of the semiconductor laser case that seals the semiconductor laser chip is composed of a parallel flat plate, and this parallel flat plate is arranged obliquely to the optical axis, so that the emitted light from the semiconductor laser chip is reflected by the parallel flat plate. A semiconductor laser characterized in that a photodetector is placed at a position where a photodetector is placed.
に配置したことを特徴とする請求項1記載の半導体レー
ザー。(2) The semiconductor laser according to claim 1, wherein the light receiving surface of the photodetector is arranged obliquely with respect to the optical axis of the photodetector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63084730A JPH01256189A (en) | 1988-04-06 | 1988-04-06 | Semiconductor laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63084730A JPH01256189A (en) | 1988-04-06 | 1988-04-06 | Semiconductor laser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01256189A true JPH01256189A (en) | 1989-10-12 |
Family
ID=13838810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63084730A Pending JPH01256189A (en) | 1988-04-06 | 1988-04-06 | Semiconductor laser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01256189A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065990A (en) * | 1992-06-22 | 1994-01-14 | Sharp Corp | Package for semiconductor laser |
EP0786838A2 (en) * | 1996-01-25 | 1997-07-30 | Hewlett-Packard Company | Laser based light source using diffraction, scattering or transmission |
US5675597A (en) * | 1994-11-16 | 1997-10-07 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser device |
JPH1031838A (en) * | 1996-04-18 | 1998-02-03 | Samsung Electron Co Ltd | Laser diode package having light output monitoring function |
US5761229A (en) * | 1996-01-25 | 1998-06-02 | Hewlett-Packard Company | Integrated controlled intensity laser-based light source |
US5771254A (en) * | 1996-01-25 | 1998-06-23 | Hewlett-Packard Company | Integrated controlled intensity laser-based light source |
US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
US6932522B2 (en) | 1998-12-30 | 2005-08-23 | Finisar Corporation | Method and apparatus for hermetically sealing photonic devices |
JP2007121920A (en) * | 2005-10-31 | 2007-05-17 | Sony Corp | Optical module, optical communication module, and optical communication device |
-
1988
- 1988-04-06 JP JP63084730A patent/JPH01256189A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065990A (en) * | 1992-06-22 | 1994-01-14 | Sharp Corp | Package for semiconductor laser |
US5675597A (en) * | 1994-11-16 | 1997-10-07 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser device |
US5771254A (en) * | 1996-01-25 | 1998-06-23 | Hewlett-Packard Company | Integrated controlled intensity laser-based light source |
EP0786838A3 (en) * | 1996-01-25 | 1997-10-08 | Hewlett Packard Co | Laser based light source using diffraction, scattering or transmission |
US5761229A (en) * | 1996-01-25 | 1998-06-02 | Hewlett-Packard Company | Integrated controlled intensity laser-based light source |
EP0786838A2 (en) * | 1996-01-25 | 1997-07-30 | Hewlett-Packard Company | Laser based light source using diffraction, scattering or transmission |
US5809050A (en) * | 1996-01-25 | 1998-09-15 | Hewlett-Packard Company | Integrated controlled intensity laser-based light source using diffraction, scattering and transmission |
JPH1031838A (en) * | 1996-04-18 | 1998-02-03 | Samsung Electron Co Ltd | Laser diode package having light output monitoring function |
US5920585A (en) * | 1996-04-18 | 1999-07-06 | Samsung Electronics Co., Ltd. | Laser diode package having an optical power monitoring function |
CN1088885C (en) * | 1996-04-18 | 2002-08-07 | 三星电子株式会社 | Laser diode elements with light yield mornitoring function |
US6932522B2 (en) | 1998-12-30 | 2005-08-23 | Finisar Corporation | Method and apparatus for hermetically sealing photonic devices |
US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
JP2007121920A (en) * | 2005-10-31 | 2007-05-17 | Sony Corp | Optical module, optical communication module, and optical communication device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1143584A3 (en) | Semiconductor laser array | |
JPH01256189A (en) | Semiconductor laser | |
JPH06309685A (en) | Laser output control device for optical information recording/reproducing device | |
JP2002057404A (en) | Laser diode, semiconductor light-emitting device and method of manufacture | |
JPS60257584A (en) | Photodetector built-in type semiconductor laser | |
EP1191522A3 (en) | Optical pickup apparatus | |
US5675597A (en) | Semiconductor laser device | |
JPH05183220A (en) | Semiconductor laser-excited solid-laser device | |
JPS59208886A (en) | Light emitting semiconductor device | |
JP2000228559A (en) | Optical device | |
JPH01189978A (en) | Luminous surface type semiconductor laser | |
JP2002140830A (en) | Optical pickup device and method for manufacturing optical pickup device | |
JP2003347649A (en) | Light emitting device and its producing process | |
US20060285562A1 (en) | Semiconductor laser device | |
JPH11284273A (en) | Semiconductor laser apparatus | |
JP2003005237A (en) | Wavelength conversion type laser device and its control method | |
JPH10303513A (en) | Semiconductor laser device | |
JPH11273138A (en) | Optical semiconductor device and optical pickup | |
JPS61127191A (en) | Semiconductor laser | |
JPH05128569A (en) | Optical pickup apparatus | |
JP2002314185A (en) | Semiconductor laser device and manufacturing method therefor | |
JPH04268777A (en) | Semiconductor laser excitation solid-state laser device and manufacture thereof | |
JPH0281493A (en) | Semiconductor laser device | |
JPH05304313A (en) | Optical semiconductor device | |
JPS6092681A (en) | Semiconductor laser |