JPH01248112A - Light emitting element module - Google Patents

Light emitting element module

Info

Publication number
JPH01248112A
JPH01248112A JP7443788A JP7443788A JPH01248112A JP H01248112 A JPH01248112 A JP H01248112A JP 7443788 A JP7443788 A JP 7443788A JP 7443788 A JP7443788 A JP 7443788A JP H01248112 A JPH01248112 A JP H01248112A
Authority
JP
Japan
Prior art keywords
holder
emitting element
light emitting
optical
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7443788A
Other languages
Japanese (ja)
Inventor
Masahiro Sakakibara
榊原 雅博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP7443788A priority Critical patent/JPH01248112A/en
Publication of JPH01248112A publication Critical patent/JPH01248112A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G02B6/4208Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

PURPOSE:To reduce an axis shift due to solder creep characteristics by using magnetic bodies for a cap and a holder. CONSTITUTION:A 1st optical fiber 15 for coupling the projection photoelectric power from a semiconductor laser 4 with an optical fiber 15 optically, a 1st holder 9, and a 2nd holder 20 are fixed with solder after their optical axes are adjusted. At this time, the 1st holder 19 is attracted to the cap 18 formed of a magnetic material with the attractive force of a permanent magnet 8 as a component of an optical isolator incorporated in the 1st holder 19. Further, the 2nd holder 20 is also attracted to the 1st holder i formed of a magnetic material as well. Consequently, the quantity of the axis shift with time due to the solder creep characteristics is reducible.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) この発明は、光アイソレータ素子を内蔵した発光素子モ
ジュールに関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a light emitting element module incorporating an optical isolator element.

(従来の技術) 近年、光通信分野においては、伝送速度がギガピクト以
上の伝送装置が開発されつつあシ、この伝送装置に使用
される発光素子モジュールとして、半纏体レーザ、例え
ば分布帰還形半導体レーザ(DFBレーザ)を発光素子
とした発光素子モジュールが用いられる。
(Prior Art) In recent years, in the field of optical communications, transmission devices with transmission speeds of Gigapictures or higher have been developed.Semiconductor lasers, such as distributed feedback semiconductor lasers, are being used as light-emitting element modules used in these transmission devices. A light emitting element module using a (DFB laser) as a light emitting element is used.

半導体レーザを発光素子とした場合、反射もどり光によ
り半導体レーザ出射光に雑音が発生するとともに、波長
変動も発生し、ギガビット以上の伝送装置においては、
伝送特性の劣化をきたす。反射もどり光を抑圧する手段
としては、一般的に光アイソレータを発光素子モジュー
ルに内蔵し、半導体レーザに反射もどり光をもどさない
構成が採られる。
When a semiconductor laser is used as a light emitting element, the reflected light causes noise in the semiconductor laser emitted light, as well as wavelength fluctuations.
This causes deterioration of transmission characteristics. As means for suppressing the reflected light, an optical isolator is generally built into the light emitting element module to prevent the reflected light from returning to the semiconductor laser.

第2図に代表的な光アイソレータ内蔵発光素子モジ−−
ルの構成を示す。1は電気信号入出力用リード、2は半
導体レーザ固定用ステム、3は半導体レーザの出射光電
力検出用光検出器、4は半導体レーザ、5は第1の光学
レンズ、6はキャップ、7はガラス窓、8は永久磁石、
9はファラデー回転子、10は第2の光学レンズ、11
は非磁性材料の第1のホルダ、12は偏光子、13はフ
ェルール、14は非磁性材料の第2のホルダ、15は光
ファイバ、16.17は第1.第2のホルダ半田固定部
である。このように構成された発光素子で モジュールは、15の光ファイバにシングルモード光フ
ァイバを用いた場合、半導体レーザ4の光軸に対して光
ファイバ15が数ミクロン最適調整、固定後に軸ずれす
ると光ファイバ15への光結合効率が大幅に劣化する。
Figure 2 shows a typical light-emitting element module with a built-in optical isolator.
The configuration of the file is shown below. 1 is a lead for electrical signal input/output, 2 is a stem for fixing a semiconductor laser, 3 is a photodetector for detecting the power of the output light of the semiconductor laser, 4 is a semiconductor laser, 5 is a first optical lens, 6 is a cap, and 7 is a Glass window, 8 is a permanent magnet,
9 is a Faraday rotator, 10 is a second optical lens, 11
12 is a polarizer, 13 is a ferrule, 14 is a second holder made of nonmagnetic material, 15 is an optical fiber, and 16.17 is a first holder made of nonmagnetic material. This is the second holder solder fixing part. In the module with the light emitting element configured in this way, when a single mode optical fiber is used as the optical fiber 15, if the optical fiber 15 deviates by a few microns from the optical axis of the semiconductor laser 4 after being optimally adjusted and fixed, the light will emit light. The optical coupling efficiency to the fiber 15 is significantly degraded.

軸ずれ要因として、温度変動、半田固定部16.17の
半田クリープ特性によるものがある。特に半田クリープ
特性による軸ズレは、経時的に発生し、光通信システム
構成上対応が困難である。半田クリープ特性とは、固定
用半日に静荷重を加えたとき、ある温度以上で塑性変形
を示す現象で、歪量は時間の関数である。
The axis misalignment factors include temperature fluctuations and solder creep characteristics of the solder fixing parts 16 and 17. In particular, axis misalignment due to solder creep characteristics occurs over time and is difficult to deal with in terms of optical communication system configuration. Solder creep characteristics are a phenomenon in which plastic deformation occurs above a certain temperature when a static load is applied to a fixing half-day, and the amount of strain is a function of time.

第3図に静荷重、温度をパラメータとした半田クリープ
特性を示す。例えば、第3図から判る通り2μmの歪量
が発生するまでの時間は、19160℃で2×10時間
、10g、60℃で104時間である。
Figure 3 shows the solder creep characteristics using static load and temperature as parameters. For example, as can be seen from FIG. 3, the time required to generate a strain of 2 μm is 2×10 hours at 19160° C., 104 hours at 10 g and 60° C.

光アイソレータ素子を内蔵した発光素子モジ−一ルでは
、永久磁石8、ファラデー回転子9が第1のホルダ11
内に内蔵されるため、ホルダ固定用半田16にアイソレ
ータ素子を内蔵しない発光素子モジュールよりも過大な
靜荷1がかかり、半田クリープ特性による軸ずれ量が大
きく、光結合効率の劣化速度が速まり光通信システムに
重大な支障をきたす。
In a light emitting element module incorporating an optical isolator element, a permanent magnet 8 and a Faraday rotator 9 are placed in a first holder 11.
Since the isolator element is built in, the holder fixing solder 16 is subjected to an excessive load 1 than a light emitting element module that does not have an isolator element built in, resulting in a large amount of axial misalignment due to solder creep characteristics, which accelerates the rate of deterioration of optical coupling efficiency. This will cause serious trouble to optical communication systems.

(発明が解決しようとする課題) 本発明は、半田固定部の半田クリープ特性による軸ずれ
を大幅獄吏なくすることが可能な光アイソレータ内蔵発
光素子モジ為−ルを提供することを目的とする。
(Problems to be Solved by the Invention) An object of the present invention is to provide a light emitting element module with a built-in optical isolator that can significantly eliminate axis misalignment due to solder creep characteristics of a solder fixing part.

〔発明の構成〕[Structure of the invention]

(11題を解決する為の手段) 前項の問題点を解決するため、気脣用窓を備えたキャッ
プ、光学レンズ、光アイソレータ素子を固定するホルダ
、光ファイバを固定するホルダを全て磁性材料により製
作した光アイソレータ素子内蔵発光素子モジュールであ
る。
(Means for solving problem 11) In order to solve the problem in the previous section, the cap with the window, the optical lens, the holder for fixing the optical isolator element, and the holder for fixing the optical fiber are all made of magnetic material. This is the manufactured light-emitting element module with built-in optical isolator element.

(作 用) 光アイソレータ素子の構成部品である磁石の吸引力を用
いるべく、前記したキャップ、ホルダの材料を磁性体と
することにより、各ホルダは、各々吸着され、半田固定
を施しても固定部への静荷重は大幅に低減でき、半田ク
リープ特性による軸ずれを大幅に少なくする事が可能で
ある。
(Function) In order to use the attractive force of the magnet, which is a component of the optical isolator element, by using magnetic materials for the cap and holder, each holder is attracted to each other and remains fixed even when soldered. The static load on the parts can be significantly reduced, and axial misalignment due to solder creep characteristics can be significantly reduced.

(実施例) 本発明の実施例を第1図に示す。尚、第2図の従来例と
同一部分には同−符号付している。気密用窓を備えた磁
性体材料によυ形成したキャップ18と、永久磁石8、
ファラデー回転子9、第2の光学レンズ10、を内蔵、
固定する磁性体材料によυ形成した第1のホルダ19と
、偏光子12、フェルール13を固定する磁性体材料に
よシ形成した第2のホルダ20を備え、半導体レーザ4
からの出射光電力を効率よく光ファイバ15に光結合す
ヘキ第1の光学レンズ5、第1のホルダ19、第2のホ
ルダ20を各々光軸調整したのち半田によシ固定する。
(Example) An example of the present invention is shown in FIG. Note that the same parts as in the conventional example shown in FIG. 2 are given the same reference numerals. a cap 18 formed of a magnetic material with an airtight window; a permanent magnet 8;
Built-in Faraday rotator 9, second optical lens 10,
A first holder 19 made of a magnetic material to fix the polarizer 12 and a second holder 20 made of a magnetic material to fix the polarizer 12 and the ferrule 13.
The first optical lens 5, the first holder 19, and the second holder 20 are fixed with solder after adjusting their optical axes.

このとき、第1のホルダ19内に内蔵した光アイソレー
タ素子の構成部品である永久磁石8の吸引力によって第
1のホルダ19は磁性体材料で形成したキャップ18に
吸着される。
At this time, the first holder 19 is attracted to the cap 18 made of a magnetic material by the attractive force of the permanent magnet 8, which is a component of the optical isolator element built into the first holder 19.

また、第2のホルダ20も同様に磁性体材料で形成した
第1のホルダ19に吸着される。
Further, the second holder 20 is similarly attracted to the first holder 19 made of a magnetic material.

これによって、キャップ18と第1のホルダ19の第1
のホルダ半田固定部16、第1のホルダ19と第2のホ
ルダ20の第2のホルダ半田固定部17への静荷重の大
半を吸着力によって低減でき、半田クリープ特性による
経時的な軸ずれ量を大幅に低減することができ、光ファ
イバ15への光結合効率劣化を抑圧する事が可能である
。磁性体材料については、鉄系の材料例えば、コバール
、鉄又は磁性体のステンレスを使用し、腐食防止、牛田
儒れ性の向上を目的として、メッキ処理例えば、金メッ
キ処理を施すことにより半田固定の確実性向上、耐湿性
の向上を計ることが出来る。
This allows the cap 18 and the first holder 19 to
Most of the static loads on the holder solder fixing part 16 and the second holder solder fixing part 17 of the first holder 19 and the second holder 20 can be reduced by the adsorption force, and the amount of axis misalignment over time due to solder creep characteristics can be reduced. can be significantly reduced, and deterioration in optical coupling efficiency to the optical fiber 15 can be suppressed. Regarding magnetic materials, use iron-based materials such as Kovar, iron, or magnetic stainless steel, and apply a plating treatment, such as gold plating, to prevent solder fixation for the purpose of preventing corrosion and improving elasticity. It is possible to improve reliability and moisture resistance.

また、各々のホルダを吸着させるための永久磁石として
光アイソレータ素子構成部品の永久磁石を使用するため
部品数の増加にはならない。
Furthermore, since the permanent magnets of the optical isolator element components are used as permanent magnets for attracting each holder, the number of parts does not increase.

本発明に関しては、前述の実施例に限定されず、種々変
形が可能である。前述の実施例では、2つの光学レンズ
による光結合系であるが、1つの光学レンズ光結合系に
ついても適用可能である。
The present invention is not limited to the above-described embodiments, and various modifications are possible. In the above-mentioned embodiment, the optical coupling system includes two optical lenses, but it is also applicable to a single optical lens optical coupling system.

また、光アイソレータの構成についても、ファラデー回
転子の前(半導体レーザ側)に検光子を備えても何等支
障はない。また、キャップ、ホルダの形状、大きさ及び
磁性体材料についても限定されない。
Furthermore, regarding the configuration of the optical isolator, there is no problem in providing an analyzer in front of the Faraday rotator (on the semiconductor laser side). Furthermore, the shape, size, and magnetic material of the cap and holder are not limited.

要するに本発明は、その要旨を免税しない範囲で種々変
形して実施することができる。
In short, the present invention can be implemented with various modifications without departing from the gist thereof.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、以上説明したように、キャップ、ホル
ダを磁性体材料で形成するのみで、元アイソレータ素子
の構成部品である永久磁石の吸引力を利用して、キャッ
プとホルダ、ホルダとホルダを吸着させ半田固定するこ
とによシ、半田クリープ特性による固定部の軸ずれを大
幅窓低減することが可能であるとともに、構成部品の増
加も次く、経時的に安定な光アイルレータ素子内蔵発光
素子モジュールを提供できる。
According to the present invention, as explained above, by simply forming the cap and holder with a magnetic material, the cap and holder, and the holder and holder By adsorbing and fixing with solder, it is possible to significantly reduce the axis misalignment of the fixed part due to solder creep characteristics, and the number of component parts increases. It can provide element modules.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のアイソレータ素子内蔵発光素子モジ−
−ルの実施例の構成図、第2図は従来のアイソレータ素
子内蔵発光素子モジ−−ルの構成図、第3図は半田クレ
ープ特性を示す図である。 3・・・・・・・・・光検出器 4・・・・・・・・・半導体レーザ 5・・・・・・・・・第1の光学レンズ8゛°°”°°
°°永久磁石 9・・・・・・・・・ファラデー回転子1o・・・・・
・・・・第2の光学レンズ19°°°゛°゛°°°磁性
体材料の第1のホルダ12°・°“°“°°°偏光子 13°゛゛°°゛°°フエ′−′ 16、17  °゛°°゛°°°°半田固定部18・・
・・・・・・・キャップ 15°°°°°°°°゛光フアイバ
Figure 1 shows a light emitting device module with a built-in isolator element according to the present invention.
2 is a block diagram of a conventional light emitting element module with a built-in isolator element, and FIG. 3 is a diagram showing solder crepe characteristics. 3...Photodetector 4...Semiconductor laser 5...First optical lens 8゛°°"°°
°°Permanent magnet 9...Faraday rotator 1o...
...Second optical lens 19°°°゛°゛°°°First holder made of magnetic material 12°・°"°"°°°Polarizer 13°゛゛°°゛°°F'- ' 16, 17 °゛°°゛°°°° Solder fixing part 18...
・・・・・・Cap 15°°°°°°°°゛Optical fiber

Claims (4)

【特許請求の範囲】[Claims] (1)発光素子と、前記発光素子が気密用窓を備えたキ
ャップ内に実装され、前記発光素子からの出射光を光フ
ァイバに光結合するための少なくとも1つの光学レンズ
と光アイソレータ素子を、前記発光素子と前記光ファイ
バの間に備えた発光素子モジュールにおいて、前記気密
用窓を備えたキャップ、前記光学レンズ、光アイソレー
タ素子を固定する第1のホルダ部材、前記光ファイバを
固定する第2のホルダ部材を、全て磁性体材料で形成し
たことを特徴とする発光素子モジュール。
(1) a light emitting element; the light emitting element is mounted in a cap provided with an airtight window; and at least one optical lens and an optical isolator element for optically coupling emitted light from the light emitting element to an optical fiber; In the light emitting element module provided between the light emitting element and the optical fiber, the cap provided with the airtight window, the optical lens, a first holder member for fixing the optical isolator element, and a second holder member for fixing the optical fiber. A light emitting element module characterized in that the holder member is entirely made of a magnetic material.
(2)キャップ、第1のホルダ部材、第2のホルダ部材
同士を半田付け固定したことを特徴とする請求項1記載
の発光素子モジュール。
(2) The light emitting element module according to claim 1, wherein the cap, the first holder member, and the second holder member are fixed to each other by soldering.
(3)キャップ、第1のホルダ部材、第2のホルダ部材
に少なくとも一層の金メッキを施こしたことを特徴とす
る請求項1記載の発光素子モジュール。
(3) The light emitting element module according to claim 1, wherein the cap, the first holder member, and the second holder member are plated with at least one layer of gold.
(4)キャップ、第1のホルダ部材、第2のホルダ部材
に施こした金メッキ層の下層に少なくとも一層のバッフ
ァ層を施こしたことを特徴とする請求項1記載の発光素
子モジュール。
(4) The light emitting element module according to claim 1, characterized in that at least one buffer layer is applied below the gold plating layer applied to the cap, the first holder member, and the second holder member.
JP7443788A 1988-03-30 1988-03-30 Light emitting element module Pending JPH01248112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7443788A JPH01248112A (en) 1988-03-30 1988-03-30 Light emitting element module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7443788A JPH01248112A (en) 1988-03-30 1988-03-30 Light emitting element module

Publications (1)

Publication Number Publication Date
JPH01248112A true JPH01248112A (en) 1989-10-03

Family

ID=13547200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7443788A Pending JPH01248112A (en) 1988-03-30 1988-03-30 Light emitting element module

Country Status (1)

Country Link
JP (1) JPH01248112A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132619A (en) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd Semiconductor laser device and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132619A (en) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd Semiconductor laser device and its manufacture

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