JPH01242955A - Production of exhaust gas sensor - Google Patents
Production of exhaust gas sensorInfo
- Publication number
- JPH01242955A JPH01242955A JP7121188A JP7121188A JPH01242955A JP H01242955 A JPH01242955 A JP H01242955A JP 7121188 A JP7121188 A JP 7121188A JP 7121188 A JP7121188 A JP 7121188A JP H01242955 A JPH01242955 A JP H01242955A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- sensor body
- thermal
- sensor
- exhaust gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 11
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 239000000446 fuel Substances 0.000 claims abstract description 5
- 230000003746 surface roughness Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 22
- 238000007751 thermal spraying Methods 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000007921 spray Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 12
- 238000009499 grossing Methods 0.000 description 6
- 229910002929 BaSnO3 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 235000006693 Cassia laevigata Nutrition 0.000 description 1
- 229910002254 LaCoO3 Inorganic materials 0.000 description 1
- -1 MgAl2O4 Chemical class 0.000 description 1
- 229910026161 MgAl2O4 Inorganic materials 0.000 description 1
- 241000735631 Senna pendula Species 0.000 description 1
- 229910010252 TiO3 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229940124513 senna glycoside Drugs 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の利用分野］
この発明は、溶射膜によりセンサ本体を耐熱絶縁性基板
に固定するようにした、排ガスセンサの製造方法に関す
る。この発明の排ガスセンサは、例えば自動車エンジン
の空燃比の制御に用いる。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for manufacturing an exhaust gas sensor in which a sensor body is fixed to a heat-resistant insulating substrate using a sprayed film. The exhaust gas sensor of the present invention is used, for example, to control the air-fuel ratio of an automobile engine.
［従来技術］
発明者らは、耐熱絶縁性基板にＢａ５ｎＯａやＴｉＯ２
等を用いたセンサ本体を配置し、センサ本体の一部と周
囲の基板とに溶射を施して、センサ本体を固定するよう
にした、排ガスセンサの製造方法を提案した（特願昭６
１−２３０，２９２号）。[Prior art] The inventors used Ba5nOa and TiO2 on a heat-resistant insulating substrate.
proposed a manufacturing method for an exhaust gas sensor in which the sensor body is fixed by arranging the sensor body using materials such as the like, and then spraying a part of the sensor body and the surrounding substrate to fix the sensor body.
1-230, 292).
センサ本体に部分的に溶射を施すには、適当なマスクを
用いる。発明者らはここで、金属製のマスクを用いた。A suitable mask is used to partially spray the sensor body. Here, the inventors used a metal mask.
しかし金属マスクを用いると、次の問題が生じた。However, when using a metal mask, the following problem arose.
（１） 溶射時の熱により、マスクが変形する。(1) The mask is deformed by the heat during thermal spraying.
（２）マスクに溶射粒子が付着し、２〜３回使用する毎
に、溶射膜をマスクからはがさねばならなくなる。(2) Sprayed particles adhere to the mask, and the sprayed film must be peeled off from the mask every 2 to 3 uses.
（３）マスクに付着した溶射膜と、センサ本体や基板に
設けた溶射膜とが、つながってしまうことが有る。溶射
膜がつながってしまうと、マスクを外す際に、溶射膜が
破損する。(3) The sprayed film attached to the mask and the sprayed film provided on the sensor body or substrate may become connected. If the sprayed film is connected, it will be damaged when the mask is removed.
［発明の課題］
この発明の課題は、（１）マスクの熱変形の防止、（２
）マスクへの溶射粒子の付着の抑制、に有る。[Problems to be solved by the invention] The problems to be solved by this invention are (1) prevention of thermal deformation of a mask;
) Suppression of adhesion of thermal spray particles to the mask.
［発明の構成と作用］
この発明は、空燃比により抵抗値が変化する金属酸化物
半導体を用いたセンサ本体を耐熱絶縁性基板に配置し、
センサ本体に、マスクを用いてセンサ本体の表面の一部
を被覆しながら、溶射を施すようにした、排ガスセンサ
の製造方法において、前記マスクをセラミック製とした
ことを特徴とする。[Structure and operation of the invention] The present invention includes a sensor body using a metal oxide semiconductor whose resistance value changes depending on the air-fuel ratio, arranged on a heat-resistant insulating substrate,
A method for manufacturing an exhaust gas sensor, in which thermal spraying is applied to a sensor body while covering a part of the surface of the sensor body using a mask, characterized in that the mask is made of ceramic.
ここで、空燃比により抵抗値が変化する金属酸化物半導
体としては、例えばＢａＳｎＯ３、Ｔ ｉ Ｏｔ、Ｓｒ
ＴｉＯ３、ＬａＣｏＯ３等が有る。またこれらを用いた
センサ本体としては、例えば金属酸化物半導体をプレス
成型し焼結したもの、あるいは金属酸化物半導体を印刷
等により膜状に成型した乙の等が有る。Here, examples of metal oxide semiconductors whose resistance value changes depending on the air-fuel ratio include BaSnO3, TiOt, Sr
There are TiO3, LaCoO3, etc. Sensor bodies using these materials include, for example, those made by press-molding and sintering a metal oxide semiconductor, or those made by forming a metal oxide semiconductor into a film shape by printing or the like.
耐熱絶縁性基板としては、例えばアルミナ等の基板を用
いる。センサ本体を基板に配置するには、例えばプレス
成型後に焼結したセンサ本体を、基板のくぼみ部に収容
すれば良い。あるいは基板上に金属酸化物半導体の膜を
印刷する、等でも良い。As the heat-resistant insulating substrate, for example, a substrate made of alumina or the like is used. In order to arrange the sensor body on the substrate, for example, the sensor body, which has been press-molded and sintered, may be housed in a recessed portion of the substrate. Alternatively, a metal oxide semiconductor film may be printed on the substrate.
そしてセラミックマスクにより、センサ本体の一部を被
覆した状態で溶射を施す。マスクの材質はセラミックで
あれば良い。セラミックは熱変形を起こさず、また金属
に比べ溶射粒子が付着し難い。従って、セラミックのマ
スクを用いると、マスクの熱変形を防止し、かつマスク
への溶射粒子の付着を抑制することができる。マスクの
熱変形や溶射粒子の付着を抑制すると、マスクと、セン
サ本体や基板とで溶射膜がつながるのを防止できる。Thermal spraying is then performed with a portion of the sensor body covered using a ceramic mask. The material of the mask should be ceramic. Ceramic does not undergo thermal deformation, and thermal spray particles are less likely to adhere to it than metal. Therefore, when a ceramic mask is used, thermal deformation of the mask can be prevented and adhesion of thermal spray particles to the mask can be suppressed. By suppressing thermal deformation of the mask and adhesion of sprayed particles, it is possible to prevent the sprayed film from connecting between the mask and the sensor body or substrate.
マスクの材質には、好ましくはＡｌＮ５Ｓ １３Ｎ＋、
ＢＮ％ＴｉＮ等の窒化物、あるいは５ｉＣＳＷＣ。The material of the mask is preferably AlN5S 13N+,
Nitride such as BN%TiN or 5iCSWC.
ＴＩＣ等の炭化物を用いる。溶射材料として好ましいも
のはＭｇＡｌ２Ｏ４、Ｔ ｉ Ｏｔ、Ａｔ、Ｏ，等の金
属酸化物であるため、マスクには金属酸化物とのなじみ
が悪く、熱膨張率が異なるものが好ましいからである。Carbide such as TIC is used. This is because metal oxides such as MgAl2O4, TiOt, At, O, etc. are preferable as the thermal spraying material, and the mask is preferably one that is poorly compatible with metal oxides and has a different coefficient of thermal expansion.
溶射材料とのなじみが悪く、熱膨張率が異なれば、マス
クへの溶射粒子の付着を抑制することができる。例えば
、
マスクの表面、特にセンサ本体側から見たマスクの背面
には、平滑処理を施すのが好ましい。なおマスクの全面
に平滑処理を施すのは困難な場合が有り、平滑処理はセ
ンサ本体側から見たマスクの背面に施せば足りる。平滑
処理を施すのは、溶射粒子の付着を抑制するためである
。実験によると、マスクの表面粗さを４μｍ以下とすれ
ば、溶射粒子の付着を充分に防止できることが判った。If the material is not compatible with the thermal spray material and has a different coefficient of thermal expansion, it is possible to suppress the adhesion of the thermal spray particles to the mask. For example, it is preferable to smooth the surface of the mask, especially the back surface of the mask when viewed from the sensor body side. Note that it may be difficult to perform smoothing on the entire surface of the mask, and it is sufficient to perform smoothing on the back surface of the mask as viewed from the sensor body side. The purpose of performing the smoothing treatment is to suppress adhesion of thermal spray particles. Experiments have shown that if the surface roughness of the mask is 4 μm or less, adhesion of thermal spray particles can be sufficiently prevented.
以下、特定の条件に付いて、実施例を説明する。Examples will be described below with regard to specific conditions.
［実施例］
スズ酸の水溶液にＢａＣＬを滴下し、３ ａ Ｓ ｎ
ＯＪ・３Ｈ，Ｏの結晶を沈でんさせた。この沈でんを熱
分解し、Ｂａ５ｎＯ：＋とじた。ＢａＳｎＯ３の粉末を
プレス成型し、一対の電極線を埋設したセンサ本体とし
た。センサ本体を空気中で焼結した。[Example] BaCL was dropped into an aqueous solution of stannic acid, and 3 a S n
Crystals of OJ.3H,O were precipitated. This precipitate was thermally decomposed and bound to Ba5nO:+. BaSnO3 powder was press-molded to form a sensor body in which a pair of electrode wires were embedded. The sensor body was sintered in air.
このセンサ本体を用いて、第１図の排ガスセンサを製造
した。図において、２はセンサ本体、４はその電極線の
一方で、他にもう１本の電極線が埋設しである。６はア
ルミナを用いた耐熱絶縁性基板、８は基板６に設けたく
ぼみ部で、この部分にセンサ本体２を収容する。ｌＯは
電極線４等を引き出すための溝で、一対の電極線に応じ
、一対設ける。１２は、電極線４に接続したＰｔの印刷
電極である。基板６には、これ以外に図示しないヒータ
等を設ける。Using this sensor body, the exhaust gas sensor shown in FIG. 1 was manufactured. In the figure, 2 is the sensor body, 4 is one of its electrode wires, and another electrode wire is buried. 6 is a heat-resistant insulating substrate made of alumina, and 8 is a recess provided in the substrate 6, in which the sensor main body 2 is accommodated. IO is a groove for drawing out the electrode wire 4, etc., and a pair of grooves are provided corresponding to a pair of electrode wires. 12 is a Pt printed electrode connected to the electrode wire 4. The substrate 6 is also provided with a heater (not shown) and the like.
センサ本体２をくぼみ部８に収容し、電極線４を印刷電
極１２に溶接した後、セラミックの溶射マスク１４を用
いて、溶射膜１６を形成した。溶射の方向は基板６に垂
直な方向（図の矢印）としたが、斜めから溶射しても良
い。After the sensor main body 2 was accommodated in the recess 8 and the electrode wire 4 was welded to the printed electrode 12, a thermal spray film 16 was formed using a ceramic thermal spray mask 14. Although the direction of thermal spraying was perpendicular to the substrate 6 (arrow in the figure), thermal spraying may be performed obliquely.
溶射材料には平均粒径３０μｍのＭｇＡ Ｉｔｏ ４を
用い、Ａｒ雰囲気で６５ＯＡの溶射電流により、膜厚２
００μｍ程度の溶射膜１６とした。溶射材料には、これ
以外にＴ ｉ ＯｔやＡｌｔ０３等の金属酸化物が好ま
しい。また溶射膜１６は実施例では緻密質としたが、多
孔質でも良い。溶射膜１６により、センサ本体２を基板
６に保持することかできる。また電極線４等や、印刷電
極１２等を雰囲気から遮断し、保護することができる。MgA Ito 4 with an average particle size of 30 μm was used as the spray material, and a film thickness of 2
The sprayed film 16 was about 00 μm thick. In addition to these, metal oxides such as T i Ot and Alt03 are also preferable as the thermal spraying material. Further, although the sprayed film 16 is dense in the embodiment, it may be porous. The sprayed film 16 allows the sensor body 2 to be held on the substrate 6. Further, the electrode wire 4, etc., the printed electrode 12, etc. can be shielded from the atmosphere and protected.
実施例に用いた溶射マスクＩ４を、第２図に示す。マス
ク１４の材質には、ＭｇＡｌｔＯａ等の金属酸化物と熱
膨張率が異なり、また化学的ななじみが悪いものとして
、ＡＩＮを用いた。熱膨張率が異なりなじみか悪いと、
マスク１４には溶射粒子が付着しない、あるいは付着し
ても容易に剥離する。なおマスク１４の材質には、これ
以外に５１３Ｎ４やＢＮ、’Ｉ’ｉＮ、あるいはＳｉＣ
やＷＣ，ＴｉＣも好ましい。各種セラミックの線膨張率
は、ＡＩ。The thermal spray mask I4 used in the example is shown in FIG. As the material for the mask 14, AIN was used because it has a different thermal expansion coefficient from metal oxides such as MgAltOa and is chemically incompatible. If the coefficient of thermal expansion is different and the compatibility is poor,
Thermal spray particles do not adhere to the mask 14, or even if they do, they are easily peeled off. In addition, the material of the mask 14 may include 513N4, BN, 'I'iN, or SiC.
, WC, and TiC are also preferable. The coefficient of linear expansion of various ceramics is AI.
０３やＭｇＡｌｔＯ４でｌ０ＸＩＯ−’℃−１程度、Ｔ
ｉ Ｏｔで９ｘｌＯ−’℃−Ｉ捏度である。一方ＡＩ
Ｎでは６ ｘ ｌ Ｏ−”Ｃ−’、Ｓ ｉＣヤＴ ｉＣ
テ４ Ｘ Ｉ Ｏ−１′℃−１程度である。03 and MgAltO4 about 10XIO-'℃-1, T
iOt is 9xlO-'°C-I degree. On the other hand, AI
In N, 6 x l O-"C-', S iC ya T iC
It is about TE4XIO-1'°C-1.
マスク！４の形状が不適切であると、あるいはマスク１
４に金属マスクを用いると、第４図のようにマスク１４
の側面で溶射膜１６が連続的につながることがある。こ
れを防止する手段の１つとして、センサ本体２と接触す
る部分の面積を、マスク１４の背面（溶射の流れに接し
た而）の面積よりら小さくすることが有る。このために
は、例えば第２図のようにマスク１４の側面に切り落と
し部２２を設ける、あるいは第３図のマスク３４のよう
に側面にテーパ一部３２を設けることが好ましい。この
ようにすれば、切り落とし部２２やテーパ一部３２で生
じた陰のため、マスク１４等の側面とセンサ側とで、溶
射膜１６が連続してつながることを防止できる。実施例
では、Ｗ面２×２ｍｍ、厚さ０ 、６ ＋＋ｕ＋＋のセ
ンサ本体２に対して、背面の幅がＩ 、 ８ ｍｍ、セ
ンサ本体２と接触した部分の幅り月、 ６ ｍｍ、厚さ
が０ 、６ ｍｍの長手の板状のマスク１４を用いた。mask! If the shape of mask 4 is inappropriate, or mask 1
If a metal mask is used for the mask 14 as shown in FIG.
The sprayed film 16 may be continuously connected on the side surface. One way to prevent this is to make the area of the part that comes into contact with the sensor body 2 smaller than the area of the back surface of the mask 14 (which is in contact with the thermal spray flow). For this purpose, it is preferable to provide a cut-off portion 22 on the side surface of the mask 14 as shown in FIG. 2, or to provide a tapered portion 32 on the side surface as in the mask 34 shown in FIG. 3, for example. In this way, it is possible to prevent the sprayed film 16 from being continuously connected to the side surface of the mask 14 etc. and the sensor side due to the shadow created by the cut-off portion 22 or the tapered portion 32. In the example, the width of the back surface is I, 8 mm, and the width of the part in contact with the sensor body 2 is 6 mm, and the thickness is 6 mm. A long plate-shaped mask 14 with a diameter of 0.6 mm was used.
また切り落とし部２２は厚さ方向の中心に設け、切り落
としの幅はＯ、ｌ ｍｍとした。Further, the cut-off portion 22 was provided at the center in the thickness direction, and the width of the cut-off portion was 0.1 mm.
次に、用いたＡＩＮマスクの背面と側面（図の太実線の
部分）を、＃ｌ０００番のダイアモンド研摩剤で平滑化
し、表面粗さ（表面粗さ計で測定）を元の６〜ＩＯμｍ
から２〜３μｍまで平滑化した。Next, the back and side surfaces (thick solid line parts in the figure) of the AIN mask used were smoothed with #1000 diamond abrasive, and the surface roughness (measured with a surface roughness meter) was reduced to the original 6 to IO μm.
It was smoothed from 2 to 3 μm.
好ましい平滑化の条件は表面粗さで４μｎ以下で、平滑
化を進めると溶射粒子がマスク１４に付着し難くなる。A preferable smoothing condition is a surface roughness of 4 μm or less, and as the smoothing progresses, thermal spray particles become less likely to adhere to the mask 14.
試験例
第２図のマスク１４を用い、各種の条件で溶射を行った
。マスク１４には、背面１ 、８ ｍｍ幅、センサ本体
２との接触面１．６＋ｎｏ＋幅のものを用いた。Test Example Thermal spraying was carried out under various conditions using the mask 14 shown in FIG. The mask 14 used had a back surface 1.8 mm wide and a contact surface with the sensor body 2 1.6+no+ width.
金属製（ＳＵＳ３０４）のマスクを比較例としく比較例
り、表面粗さ２〜３μｍまで研摩したＡＩＮのマスクを
実施例１とし、未研摩のＡＩＮを用いたマスクを実施例
２（表面粗さ６〜１０μｍ）とした。溶射の条件は、前
記の通りである。A metal (SUS304) mask was used as a comparative example, a mask made of AIN polished to a surface roughness of 2 to 3 μm was used as Example 1, and a mask using unpolished AIN was used as Example 2 (surface roughness 6 to 10 μm). The thermal spraying conditions are as described above.
比較例ＩのマスクではＩＯ回程度使用ずろとマスク１４
は熱変形し、熱変形の毎にマスクをたたき直して形状を
整えねばならなかった。また２〜３回使用する毎に、マ
スク１４に溶射膜が厚く付着した。溶射膜を除くには、
マスクＩ４をたわまさねばならなかった。熱変形したマ
スクや溶射粒子が厚く付着したマスクを用いると、溶射
膜１６が基板６やセンサ本体２からマスク１４の側面に
つながったものが生じた。このようなセンサでは、マス
クの取り外し時に溶射膜１６の破損が生じた。The mask of Comparative Example I was used about IO times and the mask was 14
was deformed by heat, and each time the mask was deformed by heat, the mask had to be beaten again to adjust its shape. Moreover, the sprayed film thickly adhered to the mask 14 every time it was used two to three times. To remove the sprayed film,
Mask I4 had to be bent. When a thermally deformed mask or a mask to which sprayed particles were thickly adhered was used, the sprayed film 16 was connected to the side surface of the mask 14 from the substrate 6 or the sensor body 2. In such a sensor, the sprayed film 16 was damaged when the mask was removed.
実施例１のマスクでは熱変形は生じず、マスク１４には
溶射膜１６は部分的にしか付着しなかった。付着した溶
射膜らピンセットではさむと、容易に剥離した。また基
板６やセンサ本体２と、マスク１４の側面との、溶射膜
１６の連続付着の現象は生じなかった。No thermal deformation occurred in the mask of Example 1, and the sprayed film 16 was only partially attached to the mask 14. When the attached thermal sprayed film was pinched with tweezers, it was easily peeled off. Further, the phenomenon of continuous adhesion of the sprayed film 16 to the substrate 6, the sensor body 2, and the side surface of the mask 14 did not occur.
実施例２のマスクでも熱変形は生じなかった。No thermal deformation occurred in the mask of Example 2 either.
しかし溶射膜１６は、マスク１４の全面に付着した。付
着した溶射膜は、ピンセットで容易に除去できた。付着
した溶射膜を除去しないままマスクを繰り返し使用する
と、基板６やセンサ本体２と、マスク１４の側面との、
溶射１１ｉ１６の連続付着の現象が生じた。However, the sprayed film 16 adhered to the entire surface of the mask 14. The attached thermal spray film could be easily removed with tweezers. If the mask is used repeatedly without removing the attached thermal spray film, the substrate 6, the sensor body 2, and the side surface of the mask 14 may be damaged.
A phenomenon of continuous deposition of thermal spray 11i16 occurred.
実施例１のマスク１４に付いて、センサ本体２に対する
マスク部の割合の効果を測定した。溶射膜１６によりセ
ンサ本体２を覆う部分の面積を、１０％、３０％、５０
％の３種とした。これらのセンサを各１０ｐｌ、３０Ｇ
−２３０Ｈｚの条件で５時間の振動テストにかけた。い
ずれの被覆面積でら、センサ本体２の脱落等の現象は生
じなかった。次に、センナを８００℃でλ（当■比）が
０９８と１．０２の雰囲気に交互にさらし、この間の応
答速度を測定した。応答速度は、Ｉ Ｏ−９０％応答の
時間により求めた。応答速度への被覆面積の影響を、表
１に示す。これらの結果から明らかなように、溶射膜１
６による被覆面積は、センサ本体２の５〜４０％が好ま
しい。Regarding the mask 14 of Example 1, the effect of the ratio of the mask portion to the sensor body 2 was measured. The area of the part that covers the sensor body 2 with the sprayed film 16 is 10%, 30%, and 50%.
There were three types of %. Each of these sensors is 10pl, 30G
A vibration test was conducted for 5 hours at -230Hz. No phenomena such as falling off of the sensor body 2 occurred in any of the covered areas. Next, the senna was exposed alternately to atmospheres with λ (equal ratio) of 098 and 1.02 at 800° C., and the response speed during this period was measured. The response speed was determined by the time for IO-90% response. Table 1 shows the influence of the covered area on the response speed. As is clear from these results, thermal sprayed film 1
The area covered by the sensor body 6 is preferably 5 to 40% of the sensor body 2.
表１
＋０ ０．＋ ０．１５
３０ ０．２ ０．２５
５０ ０．４ ０．６
［発明の効果］
この発明では、セラミックマスクを用いることにより、
マスクの熱変形を防止し、かつマスクへの溶射粒子の付
着を抑制ずろ。そしてこれに伴って、マスクと、センサ
本体や基板との間で、溶射膜が連続してつながることを
防止する。Table 1 +0 0. + 0.15 30 0.2 0.25 50 0.4 0.6 [Effect of the invention] In this invention, by using a ceramic mask,
Prevents thermal deformation of the mask and suppresses adhesion of thermal spray particles to the mask. Along with this, the sprayed film is prevented from being continuously connected between the mask and the sensor body or substrate.
セラミックマスクの材質に窒化物や炭化物を用いると、
溶射粒子とのなじみが悪く、熱膨張率が異なるため、溶
射粒子のマスクへの付着を更に抑制することができる。If nitride or carbide is used as the material for the ceramic mask,
Since it is poorly compatible with the thermal spray particles and has a different coefficient of thermal expansion, it is possible to further suppress the adhesion of the thermal spray particles to the mask.
マスクの表面を平滑化すると、溶射粒子の付着を更に抑
制できる。Smoothing the surface of the mask can further suppress the adhesion of thermal spray particles.
第１図は実施例の排ガスセンサの製造過程を現す断面図
、第２図は実施例で用いたマスクの断面図である。第３
図は変形例で用いたマスクの断面図である。第４図は、
従来例での溶射粒子の付着状況を示す断面図である。
図において、
２ センサ本体、 ４ 電極線、
６ 耐熱絶縁性基板、 ８ くぼみ部、１４．３４
マスク、 ＋６ 溶射膜、２２ 切り落とし部、
３２ テーパ一部。FIG. 1 is a sectional view showing the manufacturing process of the exhaust gas sensor of the example, and FIG. 2 is a sectional view of the mask used in the example. Third
The figure is a sectional view of a mask used in a modified example. Figure 4 shows
FIG. 3 is a cross-sectional view showing the adhesion of thermal spray particles in a conventional example. In the figure: 2 sensor body, 4 electrode wire, 6 heat-resistant insulating substrate, 8 recess, 14.34
Mask, +6 sprayed film, 22 cut-off part,
32 Taper part.
Claims (3)
を用いたセンサ本体を耐熱絶縁性基板に配置し、 センサ本体に、マスクを用いてセンサ本体の表面の一部
を被覆しながら、溶射を施すようにした、排ガスセンサ
の製造方法において、 前記マスクをセラミック製としたことを特徴とする、排
ガスセンサの製造方法。(1) The sensor body, which uses a metal oxide semiconductor whose resistance value changes depending on the air-fuel ratio, is placed on a heat-resistant insulating substrate, and the sensor body is sprayed while a part of the surface of the sensor body is covered using a mask. A method for manufacturing an exhaust gas sensor, characterized in that the mask is made of ceramic.
クのマスクとしたことを特徴とする、請求項１に記載の
排ガスセンサの製造方法。(2) The method for manufacturing an exhaust gas sensor according to claim 1, wherein the mask is a ceramic mask made of carbide rather than nitride.
さを４μｍ以下としたことを特徴とする、請求項１また
は２に記載の排ガスセンサの製造方法。(3) The method for manufacturing an exhaust gas sensor according to claim 1 or 2, characterized in that the surface roughness of the back surface of the mask as viewed from the sensor main body side is 4 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7121188A JPH01242955A (en) | 1988-03-24 | 1988-03-24 | Production of exhaust gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7121188A JPH01242955A (en) | 1988-03-24 | 1988-03-24 | Production of exhaust gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01242955A true JPH01242955A (en) | 1989-09-27 |
Family
ID=13454120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7121188A Pending JPH01242955A (en) | 1988-03-24 | 1988-03-24 | Production of exhaust gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01242955A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008056652A1 (en) * | 2008-11-10 | 2010-05-12 | Mtu Aero Engines Gmbh | Mask for kinetic cold gas compacting |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49752A (en) * | 1972-04-18 | 1974-01-07 | ||
| JPS5518922A (en) * | 1978-07-26 | 1980-02-09 | Fuji Electric Co Ltd | Oxygen sensor |
-
1988
- 1988-03-24 JP JP7121188A patent/JPH01242955A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49752A (en) * | 1972-04-18 | 1974-01-07 | ||
| JPS5518922A (en) * | 1978-07-26 | 1980-02-09 | Fuji Electric Co Ltd | Oxygen sensor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008056652A1 (en) * | 2008-11-10 | 2010-05-12 | Mtu Aero Engines Gmbh | Mask for kinetic cold gas compacting |
| US8852681B2 (en) | 2008-11-10 | 2014-10-07 | Mtu Aero Engines Gmbh | Mask for kinetic cold gas compacting |
| EP2344281B1 (en) * | 2008-11-10 | 2015-03-11 | MTU Aero Engines GmbH | Mask for kinetic cold gas compacting |
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