JPH01242634A - Production of epoxy resin laminate - Google Patents
Production of epoxy resin laminateInfo
- Publication number
- JPH01242634A JPH01242634A JP7080188A JP7080188A JPH01242634A JP H01242634 A JPH01242634 A JP H01242634A JP 7080188 A JP7080188 A JP 7080188A JP 7080188 A JP7080188 A JP 7080188A JP H01242634 A JPH01242634 A JP H01242634A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- glass cloth
- laminate
- epoxy resin
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000004744 fabric Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- 125000005462 imide group Chemical group 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 150000003949 imides Chemical class 0.000 abstract 4
- 238000010030 laminating Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 17
- 229920001721 polyimide Polymers 0.000 description 10
- 239000009719 polyimide resin Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000009413 insulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は耐電食性に優れたガラス布基材エポキシ樹脂積
層板に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a glass cloth-based epoxy resin laminate having excellent electrolytic corrosion resistance.
（従来技術）
プリント配線板の高密度化が進むにつれ、ガラスイＵ′
１基材エポキシ樹脂積層板を用いて製造したプリント配
線板では、「電食」による絶縁破壊が問題となっている
。(Prior art) As the density of printed wiring boards progresses, glass
In printed wiring boards manufactured using single-base epoxy resin laminates, dielectric breakdown due to "electrolytic corrosion" has become a problem.
ここで「電食」とは、ガラスＩｎを基材に使用したプリ
ント配線板が組込まれた電気、電子機器が実際に使用さ
れるに際し、外部よりかかる電圧により、基板中の導電
性物質（主にメツキ時に浸みんだ銅イオン、メッキ銅よ
り溶出した銅イオン）が、基板中を陽極から陰極に移行
し析出することにより、電極間の絶縁距離が次第に短く
なり、ついには回路が短絡するという現象である。Here, "electrolytic corrosion" refers to electrical and electronic equipment that incorporates printed wiring boards that use glass In as a base material. The copper ions that soaked into the plate during plating and the copper ions that eluted from the plated copper move through the board from the anode to the cathode and precipitate, which gradually shortens the insulation distance between the electrodes and eventually shorts the circuit. It is a phenomenon.
一般にはＣＡＦ （ｃｏｎｄｕｃｔｉｖｅ ａｎｏｄｉ
ｃ ｆｉｌａｍａｅｎｔ）と呼ばれているこの現象は、
ガラス布と樹脂の界面で起こり、樹脂としてイミド基含
有熱硬化性樹脂を使用する場合、エポキシ樹脂使用の場
合に比べて、上記ＣＡＦが発生しにくいことが知られて
いる。Generally, CAF (conductive anodi
This phenomenon, called c filamaent), is
It is known that CAF occurs at the interface between glass cloth and resin, and is less likely to occur when an imide group-containing thermosetting resin is used as the resin, compared to when an epoxy resin is used.
ここで、上記イミド基含有熱硬化性樹脂としては、ビス
マレイミド系ポリイミド樹脂、ナジック酸末端ポリイミ
ド樹脂、アセブレン末端ポリイミド樹脂、仝芳香族ポリ
イミド樹脂、エポキシ変性ポリイミド樹脂がおる。従っ
て、高信頼性を要求する分野、例えば大型コンピュータ
等に使用されるプリント配線板用基板には、これらイミ
ド基含有樹脂特にビスマレイミド系ポリイミド樹脂等が
多く使用されるようになってきている。Here, the imide group-containing thermosetting resins include bismaleimide polyimide resins, nadic acid-terminated polyimide resins, acebrene-terminated polyimide resins, aromatic polyimide resins, and epoxy-modified polyimide resins. Therefore, these imide group-containing resins, particularly bismaleimide polyimide resins, etc., are increasingly being used in fields that require high reliability, such as printed wiring board substrates used in large-scale computers and the like.
（発明が解決しようとする課題）
しかし上記ビスマレイミド系ポリイミド樹脂等イミド基
含有樹脂は、非常に高価であり、これらの樹脂のみで製
造した積層板は、市販されている一般の難燃性ガラス布
基材エポキシ樹脂積層板（ＮＥＭＡグレードＦＲ−４）
の２〜４倍の価格である。(Problem to be Solved by the Invention) However, imide group-containing resins such as the bismaleimide polyimide resins mentioned above are very expensive, and laminates made only with these resins cannot be manufactured using commercially available general flame-retardant glass. Cloth-based epoxy resin laminate (NEMA grade FR-4)
It is 2 to 4 times the price.
本発明は上記問題点に鑑み、ＣＡＦ防止効果があり、し
かも一般のガラス布基材エポキシ樹脂積層板と同一条件
で成形でき、かつ低コストで成形できるガラス布基材積
層板を提供することを目的とする。In view of the above problems, the present invention aims to provide a glass cloth base laminate that has a CAF prevention effect, can be molded under the same conditions as general glass cloth base epoxy resin laminates, and can be molded at low cost. purpose.
（課題を解決するための手段）
本発明は、ガラスイ５に予めイミド基を有する熱硬化性
樹脂をガラス布１００重量部に対し０．０５〜３０重量
部塗布し、次いでエポキシ樹脂を含浸して加熱乾燥して
得られたプリプレグを所定枚数重ねて加熱加圧すること
を特徴とするガラス布基材エポキシ樹脂積層板の製造法
に関する。(Means for Solving the Problems) The present invention includes applying 0.05 to 30 parts by weight of a thermosetting resin having an imide group to 100 parts by weight of glass cloth on the glass cloth 5, and then impregnating it with an epoxy resin. The present invention relates to a method for manufacturing a glass cloth-based epoxy resin laminate, which is characterized by stacking a predetermined number of prepregs obtained by heating and drying and heating and pressing them.
本発明になるガラス布基材エポキシ樹脂積層板を得るに
は、まずビスマレイミド系ポリイミド樹脂等のＣＡＦの
抑制効果が大きい樹脂をガラス布に対して、０．０５〜
３０重量％、望ましくは３〜１５重量％塗布含浸させ、
加熱により半硬化もしくは硬化状態でガラス布のフィラ
メントを覆う。In order to obtain the glass cloth-based epoxy resin laminate of the present invention, first, a resin having a large CAF suppressing effect, such as bismaleimide polyimide resin, is added to the glass cloth in an amount of 0.05 to
Coating and impregnating 30% by weight, preferably 3 to 15% by weight,
Covers the glass cloth filament in a semi-hardened or hardened state by heating.
この場合、処理ムラが発生しないよう、ガラス布の厚み
、織密度により最適な樹脂濃度、乾燥条件を選定する必
要がある。In this case, it is necessary to select the optimum resin concentration and drying conditions depending on the thickness and weave density of the glass cloth to prevent uneven processing.
次に、エポキシ樹脂を所定量塗布し、加熱により半硬化
状態にしたプリプレグを作成し、これを所定枚数重ね合
わせ、加熱加圧により成形し積層板を製造するものであ
る。Next, a predetermined amount of epoxy resin is applied and heated to create a semi-cured prepreg, and a predetermined number of prepregs are stacked together and molded by heating and pressing to produce a laminate.
ここで本発明では上記各プリプレグには重量比で３０〜
８０重屯％の樹脂分が含有されるのが好ましい。Here, in the present invention, each of the above prepregs has a weight ratio of 30 to 30.
Preferably, the resin content is 80% by weight.
（実施例） 次に本発明を実施例および比較例により説明する。(Example) Next, the present invention will be explained with reference to Examples and Comparative Examples.
実施例１
まずイミド基含有熱硬化性樹脂としてはケルイミド６０
１（日本ポリイミド社製）を使用した。Example 1 First, Kelimide 60 was used as an imide group-containing thermosetting resin.
1 (manufactured by Nippon Polyimide Co., Ltd.) was used.
またガラス布には、ＭＩＬ記＠７６２８、アミノシラン
処理品を用い、上記樹脂をこのガラス布に対して１０重
量％塗布し乾燥した。次に以下に示す配合比で得たエポ
キシワニスをガラス布に対して３０重量％塗布乾燥しプ
リプレグを作成した。Further, a MIL @7628, aminosilane-treated glass cloth was used, and 10% by weight of the above resin was applied to the glass cloth and dried. Next, a prepreg was prepared by applying 30% by weight of epoxy varnish prepared in the proportion shown below to a glass cloth and drying it.
このプリプレグを８枚重ね合わせ、加熱加圧により、厚
み１．５ｍｍのプリント配線板用積層板を作成した。Eight sheets of this prepreg were stacked together and heated and pressed to create a laminate for a printed wiring board with a thickness of 1.5 mm.
配合比
ＰＥＲ５１１・・・１００重量部
［）ｉｃｙ ・・・４重量部
ＢＤＭＡ ・・・０．２重量部
（固形分７０％、溶媒はＭＥＫ、メチルグリコールを使
用）
次に上記の如くして作成したプリント配線板用積層板に
、穴明は加工を行なった後、銅メツキを施し、回路加工
を行ない、日本電信電話（株）武蔵野電気通信研究所指
定のＤＥＸ−２１信頼性検討用２段幅プリント配線板を
作成した。Blending ratio PER511...100 parts by weight [)icy...4 parts by weight BDMA...0.2 parts by weight (solid content 70%, MEK and methyl glycol used as solvents) Next, create as above After processing the printed wiring board laminate, we applied copper plating and circuit processing to the 2-stage DEX-21 reliability test designated by Nippon Telegraph and Telephone Corporation Musashino Telecommunications Research Institute. A width printed wiring board was created.
比較例１
上記実施例１で使用したケルイミド６０１を同じく上記
実施例１で使用したガラス布に対し４０重量％の割合い
で塗布、加熱し、プリプレグを作成した。次にこのプリ
プレグを８枚重ね合わせ、加熱、加圧により厚み’１．
５ｍｍのプリント配線板用積層板を作成した。作成した
プリント配線板用積層板に上記実施例１で示した方法と
同一方法を施しＤＥＸ−２１信頼性検討用２段幅プリン
ト配線板を作成した。Comparative Example 1 Kelimide 601 used in the above Example 1 was applied to the glass cloth also used in the above Example 1 at a ratio of 40% by weight and heated to create a prepreg. Next, 8 sheets of this prepreg are stacked, heated and pressurized to a thickness of '1.
A 5 mm printed wiring board laminate was created. The produced printed wiring board laminate was subjected to the same method as shown in Example 1 above to produce a two-stage printed wiring board for DEX-21 reliability evaluation.
比較例２
上記実施例１で使用したエポキシワニスと同一ワニスを
ガラス布（ＭＩ Ｌ記号７６２８、■ポキシシラン処理
品（日東紡製））に対して４０重二％塗布、加熱し、プ
リプレグを作成した。このプリプレグを８枚重ね合わせ
、加熱、加圧により厚み１．５ｍｍのプリント配線板用
積層板を作成し、上記実施例１で示した方法と同一方法
でＤＥＸ−２１信頼性検討用２段幅プリント配線板を作
成した。Comparative Example 2 The same epoxy varnish used in Example 1 above was applied at 40% to a glass cloth (MI L symbol 7628, poxysilane treated product (manufactured by Nittobo)) and heated to create a prepreg. . A laminate for a printed wiring board with a thickness of 1.5 mm was made by stacking 8 sheets of this prepreg, heating and pressurizing it, and using the same method as shown in Example 1 above, a two-stage width for DEX-21 reliability evaluation was made. Created a printed wiring board.
ここで実施例１．比較例１および比較例２で作成したＤ
ＥＸ−２１信頼性検討用２段幅プリン１〜配線板を、８
５℃、９５％ＲＨ下で、連続的に、印加電圧９０Ｖで印
加し、電食試験を行なった。Here, Example 1. D created in Comparative Example 1 and Comparative Example 2
EX-21 2-stage width printer 1 to wiring board for reliability study, 8
An electrolytic corrosion test was conducted by continuously applying an applied voltage of 90 V at 5° C. and 95% RH.
ＣＡＦの発生度合は、プリント配線板の絶縁抵抗の低下
度合で評価した。上記試験結果を第１図に示すが１は実
施例１．２は比較例１．３は比較例２の各電食試験にお
ける絶縁抵抗の低下曲線を示している。The degree of occurrence of CAF was evaluated by the degree of decrease in insulation resistance of the printed wiring board. The above test results are shown in FIG. 1, in which 1 shows the reduction curve of insulation resistance in each electrolytic corrosion test of Example 1.2 and Comparative Example 1.3 and Comparative Example 2.
第１図からも明らかな如く、実施例１で作成したプリン
ト配線板の絶縁性は比較例１で作成したプリント配線板
に近く、比較例２で作成したプリント配線板に対しては
はるかに良好な結果を示している。As is clear from Figure 1, the insulation properties of the printed wiring board made in Example 1 are close to those of the printed wiring board made in Comparative Example 1, and are much better than the printed wiring board made in Comparative Example 2. This shows the results.
次に次表に、実施例１．比較例１および比較例２で使用
した積層板の価格比を示す。価格比は、比較例２で使用
した積層板を１として比較したものであるが、実施例１
で使用した樹脂は比較例１で使用した樹脂に比べ大幅に
安価であることがわかる。Next, the following table shows Example 1. The price ratio of the laminates used in Comparative Example 1 and Comparative Example 2 is shown. The price ratio is based on the laminate used in Comparative Example 2 as 1, but compared with Example 1.
It can be seen that the resin used in Comparative Example 1 is significantly cheaper than the resin used in Comparative Example 1.
このように、本発明では、ＣＡＦが樹脂とガラスイｌｉ
との界面で発生することに鑑み、高価ではあるがＣＡＦ
の抑制効果が極めて大きいビスマレイミド系ポリイミド
樹脂等のイミド基を有する熱硬化性樹脂を予めガラス布
に塗布し、ざらにエポキシ樹脂との組み合せにより積層
板を構成したので、安価でしかもＣＡＦ抑制効果のある
積層板を得ることができた。In this way, in the present invention, CAF is made of resin and glass
Although it is expensive, considering that CAF occurs at the interface with
A thermosetting resin with an imide group such as bismaleimide polyimide resin, which has an extremely large suppressing effect on CAF, is applied to a glass cloth in advance, and the laminated board is constructed by combining it with an epoxy resin, which is inexpensive and effective in suppressing CAF. We were able to obtain a laminate with a certain
（発明の効果）
本発明になるガラス布基材エポキシ樹脂積層板は、上記
の如く、ガラス布に予めイミド基含有熱硬化性樹脂を塗
イ「含浸させることにより積層板を構成したので、上記
第１図からも明らかな如く、従来のイミド基含有樹脂の
みで積層板を構成した場合に比して、ＣＡＦ防止効果に
ほとんど差がなく、低コストで成形できる等の効果を有
する。(Effects of the Invention) As described above, the glass cloth-based epoxy resin laminate of the present invention was constructed by pre-coating and impregnating glass cloth with an imide group-containing thermosetting resin. As is clear from FIG. 1, there is almost no difference in CAF prevention effect compared to the case where a laminate is constructed only from conventional imide group-containing resins, and there are effects such as low cost molding.
第１図は実施例１および比較例１．２の各電食試験の試
験結果図である。
１・・・実施例１の電食試験における絶縁抵抗の低下曲
線
２・・・比較例１の電食試験における絶縁抵抗の低下曲
線
３・・・比較例２の電食試験における絶縁抵抗の低下曲
線
代理人 弁理士 廣 瀬 章ハ
“ゝ１
Ｏ：Ｘ７ｉ＠例
第１図
−Ｕ二 続 ネ市 １已 害（方式）昭和 ６
鉾 ７月 ４ 日
特許庁区官 殿 １．￥７”
ｌ、 事件の表示
昭和６３年特許願第 ７０８０１号
２、 発明の名称
エポキシ樹脂積層板の製造法
３６ 補正をする者
事件との関係 特許出願人
住所 東京都新宿区西新宿二丁目１番１号名称（４
４５）日立化成工業株式会社
代表者 横 山 亮 次
４、 代理人
■１６３
居所 東京都新宿区西新宿二丁目１番１号日立化成
工業株式会社内
電話 東京 ３４６−３１１１ （大代表）氏名（８５
３０）弁理士 廣 瀬 章５、 補正命令の日付
昭和６３年 ６月２８日（発送Ｅ１１
［エポキシ樹脂積層板の製造法」と訂正する。FIG. 1 is a diagram showing the test results of each electrolytic corrosion test of Example 1 and Comparative Examples 1.2. 1... Insulation resistance reduction curve in the electrolytic corrosion test of Example 1 2... Insulation resistance reduction curve in the electrolytic corrosion test of Comparative Example 1 3... Insulation resistance reduction in the electrolytic corrosion test of Comparative Example 2 Curve agent Patent attorney Akira Hirose “ゝ1 O:
Hoko July 4th Patent Office District Officer 1. ¥7”
l. Indication of the case Patent Application No. 70801 No. 70801 of 1988 2 Title of the invention Method for manufacturing epoxy resin laminates 36 Person making the amendment Relationship to the case Patent applicant address 1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo Name (4
45) Hitachi Chemical Co., Ltd. Representative Ryoji Yokoyama 4, Agent 163 Address 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo Hitachi Chemical Co., Ltd. Telephone: Tokyo 346-3111 (Main representative) Name (85)
30) Patent Attorney Hirose Akira 5. Date of amendment order: June 28, 1985 (Shipping E11 [Method for manufacturing epoxy resin laminates]).
Claims (1)
ラス布１００重量部に対し０．０５〜３０重量部塗布し
、次いでエポキシ樹脂を含浸して加熱乾燥して得られた
プリプレグを所定枚数重ねて加熱加圧することを特徴と
するガラス布基材エポキシ樹脂積層板の製造法。1. Apply 0.05 to 30 parts by weight of a thermosetting resin having an imide group to glass cloth per 100 parts by weight of glass cloth, then impregnate with epoxy resin and dry by heating to obtain a predetermined number of prepregs. A method for producing a glass cloth-based epoxy resin laminate, which is characterized by stacking and heating and pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7080188A JPH01242634A (en) | 1988-03-24 | 1988-03-24 | Production of epoxy resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7080188A JPH01242634A (en) | 1988-03-24 | 1988-03-24 | Production of epoxy resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01242634A true JPH01242634A (en) | 1989-09-27 |
Family
ID=13442014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7080188A Pending JPH01242634A (en) | 1988-03-24 | 1988-03-24 | Production of epoxy resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01242634A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5232689A (en) * | 1990-12-21 | 1993-08-03 | Dow Corning Corporation | Translucent antiperspirant compositions |
| JP2011026607A (en) * | 2010-09-08 | 2011-02-10 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg, laminated sheet, and printed wiring board |
| JP2014226824A (en) * | 2013-05-21 | 2014-12-08 | 宇部興産株式会社 | Fiber-reinforced polyimide composite material, and method of producing the same |
-
1988
- 1988-03-24 JP JP7080188A patent/JPH01242634A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5232689A (en) * | 1990-12-21 | 1993-08-03 | Dow Corning Corporation | Translucent antiperspirant compositions |
| JP2011026607A (en) * | 2010-09-08 | 2011-02-10 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg, laminated sheet, and printed wiring board |
| JP2014226824A (en) * | 2013-05-21 | 2014-12-08 | 宇部興産株式会社 | Fiber-reinforced polyimide composite material, and method of producing the same |
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