JPH01241813A - Solid electrolytic capacitor having open mechanism - Google Patents
Solid electrolytic capacitor having open mechanismInfo
- Publication number
- JPH01241813A JPH01241813A JP7054688A JP7054688A JPH01241813A JP H01241813 A JPH01241813 A JP H01241813A JP 7054688 A JP7054688 A JP 7054688A JP 7054688 A JP7054688 A JP 7054688A JP H01241813 A JPH01241813 A JP H01241813A
- Authority
- JP
- Japan
- Prior art keywords
- fuse wire
- conductive metal
- metal spring
- lead terminal
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 239000007787 solid Substances 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 abstract description 8
- 239000010955 niobium Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052758 niobium Inorganic materials 0.000 abstract description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052715 tantalum Inorganic materials 0.000 abstract description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 3
- 238000001721 transfer moulding Methods 0.000 abstract description 3
- 238000004382 potting Methods 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000007664 blowing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はオープン機構付き固体電解コンデンサに関し、
特にオープン機構部の構造lこ関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor with an open mechanism,
This particularly concerns the structure of the opening mechanism.
従来、タンタル(Ta ) 、ニオブ(Nb)、アルミ
ニウム等の弁作用を有する金属を用いた固体電解コンデ
ンサは、種々の電子回路lこ使用されており、故障率が
小さいことが利点とされているが、−旦故障が発生した
場合の故障モードは短絡故障が多く、大きな短絡電流が
流れるため、コンデンサ素子が発熱し、遂には焼損に至
ることがある。Conventionally, solid electrolytic capacitors made of metals with valve action, such as tantalum (Ta), niobium (Nb), and aluminum, have been used in various electronic circuits, and their advantage is that they have a low failure rate. However, when a failure occurs, the failure mode is often a short-circuit failure, and a large short-circuit current flows, causing the capacitor element to generate heat, which may eventually lead to burnout.
このような過度の短絡電流による故障発生の際は、他の
回路構成素子を保護するため、故障モードを短絡から開
放にする必要がある。この対策として一般にはヒユーズ
が用いられており、従来の技術としては実開昭59−1
19029等がある。When a failure occurs due to such an excessive short-circuit current, it is necessary to change the failure mode from a short-circuit to an open circuit in order to protect other circuit components. Fuses are generally used as a countermeasure against this problem, and the conventional technology is
There are 19029 etc.
実開昭59−119029によるオープン機構付き固体
電解コンデンサは、第5図に示すように、陰極リード端
子5とコンデンサ素子1を絶縁性接着剤11で接続し、
その後、ヒューズ線7を陰極リード端子5とコンデンサ
素子1間に接続し、最後に樹脂外装した構造となってい
た。A solid electrolytic capacitor with an open mechanism according to Utility Model Application Publication No. 59-119029 has a structure in which a cathode lead terminal 5 and a capacitor element 1 are connected with an insulating adhesive 11, as shown in FIG.
Thereafter, the fuse wire 7 was connected between the cathode lead terminal 5 and the capacitor element 1, and finally the structure was covered with resin.
上述した従来のオープン機構付き固体電解コンデンサは
、コンデンサが故障し、短絡電流が流れた場合、ヒユー
ズ線7が発熱し、特にその一部分が赤熱、溶解し溶断す
る構造であるが、ヒユーズ線7を外装樹脂10で覆って
いるため、溶解したヒユーズ線7がそのまま残り電気的
接続が保たれたままとなり、オープンとならず、焼損と
なる場合があった。The conventional solid electrolytic capacitor with an open mechanism described above has a structure in which when the capacitor fails and a short circuit current flows, the fuse wire 7 generates heat, and a part of it in particular becomes red hot and melts and blows out. Since the fuse wire 7 is covered with the exterior resin 10, the melted fuse wire 7 remains as it is, and the electrical connection is maintained, so that the fuse wire 7 is not opened and may burn out.
また、ヒユーズ線7が外装樹脂10で覆われているため
、発熱したヒユーズ線7の熱が外装樹脂10に放熱され
、ヒユーズ線7の温度上昇が妨げられ、ヒユーズ線7が
溶断しなこくくなり、溶断特性が悪くなるという欠点を
有していた。In addition, since the fuse wire 7 is covered with the exterior resin 10, the heat generated by the fuse wire 7 is radiated to the exterior resin 10, preventing the temperature rise of the fuse wire 7 and preventing the fuse wire 7 from blowing out. Therefore, it had the disadvantage of poor fusing characteristics.
本発明の目的は、従来Zヒューズの溶断特性がバラつい
たり、溶断せず焼損となっていた不具合を防止し、安定
したヒユーズ溶断特性を有するオープン機構付き固体電
解コンデンサを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a solid electrolytic capacitor with an open mechanism that has stable fuse blowing characteristics and prevents the problems of conventional Z fuses, such as variations in blowing characteristics or burnout without blowing.
〔課題を解決するための手段〕
本発明のオープン機構付き固体電解コンデンサは、コン
デンサ素子に陽極リード端子およびヒユーズ線を介して
陰極リード端子を接続してなるヒューメ伺き固体゛電解
コンデンサlこおいて、前記ヒユーズ腓と直列に導電性
金属バネを接続し、前記ヒユーズ線と導電性金属バネを
中空の樹脂ケースに収納してオープン機構を構成し、該
オープン機構をコンデンサ素子と陰極リード端子間ζこ
接続したことを%徴として構成される。[Means for Solving the Problem] The solid electrolytic capacitor with an open mechanism of the present invention is a solid electrolytic capacitor with an open mechanism, which is a fume-like solid electrolytic capacitor formed by connecting a cathode lead terminal to a capacitor element via an anode lead terminal and a fuse wire. A conductive metal spring is connected in series with the fuse leg, the fuse wire and the conductive metal spring are housed in a hollow resin case to form an open mechanism, and the open mechanism is connected between the capacitor element and the cathode lead terminal. It is constructed as a percentage sign that ζ is connected.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明のオープン機構付固体電解コンデンサの
一実施例の内部構造を示す斜視図である。FIG. 1 is a perspective view showing the internal structure of an embodiment of a solid electrolytic capacitor with an open mechanism according to the present invention.
第2図、第3図はオープン機構部の構造を示す縦断面図
である。FIGS. 2 and 3 are longitudinal sectional views showing the structure of the opening mechanism section.
まず、第1図に示すように、タンタル、ニオブ。First, as shown in Figure 1, tantalum and niobium.
アルミニウム等のコンデンサ素子1から植立状に取抄出
された陽極リード2を陽極リード端子4に溶接にて接続
する。次lこ、第2図に示すヒユーズ線7と直列に導電
性金属バネ8を溶接にて接続し、ヒユーズ線7と導電性
金属バネ8の他端が取り出された、内部空間を有するエ
ポキシ等の絶縁性樹脂ケース9を準備する。このヒュー
ズ線7の一方の端をコンデンサ素子1の陰電極である陰
極層3にはんだ6により接続する。また導電性金属バネ
8の一方の端を陰極リード端子5に溶接により接続する
。しかるのち、トランスファーモールド、樹脂ボッティ
ング等により陽極リード端子4及び陰極リード端子5の
一部を残し樹脂外装を行なう。An anode lead 2 taken out in a raised shape from a capacitor element 1 made of aluminum or the like is connected to an anode lead terminal 4 by welding. Next, a conductive metal spring 8 is connected in series with the fuse wire 7 shown in FIG. 2 by welding, and the other ends of the fuse wire 7 and the conductive metal spring 8 are taken out. An insulating resin case 9 is prepared. One end of this fuse wire 7 is connected to the cathode layer 3, which is the negative electrode of the capacitor element 1, by solder 6. Further, one end of the conductive metal spring 8 is connected to the cathode lead terminal 5 by welding. Thereafter, resin packaging is performed by transfer molding, resin botting, etc., leaving a portion of the anode lead terminal 4 and cathode lead terminal 5.
最後に、陽極リード端子4及び陰極リード端子5をコの
字形に成形して製品とする。Finally, the anode lead terminal 4 and the cathode lead terminal 5 are formed into a U-shape to form a product.
ここで、樹脂ケース9は内部に入れる導電性金属バネ8
が収縮膨張できる大きさとし、ヒユーズ線7と導電性金
属バネ8の一方の端が取り出せる穴を有し、かつ外装樹
脂10が樹脂ケース内部に入らない程度、つまりヒュー
ズ線7及び導電性金属バネ8がようやく動く程度の穴と
することが望ましい。Here, the resin case 9 has a conductive metal spring 8 inserted therein.
The fuse wire 7 and the conductive metal spring 8 have a size that allows the fuse wire 7 and the conductive metal spring 8 to be expanded and contracted, and have a hole through which the fuse wire 7 and one end of the conductive metal spring 8 can be taken out, and the exterior resin 10 does not enter inside the resin case, that is, the fuse wire 7 and the conductive metal spring 8 It is desirable to make the hole just large enough that it can barely move.
第2図は導電性金属バネ8を螺旋状のものを使用した場
合を示し、第3図はく形をした導電性金属バネ8を使用
した場合を示す。この導電性金属リード端子に溶接する
。FIG. 2 shows a case where a helical conductive metal spring 8 is used, and FIG. 3 shows a case where a box-shaped conductive metal spring 8 is used. Weld to this conductive metal lead terminal.
第4図(a)は本発明の自立型オープン機構付固体電解
コンデンサの第2の実施例の内部構造を示す断面図であ
る。FIG. 4(a) is a sectional view showing the internal structure of a second embodiment of the self-supporting solid electrolytic capacitor with an open mechanism according to the present invention.
第2の実施例の場合、コンデンサ素子1より植立された
陽極リード2に陽極リード端子4を溶接により接続する
。次に、ヒューズ線7の樹脂ケース9より出ている部分
をはんだ6によりコンデンサ素子の上面に接続する。さ
らに導電性金属バネ8の樹脂ケース9より出ている部分
を陰極リード端子5に溶接により接続する。しかるのち
、トランスファモールド、樹脂ポツティング等により陽
極リード端子4及び陰極リード端子5の一部を残し樹脂
外装を行なう。In the case of the second embodiment, an anode lead terminal 4 is connected to an anode lead 2 erected from a capacitor element 1 by welding. Next, the portion of the fuse wire 7 protruding from the resin case 9 is connected to the upper surface of the capacitor element with the solder 6. Furthermore, the portion of the conductive metal spring 8 protruding from the resin case 9 is connected to the cathode lead terminal 5 by welding. Thereafter, the anode lead terminal 4 and the cathode lead terminal 5 are partially covered with resin by transfer molding, resin potting, etc.
第4図(b)は本発明の第3の実施例の断面図であり、
ヒユーズ線7及び導電性金属バネ8の入った樹脂ケース
9をコンデンサ素子1の側面に取付けた場合を示す。FIG. 4(b) is a sectional view of a third embodiment of the present invention,
A case is shown in which a resin case 9 containing a fuse wire 7 and a conductive metal spring 8 is attached to the side surface of the capacitor element 1.
6一
〔発明の効果〕
以上説明したように本発明は、オープン機構付き固体電
解コンデンサにおいて、ヒューズ線ト直列ζこ導電性金
属バネを接続することにより、コンデンサ素子が故障し
、コンデンサ素子に短絡電流が流れた場合、ヒューズ線
が発熱し、ヒューズ線の一部分が溶融し、溶断する時、
直列に接続された導電性全綱バネがヒユーズ線を引張り
ヒユーズ線の溶断部分の間隔を広げ、再融着を防止し確
実にオープンlこするという効果がある。61 [Effects of the Invention] As explained above, the present invention provides a solid electrolytic capacitor with an open mechanism in which a conductive metal spring is connected in series with a fuse wire, thereby preventing a short circuit in the capacitor element due to failure of the capacitor element. When current flows, the fuse wire generates heat and a part of the fuse wire melts, causing it to blow out.
The series-connected conductive full-wire springs pull the fuse wire, widening the gap between the fused portions of the fuse wire, preventing re-fusion, and ensuring a secure opening.
これにより、従来のヒユーズを内蔵した固体電解コンデ
ンサに発生していたヒユーズが溶断しなかったり、ヒュ
ーズ溶断特性がバラつくといった不具合を防止できると
いう効果がある。This has the effect of preventing problems that occur in conventional solid electrolytic capacitors with built-in fuses, such as the fuse not blowing or the fuse blowing characteristics varying.
第1図は本発明の第1の実施例のオープン機構付き固体
電解コンデンサの内部構造を示す斜視図、第2図、第3
図はオープン機構部分の構造を示す縦断面図、第4図(
a)、第4図(b)は本発明の第2および第3の実施例
の内部構造を示す縦断面図、第5図は従来のオープン機
構付き固体電解コンデンサの縦断面図である。
1・・・・・・コンデンサ素子、2・・・・・・陽極リ
ード、3・・・・・・陰極層、4・・・・・・陽極リー
ド端子、5−・・・陰極リード端子、6・・・・・・は
んだ、7・・・・・・ヒユーズ線、8・・・・・・導電
性金属バネ、9・・・・・・樹脂ケース、10・・・・
・・外装樹脂、11・・・・・・絶縁性接着剤。
代理人 弁理士 内 原 晋FIG. 1 is a perspective view showing the internal structure of a solid electrolytic capacitor with an open mechanism according to the first embodiment of the present invention, FIG.
The figure is a vertical sectional view showing the structure of the opening mechanism part, and Figure 4 (
a) and FIG. 4(b) are vertical cross-sectional views showing the internal structures of second and third embodiments of the present invention, and FIG. 5 is a vertical cross-sectional view of a conventional solid electrolytic capacitor with an open mechanism. 1... Capacitor element, 2... Anode lead, 3... Cathode layer, 4... Anode lead terminal, 5-... Cathode lead terminal, 6... Solder, 7... Fuse wire, 8... Conductive metal spring, 9... Resin case, 10...
...Exterior resin, 11...Insulating adhesive. Agent Patent Attorney Susumu Uchihara
Claims (1)
して陰極リード端子を接続してなるオープン機構付き固
体電解コンデンサにおいて、前記ヒューズ線と直列に導
電性金属バネを接続し、前記ヒューズ線と導電性金属バ
ネを中空の樹脂ケースに収納してオープン機構を構成し
、該オープン機構をコンデンサ素子と陰極リード端子間
に接続したことを特徴とするオープン機構付き固体電解
コンデンサ。In a solid electrolytic capacitor with an open mechanism in which a cathode lead terminal is connected to a capacitor element via an anode lead terminal and a fuse wire, a conductive metal spring is connected in series with the fuse wire, and the fuse wire and the conductive metal spring are connected to each other in series with the fuse wire. What is claimed is: 1. A solid electrolytic capacitor with an open mechanism, characterized in that the open mechanism is constructed by housing the capacitor in a hollow resin case, and the open mechanism is connected between a capacitor element and a cathode lead terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7054688A JPH01241813A (en) | 1988-03-23 | 1988-03-23 | Solid electrolytic capacitor having open mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7054688A JPH01241813A (en) | 1988-03-23 | 1988-03-23 | Solid electrolytic capacitor having open mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01241813A true JPH01241813A (en) | 1989-09-26 |
Family
ID=13434624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7054688A Pending JPH01241813A (en) | 1988-03-23 | 1988-03-23 | Solid electrolytic capacitor having open mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01241813A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5432672A (en) * | 1992-10-15 | 1995-07-11 | Rohm Co., Ltd. | Solid electrolytic capacitor |
US6420043B1 (en) | 1996-11-07 | 2002-07-16 | Cabot Corporation | Niobium powders and niobium electrolytic capacitors |
US6616728B2 (en) | 1998-05-04 | 2003-09-09 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
-
1988
- 1988-03-23 JP JP7054688A patent/JPH01241813A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5432672A (en) * | 1992-10-15 | 1995-07-11 | Rohm Co., Ltd. | Solid electrolytic capacitor |
US6420043B1 (en) | 1996-11-07 | 2002-07-16 | Cabot Corporation | Niobium powders and niobium electrolytic capacitors |
US6616728B2 (en) | 1998-05-04 | 2003-09-09 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
US6896715B2 (en) | 1998-05-04 | 2005-05-24 | Cabot Corporation | Nitrided niobium powders and niobium electrolytic capacitors |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3820143B2 (en) | Surface mount type small fuse | |
US4943842A (en) | Semiconductor device with fuse function | |
JPH04299816A (en) | Solid electrolytic capacitor with open mechanism | |
JPH02105513A (en) | Chip-shaped solid electrolytic capacitor with fuse | |
JPH01241813A (en) | Solid electrolytic capacitor having open mechanism | |
JP2738168B2 (en) | Chip type solid electrolytic capacitor with fuse | |
JP2020072090A (en) | Fuse resistor assembly and manufacturing method for fuse resistor assembly | |
JPH02184016A (en) | Solid electrolytic capacitor equipped with open mechanism | |
KR20010008916A (en) | Micro-fuse and manufacturing method thereof | |
JPH0519292B2 (en) | ||
JPH0351967Y2 (en) | ||
JPH0533002Y2 (en) | ||
JPH0445232Y2 (en) | ||
JPH0436107Y2 (en) | ||
KR200197255Y1 (en) | Tantal condensor of a fuge type | |
JPH0723954Y2 (en) | Chip type solid electrolytic capacitor | |
JP2553887B2 (en) | Electronic parts with fuse | |
JP2006310573A (en) | Tantalum capacitor with fuse | |
JP3067379B2 (en) | Manufacturing method of solid electrolytic capacitor with fuse | |
JPH0440855B2 (en) | ||
JPH0356037Y2 (en) | ||
JPH0438514Y2 (en) | ||
JPH0436105Y2 (en) | ||
JP2842067B2 (en) | Chip solid electrolytic capacitor with fuse | |
JPH0513531B2 (en) |