JPH01241728A - Fuse and manufacture thereof - Google Patents
Fuse and manufacture thereofInfo
- Publication number
- JPH01241728A JPH01241728A JP6735488A JP6735488A JPH01241728A JP H01241728 A JPH01241728 A JP H01241728A JP 6735488 A JP6735488 A JP 6735488A JP 6735488 A JP6735488 A JP 6735488A JP H01241728 A JPH01241728 A JP H01241728A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- fuse
- chip
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 238000002844 melting Methods 0.000 claims abstract description 47
- 230000008018 melting Effects 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 229910000978 Pb alloy Inorganic materials 0.000 abstract description 2
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 2
- 230000032683 aging Effects 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野〉
本発明はヒユーズ及びその製造方法に関し、特にヒユー
ズの両端に端子金具を設置プたカー１−リッジタイプと
して用いられるものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a fuse and a method for manufacturing the same, and particularly to a fuse that is used as a cartridge type in which terminal fittings are installed at both ends of the fuse. be.
（従来の技術）
カートリッジタイプのヒユーズは銅あるいはこれに銅メ
ツキをした比較的高融点の金属からなる可溶金属導体の
中央部に錫等の低融点金属チップを保持させ、許容範囲
を越える過電流が流れた際、低融点金属チップが溶融し
、可溶金属導体へ拡散することにより合金が生じ、そこ
が溶融切断する構造となっている（実開昭５９−６６８
／１４号公報）。(Prior art) A cartridge type fuse has a low melting point metal chip such as tin held in the center of a fusible metal conductor made of copper or copper-plated metal with a relatively high melting point. When current flows, the low melting point metal chip melts and diffuses into the fusible metal conductor, creating an alloy, which is then melted and cut.
/No. 14 Publication).
第６図、第７図は従来のヒユーズを示１図であり、ヒユ
ーズ１は金属導体２と低融点金属である錫チップ３から
成り、金属導体２は中央部に四部２ａを有し、その−四
にはかしめ片２ｂが延設され、金属導体の両端には溶接
片２Ｃとストッパ２ｄが設けられている。この四部２ａ
の上に錫チップ３を乗せ、かしめ片２ｂを折曲げてこれ
らをかしめることによりヒユーズ１を得ることができる
。Figures 6 and 7 are diagrams showing a conventional fuse. The fuse 1 consists of a metal conductor 2 and a tin chip 3, which is a low-melting point metal. The metal conductor 2 has four parts 2a in the center. A caulking piece 2b is extended from -4, and a welding piece 2C and a stopper 2d are provided at both ends of the metal conductor. This fourth part 2a
The fuse 1 can be obtained by placing the tin chip 3 on top of the tin chip 3, bending the caulking piece 2b, and caulking these together.
第７図は端子金具の斜視図であり、端子金具４の基部４
ａの上部には受座４ｂ、切欠４Ｃが設けられ、第６図に
示すヒユーズ１の溶接片２Ｃを端子金具４の受座４ｂに
当接し、ストッパ２ａを切欠４Ｃに嵌合した後、当接を
溶接することにより、カートリッジタイプのヒユーズが
形成される。FIG. 7 is a perspective view of the terminal fitting 4, and shows the base 4 of the terminal fitting 4.
A catch seat 4b and a notch 4C are provided in the upper part of a, and after abutting the welding piece 2C of the fuse 1 shown in FIG. By welding the contacts, a cartridge-type fuse is formed.
なお、図示はしないが、カートリッジタイプのヒユーズ
にはケースが嵌められ絶縁保護が成されている。Although not shown, the cartridge type fuse is fitted with a case to provide insulation protection.
また、上記ヒユーズ導体中央部の凹部の代りに横溝を複
数本設け、かしめた後の接触効率を改良したもの（実開
昭６２−１３４９号公報参照）や端子金具とヒユーズが
一体的に成形されたものも知られている。In addition, a plurality of horizontal grooves are provided instead of the recess in the center of the fuse conductor to improve the contact efficiency after caulking (see Utility Model Application Publication No. 1349/1983), and a structure in which the terminal fitting and the fuse are integrally molded. It is also known that
（発明が解決しようとする課題）
ヒユーズは金属導体である銅に低融点の錫チップがかし
めによって接触しており、過電流が流れたとき、錫チッ
プが溶融し、これが銅に拡散して合金を生成し、一定電
流を越える電流が流れたときには抵抗値が高くなるため
、金属導体自体が溶断づる機構となっている。(Problem to be solved by the invention) In a fuse, a tin tip with a low melting point is in contact with copper, which is a metal conductor, by caulking. When an overcurrent flows, the tin tip melts, which diffuses into the copper and becomes an alloy. When a current exceeding a certain level flows, the resistance value increases, so the metal conductor itself melts and breaks.
とごろが、従来のヒユーズを熱的影響の大きい耐久試験
にかけ、その後の溶断性を測定づると、一定電流で溶［
１ｉするまでの時間が大幅に遅れてしまう。つまり、熱
のかかる雰囲気中で長期にｈメり使用すると過電流に対
する感反が鈍化することが判明した。However, when a conventional fuse was subjected to an endurance test that had a large thermal effect and its fusing properties were measured, it was found that it melted with a constant current.
There will be a significant delay in the time it takes to complete 1i. In other words, it has been found that when used for a long period of time in a hot atmosphere, the reaction to overcurrent becomes less sensitive.
この原因について鋭意検討した結果、低融点金属である
錫チップの表面が酸化Ｊることによる。As a result of intensive investigation into the cause of this problem, it was found that the surface of the tin chip, which is a low melting point metal, is oxidized.
したがって、この種のヒユーズにおいて、か（〕め部の
酸化を防止し、経時的な感度低下防由を図ることが課題
となっている。Therefore, in this type of fuse, it is a challenge to prevent oxidation of the locking portion and prevent a decrease in sensitivity over time.
［発明の構成］
（課題を解決するための手段）
上記課題を解決するため、本発明は次の手段をとるもの
である。[Structure of the Invention] (Means for Solving the Problems) In order to solve the above problems, the present invention takes the following measures.
即ら本発明のヒユーズは可溶金属導体の中央部に錫チッ
プを乗せて成るヒユーズにおいて、上部可溶金Ｒ導体と
低融点金属チップを溶融密着させることを特徴とするも
のであり、また、上記のヒユーズにおいて、可溶金属導
体と低融点金属チップの接触面がＭ肴しているもの、あ
るいは可溶金属導体と低融点金属チップの接触部周縁が
他の低融点金属で溶融密封されているものも好ましい。That is, the fuse of the present invention is a fuse consisting of a tin chip placed on the center part of a fusible metal conductor, and is characterized in that the upper fusible metal R conductor and the low melting point metal tip are melted and brought into close contact with each other. Among the above fuses, the contact surface between the fusible metal conductor and the low melting point metal chip is melted, or the periphery of the contact area between the fusible metal conductor and the low melting point metal chip is melt-sealed with another low melting point metal. It is also preferable to have one.
更にこれらのヒユーズを製造する方法としては可溶金属
導体に過電流を通電するか又は外部加熱により、可溶金
属導体と低融点金属チップの接触面を融着させる方法が
ある。Further, as a method of manufacturing these fuses, there is a method of fusing the contact surfaces of the fusible metal conductor and the low melting point metal chip by passing an excessive current through the fusible metal conductor or by external heating.
本発明において用いる可溶金属導体は比較的融りの高い
金属であり、銅、錫メツキ銅、銅合金、アルミ、アルミ
合金等であるが錫メツキ銅が好ましい。The fusible metal conductor used in the present invention is a metal with a relatively high melting rate, and includes copper, tin-plated copper, copper alloy, aluminum, aluminum alloy, etc., and tin-plated copper is preferable.
低融点金属パウダーは粒径が約１０〜８０μのものが好
ましい。The low melting point metal powder preferably has a particle size of about 10 to 80 microns.
低融点金属としては錫と鉛の合金である、いわゆるはん
だが好ましい。As the low melting point metal, so-called solder, which is an alloy of tin and lead, is preferable.
融着のために流す過電流は低融点金属であるチップの融
点である約２３２℃をわずかに越える程度の電流であり
、短時間通電することが好ましい。The overcurrent applied for fusion is a current that slightly exceeds the melting point of the chip, which is a low melting point metal, about 232° C., and is preferably applied for a short period of time.
外部加熱も同様である。The same applies to external heating.
低融点金属パウダーを低融点金属チップに付着させる方
法は、低融点金属チップを少し加熱してお（と付着しや
（い。付着個所は可溶金属導体との接触部分のみで十分
であるが、全表面に付着していてもよい。The method of attaching low-melting point metal powder to a low-melting point metal chip is to heat the low-melting point metal chip a little. , may be attached to the entire surface.
低融点金属で溶融密封する際には少なくとｂ接触面全部
を密封する必要があり、金体を低融貞金属付けしてもよ
い。When melting and sealing with a low melting point metal, it is necessary to seal at least the entire contact surface b, and the metal body may be attached with a low melting point metal.
本発明にｄ３いて「溶融密着」なる語は、接触面が融着
している場合と、接触面が＠６していなくとも接触面が
溶融密封されている場合の両りを含む意味である。In d3 of the present invention, the term "melted and sealed" includes both cases where the contact surfaces are fused and cases where the contact surfaces are fused and sealed even if the contact surfaces are not @6. .
本発明における低融点金属チップを保持する場所の導体
の形状は特に限定されず、四部、横溝、平面等が選ばれ
る。In the present invention, the shape of the conductor at the location where the low melting point metal chip is held is not particularly limited, and a four-part shape, a horizontal groove, a flat surface, etc. are selected.
（作用）
本発明の可溶金属導体と低融点金属チップの接触部は接
触面が融盲されているかあるいはその接触面が溶融密封
されているので、外気に曝されることがなく、低融点金
属チップの酸化防止作用をする。(Function) The contact area between the fusible metal conductor and the low-melting point metal chip of the present invention has a melt-blind contact surface or a melt-sealed contact surface, so it is not exposed to the outside air and has a low melting point. Prevents oxidation of metal chips.
（実施例） 以下、図面を参照して本発明の詳細な説明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.
実ｍ例１ 第１図〜第３図は本発明の第１実施例を示している。Actual example 1 1 to 3 show a first embodiment of the present invention.
第１図は本発明の端子金具１０を一体的に成形したヒユ
ーズで図に承りように銅に錫メツキを施した可溶金属導
体２どその中央部に両側に延設されるかしめ片２ｂを有
するヒユーズ１の中央部に低融点金属である錫チップ３
を乗せ、かしめ片２ｂを屈曲させてこれらをかしめた。FIG. 1 shows a fuse integrally formed with the terminal fitting 10 of the present invention, and as shown in the figure, a fusible metal conductor 2 made of tin-plated copper has a caulking piece 2b extending from both sides in the center. A tin chip 3, which is a low melting point metal, is placed in the center of the fuse 1.
, and the caulking pieces 2b were bent to caulk them.
第２図はかしめた状態を示す要部断面図であり、低融点
金属である錫デツプ３はかしめ力によりやや変形し、可
溶金属導体２もわずかに窪んでいる。FIG. 2 is a sectional view of the main part showing the caulked state, and the tin dip 3, which is a low melting point metal, is slightly deformed by the caulking force, and the fusible metal conductor 2 is also slightly depressed.
次にこのヒユーズ１の両端に電源をつなぎ可溶金属導体
２に過電流を短時間通電した。Next, a power source was connected to both ends of the fuse 1, and an overcurrent was applied to the fusible metal conductor 2 for a short time.
通電後の要部前面を第３図に示す。錫チップ３は一部溶
融し、可溶金属導体２との接触面は融着している。Figure 3 shows the front of the main part after energization. The tin chip 3 is partially melted, and the contact surface with the fusible metal conductor 2 is fused.
また、過電流を通電する代りにかしめ部をヒーターで加
熱した場合も同様の状態となった。A similar situation occurred when the caulked portion was heated with a heater instead of applying an overcurrent.
実施例２
実施例１と同型のヒユーズを用い、錫チップ３として、
錫チップの表面に平均粒径５０μの錫パウダーを付着さ
せたものを用い、実施例１と同様の操作を行った。Example 2 Using the same type of fuse as in Example 1, as the tin chip 3,
The same operation as in Example 1 was performed using a tin chip with tin powder adhering to the surface having an average particle size of 50 μm.
第４図は錫パウダー付着錫チップ３ａのかしめる前の状
況を示した断面図である。５は接触面にＩＩ ｔｌした
錫パウダーである。FIG. 4 is a sectional view showing the tin powder-coated tin chip 3a before caulking. 5 is tin powder applied to the contact surface.
次いで、これらを実施例１と同様にかしめ、史に通電、
あるいはヒーター加熱を行った。Next, these were caulked in the same manner as in Example 1, and energized.
Alternatively, heating was performed with a heater.
通電および加熱後の接触面の状況は実施例１の第３図と
同じであった。ただ、本実施例の場合、通電時間および
加熱時間を、より短くしても融着接触面を得ることがで
きた。The condition of the contact surface after energization and heating was the same as in FIG. 3 of Example 1. However, in the case of this example, a fused contact surface could be obtained even if the current application time and heating time were shorter.
実施例３
実施例１と同型のヒユーズを用い、錫チップをかしめ片
でかしめた後、かしめ部の両側を、他のはんだで溶融接
続した。はんだの融点は１８０℃であり、錫チップ（融
点的２３２℃）は溶融しないが、３者は完全に接続され
た。Example 3 Using the same type of fuse as in Example 1, a tin chip was caulked with a caulking piece, and then both sides of the caulked portion were fused and connected with another solder. The melting point of the solder was 180°C, and although the tin chip (melting point: 232°C) did not melt, the three were perfectly connected.
第５図は、はんだで溶融密封した状況を示プ要部断面図
である。FIG. 5 is a cross-sectional view of the main part showing the state of melting and sealing with solder.
第５図において、６ははんだであり、かしめ部の両サイ
ドをはんだ付けすることにより、実質上、錫ブップ３と
可溶金属導体２とが溶融接続している。In FIG. 5, 6 is solder, and by soldering both sides of the caulked portion, the tin bump 3 and the fusible metal conductor 2 are substantially fused and connected.
又実施例１〜３で１９られたヒユーズを耐久試゛験にか
けた後、溶断性能テストを行った。また、比較のために
、かしめによるものも加えた。その結果、本発明のヒユ
ーズは従来品に比べ５侶以上の耐久性を示した。Further, the fuses prepared in Examples 1 to 3 were subjected to a durability test, and then a fusing performance test was conducted. Also, for comparison, a caulking test was also added. As a result, the fuse of the present invention showed durability of 5 fuses or more compared to conventional products.
ただ、実施例１〜３の中では実施例２が最も優れ′Ｃお
り、実施例１．３はそれより劣った。However, among Examples 1 to 3, Example 2 was the best, and Examples 1 and 3 were inferior.
［発明の効宋］
本発明のヒユーズは低融点金属チップと可溶金属導体の
接触面が融着あるいは間接溶融接続により、接続してい
るため、低融点金属接触面の酸化が起こらず又は起きて
も影響がなく、過電流の感瓜が経時的に低下するのを防
止し、耐久性を向上させることができる。[Effects of the Invention] In the fuse of the present invention, since the contact surfaces of the low melting point metal tip and the fusible metal conductor are connected by fusion bonding or indirect fusion bonding, oxidation of the low melting point metal contact surface does not occur or occurs. There is no effect even if the current is applied, and it is possible to prevent the overcurrent from decreasing over time and improve durability.
また本発明の方法は過電流の通電、加熱、はんだ付番ノ
等、比較的命易な工程が加わるのみで、工程め複雑化が
なく優れたヒユーズを製造する方法である。Furthermore, the method of the present invention requires relatively simple steps such as overcurrent application, heating, and soldering, and is a method for manufacturing an excellent fuse without complicating the process.
第１図〜第５図は本発明の実施例であり、第１図はヒユ
ーズの斜視図、第２図は低融点金属チップをかしめた状
態を示１ｊ要部断面図、第３図は低融点金属チップを一
部融着した状態を示ｉＪ要部断面図、第４図は低融点金
属パウダーの付着状態を示１要部断面図、第５図ははん
だで溶融密封した状態を示す要部断面図、第６図は従来
のヒ１−ズの斜視図、第７図はこれをかしめた状態の端
子金具を付けたカートリッジタイプの斜視図である。
１・・・ヒユーズ
２・・・可溶金ＩｉＩ導体
２ｂ・・・かしめ片
３・・・錫チップ
代理人 弁理士 三 好 保 男
第６図
第７図
卜驚虻
二へ（Ｑト
１＠］１
１”Ｉ 馳 る 木
ｉＪ 闇 ： Ｎ
：：＝ｊ
−〜への
、Ｏ
ＣすFigures 1 to 5 show examples of the present invention. Figure 1 is a perspective view of a fuse, Figure 2 is a cross-sectional view of the main part of a low-melting metal tip shown in a caulked state, and Figure 3 is a perspective view of a fuse. Figure 4 is a sectional view of the main part showing the state in which the melting point metal chip is partially fused, Figure 4 is a sectional view of the main part 1 showing the state of attachment of the low melting point metal powder, and Figure 5 is the main part showing the state where it is melted and sealed with solder. A partial sectional view, FIG. 6 is a perspective view of a conventional heat shield, and FIG. 7 is a perspective view of a cartridge type with a terminal fitting in a crimped state. 1...Fuse 2...Fusible gold IiI conductor 2b...Caulking piece 3...Tin chip agent Patent attorney Yasuo Miyoshi Figure 6 Figure 7 ] 1 1” I will hold the tree iJ darkness: N::=j −～to, OCsu
Claims (3)
て成るヒューズにおいて、上記可溶金属導体と低融点金
属チップを溶融密着させたことを特徴とするヒューズ。(1) A fuse comprising a low melting point metal tip placed on the fusing portion of a fusible metal conductor, characterized in that the fusible metal conductor and the low melting point metal tip are melted and bonded to each other.
属で溶融接続されていることを特徴とする請求項（１）
記載のヒューズ。(2) Claim (1) characterized in that the fusible metal conductor and the low melting point metal chip are fused and connected with another low melting point metal.
Fuse listed.
た後、可溶金属導体に過電流を通電するか又は外部加熱
により可溶金属導体と低融点金属チップの接触面を融着
させることを特徴とするヒューズの製造方法。(3) After placing a low melting point metal chip on the fusing part of the fusible metal conductor, the contact surfaces of the fusible metal conductor and the low melting point metal chip are fused by applying an overcurrent to the fusible metal conductor or by external heating. A method for manufacturing a fuse characterized by:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63067354A JP2667188B2 (en) | 1988-03-23 | 1988-03-23 | Fuse and manufacturing method thereof |
| DE3909302A DE3909302A1 (en) | 1988-03-23 | 1989-03-21 | FUSE PROTECTION AND METHOD FOR PRODUCING THE SAME |
| GB8906613A GB2217531B (en) | 1988-03-23 | 1989-03-22 | Fuse and manufacturing method therefor |
| US07/327,088 US4944084A (en) | 1988-03-23 | 1989-03-22 | Fuse and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63067354A JP2667188B2 (en) | 1988-03-23 | 1988-03-23 | Fuse and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01241728A true JPH01241728A (en) | 1989-09-26 |
| JP2667188B2 JP2667188B2 (en) | 1997-10-27 |
Family
ID=13342597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63067354A Expired - Lifetime JP2667188B2 (en) | 1988-03-23 | 1988-03-23 | Fuse and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2667188B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581225A (en) * | 1995-04-20 | 1996-12-03 | Littelfuse, Inc. | One-piece female blade fuse with housing |
| JPH09204870A (en) * | 1996-01-29 | 1997-08-05 | Yazaki Corp | Fuse-element of fusible link element |
| US5668521A (en) * | 1995-03-22 | 1997-09-16 | Littelfuse, Inc. | Three piece female blade fuse assembly having fuse link terminal with a clip receiving portion |
| JPH09265891A (en) * | 1996-03-29 | 1997-10-07 | Yazaki Corp | Fuse and its manufacture |
| US5886612A (en) * | 1997-10-20 | 1999-03-23 | Littelfuse, Inc. | Female fuse housing |
| US5929740A (en) * | 1997-10-20 | 1999-07-27 | Littelfuse, Inc. | One-piece female blade fuse with housing and improvements thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620254U (en) * | 1979-07-25 | 1981-02-23 | ||
| JPS6147030A (en) * | 1984-08-10 | 1986-03-07 | 松下電器産業株式会社 | Temperature fuse |
| JPS6220633A (en) * | 1985-07-18 | 1987-01-29 | Toyota Motor Corp | Controlling method for fuel injection pump for diesel engine |
-
1988
- 1988-03-23 JP JP63067354A patent/JP2667188B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620254U (en) * | 1979-07-25 | 1981-02-23 | ||
| JPS6147030A (en) * | 1984-08-10 | 1986-03-07 | 松下電器産業株式会社 | Temperature fuse |
| JPS6220633A (en) * | 1985-07-18 | 1987-01-29 | Toyota Motor Corp | Controlling method for fuel injection pump for diesel engine |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5668521A (en) * | 1995-03-22 | 1997-09-16 | Littelfuse, Inc. | Three piece female blade fuse assembly having fuse link terminal with a clip receiving portion |
| US5581225A (en) * | 1995-04-20 | 1996-12-03 | Littelfuse, Inc. | One-piece female blade fuse with housing |
| JPH09204870A (en) * | 1996-01-29 | 1997-08-05 | Yazaki Corp | Fuse-element of fusible link element |
| JPH09265891A (en) * | 1996-03-29 | 1997-10-07 | Yazaki Corp | Fuse and its manufacture |
| US5886612A (en) * | 1997-10-20 | 1999-03-23 | Littelfuse, Inc. | Female fuse housing |
| US5929740A (en) * | 1997-10-20 | 1999-07-27 | Littelfuse, Inc. | One-piece female blade fuse with housing and improvements thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2667188B2 (en) | 1997-10-27 |
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