JPH01236685A - Electronic component mounting board - Google Patents
Electronic component mounting boardInfo
- Publication number
- JPH01236685A JPH01236685A JP6433588A JP6433588A JPH01236685A JP H01236685 A JPH01236685 A JP H01236685A JP 6433588 A JP6433588 A JP 6433588A JP 6433588 A JP6433588 A JP 6433588A JP H01236685 A JPH01236685 A JP H01236685A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- electronic component
- insulating layer
- board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 69
- 239000004020 conductor Substances 0.000 claims description 31
- 239000011162 core material Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業１二の利用分野）
本発明は、金属板を芯材として、その両面に絶縁層を介
して導体回路を形成した電子部品を搭．隈するＪ，ｔ，
Ｊ！Ｉに関し，特に熱放散性を考慮した主子部品搭載
用ノ５（板に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Application in Industry 12) The present invention includes an electronic component in which a metal plate is used as a core material and conductor circuits are formed on both sides of the metal plate through insulating layers. J, t,
J! Regarding I, No. 5 (related to the board for mounting main and sub-components) takes into consideration heat dissipation properties.
（従来の技術）
’、Ｉｆ ｆ一部品は熱を発生するものであるが、これ
を搭載した）、ＩＩ板にあっては、この電子部品からの
熱の放散性を考慮しておかないと、電子部品自体の機能
の低下、基板の変形等の種々な不具合か生ずるものであ
る。そこで、従来よりセラミックや金属の良好な熱伝導
性を利用した電子部品搭載用基板か種々提案され、使用
されてきてもいる。(Conventional technology) If some components generate heat, the heat dissipation from these electronic components must be taken into account when installing the II board. Various problems may occur, such as deterioration of the function of the electronic component itself and deformation of the board. Therefore, various electronic component mounting substrates that utilize the good thermal conductivity of ceramics and metals have been proposed and used.
このような熱放散性を考慮した従来の電子部品搭載用ノ
＾板としては、例えば第４ ［’４の（ａ）及び（ｂ）
に示すような構造に形成されている。すなわち、まず熱
伝導性に優れた金属板を芯材とし、その両面に絶縁層と
なる所謂プリプレグ及び銅箔を接、ｎし、その後に両面
の銅箔を所定の形状にエツチングして導体回路を両面に
形成したものである。Conventional boards for mounting electronic components that take such heat dissipation into consideration include, for example, No. 4 ['4 (a) and (b)].
It is formed in the structure shown in . That is, first, a metal plate with excellent thermal conductivity is used as a core material, so-called prepreg and copper foil that serve as an insulating layer are attached to both sides of the core material, and then the copper foils on both sides are etched into a predetermined shape to form a conductor circuit. is formed on both sides.
このような電子部品＃５ａ用基板については、’＋Ｉｊ
子部品を外部に接続したり、あるいは１［を子部品間の
′−ニ気的接続を行なうために、その両面に銅箔から形
成された導体回路を必要とするものであるか、Ｉ−記の
ように、この導体回路に対しては中心に位置している、
金属板との絶縁をプリプレグのような絶縁層によって行
なわなければならない。このため、折角金属等の熱伝導
性に優れた材料を採用しても、その両面に熱伝導性に劣
る材料からなる絶縁層か介在することになるため、金属
等の十分な熱伝導性は完全には利用されていないのであ
る。For such a board for electronic component #5a, '+Ij
In order to connect child parts to the outside, or to make electrical connections between child parts, conductor circuits made of copper foil are required on both sides of the child parts. As shown, for this conductor circuit, it is located in the center,
The metal plate must be insulated with an insulating layer such as prepreg. For this reason, even if a material with excellent thermal conductivity such as metal is used, there will be an insulating layer made of a material with poor thermal conductivity on both sides, so the sufficient thermal conductivity of metal etc. It is not fully utilized.
そこて１本発明者等は、電子部品搭載用基板における以
上のような実状に鑑み、金属等の熱伝導性に優れた材料
の特性を１分生かすことかでき、両面あるいは多層配線
された基板について鋭意研究してきた結果、熱伝導性に
優れた金属板を部分的かつ積極的に外部に露出させるこ
とが良い結果を生むことを新規に知見し、未発ＩＪＪを
完成したのである。Therefore, in view of the above-mentioned actual situation regarding substrates for mounting electronic components, the inventors of the present invention have discovered that it is possible to take advantage of the characteristics of materials with excellent thermal conductivity such as metals, and to create substrates with double-sided or multilayer wiring. As a result of intensive research on this issue, they discovered that partially and proactively exposing a metal plate with excellent thermal conductivity to the outside produces good results, and completed an undeveloped IJJ.
（発１月か解決しようとする課題）
本発明は以上の経緯にノ＾づいてなされたものて、その
解決しようとする課題は、従来の電子部品搭載用基板に
おける熱放散性の不十分さである。(Problem to be solved in January) The present invention was made based on the above circumstances, and the problem to be solved is the insufficiency of heat dissipation in conventional electronic component mounting boards. It is.
そし゛Ｃ５本発明の［１的とするところは、筒中な構成
によって金属板の優れた熱伝導性を十分生かすことかで
きて、熱放散性に優れた′電子部品搭載用基板を提供す
ることにある。C5 The first object of the present invention is to provide a board for mounting electronic components that can fully utilize the excellent thermal conductivity of the metal plate due to its cylindrical structure and has excellent heat dissipation properties. It is in.
（課題を解決するための−Ｌ段）
以りの問題点を解決するために第一請求項に係る発１１
が採った手段は、実施例に対応する第１図を本川して説
明すると。(L-L stage for solving the problem) In order to solve the following problems, the first claim 11
The measures taken will be explained by referring to FIG. 1, which corresponds to the embodiment.
「金属板（ＩＩ）を芯材として、その両面に絶縁層（１
２）を介して導体回路（１３）を形成した’ｉｌｉ子部
品（２０）をＶ＞載する基板において。``A metal plate (II) is used as a core material, and an insulating layer (1
2) on a board on which a child component (20) with a conductor circuit (13) formed thereon is mounted.
″電子部品（２０）を搭載する部分（１４）の少なくと
も絶縁層（１２）を除去して、電子部品（２０）を金属
板（１１）に搭載するとともに、′電子部品（２０）の
搭載部（１４）に対応し、その反対側の面に形成されて
いる少なくとも絶縁層（１２）を除去して。``At least the insulating layer (12) of the part (14) on which the electronic component (20) is mounted is removed, and the electronic component (20) is mounted on the metal plate (11). Corresponding to (14), at least the insulating layer (12) formed on the opposite surface is removed.
搭載部（１４）の反対側の金属板（１１）を直接外部に
露出させたことを特徴とする電子部品ＭＳ佐川用板（１
０）Ｊ
である。Electronic component MS Sagawa plate (1) characterized in that the metal plate (11) on the opposite side of the mounting part (14) is directly exposed to the outside.
0) J.
すなわち、この第一請求項に係る電子部品搭載用基板（
１０）ｌ、： アッテハ、°１ｒ！、子ＦｆＬＺ（２０
）を搭・１′＆、する搭載部（１４）の反対側の金属板
（１１）を直接かつ積極的に外部に露出させたものであ
り、この露出部（１５）によって当該゛電子部品搭載用
基板（１０）の熱放散性を上方高めたものである。That is, the electronic component mounting board (
10) l: Atteha, °1r! , child FfLZ (20
) The metal plate (11) on the opposite side of the mounting part (14) for mounting the electronic parts (1') is directly and actively exposed to the outside, and this exposed part (15) allows the electronic parts to be mounted. The heat dissipation properties of the substrate (10) are increased upward.
また、前述の問題点を解決するために第二請求ダ１に係
る発明か採った手段は、実施例に対応する第２図を８照
して説明すると。Further, the means adopted in the invention according to the second claim 1 to solve the above-mentioned problems will be explained with reference to FIG. 2 corresponding to the embodiment.
「金属板（ＩＩ）を芯材として、その両面に絶縁層（１
２）を介して導体回路（１：ｌ）を形成した゛ト導体素
子（２０）を搭載する基板において、
゛１導体素−ｊ＜ｚｏ）を搭載する部分（１４）の少な
くとも絶縁層（１ｚ）を除去して、゛姓導体素子（２０
）を金属板（ＩＩ）に接触させた状態で搭載し、を導体
素子（２０）の搭４１部（１４）に対応し、その反対側
の面に形成されている絶縁層（１２）を除去して、搭！
を部（＋４）の反対側の金属板（１１）を直接外部に露
出させるとともに、
金属板（＋１）を通して形成したスルーホール（１６）
内に導体ビン（＋７）を植設して、この導体ビン（＋７
）によって外部との導通を確保したことを特徴とする電
子部品搭載用ノ＾板（１０）Ｊである。``A metal plate (II) is used as a core material, and an insulating layer (1
2), in which at least the insulating layer (1z ) is removed and the conductive element (20
) is mounted in contact with the metal plate (II), and the insulating layer (12) corresponding to the tower 41 part (14) of the conductive element (20) and formed on the opposite side thereof is removed. Then, the tower!
The metal plate (11) on the opposite side of the part (+4) is exposed directly to the outside, and the through hole (16) is formed through the metal plate (+1).
A conductor bottle (+7) is planted inside the conductor bottle (+7).
) is a board for mounting electronic components (10) J, which is characterized by ensuring continuity with the outside.
すなわち、この第二請求項に係る電子部品搭載用基板（
ｌＯ）にあっては、電子部品の一種である半導体素子（
２０）を搭載する搭載部（１４）の反対側の金属板（１
１）を＋ｔｆ、接かつ琶極的に外部に露出させたものて
あり、この露出部（１５）によって当該電子部品搭載用
ノ＾板（Ｈｌ）の熱放散性を１−分高めるともに。That is, the electronic component mounting board (
1O), semiconductor elements (1O) are a type of electronic component.
20) on the opposite side of the mounting section (14) on which the metal plate (1
1) is exposed to the outside at +tf, and this exposed portion (15) increases the heat dissipation of the electronic component mounting plate (Hl) by 1 min.
金属板（１１）を通して形成したスルーホール（１６）
内に導体ビン（１７）を植設して、この導体ビン（１７
）によって外部との導通を確保したものである。Through hole (16) formed through metal plate (11)
A conductor bottle (17) is planted inside the conductor bottle (17).
) to ensure continuity with the outside world.
さらに、第一ミ請求り１に係る１【（子部品搭載用基板
（１０）にあっては、第二請求項に係る電子部品搭載用
基板（＋ １１ ）について、さらにその導体ビン（１
７）の、・部を金属板（１１）と直接接触させることに
より熱伝導性をさらに高めることができるものである。Furthermore, regarding the electronic component mounting board (+11) according to the second claim, the conductor bin (1
Thermal conductivity can be further improved by bringing the * part of 7) into direct contact with the metal plate (11).
（発１１Ｉの作用）
本発明か以１−のような１段を採ることによって以下の
ような作用かある。(Effects of Expression 11I) The following effects can be achieved by adopting one step as described in 1- above in the present invention.
まず、第一＋ｉｌ’ｌ求項及び第三請求項に係る電７−
？Ｂ品搭載川ノ、ｃ板（１０）にあっては、露出部（１
５）によって、電子部品（２０）を搭載するＮ’ｐ ａ
？Ｂ （＋４）の反対側の金属板（１１）を直接かつ
請権的に外部に露出させたから、この金属板（１１）の
露出部（１５）か直接外気に接触しており、この露出部
（１５）から熱か外気に伝導されるのである。また、金
属板（１１）の熱はこの露出部（１５）から輻射熱とし
て外部に放出されるのである。従って、この−に子部品
ｂ’ｓａ用基板（ｌＯ）にあっては、その金属板（＋１
）の熱か当該金属板（１１）を通して他の部分に伝導さ
れることは勿論。First, the first +il'l claim and the third claim
? On the C plate (10) with the B product installed, the exposed part (1
5), N'p a on which electronic components (20) are mounted
? Since the metal plate (11) on the opposite side of B (+4) is exposed directly to the outside, the exposed part (15) of this metal plate (11) is in direct contact with the outside air, and this exposed part Heat is conducted from (15) to the outside air. Further, the heat of the metal plate (11) is released to the outside as radiant heat from this exposed portion (15). Therefore, in the board (lO) for the child component b'sa on this -, the metal plate (+1
) is of course conducted to other parts through the metal plate (11).
熱伝導及び熟輻射として露出部（１５）からも外部に積
極的に放出され、熱放散性が部分高いものとなっている
のである。The exposed portion (15) also actively releases heat to the outside as heat conduction and radiation, resulting in partially high heat dissipation.
また、第三請求項に係る電子部品搭載用ノ、（板（１０
）にあっては、Ｌ２第−請求項に係る’；ｔｔ子部品搭
依川ノ＾用（１０）と同様な作用をイ■している外、そ
の導体ビン（１７）の一部を金属板（１１）と直接接触
させるようにすることで、この導体ビン（１７）を通し
ても金属板（１１）の熱か外部に伝導されのである。In addition, the electronic component mounting board (board (10
), in addition to having the same effect as (10) for child parts according to claim L2, a part of the conductor bottle (17) is made of metal. By bringing it into direct contact with the metal plate (11), the heat of the metal plate (11) can be conducted to the outside even through the conductor bottle (17).
従って、この電子部品搭載用基板（１１１）にあっては
、その熱伝導性かさらに高められるのである。Therefore, the thermal conductivity of this electronic component mounting board (111) can be further improved.
（実施例）
次に、本発明を各請求項に対応する実施例に従−）て、
；↑細に説明する。(Examples) Next, the present invention will be described according to examples corresponding to each claim.
;↑Explain in detail.
実施例！
第１図には第−請求項に対応する第一実施例に係る゛ｃ
〃ｒ一部品搭棧ＩＴＪ基板（１０）か示してあり、この
′、ｕ子部品搭載用基板（１０）にあっては、金属板（
１１）を芯材とし、その両面に絶縁層（１２）を介して
導体回路（１３）を形成し、さらに電Ｉ一部品であるチ
ップキャリア、フラウトバックまたは抵抗体（２０）を
搭載するための搭載ｆｉＢ（＋４）か形成しである。す
なわち、この電子部品搭載用基板（ｌＯ）においては、
′１１ｔｆ部品（２０）か搭載されるべき部分の絶縁層
（１２）を除去して搭載部（１４）を形成したものであ
り、この搭４Ｌ′＄（＋４）において電子部品（２０）
をシリコングリース等を介して金属板（ｉｔ）に接触さ
せた状態で搭載したちのである。この場合に使用してい
るシリコングリース等は、主として電子部品（２０）か
らの熱を金属板（！ｌ）に伝導させるものである。また
、この場合の絶縁層す２）の除去は、電子部品（２ｏ）
の搭、！！部分あるいはシリコングリース等の付′ｊ部
分を確保するために、金属板（１１）とともに絶縁層（
１２）を切削加工等によって削り取って形成しである。Example! FIG. 1 shows the first embodiment corresponding to claim No. 1.
〃The ITJ board (10) with one component mounted is shown, and the metal plate (10) is shown in this
11) is used as a core material, a conductor circuit (13) is formed on both sides of the core material through an insulating layer (12), and a chip carrier, a flout back, or a resistor (20), which is an electric I part, is mounted on the core material. The mounted fiB (+4) is formed. That is, in this electronic component mounting board (lO),
The mounting part (14) is formed by removing the insulating layer (12) of the part where the '11tf component (20) is to be mounted, and in this tower 4L'$ (+4), the electronic component (20)
It is mounted in contact with a metal plate (IT) via silicone grease or the like. The silicone grease and the like used in this case mainly conducts heat from the electronic component (20) to the metal plate (!l). In addition, in this case, the removal of the insulating layer 2) is performed on the electronic component (2o).
The tower! ! In order to secure the area where silicone grease or the like is applied, the insulating layer (
12) is removed by cutting or the like.
また、この′−に子部品ＮＳａ用基板基板ｏ）にあって
は、電子部品（２０）の搭載部（１４）に対応し、その
反対側の面に形成されている絶縁層（１２）を除去して
、搭載部（１４）の反対側の金属板（Ｉ１）を直接外部
に露出さるための露出部（１５）が形成しである。この
場合の絶縁層（１２）の除去は、Ｔめ露出ｆｉ（＋５）
に対応する開口を絶縁層（１２）な形成する材料（例え
ばプリプレグ）に形成しておいて実施してもよいか、絶
縁層（１２）の形成後にこの絶縁層（１２）を金属板（
１１）とともに切削加工等によって削り取って形成して
実施してもよいものある。In addition, in this substrate o) for the child component NSa, there is an insulating layer (12) formed on the surface opposite to the mounting portion (14) of the electronic component (20). An exposed portion (15) is formed by removing the metal plate (I1) on the opposite side of the mounting portion (14) to directly expose the metal plate (I1) to the outside. In this case, the removal of the insulating layer (12) requires T exposure fi(+5).
This may be carried out by forming an opening corresponding to the insulating layer (12) in the material (for example, prepreg) to form the insulating layer (12), or after forming the insulating layer (12) by forming an opening in the metal plate (
In addition to 11), it may also be formed by scraping it off by cutting or the like.
実施例２
：ｆＳ２図には第二請求項に係る電子部品ＭａｊＴＩ基
板（１０）が示してあり、この電子部品搭載用ノ、（板
（１０）は所謂ビン・グリッド・アレイと呼ばれるもの
である。すなわち、この゛電子部品搭載用基板（１０）
にあっては、゛電子部品である半導体素子（２ｏ）を搭
載する部分（１４）か、金属板（１１）とともに絶縁層
（Ｉ２）を−・般の切削加工によって削り取ることによ
り形成してあり、搭載された半導体素子（２ｏ）は良熱
伝導性接着剤を介して金属＆（１１）に接触させである
。Embodiment 2: Fig. fS2 shows an electronic component MajTI board (10) according to the second claim, and this electronic component mounting board (10) is a so-called bin grid array. In other words, this electronic component mounting board (10)
In this case, the part (14) on which the semiconductor element (2o), which is an electronic component, is mounted, or the insulating layer (I2) together with the metal plate (11) is formed by scraping off the part (14) by a general cutting process. , the mounted semiconductor element (2o) is brought into contact with the metal & (11) via a good heat conductive adhesive.
また、この′電子部品搭載用基板（１０）は、そのスル
ーホール（Ｉｌｉ）内に植；没した導体ビン（１７）を
通して他の基板′亨に接続されるものであり、各導体ビ
ン（１７）は絶縁層（１２）ｌ二の導体回路（Ｉ３）と
適宜導通しである。勿論、各導体ビン（１７）が金属板
（１１）と直接接触しないように、導体ビン（１７）か
植、没されるスルーホール（１６〕内には絶縁層（Ｉ２
）が形成しである。Furthermore, this 'electronic component mounting board (10) is connected to other boards' through conductor bins (17) implanted in its through holes (Ili), and each conductor bin (17) ) is suitably electrically connected to the conductor circuit (I3) of the insulating layer (12). Of course, in order to prevent each conductor bottle (17) from coming into direct contact with the metal plate (11), an insulating layer (I2
) is formed.
その他の構成は、）：記第−実施例に係る電子部品搭載
用基板（１０）と同様である。The other configurations are the same as the electronic component mounting board (10) according to Example 1.
実施例３
第３１４には第二実施例と同様な所謂ビン・グリッド・
アレイと呼ばれる電子部品搭載用ノ、（板（１０）が示
しである。この第三実施例に係る電子部品搭載用基板（
１０）の第二実施例に係る電子部品搭載用基板（１０）
と異なる点は、その導体ビン（１７）の一部を金属板（
１１）と直接接触させるようにしたことであり、その他
の構成については、ｌ−２第二実施例に係る′電子部品
搭載用基板（１０）と同様である。Embodiment 3 The so-called bin grid 314 is similar to the second embodiment.
A board (10) for mounting electronic components called an array is shown in FIG.
10) Electronic component mounting board (10) according to the second embodiment
The difference is that part of the conductor bin (17) is replaced with a metal plate (
11), and the other configurations are the same as the electronic component mounting board (10) according to the second embodiment of l-2.
すなわち、この実施例に係る電子部品搭載用基板（１０
）にあっては、金属板（１１）を通して熱を他の部分に
伝導させ、かつ露出部（１５）から金属板（ＩＩ）のハ
を外部に放散させるとともに、導体ビン（１７）を通し
て熱を他の基板等に伝導させるようにしたものである。That is, the electronic component mounting board (10
), the heat is conducted to other parts through the metal plate (11), and the metal plate (II) is radiated outside from the exposed part (15), and the heat is conducted through the conductor bottle (17). It is designed to conduct to other substrates, etc.
（発明の効果）
以り詳述した通り、第一請求項に係る電子部品搭載用基
板（１０）にあっては、［；記実施例にて例示した如く
、
「金属板（１１）を芯材として、その両面に絶縁層（１
２）を介して導体回路（Ｉ３）を形成した電子部品（２
０）を搭載するノ＾板において、
’＋１４： ’ｆ ｉ’ｉＢ品（２０）を搭載する部分
（１４）の少なくとも絶縁層（１２）を除去して、１ｆ
ｆ−ｆＲ８品（２ｏ）を金属板（ＩＩ）に搭載するとと
もに、゛准ｆ一部品（２ｏ）の搭載部（１４）に対応し
、その反対側の而に形成されている少なくとも絶縁層（
１２）を除去して、搭載部（１４）の反対側の金属板（
１１）を直接外部に露出させたこと」
にその特徴かあり、これにより、簡ｔｌｉな構成によっ
て金属板の優れた熱伝導性を十分生かすことができて、
熱放散性に優れた電子部品搭載用基板（■））を提供す
ることがてきるのである。(Effects of the Invention) As described in detail above, the electronic component mounting board (10) according to the first claim has the following features: As a material, an insulating layer (1
2), which formed a conductor circuit (I3) through the electronic component (2).
0), remove at least the insulating layer (12) of the part (14) on which the 1f i'iB product (20) is mounted.
The f-fR8 product (2o) is mounted on the metal plate (II), and at least an insulating layer (corresponding to the mounting part (14) of the f-fR8 product (2o) and formed on the opposite side thereof) is mounted on the metal plate (II).
12) and remove the metal plate (
11) is directly exposed to the outside, which makes it possible to take full advantage of the excellent thermal conductivity of the metal plate with a simple configuration.
This makes it possible to provide a substrate for mounting electronic components (■) with excellent heat dissipation properties.
すなわち、この第一請求項に係る電子部品搭載用ノ＾板
（１０）によれば、露出部（１５）によって電子部品（
２０）をＰＳ佐する搭載部（１４）の反対側の金属板（
１１）か直接かつ積極的に外部に露出していて、この金
属板（１１）の露出部（１５）か直接外気に接触してこ
の露出部（１５）から熱か外気に伝導され、また金属板
（１１）の熱はこの露出部（１５）から輻射熱として外
部に放出されるのである。従って、この電ｒ−ｐ品搭載
用基板（１０）にあっては、その金属板（１１）の熱か
当該金属板（１１）を通して他の部分に伝導されること
は勿論、熱伝導及び熱輻射として露出部（１５）からも
外部に積極的に放出され、熱放散性を十分高くすること
ができるのである。That is, according to the electronic component mounting plate (10) according to the first claim, the exposed portion (15) allows the electronic component (
20) on the opposite side of the loading section (14)
11) is directly and actively exposed to the outside, and the exposed portion (15) of this metal plate (11) directly contacts the outside air, heat is conducted from this exposed portion (15) to the outside air, and the metal The heat of the plate (11) is radiated to the outside from this exposed portion (15) as radiant heat. Therefore, in this electrical R-P product mounting board (10), the heat of the metal plate (11) is not only conducted to other parts through the metal plate (11), but also heat conduction and heat transfer. The exposed portion (15) also actively emits radiation to the outside, making it possible to sufficiently improve heat dissipation.
以にのことは、所１肩ピン・グリッド・アレイと呼ばれ
る第二請求項に係る電子部品搭載用基板（１０）につい
ても同様である。The above also applies to the electronic component mounting board (10) according to the second claim, which is called a one-shoulder pin grid array.
また、第三請求項に係る電子部品搭載用基板（１０）に
よれば、ｈ記の効果を有する外、その導体ビン（１７）
の一部を金属板（１１）と直接接触させるようにするこ
とで、この導体ビン（１７）を通して金属板（１１）の
す４か外部に伝導され、露出部（１５）から金属板（１
１）の熱を外部にＭｌ、散させることかできるとともに
、導体ビン（＋７）を通して熱を他の基板等に伝導させ
ることかできて、その熱放散性をより一層高めろことか
できるものである。Further, according to the electronic component mounting board (10) according to the third claim, in addition to having the effect described in h, the conductor bottle (17)
By bringing a part of the metal plate (11) into direct contact with the metal plate (11), conduction is conducted to the outside of the metal plate (11) through the conductor bottle (17), and the metal plate (1
It is possible to dissipate the heat of 1) to the outside, and also to conduct the heat to other boards etc. through the conductor bottle (+7), further increasing its heat dissipation performance. be.
さらに、絶縁Ｊ、ｔｉ扱内に金属板等を巾に嵌入する従
来の電子部品搭載用基板にあってはマルチチップを高密
度に搭載することかＬ業的にてきなかったのであるか、
１；記の第一請求項〜第三請求項に示したような構成と
することによって、マルチチップの高密度搭載かＬ業的
にてきるようになった 、のである。Furthermore, with conventional boards for mounting electronic components, in which a metal plate, etc. is fitted across the width of the insulation J or TI, it has not been possible to mount multi-chips at high density.
1; By adopting the configuration as shown in the first to third claims, it has become possible to mount multi-chip at high density in a commercially efficient manner.
４．１Ａ面の筒ｒｇな説明
第１１′４は第一請求項に係る電子部品搭載用基板の部
分拡大断面図、第２図は第二請求項に係る電子部品搭載
用基板の部分拡大断面図、第３図は第三請求ダ１に係る
電子部品搭載用基板の部分拡大断面１？４ 、第４図の
（ａ）及び（ｂ）のそれぞれは従来の電子部品搭載用基
板を示す部分断面！Ａである。4. Explanation of cylinder rg on plane A. No. 11'4 is a partially enlarged sectional view of the electronic component mounting board according to the first claim, and FIG. 2 is a partially enlarged sectional view of the electronic component mounting board according to the second claim. Figure 3 shows a partial enlarged cross-section 1-4 of the electronic component mounting board according to the third claim 1, and Figures 4 (a) and (b) each show a conventional electronic component mounting board. cross section! It is A.
符 号 の 説 明
１０・・・電子部品搭載用基板、１１・・・金属板、１
２・・・絶縁層、 ＋３・・・導体回路、１４・・・搭
載部、１５・・・露出部、ｌト・・スルーホール、１７
・・・導体ビン、２０・・・電子部品にト導体素Ｔ−）
。Explanation of symbols 10...Substrate for mounting electronic components, 11...Metal plate, 1
2... Insulating layer, +3... Conductor circuit, 14... Mounting part, 15... Exposed part, lt... Through hole, 17
...Conductor bottle, 20...Conductor element T- for electronic parts)
.
以 １； 特１作出願人 イビデン株式会社 代 理 人 第４図 （ｂ） 食１％層ｆＡｌ喋様Below 1; Special 1st work applicant IBIDEN Co., Ltd. representative person Figure 4 (b) Food 1% layer fAl Kuki
Claims (1)
導体回路を形成した電子部品を搭載する基板において、 前記電子部品を搭載する部分の少なくとも前記絶縁層を
除去して、前記電子部品を前記金属板に搭載するととも
に、前記電子部品の搭載部に対応し、その反対側の面に
形成されている少なくとも前記絶縁層を除去して、前記
搭載部の反対側の前記金属板を直接外部に露出させたこ
とを特徴とする電子部品搭載用基板。 ２）．金属板を芯材として、その両面に絶縁層を介して
導体回路を形成した半導体素子を搭載する基板において
、 前記半導体素子を搭載する部分の少なくとも前記絶縁層
を除去して、前記半導体素子を前記金属板に接触させた
状態で搭載し、前記半導体素子の搭載部に対応し、その
反対側の面に形成されている少なくとも前記絶縁層を除
去して、前記搭載部の反対側の前記金属板を直接外部に
露出させるとともに、 前記金属板を通して形成したスルーホール内に導体ピン
を植設して、この導体ピンによって外部との導通を確保
したことを特徴とする電子部品搭載用基板。 ３）．前記導体ピンの一部が、前記金属板と直接接触し
ていることを特徴とする第二請求項に記載の電子部品搭
載用基板。[Claims] 1). In a board on which an electronic component is mounted, in which a metal plate is used as a core material and a conductor circuit is formed on both sides of the core material through an insulating layer, at least the insulating layer is removed from the part on which the electronic component is mounted, and the electronic component is At the same time as mounting the electronic component on a metal plate, removing at least the insulating layer formed on the surface opposite to the mounting part of the electronic component, and directly exposing the metal plate on the opposite side of the mounting part to the outside. A board for mounting electronic components, which is characterized by being exposed. 2). In a substrate on which a semiconductor element is mounted, in which a metal plate is used as a core material and a conductor circuit is formed on both sides of the metal plate through an insulating layer, at least the insulating layer is removed from the part on which the semiconductor element is mounted, and the semiconductor element is The metal plate is mounted in contact with a metal plate, and at least the insulating layer formed on the surface corresponding to and opposite to the mounting portion of the semiconductor element is removed, and the metal plate on the opposite side of the mounting portion is removed. What is claimed is: 1. A board for mounting an electronic component, wherein the electronic component is directly exposed to the outside, and a conductor pin is implanted in a through hole formed through the metal plate, and conduction with the outside is ensured by the conductor pin. 3). The electronic component mounting board according to claim 2, wherein a portion of the conductor pin is in direct contact with the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064335A JP2626785B2 (en) | 1988-03-17 | 1988-03-17 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064335A JP2626785B2 (en) | 1988-03-17 | 1988-03-17 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01236685A true JPH01236685A (en) | 1989-09-21 |
| JP2626785B2 JP2626785B2 (en) | 1997-07-02 |
Family
ID=13255268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63064335A Expired - Lifetime JP2626785B2 (en) | 1988-03-17 | 1988-03-17 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2626785B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279471A (en) * | 2017-11-10 | 2020-06-12 | 新电元工业株式会社 | Electronic module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967948U (en) * | 1972-09-26 | 1974-06-13 | ||
| JPS61287128A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Works Ltd | Chip carrier for electron element |
| JPS61287194A (en) * | 1985-06-13 | 1986-12-17 | 松下電工株式会社 | Chip carrier for electronic element |
| JPS62130544A (en) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | Substrate for placing semiconductor |
-
1988
- 1988-03-17 JP JP63064335A patent/JP2626785B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967948U (en) * | 1972-09-26 | 1974-06-13 | ||
| JPS61287128A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Works Ltd | Chip carrier for electron element |
| JPS61287194A (en) * | 1985-06-13 | 1986-12-17 | 松下電工株式会社 | Chip carrier for electronic element |
| JPS62130544A (en) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | Substrate for placing semiconductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111279471A (en) * | 2017-11-10 | 2020-06-12 | 新电元工业株式会社 | Electronic module |
| CN111279471B (en) * | 2017-11-10 | 2023-09-15 | 新电元工业株式会社 | electronic module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2626785B2 (en) | 1997-07-02 |
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