JPH0123536B2 - - Google Patents
Info
- Publication number
- JPH0123536B2 JPH0123536B2 JP56012592A JP1259281A JPH0123536B2 JP H0123536 B2 JPH0123536 B2 JP H0123536B2 JP 56012592 A JP56012592 A JP 56012592A JP 1259281 A JP1259281 A JP 1259281A JP H0123536 B2 JPH0123536 B2 JP H0123536B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- electrical contact
- contact material
- gas atmosphere
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 24
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910003437 indium oxide Inorganic materials 0.000 claims description 10
- 239000011787 zinc oxide Substances 0.000 claims description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 9
- 229910001887 tin oxide Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 238000003466 welding Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 229910001873 dinitrogen Inorganic materials 0.000 description 11
- 239000000843 powder Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- ASMQPJTXPYCZBL-UHFFFAOYSA-N [O-2].[Cd+2].[Ag+] Chemical compound [O-2].[Cd+2].[Ag+] ASMQPJTXPYCZBL-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 3
- YHWAKNUUZWTIQU-UHFFFAOYSA-N copper cadmium(2+) oxygen(2-) Chemical compound [O-2].[Cd+2].[Cu+2].[O-2] YHWAKNUUZWTIQU-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56012592A JPS57126930A (en) | 1981-01-30 | 1981-01-30 | Electric contact material for packed use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56012592A JPS57126930A (en) | 1981-01-30 | 1981-01-30 | Electric contact material for packed use |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57126930A JPS57126930A (en) | 1982-08-06 |
JPH0123536B2 true JPH0123536B2 (de) | 1989-05-02 |
Family
ID=11809613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56012592A Granted JPS57126930A (en) | 1981-01-30 | 1981-01-30 | Electric contact material for packed use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57126930A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105112712A (zh) * | 2015-07-30 | 2015-12-02 | 河南科技大学 | 一种高强高导点焊电极用弥散强化铜基复合材料及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522113A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Telephone current suplying system |
-
1981
- 1981-01-30 JP JP56012592A patent/JPS57126930A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS522113A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Telephone current suplying system |
Also Published As
Publication number | Publication date |
---|---|
JPS57126930A (en) | 1982-08-06 |
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