JPH01233747A - Semiconductor device with cooling apparatus - Google Patents

Abstract

PURPOSE:To easily exchange a semiconductor element by a method wherein a part between a through hole part of a mounting plate and a heat pipe is sealed by laying a flexible sealing body in order to prevent dust, rainwater or the like from penetrating into a control apparatus box from the outside. CONSTITUTION:At a flexible sealing body 31 where a bellows has been formed and which is composed of a rubber material, a brim part on one end is bonded to a through hole 14a of a mounting plate 14 by using an adhesive or the like and the other end is closely put into a heat pipe 3. When a semiconductor element 1 becomes defective and is to be exchanged, a locking bolt 13 is loosened; an interval (A) between a metal block 2 and another metal block 2 is widened; the defective element 1 is taken out as shown by an arrow and is replaced with a new element 1. Although the pipe 3 is shifted inside the through hole 14a, the sealing body 31 is bent freely, and no trouble is caused. By this setup, it is prevented that dust, rainwater or the like penetrates into a control apparatus box from the outside; the element 1 can be exchanged easily.

Description

[Detailed Description of the Invention] [Field of Industrial Application] This invention is! [Prior art] Rectifiers, choppers, etc. using semiconductor elements, related to semiconductor devices with cooling devices installed in control devices mounted on air vehicles, etc., and particularly related to improvements in sealing the penetration parts of heat pipes. As a known technology for semiconductor devices with cooling devices such as inverters,
5 and 6, which are shown in Japanese Patent No. 89148, are a partially oriented side view and a cross-sectional view showing a conventional semiconductor device equipped with a cooling device similar to this. Reference numeral ``U'' denotes a plurality of semiconductor elements such as diodes, and 2 denotes metal blocks that are stacked alternately and in contact with these semiconductor elements, and serve both as heat transfer and electrical conduction. A plurality of heat pipes 3 (V13 in the figure) are taken out from the metal block 2, and heat dissipation fins 4 are provided to form a cooling device.0 Semiconductor element 1 and the metal block 2 are aligned in the center with an alignment bin. 5 is fitted and 16 is an insulating plate applied to the metal block 2 at both ends, and consists of an insulating plate. Spacers 08 and 9 made of washers etc. are placed on the insulating plates 6 at both ends of the curl, and the end plates 08 and 9 are placed on both ends. It is maintained at the interval of . 12Vi disc spring, 13 is screwed through the end plate 8, and is tightened to apply a predetermined contact pressure between each semiconductor element 1 and the metal block 2 with a bolt; 14 is the i plate R of the above assembly;
9 is attached by port 15 on the mounting plate, and the longitudinal direction VC
It is divided into two parts, and the semiconductor device 16 with a cooling device whose surfaces are joined together constitutes a semiconductor device 16.

In the semiconductor device 16, when the semiconductor element 1 has failed and needs to be replaced, loosen the bolt 13 and tighten it as shown in FIG.
2. Widen the distance A to the extent that the semiconductor element 1 can be removed from the center, pull out the semiconductor element 1 in the direction of the arrow, fit the new semiconductor element 1, and tighten the port 13. The through hole 14a ij h
8 and 9 show the main parts of an electric car mounted with a control device containing the above-mentioned semiconductor device 6, which is large enough to allow the heat vibrator 3 to be shifted when replacing the semiconductor element 1. A side view and a front sectional view are shown. A control device box 17 is installed at the bottom of the floor of the electric vehicle 25.

This control device box 17 has the following components as shown in FIG.

Various electrical components of the control device are housed here. Semiconductor device 1
6 is placed in the box 17 by the mounting plate 14) 119 is the electric component, 20 is the electronic equipment, 21 is the circuit wiring, 22μ socket, 23ij leader line holder, 24 inspection cover It is.

[The problem that the invention attempts to solve]

In the conventional semiconductor device with a cooling device as described above, when it is mounted and used in the control device box 17, one part of the semiconductor element is built-in and exposed outside the heat pipe 3Vi to improve the heat dissipation effect. The mounting plate 14' has a through hole 1 large enough to allow the heat pipe 3 to pass therethrough and to allow the heat pipe 3 to be moved when replacing the semiconductor element 117).
4a is provided. For this reason, there are problems such as the intrusion of dust and rainwater from the outside, the need to strengthen the insulation of the equipment housed in the control equipment box 17, and the need to perform cleaning and maintenance work frequently. This invention was made to solve these problems. [1] The heat pipe is sealed with the through hole of the attached plate to prevent dust and rainwater from entering from the outside. friend!
Another object of the present invention is to provide a semiconductor device with a cooling device in which the heat pipe is shifted within the through hole when replacing the semiconductor element, thereby preventing deterioration of the insulation of internal equipment and shortening the required insulation interval.

[Means for Solving Problem 11] The semiconductor device with a cooling device according to the present invention [is a semiconductor device with a removable sealing body interposed between the through hole portion of the mounting plate and the heat pipe for sealing. It is.

[Effect]

In this invention, a flexible sealing body is installed between the heat pipe and the through hole of the mounting plate.

Prevents dust and rainwater from entering from outside.

Furthermore, when replacing the semiconductor element, the heat pipe can be moved within the through hole without any hindrance while the flexible sealing body is attached.

〔Example〕

1 and 2 are a partially sectional side view and a front view showing an embodiment of a semiconductor device with a cooling device according to the present invention, and 1 to 15.14a are the same books as those for the conventional device described above. 30t: Seal the through hole 14a of the mounting plate 14 as shown below in the semiconductor device with cooling device f1. It is a housing sealing body made of a rubber material on which a 31TF bellows is formed, and one end of the flange is joined to the through hole 14a of the mounting plate 14 with an adhesive or the like, and the other end is closely connected to the heat pipe 3. 3(a) and ()
1)) is shown in a top view and a partially sectional front view.

The semiconductor device [3O of the above-described embodiment is mounted on the top of the control device box shown in FIG. 1O by attaching a mounting plate 14 in the same manner as the conventional device described above. The through hole 14a of the mounting plate 14 is sealed with a removable sealing body 31 for the heat vibe 3Vi, and the inside of the box 17 is sealed from the outside.

If the semiconductor element 1 has failed and needs to be replaced, loosen the 13 (for HI-equipped parts) and widen the distance A between the metal block 2 and other metal blocks 2, as shown in FIG.

When the failed semiconductor element 1 is removed as shown by the arrow and replaced with a new one, the heat vibrator 3l-It moves within the through hole 14a, but the flexible sealing body 31 bends freely. No problem 0 In the above embodiment, the metal block 2 is the semiconductor element 1
0M [jF Because they are in direct contact with each other, the heat vibe 3 has a potential. However, the flexible sealing body 31 uses a rubber material for insulation. If an electrical insulator with good heat transfer (for example, an aluminum nitride plate) is used in combination with the metal block 2 as a ground potential, use a thin metal material for the removable sealing body, and use a bellows etc. [Effects of the Invention] As described above, according to the present invention, it is possible to interpose a gap sealing body between the through hole portion of the attached plate and the heat vibrator. I sealed it, so I decided! This prevents rainwater and rainwater from entering the equipment box from the outside, and eliminates insulation deterioration.As a result, the insulation interval can be shortened compared to conventional equipment, and the control equipment can be made smaller. , the number of cleaning and maintenance tasks is reduced.

Ship drawings that increase reliability? FIGS. 1 and 2 are partially sectional side and front views showing an embodiment of a semiconductor device with a cooling device according to the present invention, and FIGS. FIG. 5 is a front view of the flexible sealing body shown in FIG. 6 is a partially new side view showing a conventional semiconductor mounting device with a cooling device, FIG. 6 is a sectional view taken from ■-Vi in FIG. 5, and FIG. A side view of the 8th M Tingichi car, showing a partially new side UkU view.

Figure 9 - Cross-sectional view along the line DC-D in Figure 8, Figure 10
Figure 7iJ is probably an Ifr side view of the control equipment box in Figure 9.
...Semiconductor element, 2...Metal block, 3...Heat vibrator, 4...Radiating fin, 6...Insulating plate, 8
．． 9... End plate, 10... Support column, 12... Belleville spring, 13... Tightening with bolt %14... Plate with clearance, 14a
...Through hole, 30...Semiconductor device ra with cooling device, 3
1...Flexible sealing body.

Claims (1)

[Claims] Semiconductor elements and metal blocks are alternately stacked on top of each other, and are supported by a pair of end plates on both sides with insulating plates at both ends and held under elastic pressure.A heat pipe is extended from the metal block. In a semiconductor device with a cooling device, in which a heat dissipation fin is provided, the above-mentioned both end plates are attached to a mounting plate, and this mounting plate is provided with a through-hole through which the above-mentioned heat pipe is passed, there is no space between the above-mentioned through-hole and the heat pipe. A semiconductor device with a cooling device, which is equipped with a flexible sealing body that movably seals a heat pipe within a through hole.