JPH01232272A - Inspection instrument for printed board - Google Patents

Abstract

PURPOSE:To replace a probe according to the size of an inspection point or a through-hole formed at the inspection point by positioning the required probe above a wiring pattern by the movement of a carrier. CONSTITUTION:The required probe 12 is positioned above the inspection point by the movement of the carrier 3 and then a selecting circuit 16 operates a solenoid 13 according to the command from a control circuit 15. Then the solenoid 13 lowers a probe holder 6 to press the probe 9 against the wiring pattern 2 of a printed board 1. In this state, required characteristics are inspected. The solenoid 13 is powered off through the circuit 16 after the inspection and the solenoid 13 is reset. Then the probe holder 6 returns with the repulsive force of a leaf spring 4 and the probe 9 leaves the wiring pattern 2. Probes 8, 9, and 10 which differ in shape and size are used properly according to the wiring pattern and through-hole at an inspection point to perform the inspection smoothly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a printed circuit board inspection device, and particularly to a printed circuit board inspection device suitable for inspecting wiring patterns of unmounted printed circuit boards.

[Conventional technology]

As an example of an inspection apparatus for unmounted printed circuit boards, there is an inspection apparatus as disclosed in Japanese Patent Application Laid-open No. 168375/1983. In such an inspection apparatus, in order to move the probes to inspection points scattered on the printed circuit board, an X-Y moving mechanism as disclosed in Japanese Patent Application Laid-Open No. 58-31799 is used.

Then, by applying one probe to the test point on the printed circuit board, the capacitance between the wiring pattern connected to the test point and the conductive plate on the table is measured, and both probes are applied to both ends of the wiring pattern. The electrical resistance of the wiring pattern is measured by applying a current to the inspection point and testing the quality of the wiring pattern on the printed circuit board.

In printed circuit boards that are inspected in this manner, through-hole portions are often the inspection points.

[Problem to be solved by the invention]

In an actual printed circuit board, several types of through holes with different sizes are formed, and each of them is designated as an inspection point.

On the other hand, the probe of the inspection device is determined by taking into consideration conditions such as the wiring pattern formed on the printed circuit board, the width between the lines, and the strength of the probe.

Therefore, when the probe is brought into contact with a test point, the tip of the probe fits into a through hole formed at the test point and cannot be pulled out, which may damage the printed circuit board.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board inspection device in which probes can be replaced depending on the size of the inspection point or the through hole formed at the inspection point.

[Means to solve the problem]

The means of the present invention for achieving the above object will be explained based on FIG. 1, which corresponds to an embodiment.

In the figure, 1 is a printed circuit board, and 2 is a wiring pattern, which is formed on the printed circuit board 1.

3 is career. 5.6.7 is a probe, which is supported by the carrier 3 so as to be able to reciprocate. 12.13.14 is a solenoid, which is supported on the carrier 3 so as to correspond to the probe 5.6.7.

[For production]

Then, after moving the carrier 3 and positioning the required probe 6 above the wiring pattern 2, the solenoid 13 is activated to bring the probe 6 into contact with the wiring pattern 2 for inspection.

The inspection can be carried out smoothly by appropriately using the probes 5, 6, and 7 depending on the condition of the inspection point.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on FIGS. 1 and 2.

In the figure, 1 is a printed circuit board. 2 is a wiring pattern formed on the blind board 1;

3 is the carrier of the printed circuit board inspection equipment. 4 is a leaf spring,
One end is fixed to the carrier 3 13j. Reference numerals 5, 6, and 7 denote probe holders, each of which is attached to the free end of the leaf spring 4. 8.9.1o are probes each attached to a probe holder 5.6.7. 11 is the lead wire,
Each probe 8.9.10 is connected to an inspection device (not shown).

Reference numerals 12, 13, and 14 are solenoids, which are supported on the middle rear 3 so as to face the probe holder 5, 6, and 7.

15 is a control circuit, 16 is a selection circuit, and based on the command applied from the control circuit 15, the solenoids 12.13.1
Select 4 and activate it.

With this configuration, after a desired probe 12 is positioned above the inspection point by movement of the carrier 3, the selection circuit 16 operates the solenoid 13 based on a command from the control circuit 15. Then, the solenoid 13 pushes down the probe holder 6 and moves the probe 9 onto the printed circuit board 1.
Press it onto wiring pattern 2.

In this state, the required characteristics (capacitance, electrical resistance) are inspected.

Then, when the inspection is finished, the selection circuit 16 selects the solenoid 1 from the selection circuit 16.
3 is cut off, and the solenoid 13 is restored. Then, the probe holder 6 is also restored by the repulsive force of the leaf spring 4, and the probe 9 is separated from the wiring pattern 2.

Inspection can be carried out smoothly by changing the shape and size of the probes 8,9,10 and using them appropriately depending on the wiring pattern and through hole of the inspection point.

Note that the probe holder 5.6.7 can be connected directly to the solenoid 12.
．． 13.14 may be maintained.

〔Effect of the invention〕

As described above, according to the present invention, since the probe is selected according to the condition of the inspection point, inspection can be carried out smoothly.

[Brief explanation of the drawing]

FIG. 1 is a front sectional view showing essential parts of a printed circuit board inspection apparatus according to the present invention, and FIG. 2 is a side sectional view of FIG. 1. 1... Printed circuit board, 2... Wiring pattern, 3...
...Carrier, 5.6.7...Probe, 12.
13,14... Solenoid. Representative Patent Attorney Masaru Ogawa −1ゝ

Claims (1)

[Claims] 1. In a printed circuit board inspection device that inspects a wiring pattern by bringing a probe supported by a carrier that moves in a plane parallel to the printed circuit board into contact with an inspection point on the wiring pattern formed on the printed circuit board, , capable of reciprocating movement in the direction of contacting and separating from the wiring pattern,
1. A printed circuit board inspection device comprising: a plurality of probes supported at predetermined intervals; and a plurality of driving means arranged in correspondence with these probes to move the probes toward a wiring pattern.